TWI654662B - Exposure device and article manufacturing method - Google Patents

Exposure device and article manufacturing method

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Publication number
TWI654662B
TWI654662B TW106134495A TW106134495A TWI654662B TW I654662 B TWI654662 B TW I654662B TW 106134495 A TW106134495 A TW 106134495A TW 106134495 A TW106134495 A TW 106134495A TW I654662 B TWI654662 B TW I654662B
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Taiwan
Prior art keywords
optical element
astigmatism
optical system
projection optical
gas
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TW106134495A
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Chinese (zh)
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TW201822249A (en
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中嶋猛
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日商佳能股份有限公司
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Publication of TW201822249A publication Critical patent/TW201822249A/en
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Publication of TWI654662B publication Critical patent/TWI654662B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/7015Details of optical elements
    • G03F7/70175Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70258Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70275Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70316Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591Testing optical components
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891Temperature

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lens Barrels (AREA)
  • Lenses (AREA)

Abstract

即使在曝光的光的照度高的情況下,也將投影光學系統中的方向相互不同的多個像散收斂於容許範圍內。曝光裝置具有將遮罩的圖案投影到基板的投影光學系統,具有:第一光學元件,可為了調整投影光學系統的像散變更位置或形狀;第二光學元件,配置於投影光學系統的光瞳面或光瞳面的附近;控制部,控制第一光學元件的位置或形狀;供給部,為了調整第二光學元件溫度分布對第二光學元件供給氣體,供給部對第二光學元件供給氣體,以使前述第二光學元件的溫度分布產生的第一方向的像散和與前述第一方向不同的第二方向的像散增減方向相互相反、使第一方向的像散收斂於容許範圍內,控制第一光學元件的位置或形狀,以使第二方向的像散收斂於容許範圍內。Even when the illuminance of the exposed light is high, a plurality of astigmatisms with mutually different directions in the projection optical system are converged within an allowable range. The exposure device has a projection optical system that projects a pattern of a mask onto a substrate. The exposure device includes a first optical element that can change a position or shape for adjusting the astigmatism of the projection optical system, and a second optical element that is disposed on a pupil of the projection optical system. Near the surface or the pupil surface; the control unit controls the position or shape of the first optical element; the supply unit supplies gas to the second optical element in order to adjust the temperature distribution of the second optical element, and the supply unit supplies gas to the second optical element, The astigmatism in the first direction generated by the temperature distribution of the second optical element and the astigmatic increase and decrease directions in the second direction different from the first direction are opposite to each other, so that the astigmatism in the first direction is converged within an allowable range , Controlling the position or shape of the first optical element so that the astigmatism in the second direction converges within an allowable range.

Description

曝光裝置及物品之製造方法Exposure device and article manufacturing method

[0001] 本發明涉及曝光裝置及物品之製造方法。[0001] The present invention relates to an exposure apparatus and a method for manufacturing an article.

[0002] 在半導體裝置、液晶顯示裝置等的製程中的光刻程序中使用曝光裝置,該曝光裝置利用照明光學系統對遮罩(倍縮光罩)進行照明,經由投影光學系統向塗敷有感光性的抗蝕層的基板投影遮罩圖案的顯像。   [0003] 投影光學系統的光學元件吸收曝光的光而在光學元件內產生溫度分布,從而光學元件的折射率分布、面形狀發生變化。根據成像特性的觀點,最好降低由於光學元件的折射率分布、面形狀的變化而可能發生的聚焦差或者像散(astigmatism)等像差等。   [0004] 因此,已知一曝光裝置,在該曝光裝置中,因應由於投影光學系統內的部件吸收曝光的光而產生的投影光學系統內部整體的溫度上升,向收容投影光學系統的鏡筒內供給溫度調節後的氣體,從而使投影光學系統內的溫度分布變化降低。   [0005] 在日本特開2016-95412號公報中已公開在對設置於投影光學系統的光瞳附近的凹凸透鏡與凸面鏡之間供給氣體時,根據曝光所使用的遮罩圖案的資訊,以使凹凸透鏡的溫度分布和氣體的流動的方向符合的方式進行控制。   [0006] 在日本特開2016-95412號公報中,使氣體流過透鏡的溫度上升的區域而局部地冷卻透鏡,所以高照度的曝光的光入射於投影光學系統的情況下,估計透鏡整體的溫度分布不會充分地均勻。在該情況下,尤其難以使投影光學系統的縱橫方向的像散和傾斜方向的像散雙方收斂於容許範圍內。[0002] An exposure device is used in a lithography process in a process of manufacturing a semiconductor device, a liquid crystal display device, or the like. The exposure device uses an illumination optical system to illuminate a mask (reduction mask), and is applied to a projection optical system. The development of a mask pattern by projecting a mask on a photosensitive resist layer. [0003] The optical element of the projection optical system absorbs the exposed light and generates a temperature distribution in the optical element, so that the refractive index distribution and the surface shape of the optical element change. From the viewpoint of imaging characteristics, it is desirable to reduce aberrations such as focus difference or astigmatism that may occur due to changes in the refractive index distribution and surface shape of the optical element. [0004] Therefore, there is known an exposure device in which the entire temperature inside the projection optical system rises due to the absorption of the exposed light by the components in the projection optical system, and enters the lens barrel housing the projection optical system. The temperature-adjusted gas is supplied to reduce a change in temperature distribution in the projection optical system. [0005] Japanese Patent Application Laid-Open No. 2016-95412 discloses that when supplying gas between a meniscus lens and a convex lens provided near a pupil of a projection optical system, information based on a mask pattern used for exposure is disclosed. The temperature distribution of the meniscus lens and the direction of the gas flow are controlled in such a manner. [0006] In Japanese Patent Application Laid-Open No. 2016-95412, a lens is locally cooled by allowing a gas to flow through a region where the temperature of the lens rises. Therefore, when light with high illuminance is incident on the projection optical system, it is estimated that The temperature distribution is not sufficiently uniform. In this case, it is particularly difficult to converge both the astigmatism in the vertical and horizontal directions of the projection optical system within the allowable range.

[0007] 作為解決上述課題的本發明的一個側面的曝光裝置,具有將遮罩的圖案投影到基板的投影光學系統,前述投影光學系統具有:第一光學元件,可為了調整前述投影光學系統的像散而變更位置或者形狀;以及第二光學元件,配置於前述投影光學系統的光瞳面或者光瞳面的附近,前述曝光裝置具有:控制部,控制前述第一光學元件的位置或者形狀;以及供給部,為了調整前述第二光學元件的溫度分布,對前述第二光學元件供給氣體,前述供給部對前述第二光學元件供給氣體,以使由於曝光時的前述第二光學元件的溫度分布而產生的第一方向的像散和與前述第一方向不同的第二方向的像散的增減的方向相互相反,使前述第一方向的像散收斂於容許範圍內,控制前述第一光學元件的位置或者形狀,以使曝光時的前述第二方向的像散收斂於容許範圍內。 [0007] As an aspect of the present invention, an exposure apparatus that solves the above-mentioned problems includes a projection optical system that projects a pattern of a mask onto a substrate. The projection optical system includes a first optical element. Astigmatism changes the position or shape; and the second optical element is disposed near the pupil surface or the pupil surface of the projection optical system, and the exposure device includes a control unit that controls the position or shape of the first optical element; And the supply unit supplies gas to the second optical element in order to adjust the temperature distribution of the second optical element, and the supply unit supplies gas to the second optical element so that the temperature distribution of the second optical element due to exposure The astigmatism in the first direction and the astigmatism in the second direction which is different from the first direction are opposite to each other, so that the astigmatism in the first direction is converged within an allowable range, and the first optical element is controlled. The position or shape of the element is such that the astigmatism in the second direction during exposure is converged within an allowable range.

根據以下的實施例的描述(參考附圖),本發明的其它特徵變得顯而易見。 Other features of the present invention will become apparent from the following description of the embodiments (refer to the accompanying drawings).

以下,根據附圖,詳細說明本發明的優選的實施方式。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

(第一實施方式) (First Embodiment)

參照圖1,說明本實施方式的曝光裝置。圖1是第一實施方式的曝光裝置的概略圖。曝光裝置例如可在液晶顯示設備、有機EL設備等平面面板的製程中的光刻程序中被使 用。特別是在本實施方式中,曝光裝置採透過步進掃描方式將形成於遮罩的圖案的像轉印(曝光)到平板上(基板上)的掃描型投影曝光裝置。在圖1中,在與作為鉛直方向的Z軸垂直的平面內曝光時的原版9以及基板19的掃描方向取Y軸,與Y軸正交的非掃描方向取X軸。基板19例如是由玻璃材製造、且表面塗敷有感光劑(抗蝕層)的被處理基板。 An exposure apparatus according to this embodiment will be described with reference to FIG. 1. FIG. 1 is a schematic diagram of an exposure apparatus according to the first embodiment. The exposure device can be used, for example, in a photolithography process in a process of manufacturing a flat panel such as a liquid crystal display device or an organic EL device. use. In particular, in this embodiment, the exposure apparatus is a scanning projection exposure apparatus that transfers (exposes) an image of a pattern formed on a mask to a flat plate (on a substrate) by a step-and-scan method. In FIG. 1, the scanning direction of the original plate 9 and the substrate 19 during exposure in a plane perpendicular to the Z axis that is the vertical direction is taken as the Y axis, and the non-scanning direction orthogonal to the Y axis is taken as the X axis. The substrate 19 is, for example, a substrate to be processed that is made of a glass material and has a surface coated with a photosensitizer (resist layer).

