TWI647080B - 脆性基板之分斷方法 - Google Patents
脆性基板之分斷方法 Download PDFInfo
- Publication number
- TWI647080B TWI647080B TW104113587A TW104113587A TWI647080B TW I647080 B TWI647080 B TW I647080B TW 104113587 A TW104113587 A TW 104113587A TW 104113587 A TW104113587 A TW 104113587A TW I647080 B TWI647080 B TW I647080B
- Authority
- TW
- Taiwan
- Prior art keywords
- line
- substrate
- crack
- brittle substrate
- groove
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014112648 | 2014-05-30 | ||
JP2014-112648 | 2014-05-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201601889A TW201601889A (zh) | 2016-01-16 |
TWI647080B true TWI647080B (zh) | 2019-01-11 |
Family
ID=54698639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104113587A TWI647080B (zh) | 2014-05-30 | 2015-04-28 | 脆性基板之分斷方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6288260B2 (ja) |
KR (1) | KR101856558B1 (ja) |
CN (1) | CN106715347B (ja) |
TW (1) | TWI647080B (ja) |
WO (1) | WO2015182298A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6760641B2 (ja) * | 2016-06-29 | 2020-09-23 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
JP7095471B2 (ja) * | 2018-08-03 | 2022-07-05 | 日本電気硝子株式会社 | 管状ガラス切断方法 |
JP7425966B2 (ja) * | 2020-03-12 | 2024-02-01 | 日本電気硝子株式会社 | ガラス板の製造方法及びその製造装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI257265B (en) * | 2001-06-14 | 2006-06-21 | Mitsuboshi Diamond Ind Co Ltd | An organic EL display production apparatus and an organic EL display production method |
JP2007331983A (ja) * | 2006-06-15 | 2007-12-27 | Sony Corp | ガラスのスクライブ方法 |
JP2008201629A (ja) * | 2007-02-21 | 2008-09-04 | Epson Imaging Devices Corp | 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置 |
TW201204658A (en) * | 2010-06-14 | 2012-02-01 | Mitsuboshi Diamond Ind Co Ltd | Scribing method for brittle material substrate |
TW201302638A (zh) * | 2011-05-31 | 2013-01-16 | Mitsuboshi Diamond Ind Co Ltd | 劃線方法、鑽石尖、劃線裝置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3074143B2 (ja) | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | ガラスカッターホイール |
JP5210356B2 (ja) * | 2010-06-14 | 2013-06-12 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のスクライブ方法 |
-
2015
- 2015-04-22 WO PCT/JP2015/062223 patent/WO2015182298A1/ja active Application Filing
- 2015-04-22 JP JP2016523384A patent/JP6288260B2/ja not_active Expired - Fee Related
- 2015-04-22 KR KR1020167033459A patent/KR101856558B1/ko active IP Right Grant
- 2015-04-22 CN CN201580028975.8A patent/CN106715347B/zh not_active Expired - Fee Related
- 2015-04-28 TW TW104113587A patent/TWI647080B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI257265B (en) * | 2001-06-14 | 2006-06-21 | Mitsuboshi Diamond Ind Co Ltd | An organic EL display production apparatus and an organic EL display production method |
JP2007331983A (ja) * | 2006-06-15 | 2007-12-27 | Sony Corp | ガラスのスクライブ方法 |
JP2008201629A (ja) * | 2007-02-21 | 2008-09-04 | Epson Imaging Devices Corp | 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置 |
TW201204658A (en) * | 2010-06-14 | 2012-02-01 | Mitsuboshi Diamond Ind Co Ltd | Scribing method for brittle material substrate |
TW201302638A (zh) * | 2011-05-31 | 2013-01-16 | Mitsuboshi Diamond Ind Co Ltd | 劃線方法、鑽石尖、劃線裝置 |
Also Published As
Publication number | Publication date |
---|---|
CN106715347B (zh) | 2019-08-27 |
JP6288260B2 (ja) | 2018-03-07 |
TW201601889A (zh) | 2016-01-16 |
KR101856558B1 (ko) | 2018-05-10 |
CN106715347A (zh) | 2017-05-24 |
JPWO2015182298A1 (ja) | 2017-04-20 |
KR20160147982A (ko) | 2016-12-23 |
WO2015182298A1 (ja) | 2015-12-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |