TWI661016B - Coating composition, optical member and lighting device - Google Patents
Coating composition, optical member and lighting device Download PDFInfo
- Publication number
- TWI661016B TWI661016B TW107101524A TW107101524A TWI661016B TW I661016 B TWI661016 B TW I661016B TW 107101524 A TW107101524 A TW 107101524A TW 107101524 A TW107101524 A TW 107101524A TW I661016 B TWI661016 B TW I661016B
- Authority
- TW
- Taiwan
- Prior art keywords
- coating composition
- fluororesin
- coating film
- hydroxyl group
- optical member
- Prior art date
Links
- 239000008199 coating composition Substances 0.000 title claims abstract description 66
- 230000003287 optical effect Effects 0.000 title claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 99
- 238000000576 coating method Methods 0.000 claims abstract description 87
- 239000011248 coating agent Substances 0.000 claims abstract description 84
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 62
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 125000000524 functional group Chemical group 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 38
- -1 silanol compound Chemical class 0.000 claims description 38
- 239000002245 particle Substances 0.000 claims description 20
- 238000005286 illumination Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 40
- 239000003921 oil Substances 0.000 description 25
- 230000003373 anti-fouling effect Effects 0.000 description 21
- 239000011347 resin Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 239000002202 Polyethylene glycol Substances 0.000 description 17
- 239000000428 dust Substances 0.000 description 17
- 229920001223 polyethylene glycol Polymers 0.000 description 17
- 239000000377 silicon dioxide Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 15
- 235000012239 silicon dioxide Nutrition 0.000 description 14
- 239000010419 fine particle Substances 0.000 description 13
- 239000012948 isocyanate Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 150000002334 glycols Chemical class 0.000 description 9
- 239000004925 Acrylic resin Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 6
- 229920005862 polyol Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 4
