JP3038296B2 - Electronic component manufacturing method - Google Patents
Electronic component manufacturing methodInfo
- Publication number
- JP3038296B2 JP3038296B2 JP6337233A JP33723394A JP3038296B2 JP 3038296 B2 JP3038296 B2 JP 3038296B2 JP 6337233 A JP6337233 A JP 6337233A JP 33723394 A JP33723394 A JP 33723394A JP 3038296 B2 JP3038296 B2 JP 3038296B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic body
- ceramic
- powder
- metal oxide
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000919 ceramic Substances 0.000 claims description 119
- 239000000843 powder Substances 0.000 claims description 75
- 238000007747 plating Methods 0.000 claims description 50
- 229910044991 metal oxide Inorganic materials 0.000 claims description 41
- 150000004706 metal oxides Chemical class 0.000 claims description 41
- 238000005498 polishing Methods 0.000 claims description 26
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 5
- 239000010408 film Substances 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000004020 conductor Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、積層チップインダクタ
等のように、セラミック素体の表面に外部電極が形成さ
れた電子部品を製造する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component having external electrodes formed on the surface of a ceramic body, such as a multilayer chip inductor.
【０００２】[0002]
【従来の技術】例えば、従来の一般的な電子部品である
積層チップインダクタの製造方法は、次の通りである。
まず、磁性体セラミック粉末等を有機バインダーに分散
したセラミックスラリーを薄く成形したセラミックグリ
ーンシートを作り、このセラミックグリーンシート上に
スクリーン印刷等によって導電ペーストを印刷し、内部
電極パターンを形成する。このセラミックグリーンシー
トを所定の枚数積層すると共に、各セラミックグリーン
シート上の内部電極をスルーホール導体を介して接続す
る。2. Description of the Related Art For example, a method of manufacturing a multilayer chip inductor, which is a conventional general electronic component, is as follows.
First, a ceramic green sheet is formed by thinly forming a ceramic slurry in which a magnetic ceramic powder or the like is dispersed in an organic binder, and a conductive paste is printed on the ceramic green sheet by screen printing or the like to form an internal electrode pattern. A predetermined number of the ceramic green sheets are stacked, and the internal electrodes on each of the ceramic green sheets are connected via through-hole conductors.
【０００３】このようにして積層されたセラミックグリ
ーンシートの積層体を裁断し、個々の電子部品毎の積層
チップに裁断した後、積層チップを焼成することによ
り、焼結されたセラミック素体を得る。さらに、このセ
ラミック素体をバレル研磨する。これは、セラミック素
体の端面に内部電極の引出し電極部を導出させると共
に、その後の外部電極の形成を容易にするためである。[0003] A laminated body of ceramic green sheets laminated in this manner is cut and cut into laminated chips for individual electronic components, and then the laminated chips are fired to obtain a sintered ceramic body. . Further, the ceramic body is barrel-polished. This is for the purpose of leading the extraction electrode portion of the internal electrode to the end face of the ceramic body, and to facilitate the subsequent formation of the external electrode.
【０００４】次に、セラミック素体の端部に外部電極を
形成する。すなわち、セラミック素体の端部に、銀や銀
−パラジウム合金等の導電粉末がバインダー成分に分散
された導電ペーストを塗布し、焼き付けて、外部電極を
形成する。その後、この外部電極を湿式メッキし、その
表面にメッキ膜を形成する。例えば、銅やニッケル等の
メッキを行った後、錫や半田等のメッキを行う。Next, external electrodes are formed at the ends of the ceramic body. That is, a conductive paste in which a conductive powder such as silver or a silver-palladium alloy is dispersed in a binder component is applied to the end of the ceramic body and baked to form an external electrode. Thereafter, the external electrodes are wet-plated to form a plating film on the surface. For example, after plating with copper or nickel, plating with tin or solder is performed.
【０００５】[0005]
【発明が解決しようとしている課題】前記の外部電極を
形成するための導電ペーストは、セラミック素体の表面
への密着性を高めるため、ガラス成分を含んでいる。こ
のため、その導電ペーストを焼き付けて形成された外部
電極は、その表面に絶縁物であるガラス成分が点在する
ことになる。すなわち、外部電極は、湿式メッキを施す
のに必ずしも好ましい下地ではなく、外部電極の表面に
均一で適当な膜厚のメッキ膜を形成することは相当に困
難である。The conductive paste for forming the above-mentioned external electrode contains a glass component in order to enhance the adhesion to the surface of the ceramic body. Therefore, an external electrode formed by baking the conductive paste has a glass component which is an insulator scattered on the surface. That is, the external electrode is not always a preferable base for performing wet plating, and it is considerably difficult to form a plating film having a uniform and appropriate thickness on the surface of the external electrode.
