TWI645532B - Chip component and method of manufacturing the same - Google Patents

Abstract

A wafer member and a method of manufacturing the same are provided. The wafer member includes: a laminate; and a surface modifying member disposed on at least one region of the laminate, and the surface modifying member is configured to expose at least a surface of the laminate portion.

Description

Wafer component and method of manufacturing same

The present invention relates to a wafer member and a method of fabricating the same, and more particularly to a wafer member capable of controlling the shape of an external electrode and a method of fabricating the same.

In recent years, various bandwidths have been used with the versatility of portable electronic devices such as smart phones. That is, a plurality of functions using different bandwidths such as a wireless LAN, a Bluetooth, and a global positioning system (GPS) are employed in a smart phone. Further, as the electronic device is highly integrated, the internal circuit density in the limited space increases, and therefore, noise interference is inevitably generated between the internal circuits.

In order to suppress noise having various frequencies in portable electronic devices and also to constrain noise between internal circuits, a plurality of wafer members are currently used. For example, chip beads, common mode filters, and the like for respectively eliminating noises having different bandwidths from each other are currently used.

In addition, to protect the electronic device from, for example, electrostatic discharge (electro-static Electrostatic discharge protection devices such as varistors and suppressors are required for high voltage effects applied from the outside to the electronic device, such as discharge, ESD). In addition, at least two or more wafer members having different characteristics from each other may be laminated and fabricated into the wafer member to reduce the area occupied by the wafer members. For example, a noise filter and an electrostatic discharge protection device are stacked in a single wafer to achieve the wafer structure.

In this wafer member, the external electrode is disposed outside the laminate in which the predetermined structure is provided, and the connection with the internal circuit of the electronic device is established via the external electrode. Here, the external electrode can be provided by a plating process. That is, the wafer member can be soldered and mounted on a printed circuit board (PCB) substrate of the electronic device, and the external electrode is provided by a plating process to improve soldering characteristics.

However, the surface of the laminate has a non-uniform resistive state, and the plating layer will exhibit non-uniform growth when the plating process is performed in this state. That is, the plating layer will exhibit a blurring phenomenon, and thus the external electrodes are set to an undesired shape.

It is known that the surface of the laminate is coated with glass or the like in order to prevent this plating blur. That is, a coating layer is provided on the surface of the laminate using glass. However, since the surface coating layer is formed by coating a glass component on the surface of the laminate after the laminate is disposed, complete bonding properties with the laminate are not obtained, and The presence of the coating layer makes the conductor inside the laminate not connected to the external electrode.

(previous technical literature)

Korean Patent Registration No. 10-0876206

Korean Patent Publication No. 2002-0045782

The present invention provides a wafer member in which the shape of an external electrode is easily controlled and a method of manufacturing the same.

The present invention provides a wafer member in which the shape of an external electrode is easily controlled by modifying a surface and a method of manufacturing the same.

According to an exemplary embodiment, a wafer member includes: a laminate; and a surface modifying member disposed on at least one region of the laminate, wherein the surface modifying member is configured to expose at least a portion of the surface .

The laminate may include a plurality of laminated sheets, and a layer of a heterogeneous material different from the sheets may be disposed within the laminate.

The heterogeneous material layer may include a conductive pattern having a predetermined shape and having a material layer for preventing an overvoltage.

The surface modifying component may comprise a surface area distribution of from 5% to 90% of the surface area of the laminate.

The surface modifying member may include at least one of an oxide in a crystalline state and an oxide in an amorphous state.

The oxide may include at least one of Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , Ca ( CO ₃ ) ₂ , Ca(NO ₃ ) ₂ and CaCO ₃ .

At least a portion of the oxide may be embedded in the surface of the laminate.

The oxide may comprise particles having at least one or more particle sizes, the particles having at least one or more particle sizes being aggregated or connected to each other in at least one zone.

The microparticles of the oxide may have an average particle diameter of from 0.1 micrometers (μm) to 10 micrometers.

A recess defined in at least a portion of the surface of the laminate may be further included.

A second surface modifying member disposed in the laminate may be further included.

The second surface modifying member may be disposed on at least one of the sheets constituting the laminate.

According to another exemplary embodiment, a wafer member includes: a laminate in which a plurality of sheets are laminated; and a heterogeneous material layer disposed in the laminate and Each of the sheets is made of a different material; and an external electrode is disposed on at least one surface of the laminate, wherein the laminate has at least one surface comprising two or more elements.

A surface modifying component may be included, the surface modifying component being disposed on at least one surface of the laminate to expose at least a portion of a surface of the laminate.

The surface modifying component can comprise an oxide.

The oxide may have a thickness equal to 0.01% of the thickness of the laminate to 10% thickness.

According to still another exemplary embodiment, a method of fabricating a wafer member includes: preparing a plurality of wafer members; and forming a surface modifying member on at least one surface of the plurality of wafer members, wherein the surface modifying member is formed To expose at least a portion of the surface of the wafer member.

The plurality of wafer members and oxide powder can be fed into a container and rotated to form the surface modifying component.

A plurality of media may be fed together with the plurality of wafer members and the oxide powder.

The plurality of media may be made of a material different from that of the wafer member and the oxide powder.

The total volume of the plurality of media may be greater than the total volume of the oxide powder and less than the total volume of the plurality of laminates.

At least one of the following may be further included: performing a dip process before forming the surface modifying member, and performing surface polishing on the wafer member after forming the surface modifying member.

