TWI638165B - Probe assembly and probe structure thereof - Google Patents

Abstract

The invention discloses a probe assembly and a probe structure thereof. The probe structure includes a metal body portion, a cladding layer, and an insulating layer. The metal body portion has a surrounding surface. The cladding layer is disposed on the surrounding surface of the metal body portion. The insulating layer is disposed on the cladding layer. Thereby, the present invention can avoid the short circuit caused by the electrical contact between adjacent probe structures.

Description

Probe assembly and probe structure

The present invention relates to a probe assembly and a probe structure thereof, and more particularly to a probe assembly applied to a wafer probe card and a probe structure thereof.

First of all, the current main circular test probes and Microelectromechanical Systems (MEMS) rectangular test probes have poor mechanical properties or poor current resistance, while the poor characteristics of the probe itself can reduce the semiconductor process. Yield and test accuracy. In the prior art, the test probe of the existing wafer probe card is affected by the ambient temperature, the mechanical actuation and the current resistance during the measurement life, and the test probe of a single structure cannot overcome the amount caused by the above influence. Measuring error.

In addition, when the existing test probe is tested on the wafer, the probe card will provide a pressure to enable the test probe to scratch the oxide layer on the surface of the solder ball for testing purposes. However, since the hardness of the existing test probe itself is still insufficient, it is easy to cause mechanical fatigue under continuous mechanical operation, and the test probe cannot be returned to the original needle shape after being bent. In addition, the existing test probes are also prone to damage of the metal probe due to the continuous bending action and the Joule heat generated after the current is passed. Furthermore, when the test probe is pressed against the surface oxide layer of the solder ball, the array of test probes will be bent at the same time, but because of the large number of probes in the unit array, the test probe may be caused to be active. A short circuit phenomenon affects the measurement and even damages the circuit function.

Furthermore, since the size of the object to be side is shrinking, the main material of the current test probe is a metal material, so when the distance between each test probe is too close, This will cause the test probe to short-circuit when bent, making the probe card less reliable. At the same time, the heat dissipation, electrical conductivity and mechanical properties of the existing test probes cannot be combined at the same time. Therefore, how to propose a probe assembly and a probe structure capable of improving reliability, electrical conductivity, heat dissipation and/or mechanical strength to overcome the above-mentioned drawbacks has become an important subject to be solved by those skilled in the art. .

The technical problem to be solved by the present invention is to provide a probe assembly and a probe structure thereof for the deficiencies of the prior art.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a probe structure including a metal body portion, a cladding layer and an insulating layer. The metal body portion has a surrounding surface. The cladding layer is disposed on the surrounding surface of the metal body portion. The insulating layer is disposed on the cladding layer.

Another technical solution adopted by the present invention is to provide a probe assembly including a carrier and a plurality of probe structures. A plurality of the probe structures are disposed on the carrier, each of the probe structures including a metal body portion, a cladding layer, and an insulating layer. Wherein the metal body portion has a surrounding surface, the coating layer is disposed on the surrounding surface of the metal body portion, and the insulating layer is disposed on the coating layer.

One of the beneficial effects of the present invention is that the probe assembly and the probe structure thereof provided by the embodiments of the present invention can utilize "the cover layer is disposed on the surrounding surface of the metal body portion" and " The technical solution of the insulating layer disposed on the coating layer can improve the reliability, conductivity, heat dissipation and/or mechanical strength of the probe structure.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

M‧‧‧ probe assembly

U‧‧‧ probe structure

1‧‧‧Metal body

11‧‧‧ Surround surface

2‧‧‧coating

21‧‧‧ Strengthening layer

211‧‧‧ outer surface

22‧‧‧Antioxidant layer

221‧‧‧ outer surface

23‧‧‧graphene layer

231‧‧‧ outer surface

24‧‧‧heat layer

241‧‧‧ outer surface

3‧‧‧Insulation

T‧‧‧ bearing seat

1t‧‧‧Predetermined width

21t, 22t, 23t, 24t, 3t‧‧‧ predetermined thickness

X, Y, Z‧‧ Direction

1A is a perspective view showing one of the probe structures of the first embodiment of the present invention.