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 4
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 239000005058 Isophorone diisocyanate Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- 239000005642 Oleic acid Substances 0.000 description 4
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 125000005372 silanol group Chemical group 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000005871 repellent Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Polymers C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N Methylcyclohexane Natural products CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- DNNXXFFLRWCPBC-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C1=CC=CC=C1 DNNXXFFLRWCPBC-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- FRCHCYFLGZRELU-UHFFFAOYSA-N butan-2-one;cyclohexanone Chemical compound CCC(C)=O.O=C1CCCCC1 FRCHCYFLGZRELU-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- BAAAEEDPKUHLID-UHFFFAOYSA-N decyl(triethoxy)silane Chemical compound CCCCCCCCCC[Si](OCC)(OCC)OCC BAAAEEDPKUHLID-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007527 glass casting Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4833—Polyethers containing oxyethylene units
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4081—Mixtures of compounds of group C08G18/64 with other macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6275—Polymers of halogen containing compounds having carbon-to-carbon double bonds; halogenated polymers of compounds having carbon-to-carbon double bonds
- C08G18/6279—Polymers of halogen containing compounds having carbon-to-carbon double bonds; halogenated polymers of compounds having carbon-to-carbon double bonds containing fluorine atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
-
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
本發明之塗料組合物含有:氟樹脂,其賦予撥水性,且具有羥基;及親水材料,其賦予親水性,且具有羥基。進而,塗料組合物含有連結材料,該連結材料具有與羥基鍵結之複數個官能基,而將氟樹脂與親水材料連結。光學構件10於至少表面之一部分具備由塗料組合物獲得之塗膜2。照明裝置100具備:導光板10A,其包含光學構件;及光源20,其發射入射至導光板之光。
Description
本發明係關於一種塗料組合物、光學構件及照明裝置。詳細而言,本發明係關於一種可持續長期地賦予對油分與灰塵兩者之防污性之塗料組合物、藉由自該塗料組合物獲得之塗膜賦予了防污性之光學構件、及使用該光學構件之照明裝置。