本實施方式的曝光裝置具備照明系統IL、投影光學系統PO、對配置於投影光學系統PO的物面OP的遮罩(原版)9進行掃描的原版驅動機構、對配置於投影光學系統PO的像面IP的基板19進行掃描的基板驅動機構以及控制部C。 The exposure apparatus of this embodiment includes an illumination system IL, a projection optical system PO, an original plate driving mechanism that scans a mask (original plate) 9 disposed on the object surface OP disposed on the projection optical system PO, and an image disposed on the projection optical system PO A substrate driving mechanism and a control unit C that scan the substrate 19 with the IP surface.

照明系統IL例如可包括光源LS、第一聚焦透鏡3、蠅眼透鏡4、第二聚焦透鏡5、狹縫界定構材6、成像光學系統7、平面鏡8。光源LS例如可包括汞燈1和橢圓鏡2。狹縫界定構材6界定原版9的照明範圍(即對原版9進行照明的狹縫狀光的剖面形狀)。成像光學系統7被配置成使由狹縫界定構材6界定的狹縫成像於物面。平面鏡8在照明系統IL中使光路徑折彎。投影光學系統PO將配置於物面OP的原版9的圖案投影到配置於像面IP的基板19,由此基板19被曝光。投影光學系統PO可構成為等倍成像光學系統、放大成像光學系統以及縮小成像光學系統中的任意光學系統。其中,投影光學系統PO優選構成為等倍成像光學系統,在物面側以及像面側主光線平行,亦即在物面以及像面這雙方中具有雙遠心性。 The illumination system IL may include, for example, a light source LS, a first focusing lens 3, a fly-eye lens 4, a second focusing lens 5, a slit defining member 6, an imaging optical system 7, and a plane mirror 8. The light source LS may include, for example, a mercury lamp 1 and an elliptical mirror 2. The slit-defining member 6 defines the illumination range of the original plate 9 (that is, the cross-sectional shape of the slit-shaped light that illuminates the original plate 9). The imaging optical system 7 is configured to image a slit defined by the slit defining member 6 on an object plane. The plane mirror 8 bends a light path in the lighting system IL. The projection optical system PO projects the pattern of the original plate 9 arranged on the object plane OP onto the substrate 19 arranged on the image plane IP, and the substrate 19 is exposed. The projection optical system PO may be constituted as any optical system among the equal-magnification imaging optical system, the magnification imaging optical system, and the reduction imaging optical system. Among them, the projection optical system PO is preferably configured as an equal-magnification imaging optical system, and the principal rays are parallel on the object plane side and the image plane side, that is, the object plane and the image plane have bi-telecentricity.

[0013] 投影光學系統PO在從物面OP到像面IP的光路徑中,作為從物面側起依次配置的反射鏡具有第一平面鏡13、第一凹面鏡14、凸面鏡15、第二凹面鏡16以及第二平面鏡17。物體OP與第一平面鏡13之間的光路徑和第二平面鏡17與像面IP之間的光路徑平行。包括第一平面鏡13的鏡面的平面和包括第二平面鏡17的鏡面的平面相互成90度的角度。第一平面鏡13和第二平面鏡17也可以一體地形成。第一凹面鏡14和第二凹面鏡16也可以一體地構成。投影光學系統PO具備配置於物面OP與第一平面鏡13之間的光路徑的柱面透鏡21以及22、平凹透鏡(或者平凸透鏡)12’。另外,投影光學系統PO具備配置於第二平面鏡17與像面之間的光路徑的柱面透鏡23、24。在投影光學系統PO中,為了校正這些透鏡所致的軸上顏色像差,在凸面鏡15之前配置有凹凸透鏡(非球面透鏡)15’。凸面鏡15的反射面與投影光學系統的光瞳面相當。凸面鏡15配置於投影光學系統的光瞳面,凹凸透鏡15’配置於投影光學系統的光瞳面的附近。這些光學元件在曝光時產生不均勻的溫度分布。   [0014] 柱面透鏡23、24構成調整與沿著物面OP與第一平面鏡13之間的光路徑的第一方向(z方向)正交的第二方向(y方向)上的投影光學系統的投影倍率的第一光學系統。該柱面透鏡21以及22構成調整與第一方向以及第二方向正交的第三方向(x方向)上的投影光學系統的投影倍率的第二光學系統。平凹透鏡12’構成調整第一方向以及第二方向上的投影光學系統的投影倍率的第三光學系統。   [0015] 柱面透鏡21是上表面為平面、下表面為在x方向上具有曲率的凹柱體面,並且至柱面透鏡22的上表面具有5mm~20mm左右的空氣間隔。柱面透鏡22的上表面是在x方向上具有曲率的凸柱面、下表面是凸球面,並且至在上表面具有凹球面、在下表面具有平面的平凹透鏡12’的上表面具有5mm~20mm左右的空氣間隔。柱面透鏡21或者柱面透鏡22構成為透過致動器31(驅動部)在z方向上可移動(可驅動)。透過相對柱面透鏡22在z方向上驅動柱面透鏡21,校正x方向的倍率。另外,透過利用致動器31在z方向上驅動平凹透鏡12’,在x方向以及y方向上各向同性地校正倍率。   [0016] 控制部C由例如計算機等構成,經由線路與曝光裝置的各構成要素連接,可依照程序等控制各構成要素的動作以及調整等。控制部C可控制驅動柱面透鏡、平凹透鏡的致動器(驅動部)來控制透鏡的位置、形狀或者雙方。   [0017] 柱面透鏡23在上表面具有平面、在下表面具有在掃描方向上具有曲率的凹柱體面,並且至柱面透鏡24的上表面具有5mm~20mm左右的空氣間隔。柱面透鏡24在上表面具有在掃描方向上具有曲率的凸柱面、在下表面具有平面。柱面透鏡23或者柱面透鏡24構成為可透過致動器32在z方向上變更(移動)位置。透過利用致動器32使柱面透鏡23在z方向上移動,可校正y方向的倍率。柱面透鏡21、22、23、24各自的厚度以及間隔在空間中保持時不會引起自重變形的範圍、並且空間保持機構、上下驅動機構可構成的範圍內是任意的。柱體面在是折射率為1.475左右的合成石英的情況下,在使曲率半徑為47000mm左右時,透過1mm的移動使倍率變化約10ppm。但是,需要以使通過了設置於基準高度位置的三片透鏡的像的大小與無三片透鏡時完全相同的方式,使各柱體面以及球面微小地變化。此外,柱體面的凹面和凸面、球面的凹面和凸面也可以相互相反。此外,作為倍率校正單元,不限於柱面透鏡,也可以使用可變更平行平板的位置、形狀或者雙方而使平行平板彎曲的機構、調整透鏡的旋轉位置的機構。 [0013] The projection optical system PO has a first plane mirror 13, a first concave mirror 14, a convex mirror 15, and a second concave mirror 16 as reflecting mirrors that are sequentially arranged from the object plane side in the light path from the object plane OP to the image plane IP. And second plane mirror 17. The light path between the object OP and the first plane mirror 13 and the light path between the second plane mirror 17 and the image plane IP are parallel. The plane including the mirror surface of the first plane mirror 13 and the plane including the mirror surface of the second plane mirror 17 are at an angle of 90 degrees to each other. The first plane mirror 13 and the second plane mirror 17 may be integrally formed. The first concave mirror 14 and the second concave mirror 16 may be integrally formed. The projection optical system PO includes cylindrical lenses 21 and 22, and a plano-concave lens (or plano-convex lens) 12 'arranged in the light path between the object plane OP and the first plane mirror 13. The projection optical system PO includes cylindrical lenses 23 and 24 arranged in the light path between the second plane mirror 17 and the image plane. In the projection optical system PO, a meniscus lens (aspherical lens) 15 'is disposed in front of the convex mirror 15 in order to correct color aberrations on the axis caused by these lenses. The reflecting surface of the convex mirror 15 corresponds to the pupil surface of the projection optical system. The convex mirror 15 is disposed on the pupil surface of the projection optical system, and the meniscus lens 15 'is disposed near the pupil surface of the projection optical system. These optical elements produce an uneven temperature distribution during exposure. [0014] The cylindrical lenses 23 and 24 constitute a projection optical system that adjusts a second direction (y direction) orthogonal to a first direction (z direction) along the light path between the object plane OP and the first plane mirror 13. The first optical system of the projection magnification. The cylindrical lenses 21 and 22 constitute a second optical system that adjusts the projection magnification of the projection optical system in a third direction (x direction) orthogonal to the first direction and the second direction. The plano-concave lens 12 'constitutes a third optical system that adjusts the projection magnification of the projection optical system in the first direction and the second direction. [0015] The cylindrical lens 21 is a concave cylindrical surface having a flat upper surface and a lower cylindrical surface having a curvature in the x direction, and has an air gap of about 5 mm to 20 mm to the upper surface of the cylindrical lens 22. The upper surface of the cylindrical lens 22 is a convex cylindrical surface having a curvature in the x direction, the lower surface is a convex spherical surface, and the upper surface of the plano-concave lens 12 'having a concave spherical surface on the upper surface and a flat surface on the lower surface has 5 to 20 mm Left and right air gap. The cylindrical lens 21 or the cylindrical lens 22 is configured to be movable (drivable) in the z-direction by an actuator 31 (driving section). The cylindrical lens 21 is driven in the z direction through the opposing cylindrical lens 22 to correct the magnification in the x direction. In addition, by driving the plano-concave lens 12 'in the z direction by the actuator 31, the magnification is corrected isotropically in the x direction and the y direction. [0016] The control unit C is composed of, for example, a computer, and is connected to each component of the exposure device via a line, and can control the operation and adjustment of each component according to a program or the like. The control unit C can control an actuator (drive unit) that drives a cylindrical lens and a plano-concave lens to control the position, shape, or both of the lenses. [0017] The cylindrical lens 23 has a flat surface on the upper surface and a concave cylindrical surface having a curvature in the scanning direction on the lower surface, and has an air gap of about 5 mm to 20 mm to the upper surface of the cylindrical lens 24. The cylindrical lens 24 has a convex cylindrical surface having a curvature in the scanning direction on the upper surface and a flat surface on the lower surface. The cylindrical lens 23 or the cylindrical lens 24 is configured to be capable of changing (moving) the position in the z direction by the actuator 32. By moving the cylindrical lens 23 in the z direction by the actuator 32, the magnification in the y direction can be corrected. The ranges of the thicknesses and intervals of the cylindrical lenses 21, 22, 23, and 24 that do not cause self-weight deformation when held in space are arbitrary, and the ranges that the space holding mechanism and the up-and-down driving mechanism can form are arbitrary. When the cylindrical surface is synthetic quartz with a refractive index of about 1.475, when the radius of curvature is about 47,000 mm, the magnification is changed by about 1 ppm through a movement of 1 mm. However, it is necessary to change the cylindrical surface and the spherical surface minutely so that the size of the image passing through the three lenses provided at the reference height position is exactly the same as when there is no three lenses. In addition, the concave and convex surfaces of the cylindrical surface and the concave and convex surfaces of the spherical surface may be opposite to each other. In addition, the magnification correction unit is not limited to a cylindrical lens, and a mechanism that can change the position, shape, or both of the parallel flat plates and bend the parallel flat plates, or a mechanism that adjusts the rotation position of the lens may be used.

