TWI664069B - Crimp device - Google Patents

Abstract

The present invention provides a crimping apparatus which heat-presses a pair of workpieces in a short time via an anisotropic conductive member, and prevents occurrence of offset between workpieces. The crimping device of the present invention includes a crimping portion that presses the lead of the first workpiece and the lead of the second workpiece via ACF heat-curable resin as a base material, and the crimping portion includes: a pressing member, a second The workpiece is pressurized; the heating portion heats the pressing member; and the pressure adjusting portion pressurizes the pressing member heated by the heating portion to pressurize the second workpiece at a first pressure, which is required for ensuring conductivity The pressure is low, and the substrate is melted by heat, and during the period in which the bondable hardness is maintained after the substrate starts to harden, the second workpiece is pressurized with a second pressure required to ensure conductivity.

Description

Crimp device

The invention relates to a crimping device.

A display device such as a liquid crystal display or an organic electroluminescence (EL) display is manufactured by performing an array process of forming a circuit and a signal line on a glass plate, and a unit process of bonding a pair of glass plates to form a display. A panel as a substrate in the region; and a module process, in which a driver integrated circuit (IC) for driving is mounted outside the display region of the panel.

As a method of mounting the driver IC, a method of using a flexible film-shaped electronic component in which a driver IC is mounted, such as a chip on film (COF), has been conventionally used. In this method, the electrodes formed by exposing the electrodes formed in the horizontal direction parallel to the display surface are crimped and connected to the terminals of the electronic component (see Patent Document 1).

Hereinafter, such a pressed object such as a substrate and an electronic component is referred to as a workpiece. Further, a portion having conductivity such that electrodes, terminals, and the like of the workpiece are electrically connected to each other is referred to as a lead.

When the workpieces are connected to each other, an anisotropic conductive film (ACF) which ensures electrical conductivity between the leads of the respective workpieces by heating and pressure bonding can be used. The anisotropic conductive film is a sheet-like member in which a large amount of small conductive particles are added to a resin serving as a substrate. A thermosetting resin can be used for the base resin.

If an anisotropic conductive film is sandwiched between the leads of a pair of workpieces and heated while being pressurized, since the lead portions of each other are more protruded than the surface of the workpiece, the conductive particles of this portion are crushed, thereby The leads are electrically connected to each other. Since the other portions are not crushed and the thickness is maintained, electrical conductivity is not generated to ensure insulation. The base material of the thermosetting resin is hardened by heating, so the workpieces are mechanically connected to each other. [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Patent No. 3734548 [Problem to be Solved by the Invention]

As described above, in order to ensure the electrical conductivity of the leads by heating and pressing the pair of workpieces via the anisotropic conductive film, it is necessary to crush the necessary amount of the conductive particles. Therefore, the crimping device that heat-presses the workpiece must apply a relatively large load to the workpiece. However, if a large load is applied to the workpiece, the workpiece may be displaced from each other. Thus, the positions of the leads to be connected to each other are also shifted, resulting in defective products.

In order to cope with this situation, it is conceivable to gradually increase the crimping device from a small pressure that is less likely to deviate to a pressure required to ensure conductivity. However, in this case, it takes time until the final completion of the crimping, and the heating time becomes long, so that the positional displacement between the leads due to the expansion of the thermal expansion of the workpiece is also caused.

The present invention has been made to solve the above-described problems, and an object of the invention is to provide a pressure bonding apparatus that can heat and pressure a pair of workpieces in a short time via an anisotropic conductive member and prevent displacement between the workpieces. [Technical means to solve the problem]

In order to achieve the object, the pressure bonding apparatus of the present invention includes a crimping portion that heat-bonds a portion of the pair of workpieces having electrical conductivity via an anisotropic conductive member having a thermosetting resin as a substrate, the crimping The portion includes: a pressurizing member that pressurizes at least one of the pair of workpieces; a heating portion that heats the pressurizing member; and a pressure adjusting portion that pressurizes the heated portion The member pressurizes the workpiece at a first pressure that is lower than a pressure required to ensure electrical conductivity of the anisotropic conductive member, and melts the substrate with heat, and During the period in which the substrate is hardened and the bondable hardness is maintained, the workpiece is pressurized by a second pressure required to ensure conductivity.

The pressure adjusting unit may switch from the first pressure to the second pressure within a predetermined time from the start of pressurization of the workpiece by the pressing member. The prescribed time may be from 0.2 seconds to 1 second.

The first pressure may be less than a quarter of the second pressure.

The pressure adjusting portion may include a pressurized source of the second pressure, and a driving mechanism that drives the pressing member in a direction of contacting and moving away from the workpiece together with the pressurized source.