FIG. 1B is another perspective view of the probe structure of the first embodiment of the present invention.

Figure 2 is a side cross-sectional view taken along line II-II of Figure 1A.

Fig. 3 is a partially enlarged schematic view showing a portion III of Fig. 2;

4 is a partially enlarged schematic view showing one embodiment of a probe structure according to a third embodiment of the present invention.

FIG. 5 is a partially enlarged schematic view showing another embodiment of a probe structure according to a third embodiment of the present invention.

FIG. 6 is a partially enlarged schematic view showing an embodiment of a probe structure according to a fourth embodiment of the present invention.

FIG. 7 is a partially enlarged schematic view showing another embodiment of a probe structure according to a fourth embodiment of the present invention.

Figure 8 is a schematic illustration of a probe assembly in accordance with a fifth embodiment of the present invention.

The following is a description of the embodiments of the present invention relating to the "probe assembly and its probe structure" by specific specific examples, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present specification. The present invention may be carried out or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not intended to be construed in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

[First Embodiment]

1A, FIG. 1B and FIG. 8 are respectively a perspective view of a probe structure according to an embodiment of the present invention, and FIG. 8 is a schematic diagram of a probe assembly according to an embodiment of the present invention. The present invention provides a probe assembly M and its probe structure U. The main technical features of the probe structure U of the present invention will be described below.

1A and FIG. 1B, and FIG. 2, FIG. 2 is a side cross-sectional view taken along line II-II of FIG. 1A. The probe structure U may include a metal body portion 1, a cladding layer 2, and an insulating layer 3. For example, the shape of the probe structure U may be a rectangular column as shown in FIG. 1A or a circular column as shown in FIG. 1B. However, the present invention is not limited thereto. An embodiment in which the probe structure U has a rectangular cross section will be described.

In view of the above, please refer to FIG. 2, the metal body portion 1 may have a surrounding surface 11, and the cladding layer 2 may be disposed on the surrounding surface 11 of the metal body portion 1. Further, the insulating layer 3 may be disposed on the cladding layer. 2 on. In the embodiment of the present invention, the cladding layer 2 may preferably completely surround the metal body portion 1 as shown in FIG. 2, and the insulating layer 3 may also completely surround an outer surface of the cladding layer 2 (in the figure) Not marked around). In other words, the cladding layer 2 may cover the periphery of the metal body portion 1, and the insulating layer 3 may also cover the periphery of the outer surface of the cladding layer 2. In addition, for example, the manner in which the cladding layer 2 and the insulating layer 3 are disposed may be formed by deposition, but the invention is not limited thereto.

Next, referring to FIG. 2, for example, the metal body portion 1 may be made of a conductive material to have conductivity, and the metal body portion 1 may have a resistivity (Resistivity) of less than 5 x 10 ² Ωm (ohm meters). The material of the metal body portion 1 may be, for example but not limited to, gold (Au), silver (Ag), copper (Cu), nickel (Ni), cobalt (Co) or an alloy thereof, preferably, the metal body portion 1 The material can be copper or nickel-cobalt alloy. In addition, the resistivity of the insulating layer 3 may be greater than or equal to 10 ⁸ Ωm, and preferably, the resistivity of the insulating layer 3 may be greater than or equal to 10 ⁹ Ωm. In addition, the material of the insulating layer 3 may be, for example but not limited to, a polymer material, a ceramic or a material such as a para-xylene polymer (Poly-p-xylene), and preferably, an aluminum oxide (Aluminium oxide, Or aluminum oxide, Al ₂ O ₃ ) is preferred. Further, the metal body portion 1 may have a predetermined width 1t between 10 μm (micrometer) and 80 μm, and the insulating layer 3 may have a predetermined thickness 3t between 0.1 μm and 10 μm, preferably a predetermined thickness. 3t may be between 0.5 μm and 5 μm, although the invention is not limited by the above dimensions.

