TWI664185B - 具有用於TiO原子層沉積的臭氧活化配位基之環戊二烯鈦醇鹽 - Google Patents
具有用於TiO原子層沉積的臭氧活化配位基之環戊二烯鈦醇鹽 Download PDFInfo
- Publication number
- TWI664185B TWI664185B TW103144361A TW103144361A TWI664185B TW I664185 B TWI664185 B TW I664185B TW 103144361 A TW103144361 A TW 103144361A TW 103144361 A TW103144361 A TW 103144361A TW I664185 B TWI664185 B TW I664185B
- Authority
- TW
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- Prior art keywords
- precursor
- titanium compound
- organic titanium
- alkyl
- titanium
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/28—Titanium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G23/00—Compounds of titanium
- C01G23/04—Oxides; Hydroxides
- C01G23/047—Titanium dioxide
- C01G23/07—Producing by vapour phase processes, e.g. halide oxidation
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F17/00—Metallocenes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69394—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing titanium, e.g. TiO2
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361919795P | 2013-12-22 | 2013-12-22 | |
| US61/919,795 | 2013-12-22 | ||
| US201461939211P | 2014-02-12 | 2014-02-12 | |
| US61/939,211 | 2014-02-12 | ||
| US201462060266P | 2014-10-06 | 2014-10-06 | |
| US62/060,266 | 2014-10-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201524988A TW201524988A (zh) | 2015-07-01 |
| TWI664185B true TWI664185B (zh) | 2019-07-01 |
Family
ID=53403800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103144361A TWI664185B (zh) | 2013-12-22 | 2014-12-18 | 具有用於TiO原子層沉積的臭氧活化配位基之環戊二烯鈦醇鹽 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10870921B2 (enExample) |
| JP (1) | JP6685923B2 (enExample) |
| KR (1) | KR102382784B1 (enExample) |
| TW (1) | TWI664185B (enExample) |
| WO (1) | WO2015095845A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018048480A1 (en) * | 2016-09-09 | 2018-03-15 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Group 4 transition metal-containing film forming compositions for vapor deposition of group 4 transition metal-containing films |
| JP6948159B2 (ja) * | 2017-05-31 | 2021-10-13 | 株式会社Adeka | 新規な化合物、薄膜形成用原料及び薄膜の製造方法 |
| JP6954776B2 (ja) * | 2017-06-29 | 2021-10-27 | 株式会社Adeka | 薄膜形成用原料及び薄膜の製造方法 |
| KR102645319B1 (ko) * | 2017-12-26 | 2024-03-11 | 솔브레인 주식회사 | 박막 형성용 조성물, 이를 이용한 박막 및 그 제조방법 |
| KR102643607B1 (ko) * | 2017-12-26 | 2024-03-06 | 솔브레인 주식회사 | 박막 형성용 조성물, 이를 이용한 박막 및 그 제조방법 |
| KR102235869B1 (ko) * | 2018-02-07 | 2021-04-05 | 주식회사 유피케미칼 | 4 족 금속 원소-함유 화합물, 이의 제조 방법, 이를 포함하는 막 형성용 전구체 조성물, 및 이를 이용하는 막의 형성 방법 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5130172A (en) * | 1988-10-21 | 1992-07-14 | The Regents Of The University Of California | Low temperature organometallic deposition of metals |
| DE4122473A1 (de) | 1990-07-27 | 1992-01-30 | Kali Chemie Ag | Verfahren zur abscheidung von titan, zirkonium oder hafnium enthaltenden schichten |
| JPH04232272A (ja) | 1990-07-27 | 1992-08-20 | Kali Chem Ag | チタン、ジルコニウム又はハフニウムを含有する層の基板上への析出方法 |
| US5344948A (en) * | 1992-02-25 | 1994-09-06 | Iowa State University Research Foundation, Inc. | Single-source molecular organic chemical vapor deposition agents and use |
| CN1065871C (zh) | 1998-05-20 | 2001-05-16 | 中国石油化工总公司 | 茂金属钛化合物 |
| US8221852B2 (en) * | 2007-09-14 | 2012-07-17 | Sigma-Aldrich Co. Llc | Methods of atomic layer deposition using titanium-based precursors |
| US20130011579A1 (en) | 2010-11-30 | 2013-01-10 | Air Products And Chemicals, Inc. | Metal-Enolate Precursors For Depositing Metal-Containing Films |
| US20140124788A1 (en) * | 2012-11-06 | 2014-05-08 | Intermolecular, Inc. | Chemical Vapor Deposition System |
-
2014
- 2014-12-18 TW TW103144361A patent/TWI664185B/zh active
- 2014-12-20 KR KR1020167019582A patent/KR102382784B1/ko active Active
- 2014-12-20 US US15/107,170 patent/US10870921B2/en active Active
- 2014-12-20 JP JP2016560874A patent/JP6685923B2/ja active Active
- 2014-12-20 WO PCT/US2014/071754 patent/WO2015095845A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| TW201524988A (zh) | 2015-07-01 |
| JP2017504657A (ja) | 2017-02-09 |
| US20160362790A1 (en) | 2016-12-15 |
| US10870921B2 (en) | 2020-12-22 |
| JP6685923B2 (ja) | 2020-04-22 |
| KR102382784B1 (ko) | 2022-04-06 |
| KR20160102010A (ko) | 2016-08-26 |
| WO2015095845A1 (en) | 2015-06-25 |
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