The first pressure may be set to be lower than a pressure capable of crushing the substrate in a molten state. [Effects of the Invention]

According to the present invention, a pair of workpieces are heated and crimped in a short time via an anisotropic conductive member, and offset between the workpieces can be prevented.

Embodiments of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings.

[Cramping Object] The first workpiece 1 and the second workpiece 2 and the ACF 3 which are the pressure bonding targets of the present embodiment will be described with reference to Fig. 1 (A), Fig. 1 (B) and Fig. 2 . The first workpiece 1 is a display panel having a display area such as a liquid crystal display or an organic EL display. Such a display panel has a case where a plurality of second workpieces 2 are pressure-bonded as shown in FIG. 1(A) and a case where a single second workpiece 2 is pressure-bonded as shown in FIG. 1(B). In the present embodiment, an example in which a plurality of workpieces 2 are pressure-bonded will be described.

As shown in FIG. 2, a lead 11 as a conductive portion is provided on the side of the first workpiece 1. Each lead 11 is connected to a circuit in the display area via a signal line. The lead wires 11 are arranged in a plurality of rows at predetermined intervals (pitch p). The plurality of leads 11 have a pitch p (the distance between the center lines) of at most 40 μm or less.

As shown in FIG. 1(A), the second workpiece 2 is an electronic component joined to the first workpiece 1 via the ACF 3. COF (chip on film) is used for electronic parts. The COF is, for example, a member in which a driver IC is mounted on a flexible sheet using a flexible resin and a printed wiring is formed.

As shown in FIG. 2, a lead 21 as a conductive portion is provided on one side of the second workpiece 2. The lead 21 is a portion for electrically connecting with the lead 11 of the first workpiece 1. Each lead 21 is connected to the driver IC via a signal line. The lead wires 21 are arranged in a plurality of rows at predetermined intervals. For the lead 11 of the first workpiece 1 and the lead 21 of the second workpiece 2, it is necessary to determine the correspondence relationship to be connected to each other, and to press the corresponding lead 11 and the lead 21 so as to be aligned with each other. Therefore, the intervals of the lead wires 11 and the leads 21 are also uniform. This is uniform as long as the electrical conductivity between the corresponding lead wires 11 and the lead wires 21 can be ensured, and the insulation properties of the adjacent lead wires 11 and the lead wires 21 can be ensured.

ACF 3 is an anisotropic conductive member, and is a film in which conductive particles 32 are dispersed in a base material 31 and formed into a film shape (see FIG. 5(A)). As the substrate 31, a thermosetting resin which is hardened by heating can be used.

When the ACF 3 is pressed between the second workpiece 2 and the first workpiece 1 while being heated, the conductive particles 32 located between the lead 21 and the lead 11 are held by the lead 11 and the lead 21 and pressed. In the meantime, the electrical conductivity in the thickness direction of the lead 21 and the lead 11 and the insulating property in the surface direction are achieved (see FIG. 5(B)). Further, the thermosetting resin of the substrate 31 is cured by heating, and the second workpiece 2 is adhered to the first workpiece 1. That is, the electrical connection between the lead 11 and the lead 21 and the mechanical connection of the first workpiece 1 and the second workpiece 2 can be achieved by heating and crimping.

(Cause of the offset) If the second workpiece 2 is heated and pressed onto the first workpiece 1 via the ACF 3 as described above, there may be a surface orientation between the first workpiece 1 and the second workpiece 2. The situation of positional offset. As a result of intensive studies, the inventors found that the positional shift is due to the fact that the thermosetting resin is temporarily melted and hardened before being hardened by heating, and then hardens. In other words, when the high pressure is applied in the stage where the hardness of the base material 31 is melted and the crosslinking reaction before the start of the crosslinking reaction is lowered, the base material 31 easily flows and is unstable, so that the lubricant is sandwiched between the workpieces 1 and 2 Sliding easily occurs, and as a result, a deviation in the plane direction occurs between the workpieces 1 and 2. Therefore, it has been found that the problem can be solved by applying a high pressure at the start of hardening, that is, after the start of the crosslinking reaction, at least after the thermosetting resin is melted.

However, when the thermosetting resin is hardened and the hardness is high, it becomes impossible to adhere. Therefore, it is necessary to apply a high pressure during the period after the start of hardening and the viscosity due to melting. After the thermosetting resin is melted by heating and starts to be hardened, the time for which the hardness between the workpieces can be adhered is maintained to be extremely short. Therefore, after the melting of the thermosetting resin is started by the pressurization of the low pressure, the high pressure is not switched in a very short period of time, and the offset and the adhesion cannot be prevented.

