TWI663204B - Epoxy resin composition, electrical and electronic parts, and manufacturing method of electrical and electronic parts - Google Patents

Abstract

The present invention provides a resin composition, which is an epoxy resin composition used for ignition coils and the like, and is capable of obtaining electrical and electronic parts such as coil products with suppressed insulation breakdown under high voltage and the like and excellent reliability. The present invention relates to an epoxy resin composition and an electrical / electronic component 1. The epoxy resin composition contains (A) an epoxy resin, (B) an inorganic filler, and (C) a thermal cationic polymerization initiator as essential components. The electric / electronic component 1 includes an electric / electronic component element 2 and a resin hardened product 3 of the epoxy resin composition in which the electric / electronic component element 2 is sealed.

Description

Epoxy resin composition, electrical and electronic parts, and manufacturing method of electrical and electronic parts

The present invention relates to an epoxy resin composition, an electric / electronic part, and a method for manufacturing an electric / electronic part.

Previously, high impregnation and high electrical insulation properties were required for rail vehicle motors, rotating electric machines for generators, and coil products for various electrical machines. From this point of view, heat hardening is commonly used in the insulation treatment of coils. Resin composition, especially epoxy resin composition. For example, the acid-hardening epoxy resin composition is excellent in mechanical properties, electrical insulation, and high-voltage characteristics at high temperatures, and its performance can be improved by using it in the insulation treatment of a coil of a rotating electrical machine that applies large vibrations during operation. And reliability (for example, refer to Patent Document 1). However, since a high voltage is applied to a coil (for example, an ignition coil) used in various devices such as automobiles, if only a general epoxy resin composition is used, insulation may be insufficient and insulation damage may occur. In addition, cracks may occur in the sealing resin hardened material due to thermal stress or mechanical stress caused by a cooling cycle due to the sealing resin hardened material. If cracks occur in the sealing resin hardened material, when a current flows through the ignition coil, abnormal discharges or the like are generated in the cracked portions, and the ignition coil cannot be normally operated. Therefore, crack resistance is also required for hardened sealing resins. As a general method for improving the crack resistance of such a sealing resin hardened material, it is considered to add a large amount of silicon dioxide to the resin composition to reduce the coefficient of linear expansion. However, in this method, the gaps between the necessary copper wires are impregnated with the fine silica powder due to the impregnation with the liquid resin component. As a result, the resin composition is not impregnated between the secondary windings, resulting in poor insulation. In view of this situation, a two-liquid epoxy resin composition containing spherical silica with an average particle diameter of 2 μm or less, two types of anhydrides, a hardening accelerator, and an epoxy resin as constituent components is known (for example, refer to a patent) Reference 2). The purpose of the two-liquid epoxy resin composition is to provide an inorganic filler with less sedimentation during storage, low viscosity, excellent injection workability, small coefficient of linear expansion, excellent heat cycle resistance, and further heat resistance. Electronic machine. In addition, the present inventors have proposed a resin composition for impregnating a mold coil, which includes silicon dioxide having an average particle diameter of 10 to 30 μm and an average particle diameter of 0.01 to 1.5 μm in order to increase the dielectric breakdown voltage of a cured resin. Particles (see, for example, Patent Document 3). [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 10-60084 [Patent Literature 2] Japanese Patent Laid-Open No. 11-71503 [Patent Literature 3] Japanese Patent Laid-Open No. 2008-195782 Bulletin

