TWI662453B - Ultrasonic touch device and manufacturing method thereof - Google Patents

Abstract

A method for manufacturing an ultrasonic touch device includes the following steps: providing an ultrasonic sensing module and a plurality of conductive pins, electrically connecting the conductive pins to the ultrasonic sensing module, and providing a mold with an opening Fixing the ultrasonic sensing module in the mold so that the end of the conductive pin that is not connected to the ultrasonic sensing module extends out of the mold through the opening; and injects into the mold The sealant is cured and cured so that the sealant encapsulates the ultrasonic sensing module, and the end of the conductive pin that is not connected to the ultrasonic sensing module is exposed outside the sealant. The invention also provides an ultrasonic touch device manufactured by the manufacturing method.

Description

Ultrasonic touch device and manufacturing method thereof

The invention relates to a method for manufacturing an ultrasonic touch device and an ultrasonic touch device manufactured by the method.

Ultrasonic touch devices have a wide range of application prospects, and there is a large demand in the market. In the conventional manufacturing method of ultrasonic touch devices, it is necessary to first injection-mold a plastic shell. During the injection molding process, the plastic shell A conductive pin is embedded on the top, one end of the conductive pin penetrates the packaging plastic case and extends into the accommodation space defined by the packaging plastic case, and the other end is outside the packaging plastic case; ; Then, the packaging plastic shell and the ultrasonic sensing unit are aligned and bonded, so that the conductive pins are electrically connected to the corresponding electrodes of the ultrasonic sensing unit. When the conductive pins are embedded in the packaged plastic case, the embedded depth of the conductive pins in the plastic case has a certain tolerance, and there is also an alignment tolerance in the bonding process of the packaged plastic case and the ultrasonic sensing unit. Because there are tolerances in different steps, and after multiple steps, the structure may be severely deformed or even unable to conduct electricity due to the accumulation of tolerances.

As shown in FIG. 1, it is a packaging process of a conventional acoustic wave sensing unit. The conductive pins 141 are prefabricated on the package plastic shell 150; the ultrasonic sensing module includes a prefabricated and stacked ultrasonic transmitting unit 110 and an ultrasonic receiving unit 120, and a conductive adhesive 132 disposed on the surface of the ultrasonic sensing module. As shown in the figure, the packaged plastic shell 150 pre-installed with the conductive pins 141 is bonded to the ultrasonic sensing module. During the packaging and bonding process, the conductive adhesive 132 is connected to the conductive pins 141 to realize the ultrasonic sensing module and Electrical connection of external circuit.

There is a certain tolerance when the conductive pins 141 are pre-fabricated in the packaged plastic case 150. The distance between the conductive pins 141 and the standard distance in the packaged plastic case 150 may be longer or shorter than the standard distance. In the subsequent bonding process, the packaged plastic case There is also a tolerance in the alignment between the 150 and the ultrasonic sensing module, and there may be cases where the left and right are misaligned or the alignment plane is inclined. When the two tolerances accumulate to a certain degree, it will cause the conductive adhesive and the conductive pin to fail to be electrically connected normally. As shown in FIG. 2, it is an example of three kinds of invalid package ultrasonic sensing modules that are easy to appear in the conventional manufacturing process.

The invention provides a manufacturing method of an ultrasonic touch device which can effectively reduce manufacturing tolerances.

In addition, an ultrasonic touch device manufactured by the method is also provided.

A method for manufacturing an ultrasonic touch device includes the following steps: providing an ultrasonic sensing module and a plurality of conductive pins, electrically connecting the conductive pins to the ultrasonic sensing module, and providing a mold with an opening Fixing the ultrasonic sensing module in the mold so that the end of the conductive pin that is not connected to the ultrasonic sensing module extends out of the mold through the opening; and injects into the mold The sealant is cured and cured so that the sealant encapsulates the ultrasonic sensing module, and the end of the conductive pin that is not connected to the ultrasonic sensing module is exposed outside the sealant.

An ultrasonic touch device includes an ultrasonic sensing module, packaging glue, and conductive pins. The packaging glue covers the ultrasonic sensing module. One end of the conductive pins is located in the packaging glue and is electrically connected to the ultrasonic sensing module. The terminal of the conductive pin that is not connected to the ultrasonic sensing module is exposed outside the packaging glue.