In the present embodiment, as will be described later, the pressing member 51 heated by the heating unit 52 pressurizes the second workpiece 2 at a first pressure lower than the pressure required to ensure conductivity, and passes through the second workpiece 2 in this state. The substrate 31 is melted by heat. Then, during a period in which the molten base material 31 starts to harden due to heat and maintains the bondable hardness, the first pressure is switched to a second pressure required to ensure conductivity, so that the pressing member 51 The second pressure pressurizes the second workpiece 2. This effectively achieves prevention of offset and adhesion. Hereinafter, the details of this embodiment will be described.

[Configuration] The configuration of the pressure bonding device 40 of the present embodiment will be described with reference to Figs. 3, 4(A) and 4(B). In addition, in FIG. 3, the direction between the front and the inner lining is the Y direction, the direction orthogonal to the horizontal direction is the X direction, the vertical direction is the Z direction, and the horizontal rotation direction is θ. direction. The crimping device 40 has a crimping portion 50, a pressure receiving portion 60, a support portion 70, and a control device 80.

The crimping portion 50 is a component that heats and bonds the lead wires 11 and the lead wires 21 of the first workpiece 1 and the second workpiece 2 via the ACF 3 . The crimping portion 50 has a pressing member 51, a heating portion 52, and a pressure adjusting portion 53. Further, the second workpiece 2 is described in the form of a state in which the temporary crimping device disposed in the previous step of the crimping device 40 is temporarily pressed against the first workpiece via the ACF 3, and supplied thereto. Crimp device 40.

The pressing member 51 is a member that pressurizes the second workpiece 2. The pressing member 51 has a substantially rectangular parallelepiped shape elongated in the Y direction, and has a length capable of collectively heating and crimping (so-called formal pressure bonding) of the plurality of second workpieces 2 that have been temporarily pressed against the first workpiece 1. A pressurizing portion 51a that protrudes in a strip shape is provided on a surface of the pressing member 51 that faces the second workpiece 2. This pressurizing portion 51a has a flat pressing surface that faces the second workpiece 2 in parallel.

Further, although not shown in FIG. 3, as shown in FIG. 4(A), a cushion sheet B is inserted between the pressing member 51 and the second workpiece 2. The cushion sheet B is a sheet for cushioning, is wound around a supply reel (not shown), and is sent out by rotation, and is taken up on a take-up reel and collected.

The heating unit 52 is a member that heats the pressing member 51. The heating unit 52 is built in the pressing member 51. The heating unit 52 uses, for example, a heater that generates heat by applying a voltage. The heater is embedded in a plurality of equal intervals in the pressing member 51 on the back of the pressurizing portion 51a.

The pressure adjusting portion 53 pressurizes the second workpiece 2 with the pressing member 51 heated by the heating portion 52 at a first pressure lower than the pressure required to ensure the conductivity of the ACF 3, and heats the substrate of the ACF 3 with heat. 31 is melted, and during the period in which the adhesive strength is maintained after the base material 31 starts to harden, the second workpiece is pressurized with a second pressure required to ensure conductivity.

The "pressure required to ensure conductivity" is a pressure at which the conductive particles 32 are crushed to obtain electrical conductivity between the lead 11 of the first workpiece 1 and the lead 21 of the second workpiece 2. Regarding the lower first pressure, for example, it is conceivable to set it to be less than a quarter of the second pressure. Further, the first pressure is preferably a pressure at which the base material 31 is not crushed and the thickness thereof can be maintained even when the base material 31 is melted and the hardness is minimized. Such a first pressure and a second pressure may be obtained by an experiment or the like. "Starting of hardening of the substrate 31" is after the time when the hardness is minimized. The so-called "maintaining the bondable hardness" is a bondable viscosity, which means that it is within the range of the hardenability of adhesion.

The pressure adjustment unit 53 has a pressure source 55 and a drive mechanism 56. The pressurized source 55 is a device that applies pressure to the pressing member 51. In the present embodiment, the pressurizing source 55 serves as a source of the first pressure and the second pressure. The pressurized source 55 uses, for example, a cylinder that generates pressure by the action of compressed air. The pressurized source 55 has a working rod 55a that applies pressure by linear motion. The operating rod 55a is advanced and retracted in the Z direction by the pressurizing source 55. Further, the pressure source 55 is provided with a pressure sensor 55b that detects the pressure applied to the second workpiece 2.

Further, the operating lever 55a is coupled to the pressing member 51 via the lifting block 55c. The lifting block 55c is a member having a rectangular parallelepiped shape, and is raised and lowered as the operating rod 55a advances and retracts, so that the pressing member 51 moves up and down.