[Problems to be Solved by the Invention] In addition, for recent ignition coils, the requirements for improving withstand voltage performance have become stricter. For example, the withstand voltage performance at room temperature (25 ° C) has been continuously improved to 28 MV / m or more and further to The voltage withstand performance under heating at about 100 ° C is also required to maintain characteristics above 20 MV / m. However, it has been difficult for the resin composition used so far to achieve such properties. Therefore, an object of the present invention is to provide a resin composition, which is an epoxy resin composition used for ignition coils and the like, and can obtain electrical and electronic products such as coil products with suppressed insulation breakdown under high voltage and the like and excellent reliability. Components. Another object of the present invention is to provide an electrical and electronic component having excellent reliability as described above and a method for manufacturing the same. [Technical means to solve the problem] The present inventors have made repeated efforts in order to solve the above problems, and as a result, have found that a resin composition is prepared by using a specific thermal cationic polymerization initiator for an epoxy resin to ensure the coil and the like. The electrical and electronic parts and components have high impregnation and excellent moldability, and can obtain a highly reliable hardened product with high thermal conductivity and high insulation breakdown voltage, and completed the present invention. That is, the epoxy resin composition of the present invention is characterized by containing (A) an epoxy resin, (B) an inorganic filler, and (C) a thermal cationic polymerization initiator as essential components. The electric / electronic part of the present invention includes an electric / electronic part element and a cured product of the epoxy resin composition of the present invention which seals the electric / electronic part element. Furthermore, the method for manufacturing an electric / electronic part of the present invention is characterized in that the electric / electronic part element is placed in a mold, and the casting epoxy resin composition of the present invention is injected into the mold and semi-hardened, and The semi-hardened epoxy resin composition for casting is taken out of the mold and completely hardened by post-hardening. [Effects of the Invention] According to the epoxy resin composition of the present invention, the following epoxy resin composition can be provided, which has high impregnation to electric and electronic components such as coils, and is suitable for molding by casting impregnation, And hardened products with high thermal conductivity and high insulation breakdown voltage can be obtained. According to the electrical and electronic parts and the manufacturing method thereof of the present invention, it is possible to obtain electrical and electronic parts with high thermal conductivity, high insulation breakdown voltage, and high reliability.