The main difference between the manufacturing method and the conventional method of the ultrasonic touch device of the present invention lies in that the ultrasonic touch device of the present invention uses an encapsulation glue produced by in-mold injection instead of the encapsulation plastic shell. The feet are bonded to the conductive adhesive, and then the encapsulation is injected to complete the package. Tolerances when conducting pins are embedded in the plastic case of the package are avoided. Therefore, the ultrasonic touch device of the present invention effectively avoids the accumulation of tolerances and improves the yield of the process.

300, 600‧‧‧ Ultrasonic Touch Device

301, 601‧‧‧ Ultrasonic Sensor Module

110, 310, 610‧‧‧ Ultrasonic transmitting unit

120, 320, 620‧‧‧ Ultrasonic receiving unit

311, 611‧‧‧The first piezoelectric sheet

3112, 6112‧‧‧ First surface

3114, 6114‧‧‧Second surface

321, 621‧‧‧Second piezoelectric sheet

312, 612‧‧‧first electrode

313, 613‧‧‧Second electrode

322, 622‧‧‧ Third electrode

323, 623‧‧‧ Fourth electrode

331, 631‧‧‧‧First adhesive

132, 332, 632‧‧‧ conductive adhesive

333, 633‧‧‧Third viscose

141, 341, 641‧‧‧ conductive pins

350, 650‧‧‧ encapsulant

351, 651‧‧‧first encapsulant

352, 652‧‧‧Second Encapsulant

353, 653‧‧‧ Third encapsulant

360, 660‧‧‧ cover

361, 661‧‧‧ exposed

150‧‧‧ encapsulated plastic case

401‧‧‧mould

402‧‧‧Positioning slot

403‧‧‧ opening

FIG. 1 is an assembly diagram of an ultrasonic touch device according to a conventional method.

FIG. 2 is a schematic diagram of an ultrasonic sensing unit with tolerance accumulation after the conventional method is assembled.

3A to 3D are schematic structural diagrams of a method for manufacturing an ultrasonic touch device according to a preferred embodiment of the present invention.

4 is a schematic cross-sectional view of a mold used in a method for manufacturing an ultrasonic touch device according to a preferred embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of an ultrasonic touch device according to a preferred embodiment of the present invention.

6A-6B are schematic plan views of several embodiments of an ultrasonic transmitting unit of an ultrasonic touch device of the present invention.

In order to make the technical content disclosed in this application more detailed and complete, reference may be made to the drawings and the following specific embodiments of the present invention. The same symbols in the drawings represent the same or similar components. However, those skilled in the art should understand that the embodiments provided below are not intended to limit the scope covered by the present invention. In addition, the drawings are used for schematic illustration, and are not drawn according to their original dimensions.

First embodiment

A method for manufacturing an ultrasonic touch device according to a preferred embodiment of the present invention includes the following steps: please refer to FIG. 3A, step S1: providing an ultrasonic sensing module 301, the ultrasonic sensing module 301 includes an ultrasonic emitting unit 310 and Ultrasonic receiving unit 320.

The ultrasonic transmitting unit 310 includes a first piezoelectric sheet 311, a first electrode 312, and a second electrode 313. The first electrode 312 completely covers a first surface 3112 of the first piezoelectric sheet 311 and extends from the first surface 3112 to a second surface 3114 opposite to the first surface 3112. The second electrode 313 is disposed on the second On the surface 3114, the second electrode 313 is not in contact with the first electrode 312. The ultrasonic receiving unit 320 includes a second piezoelectric sheet 321 and third electrodes 322 and fourth electrodes 323 provided on both sides of the second piezoelectric sheet 321. The side of the ultrasonic transmitting unit 310 on which the first electrode 312 and the second electrode 313 are simultaneously formed and the side of the ultrasonic receiving unit 320 having the third electrode 322 are bonded together by a first adhesive 331. The size of the ultrasonic receiving unit 320 is smaller than the size of the ultrasonic transmitting unit 310. The ultrasonic receiving unit 320 is roughly corresponding to the middle area of the surface of one side of the ultrasonic transmitting unit 310, so that the ultrasonic transmitting unit 310 is close to the first electrode on the ultrasonic receiving unit 320 side. 312 and the second electrode 313 are at least partially exposed to the ultrasonic receiving unit 320, that is, they are not covered by the ultrasonic receiving unit 320. In this embodiment, the first electrode 312 on the second surface 3114 is not covered by the ultrasonic receiving unit 320. In this embodiment, the first adhesive 330 is an insulating adhesive.