110, 120, 130, 140, 150, 160, 170, 180, 190‧‧ sheets

310‧‧‧First coil pattern

320‧‧‧second coil pattern

330‧‧‧ Third coil pattern

340‧‧‧fourth coil pattern

351, 352, 353, 361, 362, 363‧ ‧ holes

410, 420, 430, 440, 620‧‧‧ lead electrodes

511, 512, 513, 514‧‧‧ first discharge electrode

520‧‧‧second discharge electrode

531, 532, 533, 534‧‧‧ Electrostatic discharge protection layer

610‧‧‧ capacitor electrode

1000‧‧‧Laminated body

1100‧‧‧Upper cover

1200‧‧‧lower cover

2000‧‧‧Surface modified parts

3000, 3100, 3110, 3120, 3200, 3210, 3220‧‧‧ external electrodes

S110, S120, S130, S140, S150‧‧ steps

X, Y, Z‧‧ Direction

The exemplary embodiments may be understood in more detail in conjunction with the following description in which: FIG. 1 is a perspective view of a wafer member in accordance with an exemplary embodiment.

2(a) to 2(e) are schematic views illustrating a surface of a wafer member according to an exemplary embodiment.

3 through 5 are exploded perspective views of a wafer member in accordance with an exemplary embodiment.

FIG. 6 is a process flow diagram for explaining a method of manufacturing a wafer member according to an exemplary embodiment.

7 to 9 are images of the surface of the laminate depending on the feeding amount of the oxide.

10(a) to 10(c) and FIGS. 11(a) to 11(c) are diagrams illustrating the shape of a surface modifying member related to a case in which no medium is used and depending on the size of the medium, and A schematic representation of an image of the surface of a laminate.

12(a) to 12(e) and Figs. 13(a) to 13(e) are images of the surface of the laminate after wet-polishing and dry-polishing.

14(a) to 14(b) and 15(a) to 15(b) are diagrams according to an exemplary embodiment in which a surface modifying member is formed and according to a related embodiment in which a surface modifying member is not formed Photograph of the external electrodes of the wafer member.

Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments described herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention will be fully conveyed by those skilled in the art. In the figures, the thickness of the layers and the various regions are exaggerated for clarity, and the same reference numerals are used throughout the drawings.

1 is a perspective view of a wafer member according to an exemplary embodiment, and FIGS. 2(a) to 2(e) are schematic views of a wafer member.

1 and 2(a) to 2(e), a wafer member according to an exemplary embodiment may include a laminate 1000 in which a plurality of sheets are laminated, and is disposed on at least one surface of the laminate 1000 The upper surface modifying member 2000 and the external electrode 3000 disposed on at least one surface of the laminate 1000.

Laminate

The laminate 1000 may be disposed to have a predetermined length and width and a vertical direction (for example, the Z direction) in one direction (for example, the X direction) and another direction (for example, the Y direction) perpendicular to the one direction. An approximately hexahedral shape having a predetermined height. That is, when the formation direction of the external electrode 3000 is the X direction (ie, the longitudinal direction), the direction perpendicular to the X direction may be the Y direction (ie, the width direction), and the vertical direction may be the Z direction (ie, the thickness) direction). Here, for example, the length in the X direction may be equal to or larger than the width in the Y direction and the height in the Z direction, and the width in the Y direction may be equal to or different from the height in the Z direction. When the width (Y direction) is different from the height (Z direction), the width may be larger or smaller than the height. For example, the ratio of length, width, and height can be from 1 to 5:1:0.5 to 2. That is, the length may be approximately one to five times the width and the height may be from 0.5 to 2 times the width. However, the sizes in the X direction, the Y direction, and the Z direction are only one example, and thus various changes may be made depending on the internal structure of the electronic device connected to the wafer member, the shape of the wafer member, and the function of the wafer member. . This laminate 1000 can be provided by laminating sheets having a plurality of approximate plate shapes having a predetermined size. That is, the sheet may be disposed in an approximately quadrangular shape having a predetermined length and width in the X direction and the Y direction and a predetermined thickness in the Z direction. The plurality of sheets are laminated to provide a laminate 1000 having an approximately hexahedral shape. The plurality of sheets constituting the laminate 1000 may include, for example, a multi-layer ceramic capacitor (MLCC), BaTiO ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , Bi ₂ O ₃ , ZnO, and the like. A material of one or more of the dielectric material powders such as Al ₂ O ₃ is used. Therefore, the sheet may have a corresponding dielectric constant depending on the material quality, for example, a dielectric constant of 5 to 20,000, preferably a dielectric constant of 7 to 5,000, and more preferably 200 to 3,000. Electric constant. Further, the plurality of sheets may be composed of a variable resistor material. For example, the sheet may be provided by adding an additive such as Bi ₂ O ₃ , Pr ₆ O ₁₁ , CoO, and MnO to the ZnO powder. Further, the plurality of sheets may be non-magnetic sheets or magnetic sheets. That is, the plurality of sheets may be non-magnetic sheets made of the above materials and have a predetermined dielectric constant, or a magnetic sheet further containing a magnetic material. Alternatively, at least one of the plurality of sheets can be made of a magnetic sheet or a non-magnetic sheet to suit the use of the wafer member. Additionally, the plurality of sheets may be made of a mixture of metal powder and polymer. As described above, the plurality of sheets can be made of various materials depending on the use of the wafer member. Further, an owner of the plurality of sheets may have the same thickness, or at least one of the sheets may have a larger or smaller thickness than other sheets in the sheet thickness.