此外,在使柱面透鏡如上所述移動時可調整投影倍率,但進而也可調整像散。例如,在調整y方向的投影倍率的情況下,在使在上表面具有平面、在下表面具有在掃描方向上具有曲率的凹柱體面的柱面透鏡23在z方向上移動時,與掃描方向正交的方向的折射力不發生變化,但在掃描方向上產生負的折射力。因此,掃描方向的線像(V線)成像在比與掃描方向垂直的方向的線像(H線)遠離投影光學系統的位置(下側)。即,第一光學系統具有對y方向的投影倍率的敏感度,具有對在縱橫方向(x、y方向)上發生的像散的敏感度。第二光學系統具有對x方向的投影倍率的敏感度,具有對在縱橫方向上發生的像散的敏感度。第三光學系統具有對x方向和y方向的投影倍率的敏感度,沒有對在縱橫方向上發生的像散的敏感度。因此, 透過驅動這些透鏡,可不使相互正交的兩個方向上的投影倍率變化而發生縱橫方向的像散。作為一個例子,在Z方向上將柱面透鏡21驅動+1mm、在Z方向上將柱面透鏡23驅動+2mm、在Z方向上將平凹透鏡12’驅動+1mm時,可不使x、y方向的投影倍率變化而發生3μm的縱橫方向的像散。根據上述機構,像散的校正量與透鏡的驅動量成比例。因此,如果在透鏡之間設置避免驅動時的干擾的空間,則可增大透鏡驅動量,可增大像散校正量。 In addition, when the cylindrical lens is moved as described above, the projection magnification can be adjusted, but astigmatism can also be adjusted. For example, when adjusting the projection magnification in the y direction, when the cylindrical lens 23 having a flat surface on the upper surface and a concave cylindrical surface having curvature in the scanning direction on the lower surface is moved in the z direction, it is positive to the scanning direction. The refractive power in the direction of intersection does not change, but a negative refractive power is generated in the scanning direction. Therefore, the line image (V line) in the scanning direction is imaged at a position (lower side) farther from the projection optical system than the line image (H line) in a direction perpendicular to the scanning direction. That is, the first optical system has sensitivity to a projection magnification in the y direction, and has sensitivity to astigmatism occurring in the vertical and horizontal directions (x, y directions). The second optical system has sensitivity to a projection magnification in the x direction and sensitivity to astigmatism occurring in the vertical and horizontal directions. The third optical system has sensitivity to projection magnifications in the x-direction and y-direction, and has no sensitivity to astigmatism occurring in the vertical and horizontal directions. Therefore, by driving these lenses, astigmatism in the vertical and horizontal directions can be generated without changing the projection magnification in two directions orthogonal to each other. As an example, when the cylindrical lens 21 is driven by +1 mm in the Z direction, the cylindrical lens 23 is driven by +2 mm in the Z direction, and the plano-concave lens 12 'is driven by +1 mm in the Z direction. Astigmatism in the vertical and horizontal directions of 3 μm occurs with a change in the projection magnification. According to the aforementioned mechanism, the amount of correction of astigmatism is proportional to the amount of driving of the lens. Therefore, if a space is provided between the lenses to avoid interference during driving, the amount of lens driving can be increased, and the amount of astigmatism correction can be increased.

因此,利用控制部C控制柱面透鏡21、22、23、24以及平凹透鏡12’中的任意透鏡(第一光學元件)的位置。由此,可將x、y方向的投影倍率作為預定的目標值,使縱橫方向的像散在容許範圍內。此外,在使用平行平板代替柱面透鏡的情況下,透過控制平行平板的形狀,可調整投影倍率和像散。 Therefore, the position of any lens (first optical element) among the cylindrical lenses 21, 22, 23, and 24 and the plano-concave lens 12 'is controlled by the control unit C. Thereby, the projection magnification in the x and y directions can be set as a predetermined target value, and the astigmatism in the vertical and horizontal directions can be within an allowable range. In addition, when a parallel flat plate is used instead of a cylindrical lens, the projection magnification and astigmatism can be adjusted by controlling the shape of the parallel flat plate.

接下來,說明凹凸透鏡15’的溫度分布。圖2示出在基板上對某個遮罩圖案進行了曝光時的凹凸透鏡15’的溫度分布。此外,凸面鏡15的溫度分布也與凹凸透鏡15’的溫度分布大致相同。隔著凹凸透鏡15’的中心,在B軸方向的兩側的周邊區域有高溫部,隔著凹凸透鏡15’的中心,在C軸方向的兩側的周邊區域有低溫部。圖3示出用冊尼克函數將凹凸透鏡15’的溫度分布分解了時的Z5項、Z6項。 Next, the temperature distribution of the meniscus lens 15 'will be described. FIG. 2 shows the temperature distribution of the meniscus lens 15 'when a certain mask pattern is exposed on the substrate. The temperature distribution of the convex mirror 15 is also substantially the same as that of the meniscus lens 15 '. A high-temperature portion is located on both sides of the B-axis direction through the center of the lenticular lens 15 ', and a low-temperature portion is located on both sides of the C-axis direction through the center of the lenticular lens 15'. Fig. 3 shows the Z5 term and the Z6 term when the temperature distribution of the meniscus lens 15 'is decomposed by the Booknick function.

圖3的左圖是冊尼克係數的Z5項形狀的溫度分布,圖3的右圖是冊尼克係數的Z6項形狀的溫度分布。在 冊尼克係數的Z5項形狀的溫度分布中,隔著凹凸透鏡15’的中心,在X軸方向的兩端附近有高溫部,隔著凹凸透鏡15’的中心,在Z軸方向的兩端附近有低溫部。在冊尼克係數的Z6項形狀的溫度分布中,隔著凹凸透鏡15’的中心,在B軸方向的兩端附近有高溫部,隔著凹凸透鏡15’的中心,在C軸方向的兩端附近有低溫部。此外,B軸、C軸是從X軸或者Z軸傾斜成斜度為45度的軸,設為相互垂直的軸。 The left diagram of FIG. 3 is the temperature distribution of the Z5 term shape of the Book Nick coefficient, and the right diagram of FIG. 3 is the temperature distribution of the Z6 term shape of the Book Nick coefficient. in In the temperature distribution of the Z5 term shape of the book coefficient, there are high-temperature portions near both ends in the X-axis direction through the center of the meniscus lens 15 ', and near both ends in the Z-axis direction through the center of the meniscus lens 15'. There is a low temperature section. In the temperature distribution of the Z6 term shape of the book coefficient, there are high-temperature portions near both ends in the B-axis direction through the center of the lenticular lens 15 ', and at both ends in the C-axis direction through the center of the lenticular lens 15' There is a low temperature section nearby. The B-axis and C-axis are axes inclined at an angle of 45 degrees from the X-axis or the Z-axis, and the axes are perpendicular to each other.