【０００６】そこで、湿式メッキを行う際の電流密度、
メッキ浴の組成、その他のメッキ条件等を充分に注意
し、厳格に調整しながらメッキ膜が析出しやすい条件の
もとでメッキを行うことが必要となる。しかし、このよ
うな条件のもとで湿式メッキを行うため、外部電極以外
のセラミック素体の表面にもメッキ膜が析出してしまう
ことがある。これは、いわゆるメッキ伸びと称する現象
である。特に、このようなメッキ伸びは、比較的電気抵
抗の低いセラミック素体の表面に設けた外部電極にメッ
キを施すときに起こりやすい。例えば、フェライト素
体、セラミックサーミスター素体、圧電セラミック素体
等の表面の外部電極にメッキを施すときに起こりやす
い。Therefore, the current density when performing wet plating,
It is necessary to pay careful attention to the composition of the plating bath, other plating conditions, and the like, and to perform plating under strictly adjusted conditions under which the plating film is likely to deposit. However, since wet plating is performed under such conditions, a plating film may be deposited on the surface of the ceramic body other than the external electrodes. This is a phenomenon called so-called plating elongation. In particular, such plating elongation is likely to occur when plating is performed on an external electrode provided on the surface of a ceramic body having a relatively low electric resistance. For example, this is likely to occur when plating external electrodes on the surface of a ferrite element, a ceramic thermistor element, a piezoelectric ceramic element, or the like.
【０００７】このようなメッキ伸びが生じると、電子部
品の外観を損なうだけでなく、外部電極間の絶縁抵抗が
低下し、外部電極間の耐電圧が低下したり、ショートす
る原因となる。本発明は、前記従来の電子部品の製造方
法における課題に鑑み、セラミック素体の外部電極以外
の部分にメッキ膜が析出しにくく、そのため、外部電極
間の絶縁抵抗の低下やショートが起こりにくい電子部品
の製造方法を提供することを目的とする。[0007] When such plating elongation occurs, not only does the appearance of the electronic component be impaired, but also the insulation resistance between the external electrodes decreases, causing a reduction in the withstand voltage between the external electrodes and a short circuit. The present invention has been made in view of the above-described problems in the conventional method of manufacturing an electronic component, and it is difficult for a plating film to be deposited on a portion other than the external electrodes of the ceramic body, so that the insulation resistance between the external electrodes is not easily reduced or a short circuit is unlikely to occur. An object of the present invention is to provide a method for manufacturing a component.
【０００８】[0008]
【課題を解決するための手段】本発明では、前記目的を
達成するため、セラミック素体１１の表面に形成された
外部電極１２、１２の表面に湿式メッキを施す前に、セ
ラミック素体１１の表面に予め同素体１１を構成するセ
ラミック材料より絶縁抵抗の高い金属酸化物粉末を被着
することで、湿式メッキを施す際に、セラミック素体１
１の表面にメッキ膜が析出するのを有効に防止するよう
にした。According to the present invention, in order to achieve the above object, before the surfaces of the external electrodes 12 and 12 formed on the surface of the ceramic body 11 are wet-plated, the ceramic electrodes 11 are formed. By applying a metal oxide powder having a higher insulation resistance than the ceramic material constituting the allotrope 11 on the surface in advance, the ceramic
The first embodiment effectively prevents the plating film from depositing on the surface.
【０００９】すなわち、本発明による電子部品の製造方
法は、電子部品のセラミック素体１１を得る工程と、こ
のセラミック素体１１をバレル研磨する工程と、このセ
ラミック素体１１の表面に外部電極１２、１２を形成す
る工程と、この外部電極１２、１２の表面に湿式メッキ
によりメッキ膜を形成する工程とを有する電子部品の製
造方法において、焼成後のセラミック素体１１をバレル
研磨するのと同時に、その表面に同セラミック素体１１
を構成するセラミック材料よりも電気抵抗の高い金属酸
化物粉末を付着させ、その後外部電極１２、１２を焼き
付けるのと同時に、前記の金属酸化物粉末をセラミック
素体１１の表面に焼き付け、その後前記外部電極１２、
１２の表面に湿式メッキを施すことを特徴とする。[0009] That is, a method of manufacturing an electronic component according to the present invention includes the steps of obtaining a ceramic body 11 of the electronic component, this
A step of barrel polishing the ceramic body 11, a step of forming external electrodes 12 and 12 on the surface of the ceramic body 11, and a step of forming a plating film on the surfaces of the external electrodes 12 and 12 by wet plating. method of manufacturing an electronic component having a barrel ceramic body 11 after firing
At the same time as polishing, the same ceramic body 11
Metallic acid with higher electrical resistance than ceramic material
And then bake the external electrodes 12, 12
At the same time, the metal oxide powder is
Baking on the surface of the element body 11, and then the external electrodes 12,
12 is characterized by performing wet plating on the surface thereof.
【００１０】金属酸化物粉末は、セラミック素体１１の
表面に外部電極１２、１２を形成する工程の前に、セラ
ミック素体１１をバレル研磨する際に、研磨剤に金属酸
化物粉末を混合することにより、前記セラミック素体１
１の表面に金属酸化物粉末を付着させることができる。
その後、セラミック素体１１の表面に外部電極１２、１
２を形成する際に、その焼付け工程と同時に金属酸化物
薄膜を焼き付ける。[0010] Metal oxide powders, the ceramic body 11
Before the step of forming the external electrodes 12 on the surface,
When barrel-polishing the Mick body 11 , the ceramic body 1 is mixed by mixing a metal oxide powder with an abrasive.
The metal oxide powder can be adhered to the surface of the substrate.
Then, the external electrodes 12, 1,
At the time of forming 2, a metal oxide thin film is baked simultaneously with the baking step.