Alternatively, various structures may be provided in the plurality of sheets inside the laminate 1000. That is, the laminate 1000 may be internally provided with various shapes of conductive A pattern and an electrostatic discharge protection material can be provided. That is, at least one or a plurality of different material layers having components different from the components constituting the sheet of the laminate 1000 may be provided in the laminate 1000. For example, the plurality of sheets in the laminate 1000 may be respectively provided with a spiral coil pattern and a hole filled with a conductive material therein, and thus an inductor or a noise filter may be achieved. Further, a structure such as a variable resistor and an electrostatic discharge protection member can be realized in the laminate 1000 to prevent a high voltage. Further, a plurality of internal electrodes may be disposed in the plurality of sheets inside the laminate 1000 to be respectively and alternately connected to the external electrodes 3000, and thus the capacitors may be the two adjacent internal electrodes and the two A sheet between adjacent internal electrodes is provided. In addition, a substrate in which at least one surface is provided with a coil pattern is disposed in the laminate 1000, and a sheet composed of metal powder and a polymer may be laminated on an upper portion of the substrate to provide a power inductor (power) Inductor). One of an inductor, a noise filter, a capacitor, a power inductor, a variable resistor, and an ESD protection component may be disposed in the laminate 1000, or an inductor, a noise filter, a capacitor, a power inductor At least two or more of the variable resistor and the electrostatic discharge protection member may be disposed in the laminate 1000 in combination with each other. Alternatively, the laminate 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) disposed in the lowermost layer and the uppermost layer, respectively. That is, the sheet of the lowermost layer can serve as the lower cover layer, and the sheet of the uppermost layer can serve as the upper cover layer. The lower cover layer and the upper cover layer may be provided by laminating a plurality of magnetic sheets and may have the same thickness. Here, the outer cover layer composed of the magnetic sheet and the outermost portions (ie, the lower surface and the upper surface) of the lower cover layer may be further provided with, for example, A non-magnetic sheet such as a vitreous sheet. Further, the lower cover layer and the upper cover layer may have a thickness greater than the thickness of the inner sheet.

Surface modification component

The surface modifying member 2000 may be disposed on at least one surface of the laminate 1000. The surface modifying member 2000 may be disposed on the surface of the laminate 1000 by dispensing an oxide, for example, before the external electrode 3000 is provided. Here, the oxide may be dispersed and distributed on the surface of the laminate 1000 in a crystalline state or an amorphous state. When the external electrode 3000 is formed by a plating process, the surface modifying member 2000 may be dispensed on the surface of the laminate 1000 before the plating process. That is, the surface modifying member 2000 may be dispensed prior to forming a portion of the external electrode 3000 by a printing process, or may be dispensed prior to the printing process after the printing process. Alternatively, when the printing process is not performed, the plating process may be performed after the surface modifying component 2000 is dispensed. Here, at least a portion of the surface modifying member 2000 dispensed on the surface may be melted.

Further, at least a portion of the surface modifying member 2000 may be uniformly distributed on the surface of the laminate 1000 in the same size as shown in FIG. 2(a), and at least a portion of the surface modifying member 2000 may be as shown in FIG. 2 ( The distribution shown in b) is irregularly distributed in sizes different from each other. Further, as shown in FIG. 2(c), at least a portion of the surface of the laminate 1000 may define a depressed portion. That is, the surface modifying member 2000 is disposed to define the protrusion, and at least a portion of the area on which the surface modifying member 2000 is not disposed may be recessed to define the recess. Here, at least a portion of the surface modifying member 2000 may be disposed at a depth deeper than the surface of the laminate 1000. that is, The surface modifying member 2000 may be embedded in a predetermined thickness (ie, a predetermined depth), and the remaining portion of the surface modifying member 2000 may have a height higher than the height of the surface of the laminate 1000. Here, the surface modifying member 2000 embedded in the laminate 1000 may have a thickness equal to 1/20 to 1 of the average diameter of the oxide particles. That is, all portions of the oxide fine particles may be depressed into the laminate 1000, and at least a portion of the oxide fine particles may be depressed as shown in Fig. 2(d). Alternatively, the oxide particles may be provided only on the surface of the laminate 1000 as shown in Fig. 2(d). Therefore, the oxide fine particles may be disposed on the surface of the laminate 1000 in a hemispherical or spherical shape. Further, the surface modifying member 2000 may be partially distributed on the surface of the laminate 1000 as described above and may be distributed on at least a portion of the surface. That is, as shown in FIGS. 2(a) to 2(d), oxide fine particles are distributed in the shape of an island on the surface of the laminate 1000 to provide the surface modifying member 2000. That is, the oxide having a crystalline state or an amorphous state may be spaced apart from each other and distributed on the surface of the laminate 1000 in an island shape, and thus at least a portion of the surface of the laminate 1000 may be exposed. Further, as shown in FIG. 2(e), the surface modifying member 2000 may be disposed on at least one region in a film shape by connecting at least two or more oxides, and may be disposed in the at least one island shape At least part of the area. That is, at least two or more oxide fine particles are aggregated together, or adjacent oxide fine particles are connected to each other, and thus a film shape can be achieved. However, when the oxide exists in a particulate state, or even when the two or more particles are aggregated or joined together, at least a portion of the surface of the laminate 1000 may be exposed to the outside by the surface modifying member 2000. .