The drive mechanism 56 is a mechanism that drives the pressing member 51 in a direction of contacting and moving away from the second workpiece 2 together with the pressurized source 55. The drive mechanism 56 has a frame body 561, a motor 562, a ball screw 563, a nut member 564, a bottom plate 565, a guide rail 566, and a guide rail 567.

The casing 561 is a box-shaped member that is fixed to a cover or the like of the pressure bonding device 40 (not shown). The motor 562 is a drive source fixed to the upper portion of the housing 561. The ball screw 563 is supported so as to be disposed inside the casing 561 in the Z direction and to rotate around the shaft. The nut member 564 is a member that moves up and down along the ball screw 563 by the rotation of the ball screw 563. The nut member 564 protrudes from a window formed on the side surface of the frame 561.

The bottom plate 565 is a member that extends in the Z direction and supports the lifting block 55c together with the pressurized source 55. The bottom plate 565 is mounted on a nut member 564 that protrudes from the frame 561. The guide rail 566 is a rail provided on the bottom plate 565 in the Z direction, and supports the lift block 55c so as to be slidably movable. The guide rail 567 is a rail provided on the casing 561 in the Z direction, and supports the bottom plate 565 so as to be slidably movable.

The pressure receiving portion 60 is a member that sandwiches the second workpiece 2 and the first workpiece 1 between the pressing portion 51a of the pressing member 51. The pressure receiving portion 60 is a substantially rectangular parallelepiped member that is freely movable up and down by a lifting mechanism (not shown), and has a length equivalent to that of the pressing member 51. This pressure receiving portion 60 has a support portion 61 and a heating portion 62. The support portion 61 is provided on a surface facing the pressurizing portion 51a, and extends in the Y direction, that is, in the side direction of the first workpiece 1, and protrudes in a strip shape. The support portion 61 has a receiving surface of a flat surface that faces the pressing surface of the pressurizing portion 51a.

When the pressure receiving portion 60 is set to the rising position, the receiving surface of the support portion 61 has the same height as the lower surface of the first workpiece 1 supported by the platform 71 to be described later. Further, the pressure receiving portion 60 can also be moved so that the receiving surface of the support portion 61 has the same height as the lower surface of the first workpiece 1.

The heating unit 62 is a member that is built in the pressure receiving portion 60 and heats the support portion 61. The heating unit 62 uses, for example, a heater that generates heat by applying a voltage. The heating unit 62 is embedded in a plurality of equal intervals in the pressure receiving portion 60 on the back of the support portion 61.

The support unit 70 is a device that supports the first workpiece 1. The support unit 70 has a platform 71 and a mobile device 72. The stage 71 is a flat stage that supports the first workpiece 1 in the horizontal direction. A plurality of holes, which are not shown but connected to a vacuum source, are formed in the stage 71, so that the first workpiece 1 can be adsorbed and held. The mobile device 72 is a device that supports the platform 71 to move freely in the X direction, the Y direction, and the θ direction.

The support unit 70 receives the first workpiece 1 in which the second workpiece 2 is temporarily pressed via the ACF 3 from the previous step such as the temporary pressure bonding device, and moves the first workpiece 1 so as to come to the first pressurizing unit 51a. The two workpieces 2 are crimped to the crimping position on the first workpiece 1. Further, the support unit 70 delivers the first workpiece 1 that has completed the pressure bonding operation to a subsequent process such as the substrate storage device.

The control device 80 is a device that controls the crimping device 40. The control device 80 is constituted by, for example, a dedicated electronic circuit or a computer that operates in accordance with a predetermined program. That is, the operation of the pressure bonding device 40 is controlled by operating the motor 562, the pressure source 55, the heating unit 52, the heating unit 62, the moving device 72, and the like. The timing of the operation of the motor 562, the number of revolutions, the timing and pressure of the operation of the pressure source 55, the heating temperature of the heating unit 52 and the heating unit 62, and the operation of the moving device 72, etc., are programmed and programmed by the programmable logic. A processing device such as a controller (Programmable Logic Controller, PLC) or a central processing unit (CPU) executes the program to cope with various types of the first workpiece 1, the second workpiece 2, and the ACF 3 to be crimped. Style.

As shown in FIG. 6, the control device 80 includes a detecting unit 81, a pressure control unit 82, a first temperature control unit 83, a second temperature control unit 84, a mechanism control unit 85, a storage unit 86, a setting unit 87, and input and output. Control unit 88. The detecting unit 81 detects the pressing of the second workpiece 2 by the pressing member 51 based on the signal from the pressure sensor 55b.