Next, please refer to FIG. 2 . For example, the cladding layer 2 may be a reinforcing layer having a whole as the reinforcing probe structure U, an anti-oxidation layer having an anti-oxidation effect, a heat dissipation layer having a heat dissipation effect, or a Graphene layer. In addition, for example, the reinforcing layer, the anti-oxidation layer, the heat dissipation layer, and the graphene layer may have conductivity, but the invention is not limited thereto.

Further, referring to FIG. 2, the reinforcing layer may be a material having high mechanical strength to increase the hardness and rigidity of the probe structure U as a whole. The reinforcing layer may be, for example, a material having a high Young's modulus (or may be referred to as Young's modulus). For example, the reinforcing layer may have a Young's modulus of 100 GPa or more. In addition, the material of the reinforcing layer may be an alloy material, a telluride or a diamond film, for example, may be selected from rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel, cobalt or alloys thereof, preferably The material of the reinforcing layer may be a palladium nickel alloy or a nickel cobalt alloy, but the invention is not limited thereto. Furthermore, the antioxidant layer refers to the surface of the material which is not active, and its redox potential or Oxidation-reduction potential is greater than or equal to -1.66 V, which is difficult to react with oxygen to form an oxide. For example, the oxidation resistant layer can be a corrosion resistant metal (Noble metal). For example, the material of the oxidation resistant layer can be, for example but not limited to, gold, silver, palladium or platinum. Furthermore, the thermal conductivity of the heat dissipation layer may be greater than 200 W/mK. For example, the material of the heat dissipation layer may be aluminum oxide, tantalum nitride, copper aluminum alloy, ceramic or diamond film, etc., but the present invention does not Limited. Furthermore, it should be noted that in other embodiments, the cladding layer 2 may be a graphene layer having a graphene material to improve the electrical conductivity, heat dissipation, and mechanical properties of the probe structure U as a whole.

It is worth mentioning that, in the first embodiment, the reinforcing layer may have a predetermined thickness of between 0.1 μm and 10 μm, and the oxidation resistant layer may have a predetermined thickness of between 0.1 μm and 3 μm, and the graphene layer There may be a predetermined thickness between 0.34 nm (nanometer) and 3 μm, and the heat dissipation layer may have a predetermined thickness of between 0.1 μm and 10 μm, although the invention is not limited thereto.

It should be noted that although the above content is based on the coating layer 2 as a strengthening layer, anti-oxidation The layer, the heat dissipation layer or the graphene layer will be described, but in other embodiments, the cladding layer 2 may also be a multilayer composite layer. That is, the cladding layer 2 may be composed of two or more different materials, that is, the cladding layer 2 may be selected from a reinforcing layer, an antioxidant layer, a heat dissipation layer, and a graphene layer. The above-described multilayer structure is sequentially stacked, and the subsequent embodiment will further explain an embodiment when the cladding layer 2 has a multilayer structure.

[Second embodiment]

First, please refer to FIG. 3, and together with FIG. 2, FIG. 3 is a partial enlarged view of the portion III of FIG. 2. However, it should be noted that FIG. 3 is not an actual part of the portion III of FIG. An enlarged schematic view, FIG. 3 is primarily for illustrating the profile of the probe structure U in other embodiments. Hereinafter, an embodiment in which the cladding layer 2 has a multilayer structure will be further described. In other words, the cladding layer 2 may be selected from a strengthening layer 21, an oxidation resistant layer 22, a heat dissipation layer 24, and a graphene layer 23. The two or more layers are sequentially stacked to form a multi-layered structure. The second embodiment is sequentially stacked on the metal body portion 1 with the strengthening layer 21, the oxidation resistant layer 22, the graphene layer 23, and the heat dissipation layer 24, and is located on the metal. An embodiment between the main body portion 1 and the insulating layer 3 will be described.

