TWI653367B - 具有高薄片電阻之工件上的電化學沉積 - Google Patents

具有高薄片電阻之工件上的電化學沉積 Download PDF

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Publication number
TWI653367B
TWI653367B TW103118838A TW103118838A TWI653367B TW I653367 B TWI653367 B TW I653367B TW 103118838 A TW103118838 A TW 103118838A TW 103118838 A TW103118838 A TW 103118838A TW I653367 B TWI653367 B TW I653367B
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TW
Taiwan
Prior art keywords
conductive layer
layer
deposition
ecd
seed
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TW103118838A
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English (en)
Chinese (zh)
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TW201504483A (zh
Inventor
艾密許伊斯梅爾Ｔ
夏維羅伊
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美商應用材料股份有限公司
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Priority claimed from US13/915,566 external-priority patent/US20140103534A1/en
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201504483A publication Critical patent/TW201504483A/zh
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Publication of TWI653367B publication Critical patent/TWI653367B/zh

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)
TW103118838A 2013-06-11 2014-05-29 具有高薄片電阻之工件上的電化學沉積 TWI653367B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/915,566 2013-06-11
US13/915,566 US20140103534A1 (en) 2012-04-26 2013-06-11 Electrochemical deposition on a workpiece having high sheet resistance

Publications (2)

Publication Number Publication Date
TW201504483A TW201504483A (zh) 2015-02-01
TWI653367B true TWI653367B (zh) 2019-03-11

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TW103118838A TWI653367B (zh) 2013-06-11 2014-05-29 具有高薄片電阻之工件上的電化學沉積

Country Status (3)

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KR (1) KR20140144665A (ko)
CN (1) CN104241197A (ko)
TW (1) TWI653367B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10818748B2 (en) * 2018-05-14 2020-10-27 Microchip Technology Incorporated Thin-film resistor (TFR) formed under a metal layer and method of fabrication
US10970439B2 (en) 2018-11-29 2021-04-06 Taiwan Semiconductor Manufacturing Company, Ltd System on chip (SOC) current profile model for integrated voltage regulator (IVR) co-design
US20200373200A1 (en) 2019-05-24 2020-11-26 Applied Materials, Inc. Metal based hydrogen barrier
CN113106505A (zh) * 2020-01-13 2021-07-13 深圳市业展电子有限公司 一种提高电阻体高温防氧化性能的表面处理工艺及其电阻体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070077750A1 (en) 2005-09-06 2007-04-05 Paul Ma Atomic layer deposition processes for ruthenium materials
US20080213994A1 (en) 2007-03-01 2008-09-04 Ramanan Chebiam Treating a liner layer to reduce surface oxides

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US7070686B2 (en) * 2000-03-27 2006-07-04 Novellus Systems, Inc. Dynamically variable field shaping element
US8475636B2 (en) * 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8575028B2 (en) * 2011-04-15 2013-11-05 Novellus Systems, Inc. Method and apparatus for filling interconnect structures
US8496790B2 (en) * 2011-05-18 2013-07-30 Applied Materials, Inc. Electrochemical processor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070077750A1 (en) 2005-09-06 2007-04-05 Paul Ma Atomic layer deposition processes for ruthenium materials
US20080213994A1 (en) 2007-03-01 2008-09-04 Ramanan Chebiam Treating a liner layer to reduce surface oxides

Also Published As

Publication number Publication date
KR20140144665A (ko) 2014-12-19
TW201504483A (zh) 2015-02-01
CN104241197A (zh) 2014-12-24

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