The pressure control unit 82 outputs an instruction signal to the pressure adjustment unit 53 in accordance with a signal from the pressure sensor 55b and a set timing and pressure, thereby controlling the pressure contact operation between the second workpiece 2 and the first workpiece 1. More specifically, the driving mechanism 56 instructs the raising and lowering timing of the pressurizing source 55, the lifting speed, the pressurizing timing of the pressurizing source 55, and the pressing force so that the pressure adjusting unit 53 operates as described above.

The first temperature control unit 83 outputs a signal indicating that the temperature of the heating unit 52 is the curing temperature of the base material 31 of the ACF 3 . This hardening temperature is a temperature required to thermally harden the substrate 31, and is, for example, 200 °C. The second temperature control unit 84 outputs a signal indicating that the temperature of the heating unit 62 is the temperature of the auxiliary heating unit 52. This temperature is, for example, 80 °C.

The mechanism control unit 85 operates the pressure source 55, the motor 562, the heating unit 52, the heating unit 62, and the moving device 72 in accordance with an instruction from the pressure control unit 82. When the pressurizing source 55 is an air cylinder, the mechanism control unit 85 controls the pressure of the compressed air supplied to the cylinder. The storage unit 86 stores information necessary for the control of the present embodiment. The information stored in the storage unit 86 includes the timing of the operation of the motor 562, the timing of operation of the pressurized source 55, the pressing force, the heating temperature of the heating unit 52 and the heating unit 62, and the timing of releasing the pressure contact. Further, the various timings can be controlled, for example, by the time from the start of pressing of the pressing member 51 detected by the pressure sensor 55b.

The setting unit 87 is a processing unit that sets information input from the outside in the storage unit 86. The input/output control unit 88 is an interface for controlling signal exchange or input and output with each unit that is a controlled object.

Further, the input device 91 and the output device 92 are connected to the control device 80. The input device 91 is an input mechanism for a switch, a touch panel, a keyboard, a mouse, and the like for operating the crimping device 40 via the control device 80 by an operator. The operator can input the desired timing, pressure, temperature, and the like using the input device 91.

The output device 92 is an output device such as a display, a lamp, or an instrument that sets information for confirming the state of the device to a state visible to the operator. For example, the output device 92 can display an input screen of information from the input device 91. In this case, as shown in FIG. 7 described later, information can be input by displaying a map and inputting a numerical value or selecting it in the map.

[Operation] Next, an operation example of the present embodiment will be described with reference to Figs. 7 and 8 in addition to Fig. 1(A) and Figs. 1(B) to 6 . Fig. 7 is a view showing the amount of time-lapse operation of each unit. The horizontal axis is the same as time (sec). The vertical axis indicates the relative displacement amount of each of the base material 31 of the ACF 3, the heating temperature, the pressure of the pressure source 55, and the position of the bottom plate 565 in the height direction. The lower the hardness, the lower the hardness, and the lower the hardness, and the higher the hardness, the higher the viscosity and the lower the adhesion. The height of the bottom plate 565 is further described in the lower drawing. Even after the pressing surface of the pressurizing portion 51a abuts against the second workpiece 2 at t1, the bottom plate 565 continues to descend until reaching the height h at t4. Fig. 8 is a flow chart showing the procedure of the heating and pressure bonding operation of the embodiment.

First, the first workpiece 1 to which the second workpiece 2 is temporarily pressed via the ACF 3 is placed on the stage 71 of the support portion 70, and the first workpiece 1 and the second workpiece 2 are brought to the crimping position by the moving device 72. Then, the pressure receiving portion 60 is raised, and the receiving surface of the support portion 61 comes to a position in contact with the lower surface of the first workpiece 1. Further, the pressing member 51 and the support portion 61 are heated by the heating portion 52 and the heating portion 62, respectively.

In this state, from the time t0 of Fig. 7, the pressing member 51 starts to descend by the operation of the drive mechanism 56 (step 101). At t1, the pressing surface of the pressurizing portion 51a is in contact with the second workpiece 2 via the buffer sheet B. Therefore, as shown in Fig. 4(B), the lowering of the pressing member 51 is supported by the lower surface of the first workpiece 1. The support portion 61 is stopped. Based on the signal from the pressure sensor 55b, the detecting portion 81 detects the pressing of the second workpiece 2 by the pressing member 51 (YES in step 102).

At this time, although the pressing force of the pressurizing source 55 as the cylinder is set to be constant, the pressing member 51 is connected to the operating rod 55a of the pressurizing source 55. Therefore, the drive mechanism 56 continues the lowering operation, whereby the operating lever 55a is pressed into the cylinder. Thereby, as shown in FIG. 7, the first workpiece 2 is given the first pressure. This pressure is the first pressure that is lower than the pressure required to ensure the electrical conductivity of the ACF 3. Here, it is also conceivable that the first pressure is smaller than the pressure given by the total weight of the pressing member 51 and the lifting block 55c. In this case, it is only necessary to apply a force in the lifting direction to the lifting block 55c by the pressure source 55 only by the difference between the pressure due to its own weight and the first pressure. In other words, the pressurizing source 55 includes a force that is lifted upward by a force smaller than the total weight of the pressurizing member 51 and the elevating block 55c, and functions as a source of pressure.