In detail, as shown in FIG. 3, the probe structure U may include a metal body portion 1, a coating layer 2 disposed on the metal body portion 1 and covering the metal body portion 1, and a cover layer disposed thereon. The insulating layer 3 on the layer 2 and covering the cladding layer 2. The coating layer 2 may have a strengthening layer 21, an oxidation resistant layer 22, a graphene layer 23, and a heat dissipation layer 24, and the strengthening layer 21 may be disposed on the surrounding surface 11 of the metal body portion 1, and the oxidation resistant layer 22 may be disposed. On an outer surface 211 of the reinforcing layer 21, the graphene layer 23 may be disposed on an outer surface 221 of the anti-oxidation layer 22, and the heat dissipation layer 24 may be disposed on an outer surface 231 of the graphene layer 23, and the insulating layer 3 may be It is disposed on an outer surface 241 of the heat dissipation layer 24. In addition, it should be noted that, in other embodiments, the graphene layer 23 can be selectively determined according to requirements, and is not limited to being disposed on the anti-oxidation layer. 22 is between the heat dissipation layer 24. That is, the graphene layer 23 may be disposed between the oxidation resistant layer 22 and the strengthening layer 21, and the present invention is not limited to the position at which the graphene layer 23 is disposed.

Thereby, after the provision of the cladding layer 2, the mechanical strength characteristics of the entire probe structure U can be enhanced by the reinforcing layer 21, and the reinforcing layer 21 and the metal located inside the oxidation resistant layer 22 can be protected by the oxidation resistant layer 22. The body portion 1 further reduces the influence of the probe structure on oxidation while enhancing the conductivity of the probe structure U. That is, the oxidation resistant layer 22 can be disposed on the outer surface 211 of the reinforcing layer 21, so that the oxidation resistant layer 22 serves as a layer structure for protecting the inside of the oxidation resistant layer 22. Further, after the arrangement of the graphene layer 23, the enhancement of conductivity, heat dissipation, and mechanical strength characteristics can be enhanced. Furthermore, the heat dissipation efficiency of the probe structure U can be improved by the heat dissipation layer 24 to extend the life of the probe structure U and improve the measurement accuracy.

In view of the above, in the embodiment of FIG. 3, the Young's modulus of the reinforcing layer 21 may be 100 GPa or more. In addition, the material of the strengthening layer 21 may be an alloy material, a telluride or a diamond film, for example, may be selected from rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel, cobalt or alloys thereof, preferably. The material of the reinforcing layer 21 may be a palladium nickel alloy or a nickel cobalt alloy. Further, in the second embodiment, the reinforcing layer 21 may have a predetermined thickness 21t of between 0.5 μm and 5 μm. Further, the anti-oxidation layer means that the surface of the material is not active, and its oxidation-reduction potential is greater than or equal to -1.66 V, and it is difficult to react with oxygen to form an oxide. For example, the oxidation resistant layer 22 can be a corrosion resistant metal (Noble metal). For example, the material of the oxidation resistant layer 22 can be, for example but not limited to, gold, silver, palladium or platinum. Further, in the second embodiment, the oxidation resistant layer 22 may have a predetermined thickness 22t of between 0.5 μm and 5 μm. Further, the graphene layer 23 can be broadly referred to as about 1 to 10 layers having a predetermined thickness 23t between 0.34 nm and 5 nm. Furthermore, the thermal conductivity of the heat dissipation layer 24 is greater than 200 W/mK. For example, the material of the heat dissipation layer 24 may be aluminum oxide, tantalum nitride, copper aluminum alloy, ceramic or diamond film. There is a predetermined thickness 24t between 0.5 μm and 5 μm. Further, the insulating layer 3 may have a dielectric layer A predetermined thickness of 3t between 0.5 μm and 5 μm. However, it should be noted that the present invention is not limited to the above dimensions or materials.

In view of the above, it should be noted that the characteristics of the metal body portion 1, the reinforcing layer 21, the oxidation resistant layer 22, the graphene layer 23, the heat dissipation layer 24, and the insulating layer 3 provided in the second embodiment are similar to those of the foregoing embodiment. This will not be repeated here. In addition, it is worth mentioning that, in other embodiments, the reinforcing layer 21, the anti-oxidation layer 22, the graphene layer 23, and the heat dissipation layer 24 should be sequentially stacked on the metal body according to requirements. On the part 1, that is, a multilayer structure of different characteristics can be selectively provided in the cladding layer 2 as needed.

