TWI654728B - Multi-frequency antenna package structure manufacturing method and communication device thereof - Google Patents

Abstract

The present invention provides a method for fabricating a multi-frequency antenna package structure, by which a first redistribution layer, an integrated circuit layer, a second redistribution layer, and an antenna unit layer are formed, and the first rewiring is formed The layer, the integrated circuit layer, the second redistribution layer and the antenna unit layer are formed with a plurality of openings that can communicate with each other, and each of the openings is filled with a conductive material, thereby electrically connecting the layers, and Reduce the purpose of multi-frequency antenna package structure.

Description

Multi-frequency antenna package structure manufacturing method and communication device thereof

The present invention relates to a method for fabricating an antenna package structure, and more particularly to a method for fabricating a multi-frequency antenna package structure and a communication device using the multi-frequency antenna package structure.

The antenna is an important part of the communication device and can radiate radio frequency signals. One prior connection method for electrically connecting an antenna system to a wafer system is wire bonding, wherein the antenna includes an antenna disposed on the substrate and another antenna disposed on the wafer. However, wire bonding not only significantly causes power consumption of the radio frequency signal, but also occupies a large space due to electrode pads for obtaining high quality input/output.

In order to reduce the use of wire bonding, the design of an integrated antenna in a package structure has been disclosed by a public paper. However, the package structure is not a stacked package structure that electrically connects the multi-frequency antenna to the system. Compared with the existing advanced manufacturing process, the manufacturing process of the package structure is not stable, the mold composite vias are inconsistent, and due to the influence of warpage A non-contact joint occurs.

In view of the above disadvantages of the prior art, the main object of the present invention is to provide a method for fabricating a multi-frequency antenna package structure with reduced structure.

Another object of the present invention is to provide a method of fabricating a multi-frequency antenna package structure that can simultaneously use different frequencies.

It is still another object of the present invention to provide a communication device using a multi-frequency antenna.

To achieve the above objective, the present invention provides a method for fabricating a multi-frequency antenna package structure, the method comprising the following steps: Step 1 (S1): providing a first temporary substrate having a first adhesive layer on the first adhesive layer Forming a first dielectric material layer, and forming a plurality of first metal layers in the plurality of openings of the first dielectric material layer; and step 2 (S2): forming on one of the first metal layers At least one metal via hole; at least one metal pillar is formed on a portion of the first metal layers, and an integrated circuit wafer is disposed on the metal pillar; and step 3 (S3): forming a mold layer to cover the a metal pillar, the metal via and the integrated circuit wafer; step 4 (S4): forming a first redistribution layer on the integrated circuit wafer layer; and step 5 (S5): at the first weight Forming a first antenna unit layer on the wiring layer; Step 6 (S6): forming a first protective layer on the first antenna unit layer to form a first stacked structure; Step 7 (S7): removing The first temporary substrate having the first adhesive layer, and flipping the first stacked structure to the first The laminated structure is adhered to a second temporary substrate having a second subbing layer; Step 8 (S8): forming a second redistribution layer by processing the first metal layers; Step 9 (S9): forming a second protective layer on the second redistribution layer, and applying the second protection layer Forming a plurality of bump balls on the layer to form a second stack structure; and step 10 (S10): removing the second temporary substrate having the second glue layer, and flipping the second stack structure to pass the convex The block ball mounts the second stack structure on a substrate, and the height of the integrated circuit chip layer is the same or smaller than the height of the metal through hole by the arrangement, thereby achieving the purpose of reducing the multi-frequency antenna package structure. .

100‧‧‧Integrated circuit chip

101‧‧‧Bump ball

102‧‧‧First protective layer

103‧‧‧First redistribution layer

104‧‧‧Integrated circuit layer

105‧‧‧Second redistribution layer

106‧‧‧First shield

107‧‧‧First antenna layer

108‧‧‧Second protective layer

109‧‧‧First dielectric material layer

110‧‧‧First metal layer

111‧‧‧Metal column

112‧‧‧Second antenna unit

113‧‧‧Electrical mat

114‧‧‧ integrated circuit

115‧‧‧Semiconductor materials

116‧‧‧Molded layer

117‧‧‧Metal through hole

118‧‧‧Second dielectric material layer

119‧‧‧Second metal layer

120‧‧‧Second dielectric layer

121‧‧‧Fourth metal layer

122‧‧‧ Third metal layer

123‧‧‧First dielectric layer

S1~S11‧‧‧Step process

FIG. 1 is a schematic flow chart showing the steps of a method for manufacturing a multi-frequency antenna package structure according to the present invention.

Figure 2 is a schematic diagram of the communication device of the present invention.

The embodiments of the present invention are described by way of specific examples, and those skilled in the art can understand the other advantages and advantages of the present invention from the disclosure of the present disclosure.