On the other hand, since the pressing surface of the pressurizing portion 51a gradually approaches the second workpiece 2 from t0, the base material 31 of the ACF 3 is heated by the heating of the heating portion 62 of the support portion 61 and the radiant heat from the pressurizing portion 51a. When heating, the temperature starts to rise, and if the pressing surface comes into contact with the second workpiece 2 at t1, the temperature rises abruptly. In this process, the base material 31 starts to melt and the hardness gradually decreases. At t2, for example, when 0.2 seconds elapses from t1, the hardness is reached to the lowest state, and then hardening starts. However, the time t2 until the hardness reaches the minimum differs depending on the type of the base material 31. Thus, before the hardening of the substrate 31 is started, the pressure applied to the second workpiece 2 is a low first pressure, so that the molten substrate 31 is not crushed, thereby preventing the melted substrate 31 from being destroyed. The offset of the lead 21 and the lead 11 caused by the sliding of the second workpiece 2 relative to the first workpiece 1 is easily generated.

After the hardening starts at t2, the pressure of the pressurized source 55 is raised at t3. In other words, the timing of the predetermined time elapses from the start of the pressing (t1) (YES in step 103) increases the pressure of the pressurized source 55 (step 104). The prescribed time is, for example, 0.5 seconds. Thereby, the second pressure required to ensure the conductivity of the ACF 3 rises at t4. Thus, the time t4 at which the second pressure is reached is between the start of hardening of the base material 31 (t2), and between the viscous t5 at which the second workpiece 2 can be adhered to the first workpiece 1. That is, the term "maintaining the bondable hardness" means having adhesiveness that can be adhered. In the case of FIG. 7, the period between t2 and t5 is, for example, a period from 0.2 second to 1 second from the start of pressing (t1).

At t4, the drive mechanism 56 stops the lowering operation. Thereby, as shown in FIG. 5(B), the conductive particles 32 are crushed, and the electrical conductivity of the lead 21 and the lead 11 is ensured, and electrical connection is established. Then, the base material 31 is further hardened to complete the heating and pressure bonding, that is, it is hardened until the time t6 before the pressure-bonding time is reached, and the second workpiece 2 is joined to the first workpiece 1 to establish a mechanical connection.

When the predetermined pressure contact time elapses from the start of t1, that is, the timing of the pressing (YES in step 105), the drive mechanism 56 raises the pressure source 55, whereby the pressing member 51 rises and the pressurization of the second workpiece 2 is released. (Step 106). The crimping time is, for example, 5 seconds.

[Effects and Effects] (1) According to the above embodiment, the lead wires 11 of the first workpiece 1 and the lead wires 21 of the second workpiece 2 are crimped by ACF 3 with a thermosetting resin as the base material 31. Portion 50, the crimping portion 50 has a pressing member 51, a heating portion 52, and a pressure adjusting portion 53, which presses the second workpiece 2 onto the first workpiece 1, and the heating portion 52 pressurizes The member 51 is heated, and the pressure adjusting portion 53 pressurizes the second workpiece 2 at a first pressure lower than a pressure required to ensure the conductivity of the ACF 3 by the pressing member 51 heated by the heating portion 52, and utilizes The substrate 31 is melted by heat, and the second workpiece 2 is pressurized with a second pressure required to ensure conductivity during a period in which the adhesive strength is maintained after the substrate 31 starts to harden.

Therefore, during the period in which the positional deviation between the first workpiece 1 and the second workpiece 2 is likely to occur due to the melting of the thermosetting resin, the positional deviation can be prevented by pressurizing at a low pressure, and the thermosetting resin can be started. After the hardening is less likely to cause a positional shift, a pressure is applied to crush the conductive particles to ensure conductivity. In addition, since high pressure is applied during the period in which the bondable hardness is maintained, there is no problem in mechanical connection. Therefore, since the pressure is not gradually increased to ensure the conductivity, but is switched from the first pressure to the second pressure in a very short time, the crimping time is shortened, and the lead wires 11 and the leads 21 due to thermal expansion can be prevented. The position is offset.