Here, the total area of the surface modifying member 2000 may be, for example, a laminate 1000 5% to 90% of the total area of the surface. Although the plating blur phenomenon on the surface of the laminate 1000 can be controlled depending on the area of the surface modifying member 2000, when the surface modifying member 2000 is excessively disposed, the conductive pattern inside the laminate 1000 may be difficult to contact the external electrode. 3000. That is, when the surface modifying member 2000 is disposed in an area of less than 5% of the surface area of the laminate 1000, the plating blur may not be easily controlled, and when it is disposed in an area of more than 90%, the laminate The conductive pattern inside 1000 may not be in contact with the external electrode 3000. Therefore, the surface modifying member 2000 is preferably provided in an area capable of controlling the plating blur phenomenon and bringing the conductive pattern inside the laminate 1000 into contact with the external electrode 3000. To this end, the surface modifying member 2000 may constitute 10% to 90% of the surface area of the laminate 1000, preferably 30% to 70% of the surface area of the laminate 1000, and more preferably occupy the surface area of the laminate 1000. 40% to 50% area setting. Here, the surface area of the laminate 1000 may be the surface area of one surface or may be the surface area of the six surfaces constituting the hexahedron. Alternatively, the surface modifying member 2000 may have a thickness equal to or less than 10% of the thickness of the laminate 1000. That is, the surface modifying member 2000 may have a thickness equal to 0.01% to 10% of the thickness of the laminate 1000. For example, the surface modifying member 2000 may exist in a size of 0.1 to 50 μm, and thus, the surface modifying member 2000 may have a thickness of 0.1 μm to 50 μm from the surface of the laminate 1000. That is, the surface modifying member 2000 may have a thickness of 0.1 μm to 50 μm from the surface of the laminate 1000 in addition to the embedded portion of the surface modifying member 2000. Therefore, when including the thickness embedded inside the laminate 1000, the surface modifying member 2000 may have a thickness of from 0.1 μm to 50 μm thick. When the surface modifying component 2000 has a thickness greater than that of the laminate 1000 When the thickness is 0.01%, the plating blur may not be easily controlled, and when the surface modifying member 2000 has a thickness greater than 10% of the thickness of the laminate 1000, the conductive pattern inside the laminate 1000 may not be able to The external electrode 3000 is contacted. That is, the surface modifying member 2000 may have various thicknesses depending on material properties (electrical conductivity, semiconductivity, insulation, magnetic body, etc.), and may be based on the particle size and the amount of the oxide powder. Whether you want to gather and have various thicknesses.

Since the surface modifying member 2000 is disposed on the surface of the laminate 1000 as described above, at least two regions in which the components are different from each other may exist on the surface of the laminate 1000. That is, the component detected from the region in which the surface modifying member 2000 is disposed may be different from the component detected from the region in which the surface modifying member 2000 is not disposed. For example, a component (ie, an oxide) depending on the surface modifying member 2000 may exist on a region on which the surface modifying member 2000 is disposed, and a component depending on the laminate 1000 (ie, a sheet) The component may be present on the area on which the surface modifying component 2000 is not disposed. The surface of the laminate 1000 can be imparted with roughness and modified by dispensing the surface modifying member 2000 on the surface of the laminate 1000 before the plating process as described above. Therefore, the plating process can be performed uniformly, and thus, the shape of the external electrode 3000 can be controlled. That is, the resistance of at least one region on the surface of the laminate 1000 may be different from the resistance of the other region, and when the plating process is performed in a state in which the resistance is uneven, the plating layer will exhibit non-uniform growth. In this case, an oxide in a particulate state or an oxide in a molten state may be dispersed on the surface of the body 1000 to provide the surface modifying member 2000, thereby enabling The surface of the laminate 1000 is modified and the growth of the plating layer is controlled.

Here, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , Ca(CO ₃ ) ₂ , Ca (for example) can be used. At least one or more of NO ₃ ) ₂ and CaCO ₃ are used as the oxide in the particulate state or the oxide in the molten state for uniformizing the surface resistance of the laminate 1000. Alternatively, the surface modifying member 2000 may be disposed on at least one of the sheets in the laminate 1000. That is, the conductive patterns having various shapes on the sheet can be set by a plating process, and the shape of the conductive pattern can be controlled by providing the surface modifying member 2000.

External electrode

The external electrodes 3000 (3100 and 3200) are disposed on the two opposite side surfaces and are selectively connected to the conductive patterns disposed inside the laminate 1000. That is, the external electrode 3000 may be disposed in such a manner as to be on each of the two opposite side surfaces (eg, on each of the first side surface and the second side surface) An external electrode is provided, or two or more external electrodes are provided as shown in FIG. Further, at least one external electrode may be further disposed on at least one of the third side surface and the fourth side surface perpendicular to the first side surface and the second side surface. The external electrode 3000 may be provided in at least one layer. Each of the external electrodes 3000 may be provided as a metal layer such as silver, and at least one plating layer may be disposed on the metal layer. For example, the external electrode 3000 can be disposed by laminating a copper layer, a nickel plating layer, and a tin plating layer or a tin/silver layer. Further, the external electrode 3000 can be formed, for example, by mixing 0.5% to 20% of Bi ₂ O ₃ or a multi-component glass frit having SiO ₂ as a main component with the metal powder. Here, a mixture of the glass frit and the metal powder may be fabricated in a paste form and then applied to both surfaces of the laminate 1000. As described above, since the glass frit is contained in the external electrode 3000, the adhesion between the external electrode 3000 and the laminate 1000 can be improved, and the conductive pattern inside the laminate 1000 and the external electrode 3000 are The contact response can be improved. Further, a conductive paste containing glass is applied, and then at least one plating layer is provided on the upper portion of the conductive paste to set the external electrode 3000. That is, the metal layer including the glass and the at least one plating layer on the upper portion of the metal layer are disposed, and thus the external electrode 3000 may be disposed. For example, the external electrode 3000 may be disposed in such a manner that a glass frit and a layer containing at least one of silver and copper are provided, and then by electrolytic plating or electroless plating (electroless plating) to sequentially provide a nickel plating layer and a tin plating layer. Here, the tin plating layer may have a thickness equal to or greater than the thickness of the nickel plating layer. Alternatively, the external electrode 3000 may be provided with at least one plating layer. That is, at least one plating layer may be provided by a plating process without applying a paste to thereby provide the external electrode 3000. Further, the external electrode 3000 may have a thickness of 2 micrometers to 100 micrometers, wherein the nickel plating layer has a thickness of 1 micrometer to 10 micrometers, and the tin plating/silver layer has a thickness of 2 micrometers to 10 micrometers.