先前以來,已知有為了防止污垢附著於照明裝置所使用之照明罩從而導致損害外觀、或使光學特性降低,而對該照明罩賦予防污性之技術。例如已知有為了減少灰塵或異物之附著,而對照明罩賦予防靜電性。進而已知有為了不僅減少灰塵等靜電性之污垢亦減少親水系之污垢或油類等疏水系之污垢,而除防靜電性以外亦賦予撥水性及撥油性。 於專利文獻1中,揭示有一種防污用塗料組合物,其含有:包含陰離子與陽離子之鹽之防靜電劑、具有羥基之氟系樹脂、具有羥基之聚矽氧改性丙烯酸系樹脂、及有機溶劑。又,亦揭示有一種防污積層體,其藉由賦予該防污用塗料組合物、及交聯劑,而形成有具有防污性之層。此種防污用塗料組合物由於含有具有羥基之氟系樹脂,故而可形成對油污等之防污性優異之層。進而,該塗料組合物由於含有包含陰離子與陽離子之鹽之防靜電劑,故而可製成對灰塵之附著之防污性亦優異之層。 [先前技術文獻] [專利文獻] [專利文獻1]國際公開第2009/084356號
於專利文獻1中,為了賦予防靜電性而含有陰離子與陽離子之鹽,但該鹽不具有與氟系樹脂或聚矽氧改性丙烯酸系樹脂之鍵結。因此,存在由於水或環境變化而鹽自由防污用塗料組合物獲得之層游離之情形,此時防靜電性降低。因此,由專利文獻1之塗料組合物獲得之層具有防污性之長期持續性不充分之問題。 本發明係鑒於此種先前技術所具有之問題而完成者。並且,本發明之目的在於提供一種可長期持續所獲得之塗膜之防污性之塗料組合物、具有由塗料組合物獲得之塗膜之光學構件、及使用光學構件之照明裝置。 為了解決上述問題,本發明之第一態樣之塗料組合物含有:氟樹脂,其賦予撥水性,且具有羥基;及親水材料,其賦予親水性,且具有羥基。進而,塗料組合物含有連結材料,該連結材料具有與羥基鍵結之複數個官能基,將氟樹脂與親水材料連結。 本發明之第二態樣之光學構件係於至少表面之一部分具備由上述塗料組合物獲得之塗膜。 本發明之第三態樣之照明裝置具備:導光板,其包含上述光學構件;及光源,其發射入射至導光板之光。
以下,對本實施形態之塗料組合物、具有由塗料組合物獲得之塗膜之光學構件、及使用光學構件之照明裝置詳細地進行說明。再者,關於圖式之尺寸比率,存在為了便於說明而誇大從而與實際之比率不同之情形。 [塗料組合物] 本實施形態之塗料組合物藉由塗佈於基板上並進行硬化,可獲得對油分與灰塵兩者之防污性持續之塗膜。而且,塗料組合物含有用以對所獲得之塗膜賦予撥水性之氟樹脂、及用以對塗膜賦予親水性之親水材料。 藉由塗料組合物含有氟樹脂,可對塗膜賦予較高之撥水性及撥油性、以及低附著性、易去除性。因此,可使水垢或油污難以附著於塗膜,又,即便附著亦容易去除。又,藉由塗料組合物含有親水材料,可對塗膜賦予防靜電性。即,例如由於親水材料而大氣中之水分會附著於塗膜之表面,藉此於塗膜之表面形成靜電之導電通道。藉此,抑制塗膜之帶電,故而可減少灰塵等靜電性之污垢之附著。 作為塗料組合物中所包含之氟樹脂,係使用對塗膜賦予撥水性且具有羥基者。作為此種氟樹脂,可使用於主鏈及支鏈之至少一者加成羥基而成之氟樹脂。又,加成有羥基之氟樹脂並無特別限定,例如可使用選自由聚四氟乙烯(PTFE)、聚氯三氟乙烯(PCTFE)、聚偏二氟乙烯(PVDF)、聚氟乙烯(PVF)、全氟烷氧基氟樹脂(PFA)、四氟乙烯-六氟丙烯共聚物(FEP)、乙烯-四氟乙烯共聚物(ETFE)、乙烯-三氟氯乙烯共聚物(ECTFE)所組成之群中之至少一者。再者,作為市售之含有羥基之氟樹脂,可列舉旭硝子股份有限公司製造之Lumiflon(註冊商標)、Central Glass股份有限公司製造之Cefral Coat(註冊商標)、東亞合成股份有限公司製造之Zaflon、大金工業股份有限公司製造之Zeffle(註冊商標)、DIC股份有限公司製造之Fluonate(註冊商標)、關東電化工業股份有限公司製造之Fclear(註冊商標)等。 作為塗料組合物中所包含之親水材料,係使用對塗膜賦予親水性且具有羥基者。作為此種親水材料,可使用聚乙二醇衍生物及二氧化矽(SiO2
)之至少一者。聚乙二醇衍生物由於分子中之醚基具有與水之親和性,故而可對塗膜賦予親水性。又,二氧化矽由於分子中之矽氧烷鍵(-Si-O-Si-)及表面之羥基具有與水之親和性,故而可對塗膜賦予親水性。作為聚乙二醇衍生物,例如可使用數量平均分子量為200~20000之聚乙二醇。又,作為二氧化矽,可使用粒子狀之二氧化矽微粒子。 本實施形態之塗料組合物含有將上述氟樹脂與親水材料連結之連結材料。具體而言,含有如下連結材料,其具有與氟樹脂中所包含之羥基及親水材料中所包含之羥基鍵結之複數個官能基而將氟樹脂與親水材料連結。藉由含有此種連結材料,而於所獲得之塗膜中,氟樹脂與親水材料可經由連結材料而間接地鍵結。即,於將塗料組合物塗佈於基材後,使氟樹脂之羥基及親水材料之羥基與連結材料之官能基進行反應,藉此可獲得氟樹脂與親水材料經由連結材料而鍵結之塗膜。藉此,即便於塗膜周邊之環境產生變化、或水分附著於塗膜之情形時,親水材料亦不易自塗膜溶出。因此,可長期維持塗膜之防靜電性,而減少靜電性之污垢之附著。同樣地,即便於塗膜周邊之環境產生變化之情形時,氟樹脂亦不易自塗膜溶出。因此,可長期維持塗膜之撥水性及撥油性,而減少水垢或油污之附著。 