(2) The pressure adjusting unit 53 switches from the first pressure to the second pressure within a predetermined time from the start of the pressurization of the second workpiece 2 by the pressing member 51. The switching timing can be obtained by experiments or the like. For example, in the period in which the base material 31 starts to harden after the heated pressing member 51 starts to pressurize, and the time required for bonding is maintained, the first workpiece 1 is obtained even if the second pressure is applied. The timing of the two workpieces 2 does not shift. The pressure adjustment unit 53 controls the switching pressure accordingly, thereby preventing the offset.

(3) According to the experiment of the inventors, the substrate 31 starts to harden after the pressing of the pressing member 51, and the period of the adhesive required for the adhesion is 0.2 second to 1 second. In this case, the time (switching time) from the time when the pressing is started to the time of switching to the second pressure can be set to be between 0.2 seconds and 1 second. More preferably, the switching time is set to be between 0.5 seconds and 1 second to give a second pressure. By setting in this way, positional deviation can be prevented.

(4) The first pressure is less than a quarter of the second pressure. Therefore, before the base material 31 is melted and starts to be hardened, it is set to have a very low pressure compared with the pressure for ensuring conductivity, and positional displacement can be reliably prevented. More specifically, the first pressure is a pressure that does not crush the base material 31 in a molten state, in other words, a pressure that maintains the shape of the base material 31 in a molten state. Therefore, the molten base material 31 is not crushed during the period before the second pressure is applied, so that the first workpiece 1 and the second workpiece 2 which are easily generated when the molten substrate 31 is crushed can be prevented. The positional offset between. As a result, the crimping accuracy of the first workpiece 1 and the second workpiece 2 can be improved.

(5) The pressure adjusting portion 53 has the pressing source 55 of the second pressure, and the driving mechanism 56 that drives the pressing member 51 in the direction of contacting and moving away from the second workpiece 2 together with the pressing source 55. Therefore, after the pressing member 51 is pressed against the second workpiece 2 by the driving mechanism 56 and the first pressure is applied, the pressing member 51 is pressurized by the pressurizing source 55 to apply the second pressure at the timing. . Therefore, the pressurizing source 55 can switch the pressure from a certain state to the rise only at a predetermined timing, and therefore can accurately control the switching from the first pressure to the case where the pressure rise trend is changed midway by the single pressurizing source 55. The timing of the second pressure.

(6) The conductive portion of the pair of workpieces is a plurality of leads 11 and leads 21, and the pitch p of the plurality of leads 11 and leads 21 is at most 40 μm or less. As described above, even if the first workpiece 1 and the second workpiece 2 are high-definition parts, the electrical conductivity of the corresponding leads and the insulation of the non-corresponding leads can be reliably ensured.

[Modification] (1) The pressure adjustment unit 53 is not limited to the form in which the pressure is adjusted by the combination of the pressure source 55 and the drive mechanism 56. It may be in the form of adjusting the pressure using only the pressurized source 55. The pressurizing source 55 may be a hydraulic cylinder, a ball screw mechanism or the like in addition to the pneumatic cylinder.

(2) The first workpiece 1 may be set to a member having a conductive portion other than the display panel. The portion having conductivity is not limited to the plane of the first workpiece 1, but may be the side surface of the first workpiece 1. For example, the first workpiece 1 may be a square substrate, and the lead may be exposed on the side surface thereof. In this case, the pressure receiving portion 60 that sandwiches the second workpiece 2 and the first workpiece 1 may not be provided on the side facing the crimping portion 50.

The material of the substrate of the second workpiece 2 is not limited to a flexible substrate made of resin. A glass substrate can also be used for the second workpiece 2. The first workpiece 1 can also use a resin-made flexible substrate instead of a glass substrate.

(3) In the form, a plurality of pressing members 51 of a long strip are used, and a plurality of second workpieces 2 temporarily pressed against one side of the first workpiece 1 are integrally crimped. However, the form of the final pressure bonding is not limited thereto, and a configuration may be adopted in which a plurality of pressurizing surfaces of the pressing member 51 corresponding to the second workpiece 2 are arranged one by one. The configuration in which the pressure source 55 or the like applies pressure to the pressing member 51 may be provided one by one corresponding to the plurality of pressing members 51.

In addition, the form forms a plurality of second workpieces 2 that are formally crimped on one side of the first workpiece 1, but can also be applied to formally crimp a single second workpiece 2 as shown in FIG. 1(B). A form on one side of a workpiece 1. Further, it is also applicable to a form in which one or a plurality of second workpieces are formally crimped to a plurality of sides of the first workpiece 1.

Further, the receiving side supporting the second workpiece 2 may have a configuration in which the first workpiece 1 is set to be pressurized, or may be pressurized from both the first workpiece 1 and the second workpiece 2. Composition.