當凹凸透鏡15’產生Z5項的溫度分布時,成為Z5項的折射率分布,產生Z5項的波面像差。在產生Z5項的波面像差時,遮罩圖案的橫線(H線)的焦點位置和縱線(V線)的焦點位置錯開。因此,產生作為H線的焦點位置和V線的焦點位置之差的縱橫方向的像散。另外,當凹凸透鏡15’產生Z6項的溫度分布時,成為Z6項的折射率分布,產生Z6項的波面像差。當產生Z6項的波面像差時,相對遮罩圖案的H線傾斜45度的右上斜線(S線)的焦點位置和相對H線傾斜135deg(度)的左上斜線(T線)的焦點位置錯開。因此,發生作為S線的焦點位置和T線的焦點位置之差的傾斜方向的像散。在此,將傾斜方向的像散稱為第一方向的像散,將縱橫方向的像散設為第二方向的像差。此外,上述縱橫方向和傾斜方向相差45度,但第一方向和第二方向的角度差不限定於45度,只要是相互不同的方向即可。另外,傾斜方向的像散不限於Z6項,也可以還包括Z13項等,縱橫方向的像散不限於Z5項,也可以還包括Z12項 等。 When the meniscus lens 15 'generates a temperature distribution of the Z5 term, it becomes a refractive index distribution of the Z5 term, and a wavefront aberration of the Z5 term is generated. When the wavefront aberration of the Z5 term is generated, the focal position of the horizontal line (H line) and the vertical position (V line) of the mask pattern are staggered. As a result, astigmatism in the vertical and horizontal directions is generated as the difference between the focal position of the H line and the focal position of the V line. In addition, when the meniscus lens 15 'generates a temperature distribution of the Z6 term, it becomes a refractive index distribution of the Z6 term, and a wavefront aberration of the Z6 term is generated. When the wavefront aberration of the Z6 term is generated, the focus position of the upper right oblique line (S line) inclined by 45 degrees with respect to the H line of the mask pattern and the focus position of the upper left oblique line (T line) inclined by 135 degrees (degrees) with respect to the H line are staggered. . Therefore, astigmatism in the oblique direction occurs as a difference between the focal position of the S line and the focal position of the T line. Here, the astigmatism in the oblique direction is referred to as the astigmatism in the first direction, and the astigmatism in the vertical and horizontal directions is referred to as the aberration in the second direction. In addition, the above-mentioned vertical and horizontal directions differ by 45 degrees, but the angular difference between the first direction and the second direction is not limited to 45 degrees, as long as they are mutually different directions. In addition, the astigmatism in the oblique direction is not limited to the Z6 term, and may also include the Z13 term. The astigmatism in the vertical and horizontal directions is not limited to the Z5 term, and may also include the Z12 term. Wait.

接下來,說明凸面鏡15或者凹凸透鏡15’(第二光學元件)的溫度調整。圖4示出凸面鏡15以及凹凸透鏡15’的周邊結構。圖4的右側的圖是從Y方向觀察到的圖,圖4的左側的圖示出DD’處的剖面圖。Y軸方向的單點劃線表示光軸。凸面鏡15和凹凸透鏡15’被鏡筒100(保持部)保持。如圖4所示,在凸面鏡15與凹凸透鏡15’之間形成有閉合空間102。鏡筒100設置有在Z方向上延伸的多個孔103、104。孔103是氣體的供氣口,孔104是氣體的排氣口。圖5示出通過AA’的鏡筒100的剖面圖。在鏡筒100中,作為貫通孔而設置有多個供氣口103A~G。多個供氣口103A~G的各個供氣口在相同的Z方向上延伸。另外,在鏡筒100中,相對處於單點劃線的交點的凹凸透鏡15’的光軸,在與供氣口103A~G相反的一側,作為貫通孔而設置有排氣口104A~G。另外,在從供氣口向排氣口的方向(Z方向)上,供氣口以及排氣口在鏡筒100內延伸。例如,供氣口103A在平行於通過供氣口103D和凹凸透鏡15’的光軸的線的方向(Z方向)上延伸。在鏡筒100的下側,在X軸方向上大致相等間隔地設置有多個供氣口103A~G。在鏡筒100的上側,在X軸方向上大致相等間隔地設置有多個排氣口104A~G。多個供氣口103A~G、排氣口104A~G被設置至覆蓋凸面鏡15和凹凸透鏡15’的X方向的直徑整體的位置。對多個供氣口103A~G連接供給氣體的供氣路徑36,對多個排氣口104A~G連接排出氣體的排氣路徑37。作為氣體優 選空氣、氮等,空氣無需置換閉合空間內部的氣體,不存在置換完成為止的等待時間,所以可立即使用曝光裝置,在這一點上是優異的。氮是惰性氣體,所以在不使鏡和透鏡變得模糊這點上是優異的。 Next, the temperature adjustment of the convex mirror 15 or the meniscus lens 15 '(second optical element) will be described. FIG. 4 shows the peripheral structures of the convex mirror 15 and the meniscus lens 15 '. The figure on the right side of Fig. 4 is a view seen from the Y direction, and the figure on the left side of Fig. 4 shows a cross-sectional view at DD '. The one-dot chain line in the Y-axis direction indicates the optical axis. The convex mirror 15 and the meniscus lens 15 'are held by a lens barrel 100 (holding portion). As shown in FIG. 4, a closed space 102 is formed between the convex mirror 15 and the meniscus lens 15 '. The lens barrel 100 is provided with a plurality of holes 103 and 104 extending in the Z direction. The hole 103 is a gas supply port, and the hole 104 is a gas exhaust port. Fig. 5 shows a sectional view of the lens barrel 100 passing through AA '. The lens barrel 100 is provided with a plurality of air supply ports 103A to G as through holes. Each of the plurality of air supply ports 103A to G extends in the same Z direction. In addition, in the lens barrel 100, exhaust ports 104A to G are provided as through holes on the side opposite to the air supply ports 103A to G with respect to the optical axis of the meniscus lens 15 'at the intersection of the one-dot chain line. . In addition, in a direction (Z direction) from the air supply port to the exhaust port, the air supply port and the exhaust port extend inside the lens barrel 100. For example, the air supply port 103A extends in a direction (Z direction) parallel to a line passing through the air supply port 103D and the optical axis of the meniscus lens 15 '. On the lower side of the lens barrel 100, a plurality of air supply ports 103A to G are provided at substantially equal intervals in the X-axis direction. A plurality of exhaust ports 104A to G are provided on the upper side of the lens barrel 100 at substantially equal intervals in the X-axis direction. The plurality of air supply ports 103A to G and the air discharge ports 104A to G are provided so as to cover the entire diameter in the X direction of the convex mirror 15 and the meniscus lens 15 '. A gas supply path 36 for supplying gas is connected to the plurality of gas supply ports 103A to G, and a gas discharge path 37 for discharging gas is connected to the plurality of exhaust ports 104A to G. As a gas By selecting air, nitrogen, etc., air does not need to replace the gas inside the closed space, and there is no waiting time until the replacement is completed. Therefore, the exposure device can be used immediately, which is excellent in this respect. Since nitrogen is an inert gas, it is excellent in that mirrors and lenses are not blurred.

供氣路徑36以及排氣路徑37與調整氣體的流量、溫度的氣體供給部35連接,透過氣體供給部35調整氣體的供給和排出。氣體供給部35將氣體的溫度調節成固定溫度。此外,供氣路徑36以及排氣路徑37既可以是一個系統也可以是多個系統,既可以在一個孔中設置一個系統,也可以使一個系統分支而連接到各孔。如果有多個系統,則可在各系統中獨立地調整氣體的流量、溫度。另外,氣體供給部35的動作由控制部C控制。 The gas supply path 36 and the exhaust path 37 are connected to a gas supply unit 35 that adjusts the flow rate and temperature of the gas, and the supply and exhaust of the gas is adjusted through the gas supply unit 35. The gas supply unit 35 adjusts the temperature of the gas to a fixed temperature. In addition, the air supply path 36 and the exhaust path 37 may be one system or a plurality of systems. One system may be provided in one hole, or one system may be branched and connected to each hole. If there are multiple systems, the gas flow rate and temperature can be adjusted independently in each system. The operation of the gas supply unit 35 is controlled by the control unit C.