作為連結材料,可使用具有與羥基鍵結之複數個官能基而能夠於形成塗膜時將氟樹脂與親水材料連結之材料。作為此種連結材料,可使用烷氧基矽烷及矽烷醇化合物之至少一者。烷氧基矽烷藉由水解而生成矽烷醇基(Si-OH),進而該矽烷醇基與氟樹脂及親水材料之羥基進行脫水縮合。因此,藉由使用烷氧基矽烷作為連結材料,而可藉由脫水縮合反應將氟樹脂與親水材料連結。同樣地,矽烷醇化合物由於亦具有矽烷醇基,故而可藉由脫水縮合反應將氟樹脂與親水材料連結。 作為連結材料之烷氧基矽烷較佳為使用具有複數個烷氧基者。作為烷氧基矽烷,例如可使用選自由四甲氧基矽烷、四乙氧基矽烷、甲基三甲氧基矽烷、二甲基二甲氧基矽烷、苯基三甲氧基矽烷、甲基三乙氧基矽烷、二甲基二乙氧基矽烷、苯基三乙氧基矽烷、正丙基三甲氧基矽烷、正丙基三乙氧基矽烷、己基三甲氧基矽烷、己基三乙氧基矽烷、辛基三乙氧基矽烷、癸基三乙氧基矽烷、1,6-雙(三甲氧基矽烷基)己烷所組成之群中之至少一者。又,矽烷醇化合物可使用上述烷氧基矽烷中之烷氧基之一部分水解而成為矽烷醇基者。 作為連結材料,可使用具有複數個異氰酸酯基(-NCO)之異氰酸酯化合物。藉由異氰酸酯基與羥基反應而形成胺基甲酸酯鍵(-NH-CO-O-)。因此,藉由使用異氰酸酯化合物作為連結材料,可經由胺基甲酸酯鍵而將氟樹脂與親水材料連結。 作為具有複數個異氰酸酯基之異氰酸酯化合物,可使用選自由脂肪族異氰酸酯、脂環族異氰酸酯、芳香族異氰酸酯所組成之群中之至少一者。作為脂肪族異氰酸酯,可列舉:1,6-六亞甲基二異氰酸酯(HDI)、2,2,4-三甲基六亞甲基二異氰酸酯、離胺酸二異氰酸酯等碳數6~10之二異氰酸酯。作為脂環族異氰酸酯,可列舉:異佛爾酮二異氰酸酯(IPDI)、4,4'-二環己基甲烷二異氰酸酯(氫化MDI)、1,3-二異氰酸酯基甲基環己烷(氫化XDI)、1,4-環己烷二異氰酸酯、降𦯉烷二異氰酸酯(NBDI)等。又,亦可列舉六亞甲基二異氰酸酯或異佛爾酮二異氰酸酯之異氰尿酸酯體、縮二脲體、加成物之類之改性物。作為芳香族異氰酸酯,可列舉:甲苯二異氰酸酯(TDI)、苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯(MDI)、1,5-萘二異氰酸酯、苯二甲基二異氰酸酯(XDI)、碳二醯亞胺改性之MDI等。 如上所述,連結材料可藉由與氟樹脂中所包含之羥基及親水材料中所包含之羥基鍵結而將氟樹脂與親水材料連結。但是,連結材料亦可與鄰接之氟樹脂之羥基進行反應而將氟樹脂彼此連結。同樣地,連結材料亦可與鄰接之親水材料之羥基進行反應而將親水材料彼此連結。於此情形時,氟樹脂及親水材料亦不易自所獲得之塗膜溶出,故而可減少灰塵等靜電性之污垢之附著及水垢或油污之附著。 於本實施形態之塗料組合物中,較佳為親水材料為二氧化矽微粒子,且連結材料為矽烷醇化合物及烷氧基矽烷之至少一者。氟樹脂具有羥基,進而作為親水材料之二氧化矽微粒子亦於表面具有羥基,因此該等材料之相容性較高。因此,於塗料組合物中,該等可大致均勻地混合,其結果為,可提高所獲得之塗膜之透明性及平滑性。又,矽烷醇化合物及烷氧基矽烷藉由脫水縮合而與氟樹脂及二氧化矽微粒子牢固地鍵結,故而可容易地獲得較硬且透明之塗膜。 於親水材料為二氧化矽微粒子之情形時,二氧化矽微粒子之平均粒徑較佳為1 nm~100 nm。於此情形時,二氧化矽微粒子與氟樹脂微觀地複合化,因此透過塗膜之可見光之散射變小,而可更為提高塗膜之透明性。再者,二氧化矽微粒子之平均粒徑(中值粒徑、D50)可藉由動態光散射法進行測定。 於塗料組合物中,亦可以如下狀態存在,即於作為親水材料之二氧化矽微粒子之表面鍵結有作為連結材料之矽烷醇化合物及/或烷氧基矽烷。即,二氧化矽微粒子與矽烷醇化合物及/或烷氧基矽烷無需以分離之狀態分散於塗料組合物中,該等材料亦可以預先鍵結之狀態分散於塗料組合物中。藉由使用表面鍵結有矽烷醇化合物及/或烷氧基矽烷之二氧化矽微粒子,可提高與具有羥基之氟樹脂之反應性,而更有效率地形成塗膜。 於本實施形態之塗料組合物中,亦較佳為親水材料為聚乙二醇衍生物,且連結材料為異氰酸酯化合物。氟樹脂具有羥基,進而作為親水材料之聚乙二醇衍生物亦具有羥基,因此該等材料之相容性較高。因此,於塗料組合物中,該等可大致均勻地混合,其結果為,可提高所獲得之塗膜之透明性及平滑性。又,異氰酸酯化合物藉由胺基甲酸酯鍵而與氟樹脂及聚乙二醇衍生物牢固地鍵結,因此可容易地獲得較硬且透明之塗膜。 於塗料組合物中,聚乙二醇衍生物之平均分子量較佳為200~600。平均分子量為上述範圍之聚乙二醇衍生物由於與連結材料之反應性較高,故而可更為提高塗膜之硬度及親水性。再者,聚乙二醇衍生物之平均分子量可設為數量平均分子量(Mn),例如可根據羥值求出。 其次,對本實施形態之塗料組合物之製造方法進行說明。塗料組合物可藉由將上述氟樹脂、親水材料及連結材料進行混合而製備。混合條件並無特別限定,可於大氣中以常溫混合。又,氟樹脂、親水材料及連結材料之混合順序亦無特別限定。 於將氟樹脂、親水材料及連結材料進行混合時,亦可於塗料組合物中添加溶劑而調整黏度以易於塗佈。作為黏度調整用之溶劑,例如較佳為使用水或有機溶劑。有機溶劑並無特別限定,較佳為適當選擇於塗膜製作時容易揮發且於塗膜形成時不會產生硬化阻礙等者。