Referring to FIG. 3A, step S2: electrically connect the conductive pins (Pin) 341 to the ultrasonic sensing module 301.

Step S2 may specifically include: providing a conductive adhesive 332 and a conductive pin 341, which may be a copper wire or a copper sheet. In this embodiment, two conductive adhesives 332 are provided on a surface of the ultrasonic transmitting unit 310 near the ultrasonic receiving unit 320 and not covered by the ultrasonic receiving unit 320, and one conductive adhesive 332 is provided on the surface of the first electrode 312 and the first conductive electrode 312. One electrode 312 is electrically connected, and the other conductive adhesive 332 is provided on the surface of the second electrode 313 and is electrically connected to the second electrode 313. At the same time, a conductive portion is provided on the surface of the fourth electrode 323 on the side of the ultrasonic receiving unit 320 away from the ultrasonic transmitting unit 310. Glue 332; the above-mentioned conductive glue 332 can be made at a predetermined position by feasible methods such as dispensing and dispensing. The conductive paste 332 has good conductivity and can form an electrical connection with the second electrode 313 and the fourth electrode 323. Will 3 One end of the root conductive pin 341 is respectively inserted into a conductive adhesive 332, so that the conductive pin 341 is electrically connected to the ultrasonic transmitting unit 310 and the ultrasonic receiving unit 320.

Referring to FIG. 3B and FIG. 4, step S3: providing a mold 401 to fix the ultrasonic sensing module 301 in the mold.

Step S3 specifically includes: providing a mold 401 as shown in FIG. 4, a bottom of the mold 401 is provided with a positioning groove 402, and the size of the positioning groove 402 corresponds to the size of the ultrasonic transmitting unit 310. Put the ultrasonic sensing module 301 with conductive pins 341 that was completed in step 32 into the mold 401, and the ultrasonic transmitting unit 310 is located in the positioning groove 402. In this embodiment, the ultrasonic transmitting unit 310 is close to the ultrasonic receiving One end of the unit 320 protrudes from the positioning groove 402. The positioning groove 402 corresponds to the size of the ultrasonic transmitting unit 310, and the two are fitted with each other to ensure that the ultrasonic sensing unit is fixed in the mold 401. There is an opening 403 above the mold 401. The opening 403 is a glue injection port, and the conductive pin 341 opens to the opening. The direction 403 extends through the opening 403.

Referring to FIG. 3B, step S4: inject the encapsulant 350 into the mold 401 and cure the encapsulant 350.

A liquid sealing compound 350 is provided, and the sealing compound 350 has a good sealing ability. After the ultrasonic sensing module 301 is fixed, the encapsulant 350 is slowly injected into the mold 401 from the opening above the mold 401. When the encapsulant 350 reaches or is about to reach the mold opening 403, the injection of the encapsulant 350 is stopped. The encapsulant 350 may be an organic substance, such as a resin.

The mold 401 containing the encapsulant 350 and the ultrasonic sensing module 301 is allowed to stand or heat to solidify the encapsulant 350. The liquid encapsulant 350 can be left to wait for it to solidify, or it can be appropriately heated to solidify. The temperature during the heating process should not be too high, so as not to damage the ultrasonic sensing module. The solidified encapsulant 350 covers a portion of the ultrasonic sensing module 301 beyond the positioning groove 402.

In other embodiments, the encapsulant 350 may include a first encapsulant 351 and a second encapsulant 352. The first encapsulant 351 and the second encapsulant 352 are injected twice, and step S4 specifically includes: Step S41: Inject the first encapsulant 351 into the mold 401, and cure the first encapsulant 351.

A liquid first encapsulant 351 is provided, and the first encapsulant 351 has a good sealing ability. After the ultrasonic sensor module 301 is fixed, the first encapsulant 351 is slowly injected into the mold 401 from the opening above the mold 401. The first encapsulant 351 gradually passes through the second electrode 313 and the ultrasonic receiving unit 320. When the encapsulant 351 does not pass through all the conductive adhesive 332 (or the connection portion between the conductive pins 341 and the electrodes of the ultrasonic sensing module 301), the first encapsulant 351 is stopped from being injected. The first encapsulant 351 can be made of insulating, heat-insulating, and water-proof materials, such as epoxy resin, acrylic, acrylonitrile-butadiene-styrene (ABS), and silicone material.