Hereinafter, the present invention will be described in detail with reference to an embodiment. The epoxy resin composition used in this embodiment contains (A) an epoxy resin, (B) an inorganic filler, and (C) a thermal cationic polymerization initiator as essential components. The (A) epoxy resin used in this embodiment is not particularly limited as long as it is an epoxy resin having two or more glycidyl groups (epoxy groups) in one molecule, and it is preferably a liquid one. Epoxy. Examples of such epoxy resins include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AD epoxy resin, novolac epoxy resin, glycidyl ester epoxy resin, and the like. Polyglycidyl ether, trifunctional phenol type epoxy resin, etc. These can be used individually by 1 type or in mixture of 2 or more types. In addition, when two or more types are mixed and used, it may be a liquid state when mixed. The (A) epoxy resin preferably contains an alicyclic epoxy resin. By using an alicyclic epoxy resin, the dielectric breakdown strength can be further improved. Usually, an alicyclic epoxy resin is preferably used in combination with other epoxy resins. For example, when 100 parts by mass of the (A) epoxy resin is used, 60 to 90 parts by mass relative to the bisphenol A type epoxy resin is used. The mixing ratio of 10 to 40 parts by mass contains an alicyclic epoxy resin. If the alicyclic epoxy resin is less than 10 parts by mass, the insulation failure strength at high temperature may not be improved, and shrinkage dents may be deteriorated. On the other hand, if it exceeds 40 parts by mass, the viscosity is reduced, and the filler is settled and stored stable. Risk of sexual damage. The inorganic filler (B) used in this embodiment can be used without particular limitation as long as it is an inorganic filler formulated into such a resin composition. Examples of the (B) inorganic filler include silicon dioxide, aluminum oxide, calcium carbonate, aluminum hydroxide, talc, and mica. Among these (B) inorganic fillers, it is preferable to use silicon dioxide. As the silicon dioxide used this time, any of crystalline silica and fused silica can be used. As the fused silica, broken fused silica, spherical fused silica, etc. can be used. . Examples of the crystalline silicon dioxide include CRYSTALITE A-AC, CRYSTALITE A-1, and CRYSTALITE C (the above are manufactured by Longsen Co., Ltd., trade names). Examples of the broken fused silica include: FUSELEX RD-8, FUSELEX RD-120, FUSELEX E-1, FUSELEX E-2, MSR-15, MSR-3500, TZ-20 (The above are the shares of Longsen Co., Ltd. Company manufacturing, trade name). Examples of the spherical fused silica include FB-5D and FB959 (the above are manufactured by DENKA Co., Ltd., trade names). In addition, the aragonite in the crystalline silicon dioxide can improve the dielectric breakdown strength of the hardened material when heated by containing the aragonite. In addition, the nature of the natural crushed cristobalite is crushed powder, which may be restricted in terms of workability and filling amount, and may hinder the reaction of the thermal cationic polymerization initiator. Therefore, it is preferable that the workability and formability are good In addition, the spherical cristobalite powder which inhibits the above reaction can be suppressed. The blending ratio of the (B) inorganic filler is preferably 30 to 80% by mass in the resin composition. If the (B) inorganic filler is less than 30% by mass, the hardenability may be poor, and it may be difficult to improve mechanical strength and crack resistance. If the inorganic filler is more than 80% by mass, the filler in the resin composition may settle, The viscosity increases, workability decreases, and impregnation with electrical and electronic parts and components may decrease. In addition, the (B) inorganic filler can be subjected to surface modification by adding a coupling agent to achieve better insulation reliability and mechanical strength of the hardened material. Examples of the coupling agent usable here include a silane-based coupling agent, a titanium-based coupling agent, and an aluminum-based coupling agent. The silane-based coupling agent is particularly preferred in terms of excellent properties such as moisture resistance. Examples of the silane-based coupling agent include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, methyltrimethoxysilane, and γ-aminopropyl Triethoxysilane, γ-aminopropyltrimethoxysilane, N-aminoethylaminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N 3- (4- (3-Aminopropoxy) butoxy) propyl-3-aminopropyltrimethoxysilane, these can be used alone or in combination of two or more. The (C) thermal cationic polymerization initiator used in this embodiment is a compound that generates a cationic species or a Lewis acid by heating, and a known thermal cationic polymerization initiator can be used. The thermal cationic polymerization initiator is preferably one having a polymerization initiation temperature of 60 ° C or higher and 160 ° C or lower. If the polymerization initiation temperature is extremely low, the time during which it can be used is shortened, resulting in poor workability. In addition, if the polymerization initiation temperature is relatively high, there is a possibility that damage may be caused to built-in electronic parts. The term "polymerization initiation temperature" as used herein refers to a temperature at which an acid is generated and is a temperature that is a reaction initiation temperature that has little effect on workability and parts. Examples of the (C) thermal cationic polymerization initiator include aromatic sulfonium salts such as benzylsulfonic acid, thienium salts, tetrahydrothienium salts, benzyl ammonium salts, pyridinium salts, &#166233; Among them, salts, carboxylic acid esters, sulfonic acid esters, and sulfonium imines, among them, aromatic sulfonium salts are preferred. As the (C) thermal cationic polymerization initiator, commercially available products can be used, and examples thereof include: San-Aid 60L, San-Aid 100L, San-Aid 150L, or Trade names "TA-100", "TA-120", "TA-160", etc. manufactured by San-Apro. The amount of the (C) thermal cation generator is preferably in the range of 0.5 to 1.5 parts by mass based on 100 parts by mass