箭頭107表示流入到供氣口103A~G之前的氣體的流動。多個箭頭與多個供氣口103A~G的各個對應。從多個供氣口103A~G供給由氣體供給部35調溫後的氣體。箭頭108表示從排氣口104A~G流出的氣體的流動,從排氣口104A~G排出氣體。由此,在凸面鏡15與凹凸透鏡15’之間的閉合空間102中形成氣體的流動109,調整閉合空間102內的溫度。多個供氣口103A~G、排氣口104A~G被設置至覆蓋凸面鏡15和凹凸透鏡15’的X方向的直徑整體的位置。即,供氣口103A、103G、排氣口104A、104G配置於凸面鏡15、凹凸透鏡15’的外周附近。因此,可對凸面鏡15和凹凸透鏡15’的表面的整個區域噴吹調溫後的氣體。另外,多個供氣口103A~G、排氣口104A~G在Z方向 上延伸,所以朝向一致。進而,供氣的流量、和排出的流量一致。由此,氣體的流路在Z方向(一個方向)上一致,在閉合空間102中氣體的流動不會遲滯,所以氣體以層流109方式流過。即,使氣體從多個供氣口的各個沿著相互相同的方向流過凸面鏡15、凹凸透鏡15’的表面。 An arrow 107 indicates the flow of the gas before flowing into the gas supply ports 103A to G. The plurality of arrows correspond to each of the plurality of air supply ports 103A to G. The gas whose temperature has been adjusted by the gas supply unit 35 is supplied from a plurality of gas supply ports 103A to G. The arrow 108 indicates the flow of the gas flowing from the exhaust ports 104A to G, and the gas is discharged from the exhaust ports 104A to G. Thereby, a gas flow 109 is formed in the closed space 102 between the convex mirror 15 and the meniscus lens 15 ', and the temperature in the closed space 102 is adjusted. The plurality of air supply ports 103A to G and the air discharge ports 104A to G are provided so as to cover the entire diameter in the X direction of the convex mirror 15 and the meniscus lens 15 '. That is, the air supply ports 103A and 103G and the exhaust ports 104A and 104G are arranged near the outer periphery of the convex mirror 15 and the meniscus lens 15 '. Therefore, the temperature-adjusted gas can be sprayed on the entire area of the surface of the convex mirror 15 and the meniscus lens 15 '. In addition, a plurality of air supply ports 103A to G and exhaust air ports 104A to G are in the Z direction. It extends upwards, so the orientation is consistent. Furthermore, the flow rate of the supplied air matches the flow rate of the discharged air. Thereby, the flow paths of the gas are consistent in the Z direction (one direction), and the flow of the gas does not stagnate in the closed space 102, so the gas flows through the laminar flow 109. That is, the gas is caused to flow from each of the plurality of air supply ports through the surfaces of the convex mirror 15 and the meniscus lens 15 'in the same direction.

這樣,透過對凸面鏡15與凹凸透鏡15’之間的閉合空間102供給調溫後的氣體,使氣體流過凸面鏡15、凹凸透鏡15’的表面,可調整凸面鏡15、凹凸透鏡15’的溫度分布。在對凸面鏡15與凹凸透鏡15’之間的閉合空間102持續供給調溫後的氣體之後,與閉合空間102相接的凸面鏡15和凹凸透鏡15’的溫度分布如圖6所示地成為相對Z軸左右對稱的溫度分布。圖6示出凸面鏡15和凹凸透鏡15’的概略溫度分布的圖。區域1是溫度最低的區域,區域2是溫度比區域1高的區域,區域3是溫度最高的區域。凸面鏡15和凹凸透鏡15’由於曝光而受熱,隨著遠離氣體的供氣口,溫度變高。可知在接近供氣口的區域,由於低溫氣的氣體,溫度降低。當接近相對Z軸左右對稱的溫度分布時,Z5項的波面像差變大,Z6項的波面像差變小。即,相比於不供給氣體的情況,縱橫方向的像散變大,傾斜方向的像散變小,縱橫方向的像散和傾斜方向的像散的增減的方向相互相反。在以高照度對基板進行曝光的情況下,投影光學系統的透鏡的溫度不均勻變大,像差變大。但是,即使在以高照度對基板進行曝光的情況下,透過如上所述由氣體供給部35控制氣體的供給,也可使傾斜方向的像散 收斂於容許範圍內。作為具體的一個例子,透過氣體供給部35對凸面鏡15與凹凸透鏡15’之間的空間102持續供給調溫後的氣體,其結果,傾斜方向的像散的降低量是2.5μm。 In this way, the temperature distribution of the convex mirror 15 and the meniscus lens 15 'can be adjusted by supplying the temperature-adjusted gas to the closed space 102 between the convex mirror 15 and the meniscus lens 15', so that the gas flows through the surfaces of the convex mirror 15 and the meniscus lens 15 ' . After the temperature-controlled gas is continuously supplied to the closed space 102 between the convex mirror 15 and the meniscus lens 15 ', the temperature distribution of the convex mirror 15 and the meniscus lens 15' connected to the closed space 102 becomes relative Z as shown in FIG. Axis-symmetric temperature distribution. FIG. 6 is a diagram showing a schematic temperature distribution of the convex mirror 15 and the meniscus lens 15 '. Region 1 is the region with the lowest temperature, region 2 is the region with higher temperature than region 1, and region 3 is the region with the highest temperature. The convex mirror 15 and the meniscus lens 15 'are heated by exposure, and the temperature becomes higher as they move away from the gas supply port. It can be seen that in the area close to the air supply port, the temperature is lowered due to the low-temperature gas. When the temperature distribution is symmetrical to the left and right with respect to the Z axis, the wavefront aberration of the Z5 term becomes larger, and the wavefront aberration of the Z6 term becomes smaller. That is, compared with the case where no gas is supplied, the astigmatism in the vertical and horizontal directions becomes larger and the astigmatism in the oblique direction becomes smaller. When the substrate is exposed at a high illuminance, temperature unevenness of the lens of the projection optical system becomes large, and aberration becomes large. However, even when the substrate is exposed at a high illuminance, astigmatism in the oblique direction can be made by controlling the supply of gas by the gas supply unit 35 as described above. Converge within the allowable range. As a specific example, the temperature-adjusted gas is continuously supplied to the space 102 between the convex mirror 15 and the meniscus lens 15 'through the gas supply unit 35. As a result, the amount of reduction in astigmatism in the oblique direction is 2.5 m.

這樣,並非使凸面鏡15、凹凸透鏡15’的溫度分布整體地變得均勻,而是以容許傾斜方向的像散變小、縱橫方向的像散變大的方式,形成氣體的流動,調整溫度分布。因此,有時縱橫方向的像散不在容許範圍內,反而比供給氣體之前變大。 In this way, instead of uniformizing the temperature distribution of the convex mirror 15 and the meniscus lens 15 ′ as a whole, the flow of gas is formed so that the astigmatism in the oblique direction becomes smaller and the astigmatism in the vertical and horizontal directions becomes larger to adjust the temperature distribution . Therefore, the astigmatism in the vertical and horizontal directions may not be within the allowable range, but may be larger than before the gas is supplied.

接下來,說明縱橫方向的像散的校正方法。圖7示出該校正方法的流程圖。首先,控制部C控制氣體供給部35,如上所述,對凸面鏡15與凹凸透鏡15’之間的閉合空間102開始供給調溫後的氣體,調整凸面鏡15、凹凸透鏡15’的溫度分布(S301)。在持續供給氣體的期間,控制部C以使投影光學系統PO將原版9的圖案投影到基板19並對基板19進行曝光的方式,控制曝光裝置的各部分。例如,在以高照度對基板進行曝光的情況下,投影光學系統的透鏡等的溫度變高,像差有時不收斂於容許範圍內。當在S301中供給氣體時,投影光學系統的傾斜方向的像散收斂於容許範圍內,但縱橫方向的像散不收斂於容許範圍內。因此,每當更換結束了曝光的基板19時測量縱橫方向的像散、或者按批次就縱橫方向的像散進行計測(S302)。例如,可使用配置在使基板移動的基板載台上的聚焦感測器40(計測部)進行像散的計測。然後,根據計測結果即計 測的縱橫方向的像散的發生量,計算用於將縱橫方向的像散降低到容許範圍內的柱面透鏡21、22、23、24以及平凹透鏡12’中的任意透鏡的移動量(S303)。然後,根據計算出的透鏡的移動量,驅動透鏡(S304)。於是,縱橫方向的像散和傾斜方向的像散都可收斂於容許範圍內。然後,使用像散成為容許範圍內的投影光學系統,對接下來的基板進行曝光(S305)。 Next, a method for correcting astigmatism in the vertical and horizontal directions will be described. FIG. 7 shows a flowchart of the correction method. First, the control unit C controls the gas supply unit 35. As described above, the temperature-adjusted gas is supplied to the closed space 102 between the convex mirror 15 and the meniscus lens 15 ', and the temperature distribution of the convex mirror 15 and the meniscus lens 15' is adjusted (S301 ). While the gas is continuously supplied, the control unit C controls each part of the exposure device so that the projection optical system PO projects the pattern of the original plate 9 on the substrate 19 and exposes the substrate 19. For example, when the substrate is exposed at a high illuminance, the temperature of a lens or the like of the projection optical system becomes high, and the aberration may not converge within an allowable range. When the gas is supplied in S301, the astigmatism in the oblique direction of the projection optical system converges within the allowable range, but the astigmatism in the vertical and horizontal directions does not converge within the allowable range. Therefore, the astigmatism in the vertical and horizontal directions is measured every time the substrate 19 whose exposure is completed is replaced, or the astigmatism in the horizontal and vertical directions is measured in batches (S302). For example, astigmatism can be measured using a focus sensor 40 (measurement unit) arranged on a substrate stage that moves a substrate. Then, based on the measurement results, The amount of occurrence of astigmatism in the vertical and horizontal directions is measured, and the amount of movement of any of the cylindrical lenses 21, 22, 23, 24 and the plano-concave lens 12 'for reducing the astigmatism in the vertical and horizontal directions is allowed (S303 ). Then, the lens is driven based on the calculated amount of lens movement (S304). Thus, both the astigmatism in the vertical and horizontal directions and the astigmatism in the oblique direction can converge within the allowable range. Then, the next substrate is exposed using the projection optical system whose astigmatism is within the allowable range (S305).