(4) In the above-described form, the interval between the leads 11 of the first workpiece 1 coincides with the interval of the leads 21 of the second workpiece 2, and the interval between the two is not limited to the state before the workpieces 1, 2 are heated and crimped to each other. Consistently, it also includes predicting thermal expansion so that the intervals of the leads 11 and the leads 21 of the two workpieces 1, 2 are formed differently so that the intervals are uniform after the heat crimping.

[Other Embodiments] The embodiments of the present invention and the modifications of the respective embodiments have been described above. However, the embodiments and the modifications of the respective embodiments are presented as examples, and are not intended to limit the scope of the invention. The various embodiments described above can be implemented in various other forms, and various omissions, substitutions and changes can be made without departing from the scope of the invention. The invention or its modifications are included in the scope or spirit of the invention and are included in the invention described in the patent application.

1‧‧‧First workpiece

2‧‧‧second workpiece

3‧‧‧ACF

11, 21‧‧‧ lead

31‧‧‧Substrate

32‧‧‧Electrical particles

40‧‧‧Crimping device

50‧‧‧ crimping department

51‧‧‧ Pressurized components

51a‧‧‧Pressure

52, 62‧‧‧ heating department

53‧‧‧ Pressure Adjustment Department

55‧‧‧pressure source

55a‧‧‧Working rod

55b‧‧‧pressure sensor

55c‧‧‧ lifting block

56‧‧‧ drive mechanism

60‧‧‧pressure bearing department

61‧‧‧Support

70‧‧‧Support Department

71‧‧‧ platform

72‧‧‧Mobile devices

80‧‧‧Control device

81‧‧‧Detection Department

82‧‧‧ Pressure Control Department

83‧‧‧First Temperature Control Department

84‧‧‧Second Temperature Control Department

85‧‧‧Institutional Control Department

86‧‧‧ Storage Department

87‧‧‧Setting Department

88‧‧‧Input and Output Control Department

91‧‧‧ Input device

92‧‧‧ Output device

101, 102, 103, 104, 105, 106‧‧‧ steps

561‧‧‧ frame

562‧‧‧Motor

563‧‧‧Ball screw

564‧‧‧ nut components

565‧‧‧floor

566, 567‧‧‧ rails

B‧‧‧buffer

H‧‧‧height

P‧‧‧ spacing

Starting point of t0‧‧

Time t1, t2, t3, t4, t5, t6‧‧

X, Y, Z, θ‧‧‧ directions

1(A) and 1(B) are perspective views showing a workpiece that is pressure-bonded by an embodiment. Fig. 2 is a plan view showing a lead of a workpiece which is pressure-bonded by an embodiment. Fig. 3 is a partial cross-sectional side view showing a basic configuration of a pressure bonding device according to an embodiment. 4(A) and 4(B) are schematic side views showing a heat-pressure-bonding portion of the embodiment of Fig. 3. 5(A) and 5(B) are cross-sectional views showing a pressure contact portion of the workpiece and the ACF of the embodiment of Fig. 3. Fig. 6 is a block diagram showing a control device of the embodiment of Fig. 3; Fig. 7 is a graph showing changes in pressure, temperature, height, and hardness of a substrate over time. Fig. 8 is a flow chart showing the procedure of thermocompression bonding in the embodiment.

Claims (5)

A crimping device comprising a crimping portion that heat-presses a portion of a pair of workpieces having conductivity via an anisotropic conductive member having a thermosetting resin as a substrate, the crimping portion including a pressing member that pressurizes at least one of the pair of workpieces; a heating portion that heats the pressing member; and a pressure adjusting portion that causes the pressing member heated by the heating portion Pressurizing the workpiece at a first pressure that is lower than a pressure required to ensure electrical conductivity of the anisotropic conductive member, and melting the substrate with heat, and at the base During the period during which the hardening of the material is maintained, the second pressure required to ensure electrical conductivity pressurizes the workpiece, and the first pressure is a quarter of the second pressure. One or less. The pressure bonding device according to claim 1, wherein the pressure adjusting portion switches the first pressure to the first time within a predetermined time from the start of pressurization of the workpiece by the pressing member Two pressures. The crimping device according to claim 2, wherein the predetermined time is from 0.2 second to 1 second. The crimping device according to any one of claims 1 to 3, wherein the pressure adjusting portion includes: a pressurizing source of the second pressure; and a driving mechanism, and the pressurizing source Together in the direction of contact and away from the workpiece The pressing member is driven up. The crimping device according to any one of claims 1 to 3, wherein the first pressure is set to be lower than a pressure capable of crushing the substrate in a molten state, and is even The substrate is not crushed in a state where the substrate is melted and the hardness is minimized, and the pressure of the thickness thereof can be maintained.