TWI663487B - 微影設備及物品製造方法 - Google Patents

微影設備及物品製造方法 Download PDF

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Publication number
TWI663487B
TWI663487B TW106104126A TW106104126A TWI663487B TW I663487 B TWI663487 B TW I663487B TW 106104126 A TW106104126 A TW 106104126A TW 106104126 A TW106104126 A TW 106104126A TW I663487 B TWI663487 B TW I663487B
Authority
TW
Taiwan
Prior art keywords
substrate
original plate
lithographic apparatus
electrode
patent application
Prior art date
Application number
TW106104126A
Other languages
English (en)
Chinese (zh)
Other versions
TW201740222A (zh
Inventor
米川雅見
Masami Yonekawa
Original Assignee
日商佳能股份有限公司
Canon Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能股份有限公司, Canon Kabushiki Kaisha filed Critical 日商佳能股份有限公司
Publication of TW201740222A publication Critical patent/TW201740222A/zh
Application granted granted Critical
Publication of TWI663487B publication Critical patent/TWI663487B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW106104126A 2016-02-17 2017-02-08 微影設備及物品製造方法 TWI663487B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-028297 2016-02-17
JP2016028297A JP6643135B2 (ja) 2016-02-17 2016-02-17 リソグラフィ装置および物品製造方法

Publications (2)

Publication Number Publication Date
TW201740222A TW201740222A (zh) 2017-11-16
TWI663487B true TWI663487B (zh) 2019-06-21

Family

ID=59561429

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104126A TWI663487B (zh) 2016-02-17 2017-02-08 微影設備及物品製造方法

Country Status (6)

Country Link
US (1) US10228624B2 (https=)
JP (1) JP6643135B2 (https=)
KR (1) KR102091908B1 (https=)
CN (1) CN107092163B (https=)
SG (1) SG10201700942WA (https=)
TW (1) TWI663487B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6732475B2 (ja) * 2016-02-29 2020-07-29 キヤノン株式会社 インプリント装置、物品の製造方法、保持装置および露光装置
US10722925B2 (en) * 2017-12-04 2020-07-28 Suss Micro Tec Photomask Equipment Gmbh & Co Kg Treatment head, treatment system and method for treating a local surface area of a substrate
US11376640B2 (en) * 2018-10-01 2022-07-05 Tokyo Electron Limited Apparatus and method to electrostatically remove foreign matter from substrate surfaces
US11506985B2 (en) * 2019-04-29 2022-11-22 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and method of operating the same for preventing photomask particulate contamination
JP7495814B2 (ja) * 2020-05-13 2024-06-05 キヤノン株式会社 インプリント装置、および物品の製造方法
US11567417B2 (en) * 2021-01-20 2023-01-31 Applied Materials, Inc. Anti-slippery stamp landing ring
KR102542639B1 (ko) * 2021-02-10 2023-06-12 성균관대학교산학협력단 미세 패턴 형성 장치 및 방법
KR102528880B1 (ko) * 2021-02-16 2023-05-03 성균관대학교산학협력단 전기수력학 불안정성을 이용한 패턴제작기술의 미세 구조체 사이의 2차 간섭효과에 의한 초미세구조체 제작 및 초소수성표면 형성방법
US12463042B2 (en) 2022-05-31 2025-11-04 Canon Kabushiki Kaisha Planarization system and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100068659A1 (en) * 2008-03-28 2010-03-18 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
US20120080820A1 (en) * 2010-10-04 2012-04-05 Canon Kabushiki Kaisha Imprinting method
TW201637742A (zh) * 2015-02-12 2016-11-01 應用材料股份有限公司 自身清潔的基板接觸表面

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000228439A (ja) * 1999-02-05 2000-08-15 Advantest Corp ステージ上のパーティクル除去方法及び清掃板
CN1222918C (zh) * 2001-08-27 2005-10-12 佳能株式会社 布线基板及使用该布线基板的图象显示装置
JP2008258490A (ja) * 2007-04-06 2008-10-23 Canon Inc 露光装置及び原版
US8125603B2 (en) * 2007-05-17 2012-02-28 Lg Display Co., Ltd. In-plane switching mode liquid crystal display device and method for fabricating the same
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
JP2009302234A (ja) * 2008-06-12 2009-12-24 Canon Inc 露光装置及びデバイス製造方法
JP2011040464A (ja) * 2009-08-07 2011-02-24 Canon Inc 異物除去装置、露光装置及びデバイス製造方法
JP5846572B2 (ja) * 2011-07-27 2016-01-20 ギガフォトン株式会社 チャンバ装置、極端紫外光生成装置および極端紫外光生成装置の制御方法
JP2013197465A (ja) * 2012-03-22 2013-09-30 Toshiba Corp 静電チャック装置および露光装置
DE102012017669A1 (de) * 2012-09-07 2014-03-13 Valeo Schalter Und Sensoren Gmbh Anordnung mit einem Verkleidungsteil und einem Radarsensor, Kraftfahrzeug und Verfahren zum Herstellen einer Anordnung
WO2014054749A1 (ja) 2012-10-04 2014-04-10 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6171412B2 (ja) 2013-03-06 2017-08-02 大日本印刷株式会社 インプリント方法、インプリント用のモールドおよびインプリント装置
JP2015149390A (ja) * 2014-02-06 2015-08-20 キヤノン株式会社 インプリント装置、型、および物品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100068659A1 (en) * 2008-03-28 2010-03-18 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
US20120080820A1 (en) * 2010-10-04 2012-04-05 Canon Kabushiki Kaisha Imprinting method
TW201637742A (zh) * 2015-02-12 2016-11-01 應用材料股份有限公司 自身清潔的基板接觸表面

Also Published As

Publication number Publication date
JP6643135B2 (ja) 2020-02-12
SG10201700942WA (en) 2017-09-28
CN107092163A (zh) 2017-08-25
KR20170096961A (ko) 2017-08-25
KR102091908B1 (ko) 2020-03-20
JP2017147343A (ja) 2017-08-24
CN107092163B (zh) 2020-12-29
US20170235234A1 (en) 2017-08-17
TW201740222A (zh) 2017-11-16
US10228624B2 (en) 2019-03-12

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