Structure example inside the laminate

Here, the structure of the laminated body 1000 according to an exemplary embodiment is explained in FIGS. 3 to 5. 3 to 5 are exploded perspective views of a laminated body 1000 and an exploded perspective view of a noise filter including a spiral coil pattern, according to an exemplary embodiment. Such as As described above, various wafer components such as capacitors, variable resistors, inductors, and power inductors will be realized inside the laminate 1000, and the following exemplary embodiments illustrate a common mode noise filter. Example.

Referring to FIG. 3, the laminate 1000 may be disposed in such a manner that a plurality of sheets 110 to 150 are laminated, and at least one coil pattern is respectively disposed on at least one of the selected sheets 120 to 150 ( That is, the first to fourth coil patterns 310 to 340). Further, when a plurality of coil patterns (ie, the first coil pattern 310 to the fourth coil pattern 340) are provided, at least two coil patterns (ie, the first coil pattern 310 to the fourth coil pattern 340) may be filled therein The holes 351, 352, 361 and 362 having a conductive material are vertically connected to each other. For example, the first coil pattern 310 may be connected to the third coil pattern 330 via holes 351 and 352 filled with a conductive material therein, and the second coil pattern 320 may be connected to the first via holes 361 and 362 filled with a conductive material therein Four coil patterns 340. In addition, lead-out electrodes 410 to 440 which are taken out from the respective coil patterns (ie, the first coil pattern 310 to the fourth coil pattern 340) to the outside are provided and thus the lead electrodes 410 to 440 may be connected to the external electrodes. Further, an upper cover layer 1100 and a lower cover layer 1200 may be respectively disposed on the upper portion of the uppermost sheet 110 and the lower portion of the lowermost sheet 150. Each of the upper cover layer 1100 and the lower cover layer 1200 may have a thickness greater than the thickness of each of the sheets 110 to 150.

As shown in FIG. 4, the inside of the laminated body 1000 may be further provided with an electrostatic discharge protection member. That is, the common mode noise filter is laminated with the electrostatic discharge protection component to achieve a composite device. The laminate 1000 may include: a plurality of sheets 110 to 180; The first to fourth coil patterns 310 to 340 are respectively disposed on the at least one or more selected sheets 120 to 150; the holes 351, 352, 361 and 362 are defined to be filled with a conductive material to make the first coil pattern The 310 to fourth coil patterns 340 are respectively connected; the extraction electrodes 410 to 440 are taken out from the first coil pattern 310 to the fourth coil pattern 340 and connected to the external electrodes; the plurality of first discharge electrodes 511, 512, 513 and 514, Provided on the selected sheet 170; electrostatic discharge protection layers 531, 532, 533 and 534 filled in the holes formed at both ends of the first discharge electrodes 511 to 514; and a second discharge electrode 520 disposed on the selected sheet The material 180 is connected to the electrostatic discharge protection layers 531 to 534. Here, the first discharge electrodes 511 to 514 are connected to the external electrodes together with the plurality of extraction electrodes 410 to 440, and the second discharge electrodes 520 are connected to the separate external electrodes. Further, in order to divide the common mode noise filter from the electrostatic discharge protection component, a sheet 160 may be disposed between the electrostatic discharge protection component and the common mode noise filter.

As shown in FIG. 5, at least one capacitor electrode 610 may be further disposed in the laminate 1000. That is, a sheet 190 is disposed between the two coil patterns (ie, the second coil pattern 320 and the third coil pattern 330), and the capacitor electrode 610 may be disposed on the sheet 190 and may be disposed from the capacitor electrode 610. The extraction electrode 620 is taken out to the outside. Further, holes 353 and 363 in which the conductive material is filled may be defined in the sheet 190 and thus the upper coil pattern may be connected to the lower coil pattern. A capacitor having a predetermined capacitance may be disposed between the capacitor electrode 610 and each of the second coil pattern 320 and the third coil pattern 330, and the second coil pattern 320 and the third coil pattern 330 are disposed above the capacitor electrode 610 and the capacitor Electrode 610 Each of the sheets 130 and 190 is located between the second coil pattern 320 and the third coil pattern 330.

As described above, in the wafer member according to the exemplary embodiment, the shape of the external electrode 3000 can be controlled by providing the surface modifying member 2000 on the surface of the laminate 1000. That is, the surface modifying member 2000 is disposed on the surface of the laminate 1000 to modify the surface of the laminate 1000, and thus the blurring and spreading of the external electrode 3000 due to plating can be prevented. The spreading phenomenon, and thus the shape of the external electrode 3000 can be easily controlled. Further, according to the exemplary embodiment, the surface modifying member 2000 having a composition different from that of the laminate 1000 is disposed on the surface of the laminate 1000, and thus moisture can be prevented from penetrating into the laminate 1000, and thus The life and reliability of the wafer components can be improved. The waterproof property can be identified by measuring the leakage current after maintaining the wafer member in a high temperature and high humidity environment for a predetermined time.

Method of manufacturing a wafer member

A method of manufacturing a wafer member according to an exemplary embodiment will be explained with reference to FIG. FIG. 6 is a process flow diagram for explaining a method of manufacturing a wafer member according to an exemplary embodiment.