作為有機溶劑,例如可列舉:芳香族烴類(甲苯及二甲苯等)、醇類(甲醇、乙醇及異丙醇等)、酮類(丙酮、甲基乙基酮、甲基異丁基酮及環己酮等)。進而可列舉:脂肪族烴類(己烷及庚烷等)、醚類(四氫呋喃等)、醯胺系溶劑(N,N-二甲基甲醯胺(DMF)及二甲基乙醯胺(DMAc)等)、乙酸甲酯、乙酸丁酯。該等有機溶劑可單獨使用一種,亦可組合使用兩種以上。 再者,如上所述,於使用表面鍵結有矽烷醇化合物及/或烷氧基矽烷之二氧化矽微粒子之情形時,藉由將鍵結有矽烷醇化合物之二氧化矽微粒子與氟樹脂進行混合而獲得塗料組合物。因此,可謀求製造步驟之簡化。 如上所述,本實施形態之塗料組合物含有:氟樹脂,其賦予撥水性,且具有羥基;及親水材料,其賦予親水性,且具有羥基。進而塗料組合物含有連結材料,該連結材料具有與羥基鍵結之複數個官能基而將氟樹脂與親水材料連結。藉此,於由塗料組合物獲得之塗膜中,氟樹脂與親水材料可經由連結材料而間接地鍵結。因此,親水材料不易自塗膜溶出,故而可長期維持塗膜之防靜電性,而減少靜電性之污垢之附著。同樣地,氟樹脂不易自塗膜溶出,故而可長期維持塗膜之撥水性及撥油性,而減少水垢或油污之附著。 再者,本實施形態之塗料組合物為了於所獲得之塗膜形成靜電之導電通道,而添加有親水材料。因此,該塗料組合物較佳為不含有用以形成導電通道之金屬粒子及金屬氧化物粒子。藉由不含有金屬粒子及金屬氧化物粒子,而於所獲得之塗膜中透過光之散射及吸收得到抑制,故而可更為提高塗膜之透明性。 又,本實施形態之塗料組合物較佳為亦不含有賦予光擴散性之粒子。藉由不含有此種粒子,而於所獲得之塗膜中透過光之散射得到抑制,故而可更為提高塗膜之透明性。作為賦予光擴散性之粒子,可列舉平均粒徑為1 μm~1 mm左右之粒子。作為此種粒子,例如具有苯并胍胺系樹脂粒子、苯乙烯系微粒子、三聚氰胺樹脂粒子、聚四氟乙烯粒子、硫酸鋇粒子、碳酸鈣粒子等。 [光學構件] 其次,基於圖式,對本實施形態之光學構件詳細地進行說明。如圖1所示,本實施形態之光學構件10具備基板1、及設置於基板1之至少一面且由上述塗料組合物獲得之塗膜2。 基板1並無特別限定,較佳為對於380 nm~780 nm之可見光線具有透過性。藉由將此種透光性較高之基板1用於光學構件10,而於將光學構件10用於照明裝置100之情形時,光學構件10變得透明,而可製成具備具有開放感之設計之照明裝置100。 作為基板1,只要為對於可見光線具有透過性者,則無特別限定。作為基板1,例如可使用由選自由丙烯酸系樹脂(丙烯酸酯或甲基丙烯酸酯之聚合物)、聚碳酸酯樹脂、苯乙烯樹脂、環氧樹脂及玻璃所組成之群中之至少一者所形成者。其中,丙烯酸系樹脂及聚碳酸酯樹脂之光線透過率較高。因此,基板1較佳為由丙烯酸系樹脂及聚碳酸酯樹脂之至少任一者所形成。再者,基板1中之可見光線之全光線透過率較佳為90~100%,全光線透過率可使用分光測霧計進行測定。 基板1之厚度並無特別限定,例如較佳為0.1 mm~10 mm。若考慮強度或透光性,則基板1之厚度更佳為1 mm~5 mm。再者,基板1可使用藉由玻璃鑄造製法、連續鑄造製法、擠出製法等板材成型方法而獲得者。 本實施形態之光學構件10於基板1之至少一面具備塗膜2。塗膜2係上述塗料組合物硬化而成者,氟樹脂及親水材料經由連結材料而連結。藉此,氟樹脂及親水材料不易自塗膜2溶出,故而可減少灰塵等靜電性之污垢之附著及水垢或油污之附著。 塗膜2之厚度t並無特別限定,較佳為0.1 μm~100 μm,尤佳為0.5 μm~10 μm。藉由塗膜2之厚度t為該範圍內,可獲得具有防污性並且具有較高之硬度之塗膜2。 本實施形態之光學構件10之用途並無特別限定,例如較佳為用作導光板10A。如上所述,基板1較佳為對於可見光線具有透過性,進而,塗膜2亦具有可見光線之透過性,故而可較佳地用作導光板10A。 此處,於圖1中,示出將光學構件10用作導光板10A之例。如圖1所示,於面向導光板10A之一端面1a設置光源20之情形時,自光源20發出之可見光線通過一端面1a入射至基板1之內部。所入射之可見光線3由基板1之主面反射,反覆進行該反射,藉此朝向位於一端面1a之相反側之另一端面1b傳播。此時,所傳播之光之一部分可自基板1之主面朝向Y軸方向及Y軸方向之相反方向出射。因此,於光源20點亮之情形時,自一片導光板10A之整體出射可見光線,故而可提高導光板整體之設計性。又,如上所述,基板1及塗膜2由於對於可見光線具有透過性,故而於光源20熄滅之情形時透明性較高。因此,可獲得於熄滅時因導光板原本之透明而具有開放感之設計。 其次,對本實施形態之光學構件10之製造方法進行說明。首先,將上述塗料組合物塗佈於基板1之表面。此時,塗料組合物之塗佈方法並無特別限定。作為將塗料組合物塗佈於基板1之主面之方法,可使用塗敷法或印刷法。於塗敷法中,可使用空氣噴塗、刷塗、棒式塗佈機、梅爾棒、氣刀等而塗佈塗料組合物。又,於印刷法中,可使用凹版印刷、反向凹版印刷、膠版印刷、軟版印刷、網版印刷等方法。 其次,於塗佈於基板1之塗料組合物中,使氟樹脂中所包含之羥基及親水材料中所包含之羥基與連結材料中所包含之官能基進行反應,而使氟樹脂及親水材料與連結材料鍵結。