這樣,氣體供給部使氣體流過第二光學元件的表面來調整第二光學元件的溫度,以使由於曝光時的第二光學元件的溫度分布而產生的第一方向的像散和與第一方向不同的第二方向的像散的增減相互相反。進而,氣體供給部使氣體流過第二光學元件的表面來調整第二光學元件的溫度,以使第一方向的像散收斂於容許範圍內。進而,以使曝光時的第二方向的像散收斂於容許範圍內的方式,控制第一光學元件的位置或者形狀。由此,即使在照度高的情況下,也可將投影光學系統的第一方向的像散和第二方向的像散收斂於容許範圍內。 In this way, the gas supply unit adjusts the temperature of the second optical element by flowing gas over the surface of the second optical element so that the astigmatism in the first direction and the The astigmatism in the second direction, which is different in direction, increases and decreases in opposite directions. Furthermore, the gas supply unit adjusts the temperature of the second optical element by flowing a gas through the surface of the second optical element so that the astigmatism in the first direction converges within an allowable range. Furthermore, the position or shape of the first optical element is controlled so that the astigmatism in the second direction at the time of exposure converges within an allowable range. As a result, even when the illuminance is high, the astigmatism in the first direction and the astigmatism in the second direction of the projection optical system can be converged within an allowable range.

(第二實施方式) (Second Embodiment)

接下來,說明第二實施方式的曝光裝置。作為來自氣體供給部35的氣體的供氣口和排氣口,不限於在鏡筒100開出的孔。在本實施方式中,使用將設置有多個孔的沖孔板安裝到鏡筒100的側面的結構。如果是在鏡筒100開出的孔,則鏡筒100的製造容易。另一方面,在沖孔板的情況下,可有效地降低溫度調整的冷卻不均勻。圖8示出安裝有沖孔板的鏡筒100的剖面圖。在鏡筒100的z軸方向的下側,設置有與凸面鏡15、凹凸透鏡15’的直徑相同的程度的長度的大的開口,以覆蓋該開口的方式安裝了設置有多個孔204的沖孔板201。另外,在鏡筒100的z軸方向的上側也設置有大的開口,以覆蓋該開口的方式安裝了設置有多個孔203的沖孔板200。經由沖孔板201的孔對凸面鏡15與凹凸透鏡15’之間的閉合空間102供給氣體,經由沖孔板200的孔從閉合空間102排出氣體。這樣,透過從與凸面鏡15、凹凸透鏡15’的直徑相同的程度的長度的開口供給氣體、且排出氣體,可使氣體流過凸面鏡15、凹凸透鏡15’的表面整體。因此,凸面鏡15、凹凸透鏡15’成為如圖6所示的溫度分布,相比於不供給氣體的情況,縱橫方向的像散變大,傾斜方向的像散變小。因此,即使在以高照度對基板進行曝光的情況下,也可使傾斜方向的像散收斂於容許範圍內。   [0031] (第三實施方式)   接下來,說明第三實施方式的曝光裝置。在第一實施方式中就縱橫方向的像散進行計測。在本實施方式中,根據遮罩圖案的資訊和累計曝光量,計算縱橫方向的像散的變化量。   [0032] 首先,透過實驗,求出縱橫方向的像散的變化相對基板的累計曝光量的係數(曝光歷程係數)。具體而言,使用檢測從照明光學系統IL的光路徑分支出的光的累計曝光量計。預先求出從照明光學系統IL的光路徑分支出的光的照度和基板上的光的照度的對應關係。在連續地曝光的期間,累積以累計曝光量計而計測的照度,根據所述對應關係間接地求出基板上的累計曝光量。另外,在連續地曝光時,在就累計曝光量進行計測的同時,用聚焦感測器40測定縱橫方向的像散的變化。然後,控制部C使用這些測定數據求出縱橫方向的像散的變化相對基板的累計曝光量的係數。將該曝光歷程係數存儲到控制部C的記憶體。然後,在實際對基板進行曝光時,代替圖7的S302的計測,控制部C使用求出的曝光歷程係數、遮罩圖案的資訊以及實際對基板進行曝光時的累計曝光量,計算縱橫方向的像散的變化量。然後,控制部C計算為了校正縱橫方向的像散而所需的柱面透鏡等的驅動量。然後,控制部C根據計算出的驅動量控制驅動透鏡的驅動部。   [0033] 根據本實施方式的方法,可在使基板移動而對基板進行曝光的期間等無法用聚焦感測器測定像差的期間預測縱橫方向的像散的變化,可驅動透鏡來校正像差。因此,也可校正一個基板處理中或者一個照擊曝光中的縱橫方向的像散的變化。   [0034] (物品的製造方法)   接下來,說明利用上述曝光裝置的物品(半導體IC元件、液晶顯示元件、濾色器、MEMS等)的製造方法。透過使用上述曝光裝置對塗敷有感光劑的基板(晶圓、玻璃基板等)進行曝光的程序、使該基板(感光劑)顯影的程序以及用其它公知的加工程序處理顯影後的基板的程序來製造物品。其它公知的程序包括蝕刻、抗蝕層剝離、切割、接合、封裝等。根據本製造方法,可製造質量比以往高的物品。   [0035] 以上,說明了本發明的優選的實施方式,但本發明不限定於這些實施方式,可在其要旨的範圍內進行各種變形以及變更。此外,以曝光裝置內的控制部C進行運算、控制為前提進行了說明,但作為控制部也可以使用處於曝光裝置外的控制部。另外,說明了在凸面鏡15的附近配置一個凹凸透鏡15’的例子,但也可以配置多個透鏡。在該情況下,對多個透鏡之間的空間供給氣體,如上所述調整透鏡的溫度分布。另外,在所要求的曝光精度低的情況下,也可以不配置凹凸透鏡。在該情況下,氣體供給部使氣體流過凸面鏡的表面來調整凸面鏡的溫度分布。另外,說明了反射型投影光學系統,但還可應用於折射型投影光學系統。在折射型投影光學系統的情況下,使調溫後的氣體流過配置於光瞳面的附近的透鏡,使得發生一個方向的像散,用其它光學元件校正其它方向的像散。   所附申請專利範圍應被賦予最寬泛的解釋,以包含所有這些修改和等同的結構和功能。Next, an exposure apparatus according to a second embodiment will be described. The gas supply port and the exhaust port of the gas from the gas supply unit 35 are not limited to the holes opened in the lens barrel 100. In the present embodiment, a structure in which a punching plate provided with a plurality of holes is attached to a side surface of the lens barrel 100 is used. If it is a hole made in the lens barrel 100, manufacturing of the lens barrel 100 is easy. On the other hand, in the case of a punching plate, it is possible to effectively reduce the cooling unevenness of the temperature adjustment. FIG. 8 is a cross-sectional view of the lens barrel 100 to which a punching plate is mounted. A large opening having the same length as the diameter of the convex mirror 15 and the concave-convex lens 15 ′ is provided on the lower side in the z-axis direction of the lens barrel 100, and a punch provided with a plurality of holes 204 is installed so as to cover the opening.孔板 201。 Orifice 201. In addition, a large opening is also provided on the upper side in the z-axis direction of the lens barrel 100, and a punching plate 200 provided with a plurality of holes 203 is installed so as to cover the opening. Gas is supplied to the closed space 102 between the convex mirror 15 and the meniscus lens 15 'through the holes of the punching plate 201, and gas is discharged from the closed space 102 through the holes of the punching plate 200. In this way, the gas is supplied through the opening having the same length as the diameter of the convex mirror 15 and the meniscus lens 15 'and the gas is discharged, so that the gas can flow through the entire surface of the convex mirror 15 and the meniscus lens 15'. Therefore, the convex mirror 15 and the concave-convex lens 15 'have a temperature distribution as shown in FIG. Therefore, even when the substrate is exposed at a high illuminance, the astigmatism in the oblique direction can be converged within the allowable range. [0031] (Third Embodiment) Next, an exposure apparatus according to a third embodiment will be described. In the first embodiment, the astigmatism in the vertical and horizontal directions is measured. In this embodiment, the amount of change in astigmatism in the vertical and horizontal directions is calculated based on the information of the mask pattern and the accumulated exposure amount. [0032] First, through experiments, a coefficient (exposure history coefficient) of the change in astigmatism in the vertical and horizontal directions with respect to the cumulative exposure of the substrate is obtained. Specifically, a cumulative exposure meter that detects light branched from the light path of the illumination optical system IL is used. The correspondence between the illuminance of light branched from the light path of the illumination optical system IL and the illuminance of light on the substrate is obtained in advance. During the continuous exposure period, the illuminance measured by the cumulative exposure amount is accumulated, and the cumulative exposure amount on the substrate is indirectly obtained based on the correspondence relationship. In the case of continuous exposure, while measuring the cumulative exposure, the focus sensor 40 measures the change in astigmatism in the vertical and horizontal directions. Then, the control unit C uses these measurement data to obtain a coefficient of a change in the astigmatism in the vertical and horizontal directions with respect to the cumulative exposure amount of the substrate. The exposure history coefficient is stored in the memory of the control unit C. Then, when actually exposing the substrate, instead of the measurement of S302 in FIG. 7, the control unit C uses the obtained exposure history coefficient, the information of the mask pattern, and the cumulative exposure amount when actually exposing the substrate to calculate the vertical and horizontal directions. The amount of change in astigmatism. Then, the control unit C calculates a driving amount of a cylindrical lens or the like required to correct the astigmatism in the vertical and horizontal directions. Then, the control section C controls the driving section that drives the lens based on the calculated driving amount. [0033] According to the method of this embodiment, it is possible to predict changes in astigmatism in the vertical and horizontal directions during periods when aberration cannot be measured with a focus sensor, such as during a period when the substrate is moved to expose the substrate, and the lens can be driven to correct the aberration. . Therefore, changes in the astigmatism in the vertical and horizontal directions during one substrate process or one shot exposure can also be corrected. [0034] (Manufacturing Method of Article) Next, a method of manufacturing an article (semiconductor IC element, liquid crystal display element, color filter, MEMS, etc.) using the above exposure device will be described. A program for exposing a photosensitive-coated substrate (wafer, glass substrate, etc.), a program for developing the substrate (photosensitive agent), and a program for processing the developed substrate by other known processing programs by using the above-mentioned exposure device To make items. Other well-known procedures include etching, resist stripping, dicing, bonding, packaging, and the like. According to this manufacturing method, articles of higher quality than in the past can be manufactured. [0035] The preferred embodiments of the present invention have been described above, but the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof. In addition, the description has been made on the premise that the control unit C in the exposure apparatus performs calculation and control, but a control unit outside the exposure apparatus may be used as the control unit. Although an example in which one meniscus lens 15 'is arranged near the convex mirror 15 has been described, a plurality of lenses may be arranged. In this case, a gas is supplied to the space between the plurality of lenses, and the temperature distribution of the lenses is adjusted as described above. In addition, when the required exposure accuracy is low, a meniscus lens may not be arranged. In this case, the gas supply unit adjusts the temperature distribution of the convex mirror by flowing a gas through the surface of the convex mirror. In addition, the reflective projection optical system has been described, but it can also be applied to a refractive projection optical system. In the case of a refractive-type projection optical system, the temperature-adjusted gas is caused to flow through a lens arranged near the pupil surface, so that astigmatism in one direction occurs, and astigmatism in other directions is corrected by other optical elements. The scope of the attached patent application should be given the broadest interpretation to encompass all such modifications and equivalent structures and functions.