1 is a schematic flow chart of a method for manufacturing a multi-frequency antenna package structure according to the present invention. As shown in the figure, the method includes: Step 1 (S1): providing a first temporary substrate having a first adhesive layer In the first Forming a first dielectric material layer on the adhesive layer, and forming a plurality of first metal layers in the plurality of openings of the first dielectric material layer; Step 2 (S2): one of the first metal layers Forming at least one metal via hole; forming at least one metal pillar on a portion of the first metal layers, and providing an integrated circuit wafer on the metal pillar; and step 3 (S3): forming a mold layer Covering the metal post, the metal via, and the integrated circuit wafer, thinning the molding layer to expose the metal via to form the mold layer, the metal via, and the metal pillar And an integrated circuit wafer layer formed on the integrated circuit wafer, wherein the integrated circuit wafer layer comprises a second antenna unit on an integrated circuit of the integrated circuit wafer; step 4 (S4): Forming a first redistribution layer on the integrated circuit wafer layer; step 5 (S5): forming a first antenna element layer on the first redistribution layer, wherein the first antenna is formed Forming a first shielding layer on the first redistribution layer before the unit layer, the first screen The layer includes a second dielectric layer and a plurality of fourth metal layers formed in the plurality of openings of the second dielectric layer, the fourth metal layers electrically connecting the third metal layers and the second portions a metal layer; step 6 (S6): forming a first protective layer on the first antenna unit layer to form a first stacked structure; and step 7 (S7): removing the first layer having the first adhesive layer a temporary substrate and flip The first stack structure adheres the first stack structure to a second temporary substrate having a second adhesive layer; Step 8 (S8): treating the first dielectric material layer and the first metal Forming a second redistribution layer, wherein the second redistribution layer comprises the processed first dielectric material layer and the processed first metal layer, wherein the second antenna unit layer is formed Forming a second shielding layer on the second redistribution layer, the second shielding layer includes a fourth dielectric layer and a plurality of sixth metal layers formed in the plurality of openings of the fourth dielectric layer, The sixth metal layer is electrically connected to the fourth metal layer and a portion of the first metal layer; Step 9 (S9): forming a second protective layer on the second redistribution layer, and in the second Forming a plurality of bump balls on the protective layer to form a second stack structure; and step 10 (S10): removing the second temporary substrate having the second adhesive layer, and flipping the second stacked structure to pass the The bump balls mount the second stack structure on a substrate.

2 is a schematic diagram of a communication device according to the present invention. As shown in the figure, the communication device includes a multi-frequency antenna package structure including a first redistribution layer 103 and an integrated circuit. The layer 104, a second redistribution layer 105, a first shielding layer 106, a first antenna layer 107, a first protective layer 102, a second protective layer 108, and a plurality of bump balls 101 The first redistribution layer 103 includes a first dielectric material layer 109, and a plurality of first metal layers 110 formed in the plurality of openings of the first dielectric material layer 109. The integrated circuit layer 104 is formed thereon. On the first redistribution layer 103, the integrated circuit layer 104 includes At least one metal via 117, at least one metal pillar 111, an integrated circuit wafer 100, and a molding layer 116, wherein the molding layer 116 is formed to fill the metal via 117 a plurality of openings, the metal post 111 and the integrated circuit wafer 100 are disposed on the first redistribution layer 103. The metal vias 117 are electrically connected to the first metal layers 110, and the metal pillars 111 are electrically connected to the integrated circuit. The wafer 100 and the plurality of first metal layers 110 include a second antenna unit 112 on the integrated circuit 114 of the integrated circuit wafer 100, and a plurality of conductive pads 113.

The second redistribution layer 105 is formed on the integrated circuit layer 104. The second redistribution layer 105 includes a second dielectric material layer 118 and is formed in each of the openings of the second dielectric material layer 118. a second metal layer 119, wherein the metal via 117 is electrically connected to the plurality of second metal layers 119, the first shielding layer 106 is disposed on the first antenna unit layer 107, and the second redistribution layer 105 The first shielding layer 106 includes a first dielectric layer 120 and a plurality of fourth metal layers 121 formed in the plurality of openings of the second dielectric layer 120. The fourth metal layer 121 is electrically connected to the first metal layer 121. a plurality of third metal layers 122 of the first antenna unit layer 107, and a portion of the second metal layer 119, wherein the first antenna unit is a multiple input multiple output phase antenna, and the height of the integrated circuit wafer layer is the same At or below the height of the metal through hole, wherein the communication device is an encrypted communication device or a frequency conversion device.

The above-described embodiments are merely illustrative of the features and functions of the present invention, and are not intended to limit the scope of the technical scope of the present invention. Any cooked Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.