of the epoxy resin (A). If the blending amount is less than 0.5 parts by mass, the reactivity will be significantly slower, and the exothermic heat at high temperatures will cause shrinkage of the hardened material, which will easily cause strain or damage to electrical and electronic parts. On the other hand, if it exceeds 2.0 parts by mass, There is a possibility that the fluidity at the time of injection is reduced due to shortened service life, etc., and an unfilled portion may be generated. The epoxy resin composition for casting according to this embodiment uses the components (A) to (C) as essential components, and in order to improve the curing characteristics, a curing accelerator other than the (C) thermal cationic polymerization initiator may be further added. Examples of the hardening accelerator other than the (C) thermal cationic polymerization initiator that can be used here include aromatic dimethylurea, aliphatic dimethylurea, and 3- (3,4-dichlorophenyl). -1,1-dimethylurea (DCMU), 3- (3-chloro-4-methylphenyl) -1,1-dimethylurea, 2,4-bis (3,3-dimethylureido) Urea such as toluene; tertiary amine compounds such as benzyldimethylamine, 1,8-diazabicyclo (5.4.0) undecene-7, triethylamine; 2-ethyl-4-methylimidazole , 1-benzyl-2-methylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and other imidazole compounds ; Organic phosphine salt compounds such as triphenylphosphine salts and the like. These hardening accelerators may be used individually by 1 type, and may mix and use 2 or more types. The epoxy resin composition according to this embodiment uses the above-mentioned components (A) to (C) as an essential component, and it is preferable to prepare and mix two liquids of a main agent and a hardener and use them immediately before use. At this time, the main agent is based on the components (A) to (B) described above, and other components, such as polymerization inhibitors, pigments, dyes, and defoamers, may be added and blended as necessary and within a range not incompatible with the purpose of the present invention. Agents, leveling agents, coupling agents, and other ingredients. In addition, the curing agent contains (C) a thermal cationic polymerization initiator as a constituent. To the hardening agent, a hardening accelerator, and optionally a filler can be added. The usual reason for making two-liquid is to consider workability and service life. Next, an electric / electronic part using the epoxy resin of this embodiment and a manufacturing method thereof will be described. As shown in FIG. 1, the electric / electronic component of the present embodiment is an electric / electronic component 1 including an electric / electronic component element 2 such as a coil and an internal component, and a resin hardened material 3 which seals the electric / electronic component element 2. Here, the electric / electronic component element 2 includes a lead frame 2a. The electric / electronic component element 2 can be used without particular limitation as long as it is an electric / electronic component element that is targeted for resin sealing, such as coils and internal components. Moreover, the resin hardened | cured material 3 is a thing which sealed the electric and electronic component element 2 and hardened | cured the said epoxy resin composition. Next, a method for manufacturing an electric / electronic part according to this embodiment will be described. The electrical and electronic parts of the present embodiment can be manufactured by, for example, a known vacuum pressure impregnation treatment to produce electrical and electronic parts such as coils and internal components. This vacuum pressure impregnation process can be achieved, for example, by accommodating electrical and electronic component elements in a housing having an outer shape of the electrical and electronic components, and injecting the above-mentioned components into the electrical housing containing the electrical and electronic component elements. The resin composition according to the embodiment is sequentially subjected to a vacuum impregnation treatment (a reduced pressure impregnation treatment) and a pressure treatment. At this time, the vacuum impregnation treatment is preferably performed under the conditions of a temperature of 40 ° C. to 80 ° C., a pressure of 100 Pa to 450 Pa, and a processing time of 30 minutes to 120 minutes. The pressurization treatment is preferably performed under conditions of a pressure of 2 × 10 ⁵ Pa or more and 10 × 10 ⁵ Pa or less, and a time of 15 minutes or more and 120 minutes or less. Then, after the electrical and electronic parts and components subjected to the vacuum pressure impregnation treatment are returned to normal pressure, the resin composition can be heated and hardened to produce electrical and electronic parts. The heating at this time is preferably performed at a temperature of 60 ° C. to 200 ° C. for 5 minutes to 60 minutes. In addition, it is possible to use an E-LIM (Liquid Injection Molding) molding method which is easily manufactured in a mold without using a casing. The E-LIM molding method is an injection molding method in which a liquid resin composition is injected into a mold by pressing. By using this molding method, the hardening time of the resin in the previous casting method described above requires 5 to 10 hours can be molded in tens of minutes, which can greatly improve productivity. In this E-LIM forming method, productivity can be improved because it can be taken out of a mold after a short-term hardening reaction. Moreover, since most of the hardening can be performed by post-hardening, it is not necessary to set complicated forming hardening conditions in the forming stage. In this E-LIM molding method, first, a mold capable of forming the outer shape of the sealing resin of the electric / electronic component 1 by injecting a resin composition is prepared. Then, the electrical and electronic parts and components are arranged and fixed at a specific position in the mold. FIG. 2 is a view showing a state in which the resin composition is injected in the next step, and therefore description will be made with reference to FIG. 2. In order to arrange the electric / electronic component element 2 at a specific position as described