該等反應條件並無特別限定,亦可視需要進行加熱處理。例如,於連結材料包含矽烷醇化合物之情形時,即便於常溫下脫水縮合反應亦會進行,故而只要於常溫下放置至硬化為止即可。又,於連結材料為異氰酸酯化合物之情形時,較佳為進行加熱處理,例如較佳為以50~100℃進行加熱。以此方式,可獲得於基板1之表面形成有塗膜2之光學構件10。 再者,於圖1中,僅於基板1之一個主面形成有塗膜2,但並不限定於此種態樣,例如亦可於基板1之兩個主面形成塗膜2。又,亦可於基板1之一端面1a或另一端面1b形成塗膜2。 如上所述,本實施形態之光學構件10係於至少表面之一部分具備由塗料組合物獲得之塗膜2。藉此,可獲得具備如下塗膜之光學構件,該塗膜具有長期持續性且對油與灰塵兩者之污垢具有防污功能,進而不會對光學特性產生影響。再者,與上述塗料組合物同樣地,就更為提高塗膜2之透明性之觀點而言,塗膜2較佳為不含有用以形成導電通道之金屬粒子及金屬氧化物粒子,進而較佳為亦不含有賦予光擴散性之粒子。 本實施形態之光學構件並不限定於上述導光板,例如亦可用作覆蓋LED(Light Emitting Diode,發光二極體)等光源而使來自光源之光擴散之照明罩。於此情形時,光學構件之基板為了賦予充分之光擴散性,可使用分散有光擴散劑之樹脂板。 [照明裝置] 其次,基於圖式,對本實施形態之照明裝置詳細地進行說明。本實施形態之照明裝置100具備包含上述光學構件10之導光板10A、及發射入射至導光板10A之光之光源20。 如圖1所示,光源20只要為可使可見光線通過基板1之一端面1a入射至基板1之內部者則無特別限定。作為光源20,例如可使用發光二極體(LED)等點光源、或螢光燈等線狀之光源。 如圖1所示,光源20面向導光板10A之一端面1a,自光源20發出之可見光線通過一端面1a入射至基板1之內部。因此,於本實施形態之照明裝置100中,光源20較佳為位於導光板10A之端部。又,於導光板10A為平板狀之情形時,藉由將光源20設置於導光板10A之一端面1a,而將光自導光板10A之主面向Y軸方向及Y軸方向之相反方向發射。其結果為,可謀求照明裝置之省空間化,並且有效率地照射光。 圖2至圖4係表示照明裝置100之應用例,示出將照明裝置100應用於自天花板懸掛而使用之吊燈之例。如圖2所示,照明裝置100A具備裝置本體30、及自裝置本體30導出且用以對裝置本體30供電之供電線41。進而,照明裝置100A具備安裝於供電線41之端部且卡合於設置在天花板C之頂棚燈線盒C1之連接器42。裝置本體30具有光源20、引導自光源20出射之光並將之出射至外部之導光板10A、以及保持光源20及導光板10A之殼體50。 如圖2所示,殼體50具有:光源保持部51,其保持光源20;第1導光板保持部52,其配置於光源保持部51之上側,且保持導光板10A;及第2導光板保持部53,其配置於光源保持部51之下側,且保持導光板10A。光源保持部51係形成為圓筒狀,並以其圓筒軸與鉛直方向一致之方式配置。第1導光板保持部52及第2導光板保持部53分別形成為圓板狀,並以其等之中心與光源保持部51之圓筒軸交叉之方式配置。殼體50係由輕量且散熱性及光反射性優異之材料、例如白色之聚對苯二甲酸丁二酯樹脂所形成。 導光板10A係形成為較第1導光板保持部52及第2導光板保持部53大之圓板狀。而且,導光板10A係以導光板10A之中心與光源保持部51之圓筒軸交叉之狀態,夾持於第1導光板保持部52與第2導光板保持部53之間。導光板10A係相對於天花板C而配置,並於外部露出。導光板10A係於中央具有圓形狀之開口11,於開口11配置有保持有光源20之光源保持部51。 如圖4所示,光源20具有:配線基板21,其遍及光源保持部51之外周面而安裝;複數個LED22,其等在配線基板21上每隔開特定間隔而安裝;及點亮電路23,其控制LED22之點亮。配線基板21係由撓性電路基板所構成,並經由導熱性及電絕緣性優異之絕緣板而安裝於光源保持部51。複數個LED22係以各自之光軸Ax與配線基板21正交之方式配置,且與導光板10A之內端面13對向。LED22係例如由出射白色光之白色LED所構成。點亮電路23係收納於光源保持部51之內部,且經由配電線及設置於配線基板21之配線圖案而與各LED22電性連接。 自LED22出射之光係如圖2之虛線箭頭所示般,自內端面13入射至導光板10A。所入射之光由正面4及背面2a反射,藉此於導光板10A之內部向外端面12之方向導光。繼而,所引導之光係自導光板10A之外端面12出射至外部。 而且,於照明裝置100A中,在光源20點亮之情形時,由於自導光板10A之外端面12出射可見光線,故而可製成設計性優異之吊燈。又,於光源20未點亮之情形時,由於導光板10A變得透明,故而可成為具有開放感之設計。即,如圖2所示,由於在導光板10A與天花板C之間存在間隙,故而可進行具有開放感之空間表現。 [實施例] 以下,藉由實施例及比較例而對本實施形態進一步詳細地進行說明,但本實施形態並不限定於該等實施例。 [實施例1] 於本例中,使用關東電化工業股份有限公司製造之Fclear(註冊商標)KD270R作為具有羥基之氟樹脂。