In addition, it should be noted that the present invention is not limited to the order of arrangement of the layer structures in the above-mentioned coating layer 2, that is, in other embodiments, the coating layer 2 may include an antioxidant layer 22, a strengthening Layer 21 and a heat dissipation layer 24. The anti-oxidation layer 22 may be disposed on the surrounding surface 11 of the metal body portion 1. The reinforcing layer 21 may be disposed on an outer surface 221 of the oxidation resistant layer 22, and the heat dissipation layer 24 may be disposed on an outer surface 211 of the strengthening layer 21. The insulating layer 3 may be disposed on an outer surface 241 of the heat dissipation layer 24. Meanwhile, the cladding layer 2 may further include a graphene layer 23 selectively disposed between the oxidation resistant layer 22 and the strengthening layer 21, between the strengthening layer 21 and the heat dissipation layer 24, or It is disposed between the heat dissipation layer 24 and the insulating layer 3, and the invention is not limited thereto.

[Third embodiment]

First, referring to FIG. 4 and FIG. 5, and together with FIG. 2 and FIG. 3, FIGS. 4 and 5 are cross-sectional views of the probe structure U in other embodiments. The cladding layer 2 may be a multilayer structure composed of a plurality of layers selected from a reinforcing layer, an oxidation resistant layer, and a heat dissipation layer. 4 and FIG. 5 and FIG. 3, the greatest difference between the third embodiment and the second embodiment is that the graphene layer 23 can be selectively omitted in the third embodiment. In addition, it should be noted that the metal body portion 1, the reinforcing layer 21, the oxidation resistant layer 22, the heat dissipation layer 24, and the insulation provided by the third embodiment are provided. The characteristics of layer 3 are similar to those of the previous embodiment, and will not be described herein.

Next, as shown in FIG. 4, the cladding layer 2 may have a strengthening layer 21, an anti-oxidation layer 22, and a heat dissipation layer 24, which may be disposed on the surrounding surface 11 of the metal body portion 1, and is resistant to oxidation. The layer 22 may be disposed on an outer surface 211 of the reinforcing layer 21, the heat dissipation layer 24 may be disposed on an outer surface 221 of the oxidation resistant layer 22, and the insulating layer 3 may be disposed on an outer surface 241 of the heat dissipation layer 24.

In addition, as shown in FIG. 5, the oxidation resistant layer 22 may be disposed on the surrounding surface 11 of the metal body portion 1, and the reinforcing layer 21 may be disposed on an outer surface 221 of the oxidation resistant layer 22, and the heat dissipation layer 24 may be disposed on On an outer surface 211 of the reinforcing layer 21, the insulating layer 3 may be disposed on an outer surface 241 of the heat dissipation layer 24.

Thereby, the desired effect can be achieved by the characteristics of the reinforcing layer 21, the oxidation resistant layer 22, the heat dissipation layer 24, and the insulating layer 3. In addition, in the third embodiment, the reinforcing layer 21 may have a predetermined thickness 21t between 0.5 μm and 5 μm, and the oxidation resistant layer 22 may have a predetermined thickness 22t between 0.5 μm and 5 μm, and the heat dissipation layer 24 There may be a predetermined thickness 24t between 0.5 μm and 5 μm, and the insulating layer 3 may have a predetermined thickness 3t between 0.5 μm and 5 μm, although the invention is not limited thereto.

In addition, although the third embodiment is described as an embodiment in which the cladding layer 2 has the reinforcing layer 21, the oxidation resistant layer 22, and the heat dissipation layer 24, in other embodiments, the cladding layer 2 may also be used. The present invention is not limited thereto, and is a multilayer structure composed of a plurality of layers selected from a reinforcing layer 21, an anti-oxidation layer 22, a graphene layer 23, and a heat dissipation layer 24, which are sequentially stacked. That is, the plurality of the reinforcing layer 21, the oxidation resistant layer 22, the graphene layer 23, and the heat dissipation layer 24 should be sequentially stacked on the metal body portion 1 so as to have differentities in the cladding layer 2, depending on the demand. Multi-layer structure of characteristics.