above, it is only necessary to first place the electric / electronic component element 2 at a specific position of the lower mold 11 and cover the upper mold 12 from above. At this time, the main body of the electric / electronic component element 2 is placed in the center of the gap in the mold by the lead frame 2a. Then, the epoxy resin of the present embodiment described above is injected and injected into the mold, and is semi-hardened by heating. The injection molding mold used in this embodiment includes a lower mold 11 and an upper mold 12, and recesses 11a and 12a are formed in the lower mold 11 and the upper mold 12, respectively. The recessed portions 11 a and 12 a constitute a cavity 13. Further, a gate 14 which is a resin injection port communicating with the cavity 13 is provided on the upper mold 12, and an injection nozzle 15 for injecting a liquid epoxy resin composition 3a is connected to the gate 14. A liquid epoxy resin composition 3 a is injected from the injection nozzle 15 into the cavity 13 through the gate 14 to perform injection molding. At this time, injection of the epoxy resin composition is performed under conditions of a nozzle injection pressure of 2 to 6 MPa, a nozzle injection resin temperature of 30 to 60 ° C, and a molding time of 10 to 20 minutes. Moreover, as a temperature condition at the time of semi-hardening an epoxy resin composition, it is preferable that it is 70-100 degreeC with respect to a moderate temperature range, and it is preferable that it is about 5-25 minutes. If the temperature does not reach 70 ° C, the curing reaction may not proceed sufficiently. If it exceeds 100 ° C, the curing may proceed rapidly, and the epoxy resin composition may not evenly fill the voids of the electric / electronic component element 2. If the time is less than 5 minutes, there is insufficient hardening or gelation, and it is difficult to take out the molded product from the mold. If it exceeds 25 minutes, the molding time is long, and the productivity cannot be sufficiently improved. After semi-hardening the resin composition as described above, the mold is opened, and the electric / electronic component element 2 sealed with the semi-hardened epoxy resin composition is taken out, and then heated to perform post-hardening, thereby making the epoxy resin composition Completely hardened to obtain electrical and electronic parts 1. This post-hardening can be performed, for example, by heating at a temperature of 100 ° C. or higher for about 1 to 2 hours. [Examples] Next, the present invention will be described in more detail with reference to examples. The present invention is not limited to the following examples. (Examples 1 to 7 and Comparative Examples 1 to 4) Each of the raw materials was stirred and mixed at the blending ratios shown in Tables 1 to 2 to be uniform to prepare a two-liquid liquid epoxy resin composition of a main agent and a hardener. [Table 1] [Table 2] The raw materials used in the examples and comparative examples are as follows. [(A) Epoxy resin] (A1) General-purpose epoxy resin (manufactured by Mitsui Petrochemical, trade name: Epomic R140P; bisphenol A type) (A2) alicyclic epoxy resin (manufactured by Daicel, trade name: Celloxide 2021P) [(B) Inorganic Filler] (B1) Spherical Quartzite 1 (manufactured by Micron, trade name: TS15-103-20; average particle size 10.8 μm) (B2) Spherical Quartzite 2 (Micron) Manufacture, trade name: TS16-070-72; average particle diameter 30.7 μm) (B3) spherical fused silica (manufactured by Micron, trade name: S3030; average particle diameter 4 μm) [(C) thermal cationic polymerization Starter] (C1) phosphonium salt 1 (manufactured by San-Apro, trade name: TA-100) (C2) phosphonium salt 2 (manufactured by Sanxin Chemical Industry Co., trade name: San-Aid SI-100L) (C3) Onium salt (manufactured by Japan Chemical Industry Co., Ltd., trade name: Hishicolin PX-4B) [(D) hardening accelerator other than (C)] (D1) quaternary ammonium salt (manufactured by Japan Oil Company, trade name: Nissan Cation M2 -100R) (D2) imidazole catalyst 1 (manufactured by San-Apro, trade name: U-CAT2030) (D3) imidazole catalyst 2 (manufactured by Shikoku Chemical Industry Co., Ltd., trade name: 1B2PZ) [(E) Additives) (E1) Antifoaming agent (Momentive Performance Mate RIals company, trade name: TSA720) (E2) black pigment (manufactured by AICA Industries, trade name: ECB602), and then the electrical and electronic parts and components were sealed with the liquid epoxy resin composition prepared in each example. First, an electrical / electronic component element to be sealed is housed in a recess of a lower mold of the mold, and the upper mold is embedded to assemble the mold. Next, the epoxy resin composition obtained in each example was introduced into the nozzle main pipe of the injection nozzle, and vacuum was applied in the cavity between the lower mold and the upper mold by a vacuum pump to 10 Torr. The plunger was operated, and the filled epoxy resin composition was injected into the mold cavity at a filling speed of 0.5 L / min and an injection temperature of 60 ° C as shown in FIG. 2, and then the lower mold and the upper mold were pressed under a pressure of 0.5 MPa. The mold was heated, and the epoxy resin composition was heat-hardened (semi-hardened) at 100 ° C for 10 minutes. After that, the mold was opened and the semi-hardened material was taken out of the mold, and then post-cured under conditions of 100 ° C for 2 hours, 150 ° C for 2 hours, and 180 ° C for 2 hours. Electrical and electronic parts. The characteristics of the epoxy resin composition and electrical and electronic parts obtained in each of the above Examples and Comparative Examples were evaluated, and the results are shown in Tables 3 and 4. The evaluation methods for these characteristics are also disclosed in detail below. [table 3] [Table 4] <Resin composition> (1) Viscosity For epoxy resin compositions, the viscosity was measured in accordance with JIS C 2105 by a B-type viscometer using a rotor No. 3 at a temperature of 70 ° C and a rotation speed of 12 rpm. The viscosity of the mixture was measured. (2) Specific gravity A specific gravity bottle with a determined volume is used. The epoxy resin composition is put into the specific gravity bottle at room