[0036][0036]

IL‧‧‧照明系統IL‧‧‧Lighting System

1‧‧‧汞燈1‧‧‧ Mercury lamp

2‧‧‧橢圓鏡2‧‧‧ oval mirror

3‧‧‧第一聚焦透鏡3‧‧‧ the first focusing lens

4‧‧‧蠅眼透鏡4‧‧‧ fly eye lens

5‧‧‧第二聚焦透鏡5‧‧‧Second focusing lens

6‧‧‧狹縫界定構材6‧‧‧ Slit delimiting structure

7‧‧‧成像光學系統7‧‧‧ imaging optical system

8‧‧‧平面鏡8‧‧‧ flat mirror

9‧‧‧遮罩9‧‧‧Mask

13‧‧‧第一平面鏡13‧‧‧The first plane mirror

14‧‧‧第一凹面鏡14‧‧‧The first concave mirror

15‧‧‧凸面鏡15‧‧‧ convex mirror

16‧‧‧第二凹面鏡16‧‧‧Second concave mirror

17‧‧‧第二平面鏡17‧‧‧Second Plane Mirror

19‧‧‧基板19‧‧‧ substrate

21‧‧‧柱面透鏡21‧‧‧ cylindrical lens

22‧‧‧柱面透鏡22‧‧‧ cylindrical lens

23‧‧‧柱面透鏡23‧‧‧ cylindrical lens

24‧‧‧柱面透鏡24‧‧‧ cylindrical lens

31‧‧‧致動器31‧‧‧Actuator

32‧‧‧致動器32‧‧‧Actuator

35‧‧‧氣體供給部35‧‧‧Gas Supply Department

36‧‧‧供氣路徑36‧‧‧Gas supply path

37‧‧‧排氣路徑37‧‧‧Exhaust path

40‧‧‧聚焦感測器40‧‧‧Focus Sensor

100‧‧‧鏡筒100‧‧‧ lens barrel

102‧‧‧閉合空間102‧‧‧ closed space

103‧‧‧孔103‧‧‧hole

104‧‧‧孔104‧‧‧hole

107‧‧‧氣體的流動107‧‧‧ gas flow

108‧‧‧氣體的流動108‧‧‧ gas flow

109‧‧‧氣體的流動109‧‧‧Gas flow

200‧‧‧沖孔板200‧‧‧ punching plate

201‧‧‧沖孔板201‧‧‧ punching plate

203‧‧‧孔203‧‧‧hole

204‧‧‧孔204‧‧‧hole

103A~G‧‧‧供氣口103A ~ G‧‧‧Air supply port

104A~G‧‧‧排氣口104A ~ G‧‧‧ exhaust port

12’‧‧‧平凹透鏡12’‧‧‧ Plano-Concave Lenses

15’‧‧‧凹凸透鏡15’‧‧‧ Convex lens

C‧‧‧控制部C‧‧‧Control Department

IP‧‧‧像面IP‧‧‧Image surface

LS‧‧‧光源LS‧‧‧Light source

OP‧‧‧物面OP‧‧‧ Surface

PO‧‧‧投影光學系統PO‧‧‧ Projection Optical System

圖1是曝光裝置的結構圖。 FIG. 1 is a configuration diagram of an exposure apparatus.

圖2是示出曝光後的凹凸透鏡15’的溫度分布的圖。 FIG. 2 is a diagram showing the temperature distribution of the meniscus lens 15 'after exposure.

圖3是示出冊尼克係數Z5、Z6項的溫度分布的圖。 FIG. 3 is a graph showing temperature distributions of terms Nickel coefficients Z5 and Z6.

圖4是示出凸面鏡15和凹凸透鏡15’的周邊結構的圖。 FIG. 4 is a diagram showing peripheral structures of the convex mirror 15 and the meniscus lens 15 '.

圖5是鏡筒100的剖面圖。 FIG. 5 is a sectional view of the lens barrel 100.

圖6是示出氣體供給後的溫度分布的圖。 FIG. 6 is a diagram showing a temperature distribution after gas supply.

圖7是示出像散的校正方法的流程圖。 FIG. 7 is a flowchart showing a method of correcting astigmatism.

圖8是示出實施方式2的鏡筒、供氣口以及排氣口的圖。 FIG. 8 is a diagram showing a lens barrel, an air supply port, and an exhaust port according to the second embodiment.