Claims (7)

A method for manufacturing a multi-frequency antenna package structure, the method comprising: providing a first temporary substrate having a first adhesive layer, forming a first dielectric material layer on the first adhesive layer, and Forming a plurality of first metal layers in a plurality of openings of a dielectric material layer; forming at least one metal via hole on one of the first metal layers, forming at least a portion of the first metal layers a metal pillar, and an integrated circuit wafer disposed on the metal pillar; forming a molding layer to cover the metal pillar, the metal via and the integrated circuit wafer, thinning down the molding layer Exposing the metal via to form an integrated circuit wafer layer including the mold layer, the metal via, the metal pillar and the integrated circuit wafer; forming a first rewiring on the integrated circuit wafer layer a layer, wherein the first redistribution layer comprises a second dielectric material layer and a plurality of second metal layers, wherein the second metal layers are formed in the plurality of openings of the second dielectric material layer; Forming a first antenna unit layer on a heavy wiring layer, The first antenna unit layer includes a first dielectric layer and a plurality of third metal layers formed in the plurality of openings of the first dielectric layer, wherein at least one of the third metal layers is electrically connected One of the second metal layers, and the third metal layer forms a first antenna unit; a first protective layer is formed on the first antenna unit layer to form a first stacked structure; Removing the first temporary substrate having the first adhesive layer, and flipping the first stacked structure to adhere the first stacked structure to a second temporary substrate having a second adhesive layer; a dielectric material layer and the first metal layer to form a second redistribution layer, wherein the second redistribution layer comprises the processed first dielectric material layer and the processed first metal layer, Forming a second antenna unit layer on the second redistribution layer, wherein the second antenna unit layer comprises a second dielectric layer; forming a second protective layer on the second redistribution layer, in the second Forming a plurality of bump balls on the protective layer to form a second stack structure; and removing the second temporary substrate having the second adhesive layer, flipping the second stacked structure to pass the bump ball through the bump balls The second stack structure is mounted on a substrate. The method of fabricating a multi-frequency antenna package structure according to claim 1, wherein the integrated circuit wafer layer comprises a second antenna unit located on an integrated circuit of the integrated circuit chip. The method for manufacturing a multi-frequency antenna package structure according to claim 2, further comprising: forming a first shielding layer on the first redistribution layer before forming the first antenna unit layer, the first a shielding layer includes a second dielectric layer and a plurality of fourth metal layers formed in the plurality of openings of the second dielectric layer, the fourth metal layers electrically connecting the third metal layers and portions The second metal layer. The method for manufacturing a multi-frequency antenna package structure according to claim 2, further comprising: before forming the second protection layer, the second antenna unit layer comprises a plurality of layers formed on the second dielectric layer a plurality of fourth metal layers in the opening, wherein the fourth metal layers are electrically connected to one of the first metal layers, and the fourth metal layers form a second antenna unit. The method for manufacturing a multi-frequency antenna package structure according to claim 4, further comprising: forming a first shielding layer on the first redistribution layer before forming the first antenna unit layer, the first a shielding layer includes a third dielectric layer and a plurality of fifth metal layers formed in the plurality of openings of the third dielectric layer, the fifth metal layers electrically connecting the third metal layers and portions a second metal layer; and a second shielding layer formed on the second redistribution layer, the second shielding layer comprising a fourth dielectric layer and formed on the fourth a plurality of sixth metal layers of the plurality of openings of the dielectric layer, the sixth metal layers being electrically connected to the fourth metal layers and a portion of the first metal layers. A communication device comprising: a multi-frequency antenna package structure comprising: a first redistribution layer comprising a first dielectric material layer and a plurality of first ones formed in the plurality of openings of the first dielectric material layer a metal layer; an integrated circuit layer formed on the first redistribution layer, the integrated circuit layer including at least one metal via, at least one metal pillar, an integrated circuit wafer, and a molding layer, wherein the molding layer is used to fill a plurality of openings formed by the metal via holes, the metal pillars and the integrated circuit wafer are disposed on the first redistribution layer, and the metal vias are electrically connected One of the first metal layers, the metal post electrically connecting the integrated circuit chip and one of the first metal layers; a second redistribution layer formed on the integrated circuit layer, the second The redistribution layer includes a second dielectric material layer and a plurality of second metal layers formed in the plurality of openings of the second dielectric material layer, wherein the metal vias are electrically connected to the second metal layers And a first antenna unit layer including a first dielectric layer and a plurality of third metal layers formed in the plurality of openings of the first dielectric layer, wherein the third metal layers And at least one of the second metal layers is electrically connected to one of the second metal layers, and the third metal layer forms a first antenna unit; wherein the integrated circuit wafer has an integrated circuit as a processing circuit, and the integrated circuit The integrated circuit chip has a second antenna single on the integrated circuit Or the integrated circuit chip does not include the second antenna unit, but the multi-frequency antenna package structure further includes: a second antenna unit layer, including a second dielectric layer and formed on the second dielectric a plurality of fourth metal layers of the plurality of openings of the layer, wherein at least one of the fourth metal layers is electrically connected to one of the first metal layers, the fourth metal layers forming the first a second antenna unit, and the first redistribution layer is formed on the second antenna unit layer; The first antenna unit is a multiple input multiple output phase antenna, and the height of an integrated circuit wafer layer is the same as or smaller than the height of the metal through hole. The communication device of claim 6, wherein the communication device is an encrypted communication device or a frequency conversion device.