temperature, and the specific gravity is determined from the occupied volume and mass. (3) Gelation time According to the test tube method of JIS C 2105, 10 g of the epoxy resin composition was weighed and placed in a test tube, and the time until the resin composition gelated in an oil bath at 110 ° C. was measured. <Hardened material> (4) Filler settability of the hardened material After pouring 40 g of the mixed solution into a plastic test tube, it was hardened under specific hardening conditions (1 hour at 100 ° C, and 1 hour at 150 ° C). The upper part of the hardened material having a height of 120 mm and a diameter of 17 mm f was cut by 10 mm, and the specific gravity (upper) of the hardened material was measured. Similarly, the lower portion was cut by 10 mm, and the specific gravity (lower) of the cured product was measured. The central portion was cut by 10 mm, and the specific gravity (center) of the cured product was measured. Further, for the specific gravity of the hardened material obtained in this manner, the ratio of the specific gravity of the hardened material (upper) to the specific gravity of the hardened material (bottom) [(hardened specific gravity (upper) / hardened specific gravity (bottom)) × 100] was calculated. The value obtained by this calculation is shown in the table as "the ratio of the specific gravity of the hardened material above and below". A ratio ratio close to 100% means that the difference between the content ratios of the fillers above and below is small, and no sedimentation of the fillers occurs. (5) Glass transition point (Tg): 5 × 5 × 5 mm made by curing the epoxy resin composition at 70 ° C for 2 hours, 90 ° C for 2 hours, and finally at 110 ° C for 2 hours. The thermal expansion curve of the sample was measured using a thermal analysis device TMA / SS150 (model manufactured by Seiko Instruments, Inc.) from room temperature to 250 ° C (temperature rise rate 10 ° C / min), and the glass transition point was determined from the midpoint of the displacement point. (Tg). (6) Flexural strength and flexural modulus The epoxy resin composition was cured at 70 ° C for 2 hours, cured at 90 ° C for 2 hours, and finally cured at 110 ° C for 2 hours to prepare test pieces (width: 10 mm, height : 4 mm, length: 100 mm), and the bending strength and bending modulus at a temperature of 25 ° C were measured in accordance with JIS K 6911. (7) Bend elongation to cure the epoxy resin composition at 70 ° C for 2 hours, 90 ° C for 2 hours, and finally 110 ° C for 2 hours to prepare test pieces (width: 10 mm, height: 4 mm, Length: 100 mm), and the bending elongation at 25 ° C was measured in accordance with JIS K 6911. (8) Thermal conductivity: The epoxy resin composition was cured at 70 ° C for 2 hours, 90 ° C for 2 hours, and finally 110 ° C for 2 hours to prepare a cylindrical test piece (diameter: 100 mm, thickness : 20 mm), and the thermal conductivity at 25 ° C was measured by a probe method. (9) Volume resistivity: The epoxy resin composition was cured at 70 ° C for 2 hours, cured at 90 ° C for 2 hours, and finally cured at 110 ° C for 2 hours to prepare a cylindrical test piece (diameter: 100 mm, thickness : 2 mm), and the volume resistivity at 25 ° C and 160 ° C was measured in accordance with JIS K 6911. (10) Insulation failure strength The epoxy resin composition was cured at 70 ° C for 2 hours, 90 ° C for 2 hours, and finally 110 ° C for 2 hours to prepare test pieces (width: 100 mm, length: 100 mm). , Thickness: 1 mm), and the dielectric breakdown strength at 25 ° C and 150 ° C was measured in accordance with JIS K 6911. (11) Coefficient of Thermal Expansion A sample formed by curing an epoxy resin composition at 70 ° C for 2 hours, 90 ° C for 2 hours, and finally at 110 ° C for 2 hours to form a 5 × 5 × 20 mm The thermal analysis device TMA / SS150 (manufactured by Seiko Instruments, model) measures the thermal expansion coefficients α ₁ and α ₂ at a temperature increase rate of 5 ° C./min and a load of 49.03 mN. Here, α ₁ is a coefficient of thermal expansion from 25 ° C to Tg, and α ₂ is a coefficient of linear thermal expansion from Tg to 250 ° C. [Comprehensive Judgment] The characteristics of the resin composition and the cured product according to this embodiment are evaluated as follows, a score is given to each characteristic, and a comprehensive judgment is performed based on the total score. In the comprehensive judgment, a total score of 25 points or more was set to ○, 23 to 24 points were set to △, and 22 points or less was set to ×, and the determination results are shown in Tables 3 to 4. (Sedimentation evaluation) Set the ratio of the specific gravity of the upper and lower hardened material of the obtained hardened material to 99% or more to 5 points, 95% or more and less than 99% to 3 points, Less than 95% is set to 1 point. (Glass transition evaluation value) The glass transition point obtained above is set to 5 points at 110 ° C or higher, 3 points at 100 ° C or lower and 110 ° C, and 1 point to 100 ° C. (Evaluation of thermal conductivity) The thermal conductivity obtained above was set to 5 points and 0.5 W / m · K and 1 point and less than 0.5 W / m · K. (Evaluation of dielectric breakdown strength) Set the dielectric breakdown strength obtained above to 5 points for 25 MV / m or more, 3 points for 15 MV / m or more and less than 25 MV / m for 3 points, and less than 15 MV / m Set to 1 point. This evaluation was performed on the same basis in any of 25 ° C and 150 ° C. (E-LIM moldability (porosity) evaluation) The electrical and electronic parts obtained by the above molding are cut at an arbitrary cut surface, and the number of pores in the hardened resin in the cut surface is visually inspected The evaluation was performed by confirming that the number of pores was 0, the score was 5 points, that of 1-4 pores was 3 points, and that of 5 or more pores was 1 point. From the above, it can be known that the epoxy resin composition of this embodiment has high impregnation property, and is suitable for molding by casting impregnation, and can obtain a hardened product with high thermal conductivity and high insulation breakdown voltage. The electrical and electronic parts obtained from the epoxy resin composition have high reliability.