【００１１】セラミック素体１１の表面に被着させる金
属酸化物粉末は、特に、ＴｉＯ2 粉末やＺｒＯ2 粉末が
好ましい。これらの金属酸化物粉末をバレル研磨の研磨
剤に混合する場合は、５重量％以上混合する。The metal oxide powder to be deposited on the surface of the ceramic body 11 is preferably a TiO 2 powder or a ZrO 2 powder. When these metal oxide powders are mixed with an abrasive for barrel polishing, they are mixed in an amount of 5% by weight or more.
【００１２】[0012]
【作用】前記本発明による第一の電子部品の製造方法で
は、セラミック素体１１の表面にセラミック素体１１を
構成するセラミック材料よりも電気抵抗の高い金属酸化
物粉末を被着させることにより、セラミック素体１１の
表面に同素体１１より電気抵抗の高い金属酸化物の層が
形成される。このため、その後に湿式メッキを行った際
に、メッキ浴中でセラミック素体１１の表面に発生する
活性水素に対して同素体１１の表面の耐久性が増大し、
メッキが析出しにくくなる。すなわち、いわゆるメッキ
伸びが防止される。In the first method for manufacturing an electronic component according to the present invention, the surface of the ceramic body 11 is coated with a metal oxide powder having a higher electrical resistance than the ceramic material constituting the ceramic body 11, On the surface of the ceramic body 11, a metal oxide layer having a higher electric resistance than the allotrope 11 is formed. Therefore, when wet plating is performed thereafter, the durability of the surface of the allotrope 11 against active hydrogen generated on the surface of the ceramic body 11 in the plating bath increases,
Plating becomes difficult to deposit. That is, so-called plating elongation is prevented.
【００１３】例えば、金属酸化物粉末をセラミック素体
１１の表面に付着させた後、焼き付けることにより、金
属酸化物がセラミック素体１１の表面で反応し、同素体
１１の表面に前記のような耐メッキ層が形成される。セ
ラミック素体１１をバレル研磨する場合、研磨剤に金属
酸化物粉末を混合することにより、バレル研磨工程中に
前記セラミック素体１１の表面に金属酸化物粉末を付着
させることができる。そして、この金属酸化物粉末を、
外部電極１２、１２を焼き付けるのと同時にセラミック
素体１１の表面に焼き付ければ、従来の製造工程余分な
工程を付加せず、前記の金属酸化物粉末の被着が効率よ
く行える。For example, after the metal oxide powder is adhered to the surface of the ceramic body 11 and baked, the metal oxide reacts on the surface of the ceramic body 11 and the surface of the body 11 has the above-mentioned resistance. A plating layer is formed. When barrel polishing the ceramic body 11, the metal oxide powder can be adhered to the surface of the ceramic body 11 during the barrel polishing step by mixing the metal oxide powder with the abrasive. And, this metal oxide powder,
If the external electrodes 12 and 12 are baked on the surface of the ceramic body 11 at the same time as the baking, the metal oxide powder can be efficiently applied without adding an extra step in the conventional manufacturing process.
【００１４】ＴｉＯ2 粉末やＺｒＯ2 粉末は、電気抵抗
が高く、化学的、電気的に安定しているので、前記のよ
うな耐メッキ性の高いセラミック素体１１の表面状態を
得るのに最も適している。これらの金属酸化物粉末をバ
レル研磨の研磨剤に混合する場合、それらを５重量％以
上混合することにより、耐メッキ性の高いセラミック素
体１１の表面状態が得られる。Since TiO 2 powder and ZrO 2 powder have high electric resistance and are chemically and electrically stable, it is most necessary to obtain the surface condition of the ceramic body 11 having high plating resistance as described above. Are suitable. When these metal oxide powders are mixed with an abrasive for barrel polishing, by mixing them in an amount of 5% by weight or more, the surface condition of the ceramic body 11 having high plating resistance can be obtained.
【００１５】[0015]
【実施例】次に、図面を参照しながら、本発明の実施例
について具体的且つ詳細に説明する。図１は、電子部品
の例としての積層チップインダクタのセラミックグリー
ンシートの積層構造を示す概念図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention; FIG. 1 is a conceptual diagram showing a laminated structure of ceramic green sheets of a laminated chip inductor as an example of an electronic component.
【００１６】フェライト粉末等の磁性体粉末をバインダ
ー中に分散したセラミックスラリーを用い、ドクターブ
レード法等の手段で薄いセラミックグリーンシート２
１、２３、２４、２７、２８を作る。一部のセラミック
グリーンシート２１、２３の所定の位置に予めスルーホ
ール１２、１２…を打ち抜いた後、周回状の内部電極パ
ターン１５ａ、１５ｂ、１５ｃ、１５ｄ、１５ｅ、１５
ｆを各々印刷すると共に、前記スルーホール１２、１２
…にスルーホール導体１３、１３…を印刷する。Using a ceramic slurry in which a magnetic substance powder such as a ferrite powder is dispersed in a binder, a thin ceramic green sheet 2 is formed by a doctor blade method or the like.
1, 23, 24, 27 and 28 are made. After punching through holes 12, 12... In advance at predetermined positions of some of the ceramic green sheets 21, 23, the circular internal electrode patterns 15 a, 15 b, 15 c, 15 d, 15 e, 15
f, and printing the through holes 12, 12
.. Are printed with through-hole conductors 13, 13,.