The mold 401 containing the first encapsulant 351 and the ultrasonic sensing module is left to stand or heated to solidify the first encapsulant 351. The liquid first encapsulant 351 can be left to wait for it to solidify, or it can be appropriately heated to solidify. The temperature during the heating process should not be too high, so as not to damage the ultrasonic sensor module. The solidified first encapsulant 351 covers the portion of the ultrasonic sensing module 301 beyond the positioning groove 402.

Step S42: Inject the second encapsulant 352 into the mold 401, and cure the second encapsulant 352.

Specifically, a liquid second encapsulant 352 is provided, and the second encapsulant 352 also has a good sealing ability. After the first encapsulant 351 is solidified, slowly inject the second encapsulant 352 into the mold 401 from the opening above the mold 401, and stop injecting the second encapsulant 352 when the second encapsulant 352 reaches or is about to reach the mold opening 403. The solidified second encapsulant 352 abuts an end of the first encapsulant 351 away from the ultrasonic transmitting unit 310, and exposes one end of the conductive pin 341 away from the ultrasonic sensing module 301. The second encapsulant 352 can be made of insulating, heat-insulating, and water-proof materials, such as epoxy resin, acrylic, acrylonitrile-butadiene-styrene (ABS), and silicone material. The second encapsulant 352 may be different from the first encapsulant 351.

The second encapsulant 352 is cured by the same curing method as the first encapsulant 351.

When the material of the first encapsulant 351 and the second encapsulant 352 are not the same, the first encapsulant 351 and the second encapsulant 352 can choose an adhesive material with different properties to make the encapsulant 350 have multiple attributes, for example, for direct The first encapsulant 351 enclosing the ultrasonic sensing module 301 should have better insulation performance, the hardness of the first encapsulant 351 should be smaller to enhance cushioning performance, and the second encapsulant 352 should tend to have higher Hardness to improve impact resistance.

Referring to FIG. 3C, step S5: removing the mold 401.

After the encapsulant 350 is solidified, the ultrasonic sensing module 301 is demolded using a conventional demolding method in the industry, and the ultrasonic sensing module 301 that is partially covered with encapsulant is removed from the mold 401.

Referring to FIG. 3D, step S6: the cover 360 is attached to a side of the ultrasonic sensing module 301 that is not wrapped by the encapsulant 350.

Specifically, a cover plate 360 is provided, so that the cover plate 360 and the ultrasonic emission unit 310 are bonded together. In the previous step, the second electrode 313, the third electrode 322, and the fourth electrode 323 are all located in the first encapsulant 351, and only the first electrode 312 is exposed. The cover 360 is adhered to the first electrode 312 by using the third adhesive 333, and the appropriate pressure is used to adhere the cover 360 to the first electrode 312. After the cover plate 360 is attached to the first electrode 312, there is an exposed portion 361 that is not covered by the sealant 350 and the cover plate 360 between the ultrasonic sensor module 301 and the first sealing glue 351 and the cover plate 360. The ultrasonic sensing module 301 is sealed to protect the ultrasonic sensing module 301. The method for manufacturing the ultrasonic touch device may further include the following step S7.

Step S7: Apply a third encapsulant 353 to the exposed portion 361, so that the components of the ultrasonic touch device except the one end of the conductive pin 641 are wrapped.

Second embodiment

As shown in FIG. 5, it is a schematic structural diagram of an ultrasonic touch device 600 manufactured by the method for manufacturing an ultrasonic touch device.

The ultrasonic touch device 600 includes an ultrasonic sensing module 601, conductive pins 641, encapsulant 650, and a cover plate 660.

The ultrasonic sensing module 601 includes an ultrasonic transmitting unit 610 and an ultrasonic receiving unit 620. The ultrasonic transmitting unit 610 includes a first piezoelectric sheet 611, a first electrode 612, and a second electrode 613. The first electrode 612 completely covers a first surface 6112 of the first piezoelectric sheet 611 and extends from the first surface 6112 to a second surface 6114 opposite to the first surface 6112. The second electrode 613 is disposed on the first electrode. As shown in FIGS. 6A to 6B, the surface covered by 612 is the opposite surface. As shown in FIGS. 6A to 6B, the area occupied by the first electrode 612 is smaller than the area occupied by the second electrode 613. The second electrode 613 is not in contact with the first electrode 612; and the shape of the ultrasound transmitting unit 610 is not limited, and it may be rectangular, circular, or the like. The first piezoelectric sheet 611 is a piezoelectric material, and may be piezoelectric ceramics (PZT), or polyvinylidene fluoride (PVDF). The first electrode 612 and the second electrode 613 are conductive materials, which can be conductive silver paste, metallic copper (gold), indium tin oxide, and the like. They have good conductivity. In this embodiment, conductive silver that can be produced by coating is selected. The paste is an electrode material.

