TWI664185B - 具有用於TiO原子層沉積的臭氧活化配位基之環戊二烯鈦醇鹽 - Google Patents
具有用於TiO原子層沉積的臭氧活化配位基之環戊二烯鈦醇鹽 Download PDFInfo
- Publication number
- TWI664185B TWI664185B TW103144361A TW103144361A TWI664185B TW I664185 B TWI664185 B TW I664185B TW 103144361 A TW103144361 A TW 103144361A TW 103144361 A TW103144361 A TW 103144361A TW I664185 B TWI664185 B TW I664185B
- Authority
- TW
- Taiwan
- Prior art keywords
- precursor
- titanium compound
- organic titanium
- alkyl
- titanium
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/28—Titanium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G23/00—Compounds of titanium
- C01G23/04—Oxides; Hydroxides
- C01G23/047—Titanium dioxide
- C01G23/07—Producing by vapour phase processes, e.g. halide oxidation
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F17/00—Metallocenes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
-
- H10P14/6334—
-
- H10P14/6681—
-
- H10P14/69394—
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Chemical Vapour Deposition (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361919795P | 2013-12-22 | 2013-12-22 | |
| US61/919,795 | 2013-12-22 | ||
| US201461939211P | 2014-02-12 | 2014-02-12 | |
| US61/939,211 | 2014-02-12 | ||
| US201462060266P | 2014-10-06 | 2014-10-06 | |
| US62/060,266 | 2014-10-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201524988A TW201524988A (zh) | 2015-07-01 |
| TWI664185B true TWI664185B (zh) | 2019-07-01 |
Family
ID=53403800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103144361A TWI664185B (zh) | 2013-12-22 | 2014-12-18 | 具有用於TiO原子層沉積的臭氧活化配位基之環戊二烯鈦醇鹽 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10870921B2 (enExample) |
| JP (1) | JP6685923B2 (enExample) |
| KR (1) | KR102382784B1 (enExample) |
| TW (1) | TWI664185B (enExample) |
| WO (1) | WO2015095845A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018048480A1 (en) * | 2016-09-09 | 2018-03-15 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Group 4 transition metal-containing film forming compositions for vapor deposition of group 4 transition metal-containing films |
| JP6948159B2 (ja) * | 2017-05-31 | 2021-10-13 | 株式会社Adeka | 新規な化合物、薄膜形成用原料及び薄膜の製造方法 |
| JP6954776B2 (ja) * | 2017-06-29 | 2021-10-27 | 株式会社Adeka | 薄膜形成用原料及び薄膜の製造方法 |
| KR102645319B1 (ko) * | 2017-12-26 | 2024-03-11 | 솔브레인 주식회사 | 박막 형성용 조성물, 이를 이용한 박막 및 그 제조방법 |
| KR102643607B1 (ko) * | 2017-12-26 | 2024-03-06 | 솔브레인 주식회사 | 박막 형성용 조성물, 이를 이용한 박막 및 그 제조방법 |
| CN111683953B (zh) * | 2018-02-07 | 2024-01-23 | Up化学株式会社 | 含第ⅳ族金属元素化合物、其制备方法、含其的膜形成用前体组合物及用其的膜形成方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5130172A (en) * | 1988-10-21 | 1992-07-14 | The Regents Of The University Of California | Low temperature organometallic deposition of metals |
| JPH04232272A (ja) | 1990-07-27 | 1992-08-20 | Kali Chem Ag | チタン、ジルコニウム又はハフニウムを含有する層の基板上への析出方法 |
| DE4122473A1 (de) | 1990-07-27 | 1992-01-30 | Kali Chemie Ag | Verfahren zur abscheidung von titan, zirkonium oder hafnium enthaltenden schichten |
| US5344948A (en) | 1992-02-25 | 1994-09-06 | Iowa State University Research Foundation, Inc. | Single-source molecular organic chemical vapor deposition agents and use |
| CN1065871C (zh) | 1998-05-20 | 2001-05-16 | 中国石油化工总公司 | 茂金属钛化合物 |
| EP2201149B1 (en) * | 2007-09-14 | 2013-03-13 | Sigma-Aldrich Co. | Methods of preparing titanium containing thin films by atomic layer deposition using monocyclopentadienyl titanium-based precursors |
| US20130011579A1 (en) * | 2010-11-30 | 2013-01-10 | Air Products And Chemicals, Inc. | Metal-Enolate Precursors For Depositing Metal-Containing Films |
| US20140124788A1 (en) * | 2012-11-06 | 2014-05-08 | Intermolecular, Inc. | Chemical Vapor Deposition System |
-
2014
- 2014-12-18 TW TW103144361A patent/TWI664185B/zh active
- 2014-12-20 WO PCT/US2014/071754 patent/WO2015095845A1/en not_active Ceased
- 2014-12-20 JP JP2016560874A patent/JP6685923B2/ja active Active
- 2014-12-20 KR KR1020167019582A patent/KR102382784B1/ko active Active
- 2014-12-20 US US15/107,170 patent/US10870921B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20160362790A1 (en) | 2016-12-15 |
| US10870921B2 (en) | 2020-12-22 |
| KR102382784B1 (ko) | 2022-04-06 |
| JP2017504657A (ja) | 2017-02-09 |
| TW201524988A (zh) | 2015-07-01 |
| WO2015095845A1 (en) | 2015-06-25 |
| JP6685923B2 (ja) | 2020-04-22 |
| KR20160102010A (ko) | 2016-08-26 |
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