【００１７】必要とするコイルの巻数により、内部電極
パターン１５ａ、１５ｂ、１５ｃ、１５ｄを有するセラ
ミックグリーンシート２１、２１…を適当な組数用意
し、これらを順次積層する。そして、これらセラミック
グリーンシート２１、２１…の両側には、導体１５ａに
代えて、内部導体引出し部２５、２６を各々有する内部
電極パターン１５ｅ、１５ｆが各々印刷されたセラミッ
クグリーンシート２３、２４を積層し、さらにその両側
に内部電極パターンが印刷されてないセラミックグリー
ンシート２７、２８を保護層として積層する。According to the required number of turns of the coil, an appropriate number of sets of ceramic green sheets 21 having internal electrode patterns 15a, 15b, 15c, 15d are prepared, and these are sequentially laminated. On both sides of these ceramic green sheets 21, 21,..., Ceramic green sheets 23, 24 on which internal electrode patterns 15e, 15f having internal conductor lead-out portions 25, 26 are printed, respectively, are laminated instead of conductors 15a. Then, ceramic green sheets 27 and 28 on which no internal electrode pattern is printed are laminated on both sides as protective layers.
【００１８】図１では積層セラミックインダクタの１個
分だけの積層構造を示しているが、実際には積層セラミ
ックインダクタの複数個分の内部電極パターンが印刷さ
れたセラミックグリーンシートが積層される。そのため
セラミックグリーンシートを積層した後は、その積層体
を縦横に裁断し、図１に示す個々の積層体からなるセラ
ミック素体１１に分離する。その後、このセラミック素
体１１を焼成炉に導入し、焼成することにより、セラミ
ックグリーンシート内に含まれる樹脂等のバインダー成
分を除去すると共に、セラミックを焼結させる。Although FIG. 1 shows a laminated structure of only one laminated ceramic inductor, actually, ceramic green sheets on which internal electrode patterns for a plurality of laminated ceramic inductors are printed are laminated. For this reason, after laminating the ceramic green sheets, the laminated body is cut vertically and horizontally and separated into ceramic bodies 11 composed of individual laminated bodies shown in FIG. Thereafter, the ceramic body 11 is introduced into a firing furnace and fired to remove a binder component such as resin contained in the ceramic green sheet and to sinter the ceramic.
【００１９】次に、図２に示すように、焼成済みのセラ
ミック素体１１の両端部に外部電極１２、１２が形成さ
れる。しかし、一般的にはその前に焼成済みのセラミッ
ク素体１１がバレル研磨される。これは、前記のセラミ
ックグリーンシートの積層シートを裁断しただけの積層
体では、端面に前記の内部導体引出し部２５、２６が露
出されていないことが多く、また切断面にバリがあった
り、角が尖っていて、導電ペーストを連続して均一に塗
布しにくいことによる。このため、図２（ａ）に示す状
態から、セラミック素体１１をバレル研磨し、同図
（ｂ）に示すように、その端部の角を除去する共に、そ
の端面から内部導体引出し部２５、２６を確実に露出す
るものである。Next, as shown in FIG. 2, external electrodes 12 are formed on both ends of the fired ceramic body 11. However, generally, the fired ceramic body 11 is barrel-polished before that. This is because, in a laminate obtained by merely cutting the laminated sheet of the ceramic green sheet, the inner conductor lead-out portions 25 and 26 are often not exposed at the end faces, and the cut surface has burrs or corners. Is sharp and it is difficult to apply the conductive paste continuously and uniformly. For this reason, the ceramic body 11 is barrel-polished from the state shown in FIG. 2 (a) to remove the corners of the ends as shown in FIG. , 26 are surely exposed.
【００２０】既知のように、バレル研磨は、チップ状の
セラミック素体１１を溶融アルミナ粉末等の研磨剤や安
定化ジルコニアボール等の粒状メディアと共に研磨用バ
レル（籠）に収納し、バレルを回転して研磨するもので
ある。その後、セラミック素体１１の両端部に銀や銀−
パラジウム合金等の導体粉末を含む導電ペーストを塗布
し、その導電ペーストの種類に応じた最適な温度で焼き
付け、外部電極１２、１２が形成される。さらに、湿式
メッキ法により、この外部電極１２、１２の表面に銅、
ニッケル等のメッキが施され、さらに錫や半田等のメッ
キが施される。As is known, in the barrel polishing, the chip-shaped ceramic body 11 is housed in a polishing barrel (cage) together with an abrasive such as a fused alumina powder or a granular medium such as stabilized zirconia balls, and the barrel is rotated. Polishing. Then, silver or silver-is added to both ends of the ceramic body 11.
A conductive paste containing a conductive powder such as a palladium alloy is applied and baked at an optimum temperature according to the type of the conductive paste to form the external electrodes 12 and 12. Further, copper is coated on the surfaces of the external electrodes 12 by wet plating.
Plating of nickel or the like is performed, and further plating of tin or solder is performed.
【００２１】既に述べたように、本発明ではセラミック
素体１１の端部の外部電極１２、１２の表面にメッキを
施す前に、セラミック素体１１の表面にそのセラミック
素体１１を構成するセラミック材料、例えば前記のフェ
ライトよりも電気抵抗の高い金属酸化物粉末を被着させ
る。被着させる手段としては、セラミック素体１１の表
面に金属粉末を付着させ、これを焼き付けて凝着させる
のが一般的である。As described above, in the present invention, before plating the surfaces of the external electrodes 12 at the end portions of the ceramic body 11, the ceramic constituting the ceramic body 11 is formed on the surface of the ceramic body 11. A material, for example, a metal oxide powder having a higher electric resistance than the ferrite is applied. As a means for applying, generally, a metal powder is attached to the surface of the ceramic body 11, and the metal powder is baked and adhered.