1‧‧‧Electric · Electronic Parts

2‧‧‧Electric · Electronic Components

2a‧‧‧lead frame

3‧‧‧Resin hardened

3a‧‧‧ epoxy resin composition

11‧‧‧ lower mold

11a, 12a ‧‧‧ recess

12‧‧‧ Upper mold

13‧‧‧cavity

14‧‧‧ Gate

15‧‧‧ shooting nozzle

FIG. 1 is a cross-sectional view showing a schematic configuration of an electric / electronic component according to this embodiment. FIG. 2 is a cross-sectional view for explaining a method of manufacturing an electric / electronic part according to this embodiment.

Claims (6)

An epoxy resin composition, comprising: (A) an epoxy resin, (B) spherical spar, and (C) a thermal cationic polymerization initiator as essential components. The epoxy resin composition according to claim 1, wherein the (C) thermal cationic polymerization initiator comprises an aromatic sulfonium salt. The epoxy resin composition according to claim 1 or 2, wherein the (A) epoxy resin contains 5 to 40% by mass of an alicyclic epoxy resin. An electrical. Electronic parts are characterized by: electrical. Electronic parts and components, and the electrical. The hardened product of the epoxy resin composition according to any one of claims 1 to 3 for sealing electronic parts and components. An electrical. The manufacturing method of electronic parts is characterized by: electrical. The electronic parts and components are arranged in a mold, and the epoxy resin composition according to any one of claims 1 to 3 is injected into the mold and semi-hardened. , And complete hardening by post-hardening. Such as request item 5 electrical. The manufacturing method of electronic parts, wherein the temperature at the time of semi-hardening is 70 to 100 ° C, and the temperature at the time of post-hardening is 100 ° C or more.