First, a sheet having an approximately quadrangular shape having a predetermined thickness is prepared (S110). Here, the plurality of sheets may have a size larger than the size of the wafer member. That is, a plurality of conductive patterns and the like are formed on the plurality of sheets and then the plurality of conductive patterns or the like can be cut into the size of the wafer member. Further, the plurality of sheets may be a non-magnetic sheet or a magnetic sheet having a predetermined dielectric constant. That is, the plurality of pieces At least one of the materials may be a non-magnetic sheet or a magnetic sheet. Alternatively, the plurality of sheets may be made of a variable resistor material having a predetermined breakdown voltage.

Next, a conductive pattern or the like having a predetermined shape is formed on at least one of the sheets (S120). Here, a plurality of insulating patterns may be formed on the conductive pattern. The conductive pattern may be formed into a quadrangle having a predetermined area or have a spiral shape from the central portion to the outside. Further, the conductive pattern can be formed by a screen printing method or a plating method using a conductive material such as silver, platinum, nickel, tin, and copper. Here, the surface modifying member 2000 may be formed on at least one surface of the sheet before the conductive pattern is formed by a plating method. That is, the surface of the sheet can be modified to control the plated shape by forming the surface modifying member 2000 on the surface of the sheet. Further, an electrostatic discharge protection member may be formed on at least one of the sheets to shield a high voltage such as an electrostatic discharge. An electrostatic discharge protection member may be formed between two conductive patterns spaced apart from each other in the vertical direction or the horizontal direction. For example, the electrostatic discharge protection member may be formed such that a pore of the penetrating sheet is filled, or the electrostatic discharge protection member may be formed on the sheet to be spaced apart from each other by two conductive The two conductive patterns are partially overlapped between the patterns. Further, the electrostatic discharge protection member may be a void prepared between the two conductive patterns. That is, separate materials are not formed between the two conductive patterns spaced apart from each other in the vertical direction or the horizontal direction, and pores may be maintained between the two conductive patterns and thus the pores may be used as Electrostatic discharge protection components.

Next, the laminate 1000 is formed in such a manner that a plurality of sheets on which the conductive patterns and/or the electrostatic discharge protection members are formed are stacked Layer, cutting and plasticizing (S130). Therefore, an inductor or a common mode noise filter in which a plurality of spiral coils are formed may be formed, or a capacitor in which a sheet between the two conductive patterns and the two conductive patterns constitutes a capacitance may be formed. In addition, an electrostatic discharge protection component can be formed. The wafer member for various uses is formed by laminating the plurality of sheets as described above: depending on the shape of the conductive pattern, the presence or absence of the electrostatic discharge protection member, and the material used for the sheet.

Next, a surface modifying member 2000 is formed on the surface of the laminate 1000 (S140). The surface modifying member 2000 can be formed by dispensing an oxide on the surface of the laminate 1000. For example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , Ca(CO ₃ ) ₂ , Ca ( At least one of NO ₃ ) ₂ and CaCO ₃ . Further, in order to form the surface modifying member 2000 on the surface of the laminate 1000, the oxide and the laminate 1000 are fed into a container in which a predetermined space is provided, and then rotated in the horizontal direction and/or the vertical direction. The container, whereby the oxide can be distributed on the surface of the laminate 1000. That is, a milling process can be performed. Here, the container may have an approximately cylindrical shape. Further, at least one such process is performed to form the surface modifying member 2000. The distribution amount, size, thickness, and the like of the surface modifying member 2000 on the surface of the laminate 1000 may vary depending on the amount of the oxide to be fed, the amount of the sheet 1000 to be fed, the processing time, and the like. That is, as the amount of oxide feeding and the processing time increase, the amount of distribution of the surface modifying member 2000 (i.e., surface area, size, and thickness) may increase, and as the amount of the laminated body 1000 is increased, the surface The amount of distribution (i.e., surface area, size, and thickness) of the modifying component 2000 can be increased. For example, a thickness of 0 micrometers to 10 micrometers can be dispensed on the surface of the laminate 1000 by supplying 20,000 laminates to 60,000 laminates and feeding 2 grams (g) to 15 grams of oxide. The oxide may be applied to each of the laminates 1000 in an amount of from 50 micrometers to 200 micrometers. Here, the rotational speed may be, for example, 50 revolutions per minute (rpm) to 100 rpm, and the volume of the container may be 500 cubic centimeters (cc) to 1000 cubic centimeters. In addition, the processing time can be from 30 minutes to 2 hours. In an exemplary embodiment, when 60,000 laminates 1000 having a surface area of 9.92 square millimeters (mm ² ) are fed into a predetermined container having 4 grams of oxide and then rotated for a predetermined time, the oxide is formed to 0. The thickness is from micron to 4 microns, and the oxide is formed with approximately 6.7 micrograms per square millimeter (μg/mm ² ) per surface area and is dispensed in an amount of approximately 67 micrograms per wafer. An image of the surface in this case is illustrated in FIG. Further, when 60,000 laminated bodies 1000 having a surface area of 9.92 mm 2 are fed into a predetermined container having 8 g of oxide and then rotated for a predetermined time, the oxide is formed to a thickness of 1 μm to 6 μm, and The oxides were formed at approximately 13.4 micrograms per square millimeter per surface area and were dispensed in an amount of approximately 133 micrograms per wafer. An image of the surface in this case is illustrated in FIG. In addition, when 60,000 laminated bodies 1000 having a surface area of 9.92 mm 2 are fed into a predetermined container having 11 g of oxide and then rotated for a predetermined time, the oxide is formed to a thickness of 2 μm to 10 μm, and The oxides were formed at approximately 18.5 micrograms per square millimeter per surface area and were dispensed in an amount of approximately 183 micrograms per wafer. An image of the surface in this case is illustrated in FIG.