【００２２】セラミック素体１１の表面に金属酸化物粉
末を被着させるのは、外部電極１２３、１２を形成した
後、その表面にメッキを施す前でもよいが、例えば、外
部電極１２、１２を形成する前にセラミック素体１１の
表面に金属酸化物粉末を付着させておき、外部電極１
２、１２を形成するための導電ペーストの焼付けと同時
に金属酸化物粉末を焼き付けて、セラミック素体１１の
表面に凝着させると効率的である。さらに、焼成して得
られたセラミック素体１１をバレル研磨する場合、その
表面に金属酸化物粉末を被着させるのは、必ずバレル研
磨の後に行う。但し、バレル研磨の際にセラミック素体
１１と共にバレルに収納される研磨剤やメディアと共
に、金属酸化物粉末を入れることにより、セラミック素
体１１の研磨と同時その表面に金属酸化物粉末を付着さ
せることもできる。その後、焼き付けて金属酸化物粉末
をセラミック素体１１の表面に被着させる。そうするこ
とにより、別にセラミック素体１１に金属酸化物粉末を
付着させる工程を設ける必要がなく、しかもセラミック
素体１１の表面に均一且つ強固に金属酸化物粉末を付着
させることができる。The metal oxide powder may be applied to the surface of the ceramic body 11 after the external electrodes 123 and 12 are formed and before the surfaces are plated. Before formation, a metal oxide powder is adhered to the surface of the ceramic body 11 so that the external electrode 1
It is efficient to bake the metal oxide powder at the same time as baking the conductive paste for forming the layers 2 and 12 and adhere the powder to the surface of the ceramic body 11. Further, when barrel polishing the ceramic body 11 obtained by firing, the metal oxide powder is applied to the surface of the ceramic body 11 only after barrel polishing. However, the metal oxide powder is put together with the abrasive and the media contained in the barrel together with the ceramic body 11 at the time of barrel polishing, so that the metal oxide powder adheres to the surface of the ceramic body 11 simultaneously with polishing. You can also. Then, the metal oxide powder is applied to the surface of the ceramic body 11 by baking. By doing so, there is no need to provide a separate step of attaching the metal oxide powder to the ceramic body 11, and the metal oxide powder can be uniformly and firmly attached to the surface of the ceramic body 11.
【００２３】金属酸化物粉末をバレル用の研磨剤と混合
して使用する場合、研磨剤の全体に対して金属酸化物粉
末を５〜６０重量％とするのがよい。研磨剤中の金属酸
化物粉末が５重量％未満の場合、セラミック積層体１１
の表面に充分な金属酸化物粉末の被着がしにくく、メッ
キ工程におけるいわゆるメッキ伸びを防止する効果に乏
しい。他方、研磨剤中の金属酸化物粉末が６０重量％を
越えると、バレル研磨時におけるセラミック積層体１１
の研磨性が著しく悪くなり、或る程度の時間に充分な研
磨ができない。When the metal oxide powder is used in a mixture with a polishing agent for a barrel, the content of the metal oxide powder is preferably 5 to 60% by weight based on the entire polishing agent. When the metal oxide powder in the abrasive is less than 5% by weight, the ceramic laminate 11
It is difficult to sufficiently coat the metal oxide powder on the surface of the substrate, and the effect of preventing so-called plating elongation in the plating step is poor. On the other hand, when the metal oxide powder in the abrasive exceeds 60% by weight, the ceramic laminate 11 during barrel polishing is not used.
Is extremely poor in polishing, and sufficient polishing cannot be performed within a certain period of time.
【００２４】セラミック積層体１１の表面に被着させる
金属酸化物は、セラミック積層体１１を構成するセラミ
ック材料、例えば前記のフェライトよりも電気抵抗の高
いものである。ＴｉＯ2 粉末やＺｒＯ2 粉末は、殆どの
セラミック粉末より電気抵抗が高く、且つ化学的、熱的
及び電気的に安定しており、最も最適な金属酸化物粉末
である。このような金属粉末は、平均粒径が２〜３μｍ
の微粉末が使用される。ＴｉＯ2 粉末とＺｒＯ2 粉末と
は、それ単独でも、また同時に混合して使用してもよ
い。The metal oxide to be deposited on the surface of the ceramic laminate 11 has a higher electric resistance than the ceramic material constituting the ceramic laminate 11, for example, the above-mentioned ferrite. TiO 2 powder and ZrO 2 powder have higher electric resistance than most ceramic powders and are chemically, thermally and electrically stable, and are the most optimal metal oxide powders. Such a metal powder has an average particle size of 2 to 3 μm.
Is used. The TiO 2 powder and the ZrO 2 powder may be used alone or as a mixture at the same time.