The ultrasonic receiving unit 620 includes a second piezoelectric sheet 621 and third electrodes 622 and fourth electrodes 623 disposed on both sides of the second piezoelectric sheet 621. The second piezoelectric sheet 621 is a piezoelectric material, and may be piezoelectric ceramics (PZT), or polyvinylidene fluoride (PVDF). The third electrode 622 and the fourth electrode 623 are conductive materials, which can be conductive silver paste, metallic copper (gold), indium tin oxide, and the like. They have good conductivity. In this embodiment, conductive silver that can be produced by coating is selected. The paste is an electrode material.

The size of the ultrasonic transmitting unit 610 and the ultrasonic receiving unit 620 are different. In this embodiment, the size of the ultrasonic receiving unit 620 is smaller than that of the ultrasonic transmitting unit 610. In other embodiments, the relative sizes of the sizes of the ultrasound transmitting unit 610 and the ultrasound receiving unit 620 may be changed according to specific needs.

The ultrasonic transmitting unit 610 and the ultrasonic receiving unit 620 are arranged in a stack. One side of the ultrasonic transmitting unit 610 having the first electrode 612 and the second electrode 613 and the ultrasonic receiving unit 620 has a third One side of the electrode 622 is bonded by a first adhesive 631. In this embodiment, the size of the ultrasonic transmitting unit 610 is larger than the size of the ultrasonic receiving unit 620, and the ultrasonic receiving unit 620 is disposed substantially corresponding to the second electrode 613 in the middle region of one surface of the ultrasonic transmitting unit 310, so that the ultrasonic transmitting unit 610 is close to the ultrasonic wave. The first electrode 612 and the second electrode 613 on the side of the receiving unit 620 are at least partially exposed to the ultrasonic receiving unit 620, that is, they are not covered by the ultrasonic receiving unit 620. In this embodiment, the first electrode 612 on the second surface 6114 is not covered by the ultrasonic receiving unit 620. Two conductive adhesives 632 are provided on an area of the ultrasonic transmitting unit 610 close to the ultrasonic receiving unit 620 and not covered by the ultrasonic receiving unit 620. The two conductive adhesives 632 are approximately symmetrically distributed on both sides of the ultrasonic receiving unit 620, and one conductive adhesive 632 is provided. The surface of the first electrode 612 is electrically connected to the first electrode 612, another conductive adhesive 632 is provided on the surface of the second electrode 613 and is electrically connected to the second electrode 613, and the fourth electrode 623 is far from the surface of the second piezoelectric sheet 621. A conductive adhesive 632 is also provided. In other embodiments, a plurality of conductive adhesives 632 may be provided on the second electrode 613, and the positions of the conductive adhesives 632 may be changed according to specific needs. In this embodiment, a total of three conductive adhesives 632 are provided on the ultrasonic sensing module 601.

The ultrasonic transmitting unit 610 is bonded to the cover plate 660 by a third adhesive 633, the third adhesive 633 covers the first electrode 612, and the cover plate 660 is bonded to the third adhesive 633.

In this embodiment, the first adhesive 631 is an insulating adhesive that can prevent electrical crosstalk between the second electrode 613 and the third electrode 622. In other embodiments, the first adhesive 631 may include both Composite glues of conductive glue and insulating glue. Most of the composite glues are insulating glue, which contains only a small amount of conductive glue. The conductive glue can be used for the second electrode 613 and the third. The electrical connection of the ground line between the electrodes 622. In this embodiment, the conductive paste 632 is disposed on the surfaces of the second electrode 613 and the fourth electrode 623, respectively, and serves as a medium for other elements to make electrical contact with the second electrode 613 and the fourth electrode 623. The third adhesive 633 may be a glue with better waterproof performance. The third adhesive 633 has strong adhesion, so that the cover plate 660 and the ultrasonic transmitting unit 610 are firmly combined.