Claims (14)

一種曝光裝置,具有將遮罩的圖案投影到基板的投影光學系統,前述投影光學系統具有:第一光學元件,可為了調整前述投影光學系統的像散而變更位置或者形狀;以及第二光學元件,配置於前述投影光學系統的光瞳面或者光瞳面的附近,前述曝光裝置具有:控制部,控制前述第一光學元件的位置或者形狀;以及供給部,為了調整前述第二光學元件的溫度分布而對前述第二光學元件供給氣體,前述供給部對前述第二光學元件供給氣體,以使由於前述第二光學元件的溫度分布而產生的第一方向的像散和與前述第一方向不同的第二方向的像散的增減的方向相互相反,使前述第一方向的像散收斂於容許範圍內,前述控制部控制前述第一光學元件的位置或者形狀,以使前述第二方向的像散收斂於容許範圍內。An exposure device having a projection optical system for projecting a pattern of a mask onto a substrate, the projection optical system includes: a first optical element that can change a position or a shape in order to adjust the astigmatism of the projection optical system; and a second optical element And arranged near the pupil surface or the pupil surface of the projection optical system, the exposure device includes: a control unit that controls the position or shape of the first optical element; and a supply unit for adjusting the temperature of the second optical element To supply gas to the second optical element, and the supply unit supplies gas to the second optical element such that the astigmatism in the first direction and the first direction are different from the first direction due to the temperature distribution of the second optical element The direction of increase and decrease of the astigmatism in the second direction is opposite to each other, so that the astigmatism in the first direction converges within an allowable range. The control unit controls the position or shape of the first optical element so that the The astigmatism converges within the allowable range. 如請求項1的曝光裝置,其中,前述投影光學系統具有保持前述第二光學元件的保持部,前述供給部從設置於前述保持部的多個供氣口中的各個供氣口,沿著相互相同的方向使氣體流過前述第二光學元件的表面。The exposure apparatus according to claim 1, wherein the projection optical system has a holding portion that holds the second optical element, and the supply portion is the same along each other from each of a plurality of air supply ports provided in the holding portion. The direction of gas flows through the surface of the aforementioned second optical element. 如請求項2的曝光裝置,其中,在前述保持部中,前述多個供氣口的各個供氣口在相同的方向上延伸。The exposure apparatus according to claim 2, wherein, in the holding portion, each of the plurality of air supply ports extends in the same direction. 如請求項2的曝光裝置,其中,在前述保持部中,在相對於前述第二光學元件的光軸而與前述供氣口相反的一側設置有多個排氣口,前述多個供氣口以及前述多個排氣口在相同的方向上延伸。The exposure apparatus according to claim 2, wherein in the holding portion, a plurality of exhaust ports are provided on a side opposite to the air supply port with respect to the optical axis of the second optical element, and the plurality of air supply And the aforementioned plurality of exhaust ports extend in the same direction. 如請求項1的曝光裝置,其中,透過利用前述控制部控制前述第一光學元件的位置或者形狀,可進行前述投影光學系統的相互垂直的方向的投影倍率的調整,且可進行前述第二方向的像散的調整。According to the exposure apparatus of claim 1, wherein the position or shape of the first optical element is controlled by the control unit, the projection magnification of the projection optical system in a direction perpendicular to each other can be adjusted, and the second direction can be performed. Of astigmatism. 如請求項1的曝光裝置,其中,前述曝光裝置具有計測部,該計測部就前述投影光學系統的前述第二方向的像散進行計測,根據由前述計測部計測得到的計測結果,控制前述第一光學元件的位置或者形狀,以使前述第二方向的像散收斂於容許範圍內。The exposure apparatus according to claim 1, wherein the exposure apparatus includes a measurement unit that measures the astigmatism in the second direction of the projection optical system, and controls the first measurement unit based on a measurement result obtained by the measurement unit. The position or shape of an optical element, so that the astigmatism in the second direction converges within an allowable range. 如請求項1的曝光裝置,其中,前述控制部根據基於前述投影光學系統的前述基板的曝光歷程,計算為了使前述第二方向的像散收斂於容許範圍內而所需的前述第一光學元件的驅動量,根據計算出的驅動量來控制前述第一光學元件的驅動。The exposure device according to claim 1, wherein the control unit calculates the first optical element required to converge the astigmatism in the second direction within an allowable range based on an exposure history of the substrate by the projection optical system. The driving amount of the first optical element is controlled based on the calculated driving amount. 如請求項1的曝光裝置,其中,前述第二方向是與前述第一方向相差45度的方向。The exposure apparatus according to claim 1, wherein the second direction is a direction that is 45 degrees different from the first direction. 如請求項1的曝光裝置,其中,前述投影光學系統具有凹面鏡、凸面鏡以及透鏡,該透鏡配置於前述凹面鏡與前述凸面鏡之間,被保持成在與前述凸面鏡之間形成空間,前述第二光學元件是凸面鏡或者透鏡。The exposure apparatus according to claim 1, wherein the projection optical system includes a concave mirror, a convex mirror, and a lens, and the lens is disposed between the concave mirror and the convex mirror, and is held to form a space between the convex mirror and the second optical element. It is a convex mirror or lens. 如請求項9的曝光裝置,其中,前述供給部對前述凸面鏡與前述透鏡之間的空間供給氣體。The exposure device according to claim 9, wherein the supply unit supplies gas to a space between the convex mirror and the lens. 一種曝光裝置,具有將遮罩的圖案投影到基板的投影光學系統,前述投影光學系統具有:第一光學元件,可為了調整前述投影光學系統的像散而變更位置或者形狀;以及第二光學元件,配置於前述投影光學系統的光瞳面或者光瞳面的附近,前述曝光裝置具有:控制部,控制前述第一光學元件的位置或者形狀;以及供給部,為了調整前述第二光學元件的溫度分布,對前述第二光學元件供給氣體,前述供給部對前述第二光學元件供給氣體,以使由於前述第二光學元件的溫度分布而產生的第一方向的像散收斂於容許範圍內,使與前述第一方向交叉的第二方向的像散變大,前述控制部控制前述第一光學元件的位置或者形狀,以使前述第二方向的像散收斂於容許範圍內。An exposure device having a projection optical system for projecting a pattern of a mask onto a substrate, the projection optical system includes: a first optical element that can change a position or a shape in order to adjust the astigmatism of the projection optical system; and a second optical element And arranged near the pupil surface or the pupil surface of the projection optical system, the exposure device includes: a control unit that controls the position or shape of the first optical element; and a supply unit for adjusting the temperature of the second optical element Distribution to supply gas to the second optical element, and the supply unit supplies gas to the second optical element so that the astigmatism in the first direction due to the temperature distribution of the second optical element is converged within an allowable range, so that The astigmatism in the second direction crossing the first direction becomes larger, and the control unit controls the position or shape of the first optical element so that the astigmatism in the second direction converges within an allowable range. 一種曝光裝置,具有將遮罩的圖案投影到基板的投影光學系統,前述投影光學系統具有:第一光學元件,可為了調整前述投影光學系統的像散而驅動;以及第二光學元件,在曝光時產生不均勻的溫度分布,前述曝光裝置具有:驅動部,驅動前述第一光學元件;以及供給部,為了調整前述第二光學元件的溫度分布而對前述第二光學元件供給氣體,前述供給部對前述第二光學元件供給氣體,以使由於前述第二光學元件的溫度分布而產生的第一方向的像散和與前述第一方向不同的第二方向的像散的增減的方向相互相反,使前述第一方向的像散收斂於容許範圍內,前述驅動部驅動前述第一光學元件,以使前述第二方向的像散收斂於容許範圍內。An exposure device includes a projection optical system for projecting a pattern of a mask onto a substrate. The projection optical system includes: a first optical element that can be driven to adjust the astigmatism of the projection optical system; and a second optical element that performs exposure during exposure. The exposure device includes a driving unit that drives the first optical element, and a supply unit that supplies gas to the second optical element in order to adjust the temperature distribution of the second optical element. The supply unit Supplying gas to the second optical element such that the astigmatism in the first direction and the astigmatism in the second direction different from the first direction increase and decrease due to the temperature distribution of the second optical element. The astigmatism in the first direction is converged within an allowable range, and the driving unit drives the first optical element so that the astigmatism in the second direction is converged within an allowable range. 一種曝光裝置,具有將遮罩的圖案投影到基板的投影光學系統,前述投影光學系統具有:第一光學元件,可為了調整前述投影光學系統的像散而驅動;以及第二光學元件,在曝光時產生不均勻的溫度分布,前述曝光裝置具有:驅動部,驅動前述第一光學元件;以及供給部,為了調整前述第二光學元件的溫度分布而對前述第二光學元件供給氣體,前述供給部對前述第二光學元件供給氣體,以使由於前述第二光學元件的溫度分布而產生的第一方向的像散收斂於容許範圍內,使與前述第一方向交叉的第二方向的像散變大,前述驅動部驅動前述第一光學元件,以使前述第二方向的像散收斂於容許範圍內。An exposure device includes a projection optical system that projects a pattern of a mask onto a substrate. The projection optical system includes: a first optical element that can be driven to adjust the astigmatism of the projection optical system; and a second optical element that exposes The exposure device includes a driving unit that drives the first optical element, and a supply unit that supplies gas to the second optical element in order to adjust the temperature distribution of the second optical element. The supply unit A gas is supplied to the second optical element so that the astigmatism in the first direction due to the temperature distribution of the second optical element is within an allowable range, and the astigmatism in the second direction that intersects the first direction is changed. The driving unit drives the first optical element so that the astigmatism in the second direction converges within an allowable range. 一種製造物品的製造方法,具有以下程序:使用如請求項1至13中任一項的曝光裝置對基板進行曝光;使曝光後的該基板顯影;以及透過加工顯影後的該基板來製造前述物品。A manufacturing method for manufacturing an article, comprising the steps of: exposing a substrate using an exposure apparatus according to any one of claims 1 to 13; developing the substrate after exposure; and manufacturing the aforementioned article by processing the substrate after development. .
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