【００２５】なお、前記の説明では、セラミック素体１
１としてフェライト素体を例に説明したが、セラミック
サーミスター素体、圧電セラミック素体等、他のセラミ
ック素体についても同様である。特に、比抵抗が１０6
Ω以下のセラミック素体に適用すると有効である。ま
た、セラミック素体は、積層体に限られず、柱形、筒
形、リング形等の素体についても本発明を同様にして適
用することができる。In the above description, the ceramic element 1
Although a ferrite body has been described as an example for 1, the same applies to other ceramic bodies such as a ceramic thermistor body and a piezoelectric ceramic body. In particular, the specific resistance is 10 6
It is effective when applied to a ceramic body of Ω or less. Further, the ceramic body is not limited to a laminated body, and the present invention can be similarly applied to a body having a columnar shape, a cylindrical shape, a ring shape, or the like.
【００２６】次に、本発明のより具体的な実施例につい
て説明する。 （実施例１）素体材料であるフェライト粉末を、ポリビ
ニルブチラールを主成分とするバインダーを用いてシー
ト状に成形する。また、内部導体材料となるＡｇ粉末
を、セルロース系等の樹脂とブチルカルビトールアセテ
ート等の溶剤とからるバインダーと混練し、導電ペース
トを作る。Next, a more specific embodiment of the present invention will be described. (Example 1) A ferrite powder, which is a body material, is formed into a sheet using a binder containing polyvinyl butyral as a main component. Further, Ag powder as an internal conductor material is kneaded with a binder made of a resin such as a cellulose resin and a solvent such as butyl carbitol acetate to form a conductive paste.
【００２７】次ぎに、図１に示す様に、一部セラミック
グリーンシート２１、２３にスルーホール１２を設ける
と共に、上記導電ペーストで周回状の内部電極パターン
１５ａ、１５ｂ、１５ｃ、１５ｄ、１５ｅ、１５ｆを印
刷する。Next, as shown in FIG. 1, through holes 12 are partially provided in the ceramic green sheets 21 and 23, and the internal electrode patterns 15a, 15b, 15c, 15d, 15e, and 15f formed in a circular shape with the conductive paste. Print.
【００２８】こうして得られたセラミックグリーンシー
ト２１、２３を図１で示すように積層し、この積層シー
トの上下面に導体が印刷されていないセラミックグリー
ンシート２７、２８を複数枚保護層として積み重ねる。
このように積層されたものを９０℃、４００ｋｇ／ｃｍ
2 で熱圧着した。次いで、得られた積層体を、その両端
面に導体１５ｅ、１５ｆの内部導体引き出し部２５、２
６が各々露出するようにして、所定寸法に切断する。こ
れにより得られた積層チップを９００℃の温度で大気中
で１時間焼成し、セラミック素体１１を得た。The ceramic green sheets 21 and 23 thus obtained are laminated as shown in FIG. 1, and a plurality of ceramic green sheets 27 and 28 on which no conductor is printed are laminated as protective layers on the upper and lower surfaces of the laminated sheets.
What was laminated in this way was 90 ° C., 400 kg / cm
2 was thermocompression bonded. Next, the obtained laminate is placed on both end surfaces thereof with the internal conductor lead portions 25, 2 of conductors 15e, 15f.
6 so as to be exposed, and cut into predetermined dimensions. The laminated chip thus obtained was fired at 900 ° C. in the air for 1 hour to obtain a ceramic body 11.
【００２９】次に研磨剤として、ＪＩＳ Ｒ６０１に規
定された粒度が＃４６（粒径約２５０〜６００μｍ）の
溶融アルミナ粉に、平均粒径２〜３μｍのＴｉＯ2 粉末
を混合した混合溶融アルミナ粉を用意した。この研磨剤
に含まれるＴｉＯ2 粉末は、５重量％とした。セラミッ
ク素体１００ｃｃと前記研磨剤３００ｃｃと水３００ｃ
ｃとを容積１リットルのバレル研磨用ポットに入れ、こ
のポットを２６０ｒｐｍの回転数で１時間回転した。そ
の後、ポットからインダクタ素子を取り出し、水洗し
た。Next, as a polishing agent, a mixed molten alumina powder obtained by mixing TiO 2 powder having an average particle diameter of 2-3 μm with a molten alumina powder having a particle diameter of # 46 (particle diameter of about 250-600 μm) specified in JIS R601. Was prepared. The TiO 2 powder contained in the abrasive was 5% by weight. 100 cc of ceramic body, 300 cc of the abrasive and 300 c of water
was placed in a barrel polishing pot having a volume of 1 liter, and the pot was rotated at a rotation speed of 260 rpm for 1 hour. Thereafter, the inductor element was taken out of the pot and washed with water.
【００３０】こうして研磨したセラミック素体１１の両
端に銀粉末を含んだ導電ペーストを塗布し、これを７０
０℃で焼き付けて、外部電極１２、１２を形成した。そ
の後、ニッケル電解メッキ浴にセラミック素体１１を浸
漬し、外部電極１２、１２の表面にメッキを施し、膜厚
２μｍのニッケルメッキ膜を設けた。次に、半田電解メ
ッキ浴にセラミック素体１１を浸漬し、前記ニッケルメ
ッキ膜の上にメッキを施し、膜厚１０μｍの半田メッキ
膜を設けた。このようにして作られた電子部品を無作為
に１００個抜き取り、金属顕微鏡で目視検査した結果、
セラミック素体１１の表面にはメッキ膜の析出は見られ
なかった。A conductive paste containing silver powder is applied to both ends of the ceramic body 11 thus polished,
The external electrodes 12 and 12 were formed by baking at 0 ° C. Thereafter, the ceramic body 11 was immersed in a nickel electrolytic plating bath, and the surfaces of the external electrodes 12 and 12 were plated to provide a nickel plating film having a thickness of 2 μm. Next, the ceramic body 11 was immersed in a solder electrolytic plating bath, plating was performed on the nickel plating film, and a 10 μm-thick solder plating film was provided. As a result of randomly extracting 100 electronic components made in this way and visually inspecting them with a metallographic microscope,
No deposition of a plating film was observed on the surface of the ceramic body 11.