Alternatively, the needle can be performed prior to forming the surface modifying component 2000 A pickling process on the surface of the laminate 1000. The dip process is a pre-step for modifying the surface of the laminate 1000, wherein the laminate 1000 can be treated to form a uniform on the surface of the laminate 1000 by using a weak acid. The pores. The voids are formed on the surface of the laminate 1000, and thus the surface modifying member 2000 can further facilitate the formation of the laminate 1000. Further, a plurality of media may be further filled together with the oxide when the surface modifying member 2000 is formed, and the oxide may be uniformly distributed by feeding the medium. That is, when the medium is not fed, the distribution of the oxide is non-uniform and thus the amount of oxides aggregated to each other may increase, but when the medium is fed, the distribution of the oxide is uniform and thus aggregates to each other. The amount of oxide can be reduced. Here, a material different from that of the laminate 1000 and the surface modifying member 2000 may be used as the medium. For example, stainless steel, ceramics, or the like can be used. Further, various shapes such as a spherical shape and a hexahedral shape may be used as the medium. Here, the total volume of the plurality of media may be greater than the total volume of the oxide powder and less than the total volume of the laminate 1000. For example, the total volume of the media can range from 10% to 90% of the total volume of the laminate 1000. In addition, the particle size and spacing of the oxide dispersed on the laminate 1000 can be adjusted according to the size of the medium, wherein as the size of the medium increases, the particle size and spacing of the oxide increase, and with the media As the size decreases, the particle size and spacing of the oxide decrease. That is, when the volume of the medium is less than 10% of the volume of the laminate 1000, the distribution state is the same as that when the medium is not used, and when the volume of the medium is larger than 90% of the volume of the laminate 1000 At the time, the amount of the oxide bonded to the surface of the medium is increased, and thus the oxide may not be coated on the surface of the laminate 1000. In Figure 10(a) and Figure In 11(a), a schematic cross-sectional view and a plan view for explaining the distribution shape of the surface modifying member in the case where the medium is not used are shown. As shown, the surface modifying member 2000 is irregularly distributed on the surface of the laminate 1000, and the amount of surface modifying members that are gathered and joined to each other is increased, and thus a film shape may be disposed on at least one of the regions. . Further, when a medium having a small size is used, as shown in FIGS. 10(b) and 11(b), the distribution of the surface modifying member 2000 on the surface of the laminate 1000 is better than that of FIG. 10(a). The situation shown in Fig. 11(a) is more regular, and the amount of surface modifying components that are gathered and connected to each other is reduced. However, when a medium having a large size is used, as shown in FIGS. 10(c) and 11(c), the surface modifying member 2000 is regularly distributed on the surface of the laminate 1000 and is as shown in FIG. (b) and the case where a small medium is used as shown in FIG. 11(b) is formed in a large size on the surface of the laminate 1000. The oxide bonded to the surface of the laminate 1000 is hardened using a medium as described above, and thus the oxide can be attached at a predetermined depth from the surface of the laminate 1000.

Next, if necessary, the surface of the surface modification member 2000 on which the upper surface of the laminate 1000 is formed may be polished (S150). Depending on the surface finish, a portion of the surface modifying member 2000 may be polished, and thus the surface modifying member 2000 may be formed to have an island shape. The polishing process can be performed as a dry polishing process and a wet polishing process. In the case of wet polishing, a plurality of stacked bodies 1000 including deionized water (ID) water, abrasive, and surface modifying member 2000 formed thereon may be fed to have a predetermined space After the container, the polishing was performed at a rotational speed of 50 rpm to 100 rpm. In the case of dry polishing, the abrasive and the plurality of laminates 1000 including the surface modifying member 2000 formed thereon may be used After feeding into the container, polishing was performed at a number of revolutions of 100 rpm to 200 rpm. That is, dry polishing can be performed at a high speed without feeding DI water. Here, alumina can be used as an abrasive. Further, the polishing time can be changed depending on the feeding amount of the laminate 1000, the DI water and the abrasive, the roughness of the abrasive, the polishing speed, and the like, and thus the low-speed wet polishing can be performed for more than 30 minutes, and the high-speed dry polishing can be performed less than One hour. For example, wet polishing can be carried out for 30 minutes to 24 hours, and dry polishing can be performed for 1 hour to 24 hours. 12(a) to 12(e) and Figs. 13(a) to 13(e) are surface images of the laminate after wet polishing and dry polishing. For each of the figures, Figures 12(a) and 13(a) illustrate the image before polishing, and Figures 12(b) and 13(b) illustrate the image after one hour of polishing, Figure 12 ( c) and Figure 13(c) illustrate the image after four hours of polishing, Figures 12(d) and 13(d) illustrate the image after six hours of polishing, and Figure 12(e) and Figure 13(e) ) Description of the image after 24 hours of polishing. As indicated above, the size and distribution of the surface modifying member 2000 on the laminate 1000 can be adjusted when the polishing process is performed.

14(a) to 14(b) and 15(a) to 15(b) are images of the shape of an external electrode of a wafer member on which a surface modifying member is formed, according to an exemplary embodiment, and according to the prior art An image of the shape of the external electrode of a wafer member that does not have a surface modifying component. An exemplary embodiment in which the surface modifying member is formed as shown in FIG. 14(a) may be more a laminate than the prior art in which the surface modifying member is not formed as shown in FIG. 14(b) The surface of 1000 provides insulating properties to prevent plating blurring, thereby enabling control of the shape of the external electrodes. This is compared to the prior art in which the surface modifying component is not formed as shown in FIG. 15(b), as shown in FIG. The exemplary embodiment in which the surface modifying member is formed as shown in 15(a) can provide surface roughness by surface modification to prevent blurring when plating is performed.