In other words, in other embodiments, the cladding layer 2 may include a strengthening layer 21, a graphene layer 23, and a heat dissipation layer 24, and the reinforcing layer 21 may be disposed on the surrounding surface 11 of the metal body portion 1. The graphene layer 23 may be disposed on the reinforcement layer 21 On the outer surface 211, the heat dissipation layer 24 may be disposed on the outer surface 231 of the graphene layer 23, and the insulating layer 3 may be disposed on the outer surface 241.

[Fourth embodiment]

First, please refer to FIG. 6 and FIG. 7 , and together with FIG. 4 and FIG. 5 , FIGS. 6 and 7 are cross-sectional views of the probe structure U in other embodiments. 6 and FIG. 7 and FIG. 4 and FIG. 5, the greatest difference between the fourth embodiment and the third embodiment is that the heat dissipation layer 24 can be selectively disposed in the fourth embodiment. In addition, it should be noted that the characteristics of the metal body portion 1, the reinforcing layer 21, the oxidation resistant layer 22, the heat dissipation layer 24, and the insulating layer 3 provided in the third embodiment are similar to those of the foregoing embodiment, and are not described herein again.

In the above, as shown in FIG. 6, the cladding layer 2 may have a reinforcing layer 21 and an anti-oxidation layer 22, and the reinforcing layer 21 may be disposed on the surrounding surface 11 of the metal body portion 1, and the oxidation resistant layer 22 may be disposed. On an outer surface 211 of the reinforcing layer 21, an insulating layer 3 may be disposed on an outer surface 221 of the oxidation resistant layer 22.

In addition, as shown in FIG. 7, the cladding layer 2 has an anti-oxidation layer 22 and a strengthening layer 21, and the oxidation resistant layer 22 may be disposed on the surrounding surface 11 of the metal body portion 1, and the reinforcing layer 21 may be disposed in the anti-corrosion layer 21. On an outer surface 221 of the oxide layer 22, an insulating layer 3 may be disposed on an outer surface 211 of the reinforcing layer 21.

It should be noted that although the fourth embodiment is described as an embodiment in which the cladding layer 2 has the reinforcing layer 21 and an anti-oxidation layer 22, in other embodiments, the cladding layer 2 may also be selected from a reinforcement. The multilayer structure of the layer 21, an anti-oxidation layer 22, a graphene layer 23, and a heat dissipation layer 24 are sequentially stacked, and the invention is not limited thereto. That is, a multilayer structure having different characteristics can be selectively disposed in the cladding layer 2 as needed.

[Fifth Embodiment]

First, please refer to Figure 8, and please refer to Figure 2, Figure 8 is the current A schematic diagram of a probe assembly of a fifth embodiment. A fifth embodiment of the present invention provides a probe assembly M including a carrier T and a plurality of probe structures U. A plurality of probe structures U can be disposed on the carrier T according to the measurement array design of the probe card.

Further, as shown in FIG. 2, each of the probe structures U may include a metal body portion 1, a cladding layer 2, and an insulating layer 3. The metal body portion 1 may have a surrounding surface 11, and the cladding layer 2 may be disposed on the surrounding surface 11 of the metal body portion 1, and the insulating layer 3 may be disposed on the cladding layer 2. Thereby, since the insulating layer 3 is located at the outermost layer of the probe structure U, electrical contact between the probe structures U adjacent to each other can be avoided to cause a short circuit phenomenon.

In the above, it should be noted that the characteristics of the metal body portion 1, the cladding layer 2, and the insulating layer 3 provided in the fifth embodiment are similar to those of the foregoing embodiment, and will not be described herein. In other words, the cladding layer 2 provided in the fifth embodiment can also selectively provide the reinforcing layer 21, the oxidation resistant layer 22, the graphene layer 23, and/or the heat dissipation layer 24 as described in the foregoing embodiments.