【００３１】（実施例２）前記実施例１において、研磨
剤に含まれるＴｉＯ2 粉末を、２０重量％としたこと以
外は、同実施例と同様にして電子部品を製造した。製造
された電子部品を無作為に１００個抜き取り、金属顕微
鏡で目視検査した結果、やはりセラミック素体１１の表
面にはメッキ膜の析出が見られなかった。Example 2 An electronic component was manufactured in the same manner as in Example 1 except that the amount of TiO 2 powder contained in the abrasive was 20% by weight. As a result of randomly extracting 100 manufactured electronic components and visually inspecting them with a metallographic microscope, no deposition of a plating film was observed on the surface of the ceramic body 11.
【００３２】（実施例３）前記実施例１において、研磨
剤に含まれる金属粉末を、ＺｒＯ2 粉末４０重量％とし
たこと以外は、同実施例と同様にして電子部品を製造し
た。製造された電子部品を無作為に１００個抜き取り、
金属顕微鏡で目視検査した結果、やはりセラミック素体
１１の表面にはメッキ膜の析出が見られなかった。Example 3 An electronic component was manufactured in the same manner as in Example 1 except that the metal powder contained in the abrasive was changed to 40% by weight of ZrO 2 powder. Randomly pull out 100 manufactured electronic components,
As a result of a visual inspection with a metallographic microscope, no deposition of a plating film was observed on the surface of the ceramic body 11.
【００３３】（実施例４）前記実施例１において、研磨
剤に含まれる金属粉末を、ＴｉＯ2 粉末２０重量％及び
ＺｒＯ2 粉末２０重量％としたこと以外は、同実施例と
同様にして電子部品を製造した。製造された電子部品を
無作為に１００個抜き取り、金属顕微鏡で目視検査した
結果、やはりセラミック素体１１の表面にはメッキ膜の
析出が見られなかった。Example 4 The procedure of Example 1 was repeated, except that the metal powder contained in the abrasive was 20% by weight of TiO 2 powder and 20% by weight of ZrO 2 powder. Parts were manufactured. As a result of randomly extracting 100 manufactured electronic components and visually inspecting them with a metallographic microscope, no deposition of a plating film was observed on the surface of the ceramic body 11.
【００３４】（実施例５）前記実施例１において、研磨
剤に含まれる金属粉末を、ＺｒＯ2 粉末５重量％とした
こと以外は、同実施例と同様にして電子部品を製造し
た。製造された電子部品を無作為に１００個抜き取り、
金属顕微鏡で目視検査した結果、やはりセラミック素体
１１の表面にはメッキ膜の析出が見られなかった。Example 5 An electronic component was manufactured in the same manner as in Example 1 except that the metal powder contained in the abrasive was changed to 5% by weight of ZrO 2 powder. Randomly pull out 100 manufactured electronic components,
As a result of a visual inspection with a metallographic microscope, no deposition of a plating film was observed on the surface of the ceramic body 11.
【００３５】（実施例６）前記実施例１において、研磨
剤として使用した溶融アルミナ粉に代えて、直径１．０
ｍｍの安定化ジルコニアボールからなる研磨用メディア
を用いたこと以外は、同実施例と同様にして電子部品を
製造した。製造された電子部品を無作為に１００個抜き
取り、金属顕微鏡で目視検査した結果、やはりセラミッ
ク素体１１の表面にはメッキ膜の析出が見られなかっ
た。(Example 6) In Example 1, in place of the fused alumina powder used as the abrasive, a diameter of 1.0 was used.
An electronic component was manufactured in the same manner as in Example 1 except that a polishing medium made of stabilized zirconia balls having a diameter of 2 mm was used. As a result of randomly extracting 100 manufactured electronic components and visually inspecting them with a metallographic microscope, no deposition of a plating film was observed on the surface of the ceramic body 11.
【００３６】（比較例）前記実施例１において、研磨剤
に含まれる金属粉末を、ＴｉＯ2 粉末１重量％としたこ
と以外は、同実施例と同様にして電子部品を製造した。
製造された電子部品を無作為に１００個抜き取り、金属
顕微鏡で目視検査した結果、１００個中１２個のセラミ
ック素体１１の表面にメッキ膜の析出が見られた。Comparative Example An electronic component was manufactured in the same manner as in Example 1 except that the metal powder contained in the abrasive was changed to 1% by weight of TiO 2 powder.
As a result of randomly extracting 100 manufactured electronic components and visually inspecting them with a metallographic microscope, deposition of a plating film was observed on the surface of 12 of the 100 ceramic elements 11.