One end of each conductive pin 641 is inserted into the conductive adhesive 632 and electrically contacts the second electrode 613 and the fourth electrode 623 through the conductive adhesive 632, and the other end extends away from the ultrasonic transmitting unit 610 to reserve a port for Subsequent electrical contact with other circuits. In this embodiment, three conductive adhesives 632 are provided on the ultrasonic sensing module 601. Correspondingly, the number of conductive pins 641 is three, and each conductive pin 641 is in electrical contact with one conductive adhesive 632 respectively. In other embodiments, the number of the conductive pins 641 may be multiple, or the multiple conductive pins 641 are connected to one conductive adhesive 632 at the same time.

The encapsulant 650 includes a first encapsulant 651, a second encapsulant 652, and a third encapsulant 653. The encapsulant 650 is a gel having better insulation and waterproof performance. In this embodiment, the second electrode 613, the first adhesive 631, the conductive adhesive 632, and the ultrasonic receiving unit 620 are completely covered by the first packaging adhesive 651, and the conductive pins 641 are partially covered by the first packaging adhesive 651. The second encapsulant 652 is located on a side of the first encapsulant 651 away from the ultrasonic emitting unit 610, and the second encapsulant 652 and the first encapsulant 651 are closely combined. The end of the conductive pin 641 that is not connected to the conductive adhesive 632 penetrates the first packaging adhesive 651 and the second packaging adhesive 652 in a direction away from the ultrasonic emitting unit 610. The third encapsulant 653 wraps the exposed portion 661 of the ultrasonic sensing module 601 that is not covered by the first encapsulant 651, the second encapsulant 652, and the cover plate 660, so that the ultrasonic touch device 600 except for some conductive pins 641 The rest of the components are wrapped in encapsulant 650. The encapsulant 650 wraps the ultrasonic sensing module 601 and prevents it from being attacked by liquid such as water.

It can be understood that, in other embodiments, the size of the ultrasonic receiving unit 620 may be larger than the size of the ultrasonic transmitting unit 610. At this time, as long as the ultrasonic transmitting unit 610 is stacked on the middle region of one surface of the ultrasonic receiving unit 620, The opposite ends of the electrodes on the side of the ultrasonic receiving unit 620 near the ultrasonic transmitting unit 610 are exposed to the ultrasonic transmitting unit 610. Similarly, conductive pins 641 may be provided to be electrically connected to the ultrasonic receiving unit 620 and the ultrasonic transmitting unit 610, respectively.

Hereinabove, specific embodiments of the present invention have been described with reference to the drawings. Of course, those of ordinary skill in the art can understand that, without departing from the spirit and scope of the present invention, Various changes and substitutions are made to the specific embodiments of the present invention. Such changes and substitutions fall within the scope defined by the claims of the present invention.

Claims (14)

