TWI647080B - 脆性基板之分斷方法 - Google Patents

脆性基板之分斷方法 Download PDF

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Publication number
TWI647080B
TWI647080B TW104113587A TW104113587A TWI647080B TW I647080 B TWI647080 B TW I647080B TW 104113587 A TW104113587 A TW 104113587A TW 104113587 A TW104113587 A TW 104113587A TW I647080 B TWI647080 B TW I647080B
Authority
TW
Taiwan
Prior art keywords
line
substrate
crack
brittle substrate
groove
Prior art date
Application number
TW104113587A
Other languages
English (en)
Chinese (zh)
Other versions
TW201601889A (zh
Inventor
曾山浩
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201601889A publication Critical patent/TW201601889A/zh
Application granted granted Critical
Publication of TWI647080B publication Critical patent/TWI647080B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW104113587A 2014-05-30 2015-04-28 脆性基板之分斷方法 TWI647080B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014112648 2014-05-30
JP2014-112648 2014-05-30

Publications (2)

Publication Number Publication Date
TW201601889A TW201601889A (zh) 2016-01-16
TWI647080B true TWI647080B (zh) 2019-01-11

Family

ID=54698639

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104113587A TWI647080B (zh) 2014-05-30 2015-04-28 脆性基板之分斷方法

Country Status (5)

Country Link
JP (1) JP6288260B2 (ja)
KR (1) KR101856558B1 (ja)
CN (1) CN106715347B (ja)
TW (1) TWI647080B (ja)
WO (1) WO2015182298A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6760641B2 (ja) * 2016-06-29 2020-09-23 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP7095471B2 (ja) * 2018-08-03 2022-07-05 日本電気硝子株式会社 管状ガラス切断方法
JP7425966B2 (ja) * 2020-03-12 2024-02-01 日本電気硝子株式会社 ガラス板の製造方法及びその製造装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI257265B (en) * 2001-06-14 2006-06-21 Mitsuboshi Diamond Ind Co Ltd An organic EL display production apparatus and an organic EL display production method
JP2007331983A (ja) * 2006-06-15 2007-12-27 Sony Corp ガラスのスクライブ方法
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
TW201204658A (en) * 2010-06-14 2012-02-01 Mitsuboshi Diamond Ind Co Ltd Scribing method for brittle material substrate
TW201302638A (zh) * 2011-05-31 2013-01-16 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3074143B2 (ja) 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 ガラスカッターホイール
JP5210356B2 (ja) * 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI257265B (en) * 2001-06-14 2006-06-21 Mitsuboshi Diamond Ind Co Ltd An organic EL display production apparatus and an organic EL display production method
JP2007331983A (ja) * 2006-06-15 2007-12-27 Sony Corp ガラスのスクライブ方法
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
TW201204658A (en) * 2010-06-14 2012-02-01 Mitsuboshi Diamond Ind Co Ltd Scribing method for brittle material substrate
TW201302638A (zh) * 2011-05-31 2013-01-16 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置

Also Published As

Publication number Publication date
CN106715347B (zh) 2019-08-27
JP6288260B2 (ja) 2018-03-07
TW201601889A (zh) 2016-01-16
KR101856558B1 (ko) 2018-05-10
CN106715347A (zh) 2017-05-24
JPWO2015182298A1 (ja) 2017-04-20
KR20160147982A (ko) 2016-12-23
WO2015182298A1 (ja) 2015-12-03

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MM4A Annulment or lapse of patent due to non-payment of fees