【００３７】[0037]
【発明の効果】以上説明した通り、本発明によれば、外
部電極１２、１２の表面にメッキを施す際に、いわゆる
メッキ伸びが生じることなく、外部電極間の絶縁抵抗の
低下やショートが起こりにくい電子部品を製造すること
ができる。その結果、信頼性の高い電子部品を歩留りよ
く製造することができるという効果が得られる。As described above, according to the present invention, when plating the surfaces of the external electrodes 12, 12, the so-called plating elongation does not occur, and the insulation resistance between the external electrodes decreases and short-circuiting occurs. A difficult electronic component can be manufactured. As a result, an effect is obtained that highly reliable electronic components can be manufactured with high yield.
【図１】積層セラミックインダクタのセラミックグリー
ンシートの積層構造を概念的に示す分解斜視図である。FIG. 1 is an exploded perspective view conceptually showing a laminated structure of ceramic green sheets of a laminated ceramic inductor.
【図２】度セラミックインダクタのセラミック素体のバ
レル研磨の前後の状態を示す側面図である。FIG. 2 is a side view showing a state before and after barrel polishing of a ceramic body of a ceramic inductor.
【図３】積層セラミックインダクタの外観斜視図であ
る。FIG. 3 is an external perspective view of the multilayer ceramic inductor.
１１ セラミック素体 １２ 外部電極 11 ceramic body 12 external electrode
Claims (5)
る工程と、このセラミック素体（１１）をバレル研磨す
る工程と、このセラミック素体（１１）の表面に外部電
極（１２）、（１２）を形成する工程と、この外部電極
（１２）、（１２）の表面に湿式メッキによりメッキ膜
を形成する工程とを有する電子部品の製造方法におい
て、焼成後のセラミック素体（１１）をバレル研磨する
のと同時に、その表面に同セラミック素体（１１）を構
成するセラミック材料よりも電気抵抗の高い金属酸化物
粉末を付着させ、その後外部電極（１２）、（１２）を
焼き付けるのと同時に、前記の金属酸化物粉末をセラミ
ック素体（１１）の表面に焼き付け、その後前記外部電
極（１２）、（１２）の表面に湿式メッキを施すことを
特徴とする電子部品の製造方法。1. A step of obtaining a ceramic body (11) of an electronic component, and barrel-polishing the ceramic body (11).
And that step, the external electrodes on the surface of the ceramic body (11) (12), (12) forming a, the external electrode (12), to form a plated film by wet plating on the surface of (12) And a step of subjecting the fired ceramic body (11) to barrel polishing.
At the same time, the same ceramic body (11) is
Metal oxide with higher electric resistance than the ceramic material to be formed
The powder is adhered and then the external electrodes (12), (12) are
At the same time as baking, the metal oxide powder
Baking on the surface of the shell (11),
A method for manufacturing an electronic component , comprising wet-plating the surfaces of the poles (12) and (12) .
せる金属酸化物粉末がＴｉＯ2 粉末であることを特徴と
する前記請求項１に記載の電子部品の製造方法。2. The method for manufacturing an electronic component according to claim 1 , wherein the metal oxide powder to be deposited on the surface of the ceramic body is a TiO 2 powder.
せる金属酸化物粉末がＺｒＯ2 粉末であることを特徴と
する前記請求項１または２に記載の電子部品の製造方
法。3. A method of manufacturing an electronic component according to claim 1 or 2, wherein the metal oxide powder to be deposited on the surface of the ceramic body (11) is ZrO 2 powder.
る際に、研磨剤に金属酸化物粉末を混合することによ
り、前記セラミック素体（１１）の表面に金属酸化物粉
末を付着させることを特徴とする請求項１〜３の何れか
に記載の電子部品の製造方法。4. When barrel polishing the ceramic body (11), the metal oxide powder is mixed with an abrasive to adhere the metal oxide powder to the surface of the ceramic body (11). The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein:
混合することを特徴とする請求項４に記載の電子部品の
製造方法。5. The method for producing an electronic component according to claim 4 , wherein 5% by weight or more of the metal oxide powder is mixed with the abrasive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6337233A JP3038296B2 (en) | 1994-12-26 | 1994-12-26 | Electronic component manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6337233A JP3038296B2 (en) | 1994-12-26 | 1994-12-26 | Electronic component manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08181029A JPH08181029A (en) | 1996-07-12 |
| JP3038296B2 true JP3038296B2 (en) | 2000-05-08 |
Family
ID=18306705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6337233A Expired - Fee Related JP3038296B2 (en) | 1994-12-26 | 1994-12-26 | Electronic component manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3038296B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001313212A (en) * | 2000-04-28 | 2001-11-09 | Murata Mfg Co Ltd | Laminated coil and its manufacturing method |
| JP4409225B2 (en) * | 2003-07-25 | 2010-02-03 | 京セラ株式会社 | Ferrite core, manufacturing method thereof, and common mode noise filter using the same |
| JP4841613B2 (en) * | 2008-12-26 | 2011-12-21 | 京セラ株式会社 | Ferrite core, manufacturing method thereof, and common mode noise filter |
| JP6376000B2 (en) | 2015-03-02 | 2018-08-22 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
| JP2021022581A (en) * | 2017-11-22 | 2021-02-18 | アルプスアルパイン株式会社 | Chip inductor |
-
1994
- 1994-12-26 JP JP6337233A patent/JP3038296B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08181029A (en) | 1996-07-12 |
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