[Advantageous Effects of Embodiments]

One of the advantageous effects of the present invention may be that the probe assembly M and the probe structure U thereof provided by the embodiments of the present invention can utilize the "coating layer 2 disposed on the surrounding surface 11 of the metal body portion 1" and " The insulating layer 3 can be disposed on the cladding layer 2, and the reliability, conductivity, heat dissipation and/or mechanical strength of the probe structure U can be improved. In other words, the multilayer structure in the cladding layer 2 can be used to overcome the problems of current resistance, mechanical properties, heat dissipation and insulation, respectively, to improve the mechanical strength, heat dissipation effect, and probe performance and lifetime of the probe structure U. In addition, the arrangement of the insulating layer 3 can also be utilized to avoid short circuit caused by electrical contact between adjacent probe structures U in the probe assembly M.

The above disclosure is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the scope of protection of the present invention. Inside.

Claims (11)

A probe structure comprising: a metal body portion having a surrounding surface; a coating layer disposed on the surrounding surface of the metal body portion; and an insulation a layer, the insulating layer is disposed on the coating layer; wherein the coating layer comprises a strengthening layer having a Young's modulus of 100 GPa or more, and an oxidation resistant layer having a redox potential greater than or equal to -1.66 V, A heat dissipation layer or a graphene layer having a thermal conductivity greater than 200 W/mK. The probe structure of claim 1, wherein the insulating layer has a resistivity greater than or equal to 10 ⁸ Ωm. The probe structure according to claim 1 or 2, wherein the metal body portion has electrical conductivity, and the metal body portion has a specific resistance of less than 5 x 10 ² Ωm. The probe structure according to claim 1, wherein the coating layer is selected from the group consisting of the reinforcing layer, the oxidation resistant layer, the heat dissipation layer, and the graphene layer. The multilayer structure is composed. The probe structure according to claim 1, wherein the coating layer includes the reinforcing layer, the oxidation resistant layer, and the heat dissipation layer, the reinforcing layer being disposed on the surrounding of the metal body portion On the surface, the anti-oxidation layer is disposed on an outer surface of the strengthening layer, the heat dissipation layer is disposed on an outer surface of the oxidation resistant layer, and the insulating layer is disposed outside the heat dissipation layer On the surface. The probe structure of claim 5, wherein the coating layer further comprises the graphene layer, the graphene layer being disposed between the oxidation resistant layer and the heat dissipation layer. The probe structure according to claim 1, wherein the coating layer includes the reinforcing layer and the oxidation resistant layer, and the reinforcing layer is disposed on the surrounding surface of the metal body portion, An oxidation resistant layer is disposed on an outer surface of the reinforcing layer The insulating layer is disposed on an outer surface of the oxidation resistant layer. A probe assembly includes: a carrier; and a plurality of probe structures, wherein the plurality of probe structures are disposed on the carrier, each of the probe structures including a metal body portion and a covering a layer and an insulating layer; wherein the metal body portion has a surrounding surface, the covering layer is disposed on the surrounding surface of the metal body portion, and the insulating layer is disposed on the covering layer; Wherein, the coating layer comprises a strengthening layer having a Young's modulus of 100 GPa or more, an oxidation resistant layer having a redox potential greater than or equal to -1.66 V, a heat dissipating layer having a thermal conductivity greater than 200 W/mK or a graphene. Floor. The probe assembly of claim 8, wherein the insulating layer has a resistivity greater than or equal to 10 ⁸ Ωm. The probe assembly of claim 8 or 9, wherein the metal body portion has electrical conductivity, and the metal body portion has a resistivity of less than 5 x 10 ² Ωm. The probe assembly according to claim 8, wherein the coating layer is selected from the group consisting of the reinforcing layer, the oxidation resistant layer, the heat dissipation layer, and the graphene layer. The multilayer structure is composed.