使用和光純藥工業股份有限公司製造之平均分子量為約400之聚乙二醇作為具有羥基之親水材料。使用東京化成工業股份有限公司製造之異佛爾酮二異氰酸酯作為連結材料。 首先,對於固形物成分100質量份之氟樹脂混合聚乙二醇100質量份。繼而,以氟樹脂之羥基及聚乙二醇之羥基之合計之莫耳數與異氰酸酯基之莫耳數成為相同之方式,添加當量之異佛爾酮二異氰酸酯。然後,以該混合物之固形物成分成為10質量%之方式,利用甲基乙基酮-環己酮混合溶劑進行稀釋,藉此獲得塗料組合物。 於將該塗料組合物塗佈於基板後,以80℃加熱20分鐘,藉此使氟樹脂之羥基及聚乙二醇之羥基、與異佛爾酮二異氰酸酯之異氰酸酯基反應。藉此,獲得具備塗膜之本例之光學構件。再者,所獲得之塗膜之膜厚為1 μm。又,作為基板,使用由丙烯酸系樹脂形成且縱50 mm、橫70 mm、厚度2 mm之丙烯酸系樹脂板。 [實施例2] 使用和光純藥工業股份有限公司製造之平均分子量為約200之聚乙二醇作為具有羥基之親水材料,除此以外,以與實施例1同樣之方式獲得本例之光學構件。 [實施例3] 使用和光純藥工業股份有限公司製造之平均分子量為約600之聚乙二醇作為具有羥基之親水材料,除此以外,以與實施例1同樣之方式獲得本例之光學構件。 [實施例4] 於本例中,使用關東電化工業股份有限公司製造之Fclear KD270R作為具有羥基之氟樹脂。使用中央自動車工業股份有限公司製造之Excel Pure BD-P01作為具有羥基之親水材料及連結材料。再者,Excel Pure BD-P01係作為親水材料之二氧化矽微粒子與作為連結材料之矽烷醇化合物混合而成之化合物,二氧化矽微粒子之平均粒徑為10 nm~100 nm。 繼而,對於固形物成分100質量份之氟樹脂,將Excel Pure BD-P01以固形物成分成為900質量份之方式進行混合,藉此獲得塗料組合物。 將該塗料組合物塗佈於與實施例1相同之基板,並於室溫下放置20分鐘,藉此使氟樹脂之羥基與二氧化矽微粒子及矽烷醇化合物之羥基進行脫水縮合。藉此,獲得具備塗膜之本例之光學構件。再者,所獲得之塗膜之膜厚為0.3 μm。 [比較例1] 使用作為丙烯酸多元醇樹脂之三菱麗陽股份有限公司製造之LR2634代替作為具有羥基之氟樹脂之Fclear KD270R,除此以外,以與實施例1同樣之方式獲得本例之光學構件。再者,該丙烯酸多元醇樹脂係具有羥基但不賦予撥水性之樹脂。 [比較例2] 使用關東電化工業股份有限公司製造之Fclear MD1700代替作為具有羥基之氟樹脂之Fclear KD270R,除此以外,以與實施例1同樣之方式獲得本例之光學構件。再者,Fclear MD1700係賦予撥水性之氟樹脂,但由於不具有羥基,故而為無法與連結材料鍵結之樹脂。 [比較例3] 使用作為丙烯酸多元醇樹脂之三菱麗陽股份有限公司製造之LR2634代替作為具有羥基之親水材料之聚乙二醇,除此以外,以與實施例1同樣之方式獲得本例之光學構件。再者,該丙烯酸多元醇樹脂係具有羥基但不賦予親水性之樹脂。 [比較例4] 使用作為丙烯酸多元醇樹脂之三菱麗陽股份有限公司製造之LR2634代替作為具有羥基之氟樹脂之Fclear KD270R,除此以外,以與實施例4同樣之方式獲得本例之光學構件。再者,該丙烯酸多元醇樹脂係具有羥基但不賦予撥水性之樹脂。 [比較例5] 使用關東電化工業股份有限公司製造之Fclear MD1700代替作為具有羥基之氟樹脂之Fclear KD270R,除此以外,以與實施例4同樣之方式獲得本例之光學構件。再者,Fclear MD1700係賦予撥水性之氟樹脂,但由於不具有羥基,故而為無法與連結材料鍵結之樹脂。 再者,利用目視觀察實施例1~4及比較例1、3~4之光學構件,結果確認到均為大致無色透明且均勻之塗膜。又,用手指觸碰實施例1~4及比較例1、3~4之光學構件中之塗膜,結果確認到為已硬化之膜。 然而,利用目視觀察比較例2及5之光學構件,結果確認到均為不透明且不均勻之塗膜。即,於比較例2及5中,作為不具有羥基之氟樹脂之Fclear MD1700之相容性較差,而成為懸濁狀之塗料組合物,故而所獲得之塗膜成為不均勻者。 [評價] 對於獲得了均勻之塗膜之實施例1~4及比較例1、3~4之光學構件,進行評價撥水撥油性之油附著性試驗、及評價防靜電性之灰塵附著性試驗。 (油附著性試驗(撥水撥油性試驗)) 對實施例1~4及比較例1、3~4之塗膜滴加2 μL之油酸,其後,測定5秒後之靜態接觸角。再者,靜態接觸角之測定係使用接觸角計(協和界面科學股份有限公司製造之CA-W150)而進行。將測定結果示於表1。再者,關於油酸接觸角,就容易去除油污之觀點而言,將40°以上評價為「良好」,將未達40°評價為「不良」。 如表1所示,實施例1~4之光學構件由於油酸接觸角為40°以上,故而油分之潤濕性較低。因此,可知對油分之防污性優異,進而即便附著有油污亦可容易地去除。相對於此,不含有賦予撥水性之氟樹脂之比較例1及4之光學構件由於撥水撥油性降低,故而油酸接觸角變得未達40°。因此,可知該等光學構件對油分之防污性較差,即便於附著有油污之情形時亦無法容易地去除。 (灰塵附著性試驗(防靜電性試驗)) 對實施例1~4及比較例1、3~4之塗膜測定表面電阻值。具體而言,使用三菱化學ANALYTECH股份有限公司製造之表面電阻測定器(Hiresta(註冊商標)IP MCP-HT260型),以外加電壓100 V測定表面電阻值。該表面電阻值係基於日本工業標準JIS K6911-1995之值。 關於表面電阻率,就容易去除灰塵污垢之觀點而言,將未達1×1014