A method for manufacturing an ultrasonic touch device includes the following steps: providing an ultrasonic sensing module and a plurality of conductive pins, electrically connecting the plurality of conductive pins to the ultrasonic sensing module, and providing a presence opening The mold, the ultrasonic sensing module is fixed in the mold, so that the end of the conductive pin that is not connected to the ultrasonic sensing module extends out of the mold through the opening; toward the mold An encapsulant is injected in the middle and the encapsulant is cured, so that the encapsulant encapsulates the ultrasonic sensing module, and an end of each conductive pin that is not connected to the ultrasonic sensing module is exposed outside the encapsulant. The method for manufacturing an ultrasonic touch device according to claim 1, wherein the ultrasonic sensing module includes an ultrasonic transmitting unit and an ultrasonic receiving unit arranged in a stack, and the size of the ultrasonic receiving unit is smaller than that of the ultrasonic transmitting unit. The size is small. The ultrasonic transmitting unit includes a first piezoelectric sheet, a first electrode, and a second electrode. The first piezoelectric sheet includes an opposite first surface and a second surface. The first electrode is formed by the first electrode. The surface extends to the second surface; the ultrasonic receiving unit includes a second piezoelectric sheet, third electrodes and fourth electrodes disposed on both sides of the second piezoelectric sheet, and the ultrasonic transmitting unit has a first electrode A side of the second electrode and a side of the ultrasonic receiving unit having a third electrode are bonded together by a first adhesive, and the first electrode and the second electrode on the second surface are at least partially opposite to each other. The ultrasonic receiving unit is exposed, and the step of electrically connecting the conductive pins on the ultrasonic sensing module includes: the first electrode and the second electrode on the second surface are not connected by ultrasonic waves. A conductive adhesive is disposed on a surface covered by the receiving unit, and the conductive adhesive is disposed on a surface of the fourth electrode; and one end of a conductive pin is inserted into the conductive adhesive. The method for manufacturing an ultrasonic touch device according to claim 2, wherein a positioning groove is provided at the bottom of the mold, and when the ultrasonic sensing module is fixed in the mold, an ultrasonic emission unit is located in the mold In the positioning groove, an end of the ultrasonic transmitting unit near the ultrasonic receiving unit protrudes from the positioning groove. The method for manufacturing an ultrasonic touch device according to claim 3, wherein the step of injecting an encapsulant into the mold and curing the encapsulant includes: providing a liquid encapsulant to an opening above the mold. Slowly inject the encapsulant into the mold, stop injecting the encapsulant when the encapsulant reaches or is about to reach the mold opening; and let it stand or heat to make the encapsulant solidify, and cover with the solidified encapsulant A portion of the ultrasonic sensing module above the positioning groove. The method for manufacturing an ultrasonic touch device according to claim 3, wherein the step of injecting and curing an encapsulant into the mold includes: injecting a first encapsulant into the mold; Stopping the injection of the first encapsulant when all the conductive paste passes, and curing the first encapsulant, and the solidified first encapsulant covers a portion of the ultrasonic sensing module above the positioning groove; And injecting a second encapsulant into the mold, and curing the second encapsulant, the solidified second encapsulant butts one end of the first encapsulant away from the ultrasonic emitting unit, and makes the conductive An end of the pin far from the ultrasonic sensing module is exposed. The method for manufacturing an ultrasonic touch device according to claim 1, further comprising: after removing the mold, attaching a cover on a side of the ultrasonic sensing module that is not wrapped by the encapsulant. The method for manufacturing an ultrasonic touch device according to claim 6, further comprising: coating a third sealing glue on a bare portion of the ultrasonic sensing module that is not covered by the sealing glue and the cover plate. An ultrasonic touch device includes an ultrasonic sensing module, packaging glue, and a plurality of conductive pins. The improvement is that the packaging glue wraps the ultrasonic sensing module, and one end of each of the conductive pins is located in a package. It is electrically connected to the ultrasonic sensing module in the plastic, and the end of the conductive pin that is not connected to the ultrasonic sensing module is exposed outside the packaging glue. The ultrasonic sensing module includes ultrasonic emissions arranged in a stack. A unit and an ultrasonic receiving unit, the size of the ultrasonic receiving unit is smaller than that of the ultrasonic transmitting unit, the ultrasonic transmitting unit includes a first piezoelectric sheet, a first electrode, and a second electrode, and the first piezoelectric sheet The first electrode includes a first surface and a second surface opposite to each other. The first electrode extends from the first surface to the second surface. The ultrasonic receiving unit includes a second piezoelectric plate and a second piezoelectric plate. The third electrode and the fourth electrode on both sides of the sheet, the side of the ultrasonic transmitting unit having the first electrode and the second electrode and the side of the ultrasonic receiving unit having the third electrode are bonded to each other by a first adhesive. At least part of the first electrode and the second electrode on the second surface are exposed relative to the ultrasonic receiving unit; the first electrode and the second electrode on the second surface are not exposed to the ultrasonic receiving unit The covered surface is provided with a conductive adhesive, the surface of the fourth electrode is provided with a conductive adhesive, and one end of each of the conductive pins is inserted into the conductive adhesive. The ultrasonic touch device according to claim 8, wherein the ultrasonic touch device further comprises a cover plate, and the cover plate is adhered to a side of the ultrasonic sensing module that is not wrapped by the encapsulation glue. The ultrasonic touch device according to claim 9, wherein the encapsulant includes a first encapsulant and a second encapsulant, and the first encapsulant covers an end of the ultrasonic transmitting unit near the ultrasonic receiving unit, The ultrasonic receiving unit and the conductive adhesive, and the second encapsulating adhesive is disposed at an end of the first encapsulating adhesive away from the cover plate. The ultrasonic touch device according to claim 10, wherein the first encapsulant and the second encapsulant are in epoxy resin, acrylic, acrylonitrile-butadiene-styrene, and silicone materials, respectively. Kind of. The ultrasonic touch device according to claim 11, wherein the material of the first encapsulant and the second encapsulant are the same. The ultrasonic touch device according to claim 11, wherein the materials of the first encapsulant and the second encapsulant are different. The ultrasonic touch device according to claim 10, wherein the encapsulant further includes a third encapsulant, and the third encapsulant encapsulates the ultrasonic sensing module and is not covered by the encapsulant and the cover plate. part.