TWI638239B - 位置偏移檢測方法、位置偏移檢測裝置、描繪裝置及基板檢查裝置 - Google Patents

位置偏移檢測方法、位置偏移檢測裝置、描繪裝置及基板檢查裝置 Download PDF

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Publication number
TWI638239B
TWI638239B TW104101840A TW104101840A TWI638239B TW I638239 B TWI638239 B TW I638239B TW 104101840 A TW104101840 A TW 104101840A TW 104101840 A TW104101840 A TW 104101840A TW I638239 B TWI638239 B TW I638239B
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TW
Taiwan
Prior art keywords
image
substrate
patterns
pattern
unit
Prior art date
Application number
TW104101840A
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English (en)
Chinese (zh)
Other versions
TW201537309A (zh
Inventor
中井一博
Original Assignee
斯克林集團公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 斯克林集團公司 filed Critical 斯克林集團公司
Publication of TW201537309A publication Critical patent/TW201537309A/zh
Application granted granted Critical
Publication of TWI638239B publication Critical patent/TWI638239B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW104101840A 2014-03-24 2015-01-20 位置偏移檢測方法、位置偏移檢測裝置、描繪裝置及基板檢查裝置 TWI638239B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014059915A JP2015185648A (ja) 2014-03-24 2014-03-24 位置ずれ検出方法、位置ずれ検出装置、描画装置および基板検査装置
JP2014-059915 2014-03-24

Publications (2)

Publication Number Publication Date
TW201537309A TW201537309A (zh) 2015-10-01
TWI638239B true TWI638239B (zh) 2018-10-11

Family

ID=54194434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104101840A TWI638239B (zh) 2014-03-24 2015-01-20 位置偏移檢測方法、位置偏移檢測裝置、描繪裝置及基板檢查裝置

Country Status (3)

Country Link
JP (1) JP2015185648A (ja)
TW (1) TWI638239B (ja)
WO (1) WO2015145864A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法
JP2018036235A (ja) * 2016-09-02 2018-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置、基板処理装置、基板検査方法および基板処理方法
JP6688273B2 (ja) * 2017-11-13 2020-04-28 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、決定方法及び物品の製造方法
CN113822883B (zh) * 2021-11-22 2022-03-11 中导光电设备股份有限公司 一种基于寻找晶圆直边的晶圆对位方法和系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661119A (ja) * 1992-08-07 1994-03-04 Sony Corp ウエハの回転角度補正方法
JPH11220006A (ja) * 1998-01-29 1999-08-10 Techno Horon:Kk 対象物のアライメント方法
JP2006071395A (ja) * 2004-09-01 2006-03-16 Nikon Corp 較正方法及び位置合わせ方法
JP2011077289A (ja) * 2009-09-30 2011-04-14 Dainippon Screen Mfg Co Ltd 基板位置決め方法
JP2013138100A (ja) * 2011-12-28 2013-07-11 Dainippon Screen Mfg Co Ltd 描画装置および描画方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661119A (ja) * 1992-08-07 1994-03-04 Sony Corp ウエハの回転角度補正方法
JPH11220006A (ja) * 1998-01-29 1999-08-10 Techno Horon:Kk 対象物のアライメント方法
JP2006071395A (ja) * 2004-09-01 2006-03-16 Nikon Corp 較正方法及び位置合わせ方法
JP2011077289A (ja) * 2009-09-30 2011-04-14 Dainippon Screen Mfg Co Ltd 基板位置決め方法
JP2013138100A (ja) * 2011-12-28 2013-07-11 Dainippon Screen Mfg Co Ltd 描画装置および描画方法

Also Published As

Publication number Publication date
JP2015185648A (ja) 2015-10-22
WO2015145864A1 (ja) 2015-10-01
TW201537309A (zh) 2015-10-01

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