In addition, in order to determine the waterproof property, a plurality of wafer members in which the surface modifying member is formed according to an exemplary embodiment and a plurality of wafer members in which the surface modifying member is not formed according to the prior art are formed in which the temperature is 85 ° C The environment was maintained for 12 hours in an environment with a humidity of 85%, and then a voltage of 5 volts (V) was applied to determine the leakage current. Here, the leakage current (crossing IL) between the data line and the ground line and the leakage current (IL) between each data line are measured, and will be 10 nanoamperes (nA) or higher than 10 nanoamperes. The situation when the current flows is determined as a defect. The results of the waterproof properties according to the exemplary embodiments and prior art embodiments are shown in Table 1.

As described above, no leakage current is detected and thus no defect occurs in the wafer member in which the surface modifying member is formed according to the exemplary embodiment, but in the wafer member in which the surface modifying member is not formed according to the prior art A defect rate of 3% to 18% has occurred. That is, in the case of the prior art, since a leakage current of approximately 3% occurred between the data line and the ground line, this was determined as a defect. In addition, this was determined to be a defect due to a leakage current of approximately 18% between the data lines. In addition, in the wafer member in which the defect has occurred, the measured leak Leakage currents range from tens of nanometers to shorts. Thus, according to an exemplary embodiment, a surface modifying component may be formed to improve the waterproof property of the wafer member and thus improve the life and reliability of the wafer component.

In the wafer member according to the exemplary embodiment, the surface modifying member is disposed on the laminate, and thus the shape of the external electrode can be controlled. That is, the surface modifying member is disposed on the surface of the laminate to modify the surface of the laminate, and thus the blurring and spreading of the external electrodes due to plating can be prevented, and Therefore, the shape of the external electrode can be easily controlled.

In addition, a surface modifying member can be provided to prevent moisture from penetrating into the laminate, and thus the life and reliability of the wafer member can be improved.

While the technical concept of the present invention has been specifically described with respect to the above embodiments, it should be noted that the above-described embodiments are merely illustrative and not limiting. Further, those skilled in the art will understand that various embodiments can be made within the scope of the technical idea of the present invention.

Claims (21)

A wafer member comprising: a laminate; and a surface modifying member disposed on at least one region of the laminate, wherein the surface modifying member is configured to be dispersed on the surface of the laminate At least a portion of the surface of the laminate is exposed and exposed. The wafer member according to claim 1, wherein the laminate comprises a plurality of laminated sheets, and a layer of a heterogeneous material different from the sheet is disposed in the laminate. The wafer member of claim 2, wherein the heterogeneous material layer comprises a conductive pattern having a predetermined shape and having a material layer for preventing an overvoltage. The wafer member according to claim 1, wherein the surface modifying member is distributed in a surface area of 5% to 90% of the surface area of the laminate. The wafer member according to claim 4, wherein the surface modifying member comprises at least one of an oxide in a crystalline state and an oxide in an amorphous state. The wafer member of claim 5, wherein the oxide comprises at least one of the following: Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , Ca(CO ₃ ) ₂ , Ca(NO ₃ ) ₂ and CaCO ₃ . The wafer member of claim 6, wherein at least a portion of the oxide is embedded in the surface of the laminate. The wafer member of claim 6, wherein the oxide comprises particles having at least one or more particle sizes, the particles having at least one or more particle sizes being aggregated or connected to each other in at least one region . The wafer member of claim 6, wherein the particles of the oxide have an average particle diameter of from 0.1 micrometer to 10 micrometers. The wafer member of claim 1, further comprising a recess defined in at least a portion of the surface of the laminate. The wafer member according to any one of claims 1 to 10, further comprising a second surface modifying member disposed in the laminate. The wafer member according to claim 11, wherein the second surface modifying member is disposed on at least one of the sheets constituting the laminate. A wafer member comprising: a laminate in which a plurality of sheets are laminated; a layer of a heterogeneous material disposed in the laminate and composed of each of the sheets The material is made of a different material; the external electrode is disposed on at least one surface of the laminate, and the surface modifying member is configured to be dispersed on the surface of the laminate and expose the surface of the laminate At least part of it. The wafer member of claim 13, wherein the surface modifying component comprises an oxide. The wafer member according to claim 14, wherein the oxide has a thickness equal to 0.01% to 10% of a thickness of the laminate. A method of manufacturing a wafer member, comprising: preparing a plurality of wafer members; and sequentially forming a surface modifying member and an external electrode on at least one surface of the plurality of wafer members, wherein the surface modifying member is dispersed At least a portion of the surface of the wafer member and exposing at least a portion of the surface of the wafer member. The method of claim 16, wherein the plurality of wafer members and oxide powder are fed into a container and rotated to form the surface modifying member. The method of claim 17, wherein the plurality of media are further fed together with the plurality of wafer members and the oxide powder. The method of claim 18, wherein the plurality of media are made of a material different from a material of the wafer member and the oxide powder. The method of claim 19, wherein the total volume of the plurality of media is greater than a total volume of the oxide powder and less than a total volume of the plurality of laminates. The method of any one of claims 16 to 20, further comprising at least one of the following: performing a dipping process prior to forming the surface modifying component, and forming the surface modification Surface polishing is performed on the wafer member after the material component.