Ω/sq評價為「良好」,將1×1014
Ω/sq以上評價為「不良」。 如表1所示,實施例1~4之光學構件係表面電阻率未達1×1014
Ω/sq。因此,可知對灰塵之防污性優異,進而即便附著有灰塵污垢亦可容易地去除。 相對於此,不含有賦予親水性之親水材料之比較例3之光學構件由於親水性降低,故而表面電阻率成為1×1014
Ω/sq以上。因此,可知該等光學構件對灰塵之防污性較差,於附著有灰塵污垢之情形時亦無法容易地去除。 [表1]
根據上述實施例1~4可知,藉由本實施形態,而容易地獲得油附著性及灰塵附著性較低,進而較硬且透明之塗膜。 以上,根據實施例對本實施形態之內容進行了說明,但業者可明確,本實施形態並不限定於該等記載,可進行各種變化及改良。 日本專利特願2017-007259號(申請日:2017年1月19日)之全部內容係被援用於此處。 [產業上之可利用性] 根據本發明,可獲得一種能長期持續所獲得之塗膜之防污性之塗料組合物、具有由塗料組合物獲得之塗膜之光學構件、及使用光學構件之照明裝置。
1‧‧‧基板
1a‧‧‧一端面
1b‧‧‧另一端面
2‧‧‧塗膜
2a‧‧‧背面
3‧‧‧可見光線
4‧‧‧正面
10‧‧‧光學構件
10A‧‧‧導光板
11‧‧‧開口
12‧‧‧外端面
13‧‧‧內端面
20‧‧‧光源
21‧‧‧配線基板
22‧‧‧LED
23‧‧‧點亮電路
30‧‧‧裝置本體
41‧‧‧供電線
42‧‧‧連接器
50‧‧‧殼體
51‧‧‧光源保持部
52‧‧‧第1導光板保持部
53‧‧‧第2導光板保持部
100‧‧‧照明裝置
100A‧‧‧照明裝置
Ax‧‧‧光軸
C‧‧‧天花板
C1‧‧‧頂棚燈線盒
t‧‧‧厚度
圖1係概略性地表示本實施形態之光學構件、及發射入射至光學構件之光之光源的立體圖。 圖2係概略性地表示應用本實施形態之照明裝置之吊燈之剖視圖。 圖3係自下表面側觀察圖2之吊燈所得之俯視圖。 圖4係圖2中之符號A之部分之放大圖。
Claims (4)
- 一種塗料組合物,其不含用以形成導電通道之含金屬粒子,且含有:氟樹脂,其賦予撥水性,且具有羥基;親水材料,其賦予親水性,且具有羥基;及連結材料,其具有與羥基鍵結之複數個官能基,而將上述氟樹脂與上述親水材料連結,上述親水材料為二氧化矽微粒子,且上述連結材料為矽烷醇化合物及烷氧基矽烷之至少一者。
- 如請求項1之塗料組合物,其中上述二氧化矽微粒子之平均粒徑為1nm~100nm。
- 一種光學構件,其於至少表面之一部分具備由如請求項1或2之塗料組合物獲得之塗膜。
- 一種照明裝置,其具備:導光板,其包含如請求項3之光學構件;及光源,其發射入射至上述導光板之光。
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- 2018-01-12 EP EP18742312.4A patent/EP3572475A4/en not_active Withdrawn
- 2018-01-12 WO PCT/JP2018/000593 patent/WO2018135394A1/ja unknown
- 2018-01-12 US US16/477,895 patent/US20200123409A1/en not_active Abandoned
- 2018-01-12 CN CN201880007273.5A patent/CN110191932A/zh active Pending
- 2018-01-12 JP JP2018563297A patent/JP7241298B2/ja active Active
- 2018-01-16 TW TW107101524A patent/TWI661016B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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EP3572475A4 (en) | 2020-02-05 |
US20200123409A1 (en) | 2020-04-23 |
EP3572475A1 (en) | 2019-11-27 |
CN110191932A (zh) | 2019-08-30 |
WO2018135394A1 (ja) | 2018-07-26 |
JP7241298B2 (ja) | 2023-03-17 |
JPWO2018135394A1 (ja) | 2019-12-19 |
TW201831623A (zh) | 2018-09-01 |
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