TWI630089B - 包括高熔化溫度組建材料之組成物 - Google Patents
包括高熔化溫度組建材料之組成物 Download PDFInfo
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Abstract
依據一範例,一組成物可包括呈粉末形式之一高熔化溫度組建材料;呈粉末形成之一第一低熔融溫度結合劑;以及呈粉末形式之一第二低熔融溫度結合劑;且其中此第一低熔融溫度結合劑係於不同於此第二低熔融溫度結合劑之一溫度熔融。
Description
本揭示係有關於包括高熔化溫度組建材料之組成物。
背景 於三維(3D)列印,一加成式列印方法可被用以自一數位模型製造三維固體零件。3D列印技術被認為係加成式方法,因為其等涉及施用連續材料層。此係不同於傳統機械式方法,其通常依靠移除材料產生最終零件。於3D列印,組建材料可被固化或熔融,此對於某些材料可使用熱輔助式擠壓、熔融,或燒結而實施,且對於其它材料,可使用數位光投射技術實施。
依據本發明之一實施例,係特地提出一種一種組成物,其包含: 一高熔化溫度組建材料,其係呈粉末形式; 一第一低熔融溫度結合劑,其係呈粉末形式;以及 一第二低熔融溫度結合劑,其係呈粉末形式;且 其中第一低熔融溫度結合劑係於不同於第二低熔融溫度結合劑之一溫度熔融。
詳細說明 為了簡化及例示目的,本揭露主要係提及其範例作說明。於下列說明,多數特別細節被陳述以提及本揭露之完整瞭解。但是顯而易見係本揭露可不限於此等特別細節而實施。於其它例子,某些方法及結構未被詳細說明,以便不會不必要地使本揭露難理解。於此處使用時,“一個”及“一”係打算表示一特別元素之至少一者,術語“包括”意指不受限地包括,術語“包括”意指不受限地包括,且術語“基於”意指至少部份基於。
此處揭露一3D印表機,用於實施此3D印表機以形成一3D零件之方法,及用於此方法之一組成物。一3D零件可被列印、形成,或以其它方式產生於一組建區域平台上。3D印表機亦可包括使一組成物層散佈於組建區域平台上之一散佈機,及選擇性沉積一試劑之一噴墨頭。3D印表機可形成連續之組成物層,其等可散佈及可接收此試劑。可施用能量形成最終欲被形成的3D零件之一坯體。坯體可自未形成坯體之零件的額外組成物移除,然後,可被曝置於熱及/或輻射,以使坯體熔融、燒結、緻密化、熔融,及/或硬化而形成此3D零件。於此處使用時,“3D列印零件”、“3D零件”、“3D物件”、“物件”,或“零件”可為一完成之3D列印零件或一3D列印零件之一層。
用於形成3D零件的方法之組成物可包括呈粉末形式之一高熔化溫度組建材料,呈粉末形成之一第一低熔融溫度,及呈粉末形成之一第二低熔融溫度。於一範例,此組成物可包括額外之低熔融溫度結合劑,諸如,一第三者、一第四者、一第五者等。高熔化溫度組建材料可以範圍從約5體積%至約99.9體積%,例如,從約30體積%至約95體積%,及作為一另外範例,從約50體積%至約90體積%之量存在於組成物中。
呈粉末形式之高熔化溫度組建材料可選自由金屬、金屬合金、陶瓷,及聚合物所組成之群組。金屬之非限制性範例包括鹼金屬、鹼土金屬、過渡金屬、後過渡金屬、鑭系元素,及錒系元素。鹼金屬可包括鋰、鈉、鉀、銣、銫,及鍅。鹼土金屬可包括鈹、鎂、鈣、鍶、鋇,及鐳。過渡金屬可包括鈧、鈦、釩、鉻、錳、鐵、鈷、鎳、銅、鋅、釔、鋯、鈮、鉬、鎝、釕、銠、鈀、銀、鎘、鉿、鉭、鎢、錸、鋨、銥、鉑,及金。後過渡金屬包括鋁、銦、錫、鉈、鉛,及鉍。於一範例,高熔化溫度組建材料可選自鋁、銅、Ti6
Al4
V、AlSi10
Mg、青銅合金、不銹鋼、鉻鎳鐵合金,及鈷-鉻,及鎳-鉬-鉻合金。作為高熔化溫度組建材料之金屬可具有範圍從約250°C至約3400°C,例如,從約275°C至約3000°C,及作為一進一步例子,從約300°C至約2500°C之熔點溫度。
金屬合金之非限制性例子包括鋼、焊料、白蠟、杜拉鋁(duralumin)、磷青銅、汞齊、不銹鋼合金303、304、310、316、321、347、410、420、430、440、PH13~8、17~4PH;Fe/Ni、Fe/Si、Fe/Al、Fe/Si/Al、Fe/Co、含有Fe/Co/V之磁性合金;包括衛星12之衛星6鈷合金;銅、銅合金、青銅(Cu/Sn)、黃銅(Cu/Zn)、錫、鉛、金、銀、鉑、鈀、銥、鈦、鉭、鐵、鋁合金、含鎂之合金、鐵合金、鎳合金、鉻合金、矽合金、鋯合金、金合金,及任何適合組合。作為高熔化溫度組建材料之金屬合金可具有範圍從約250°C至約3400°C,例如,從約275°C至約3000°C,及作為一進一步例子,從約300°C至約2500°C之熔點溫度。
陶瓷可為非金屬、無機化合物,諸如,金屬氧化物、無機玻璃、碳化物、氮化物,及硼化物。一些特別範例包括氧化鋁(Al2
O3
)、Na2
O/CaO/SiO2
玻璃(鈉鈣玻璃)、碳化矽(SiC)、氮化矽(Si3N4
)、二氧化矽(SiO2
)、氧化鋯(ZrO2
)、經氧化釔安定之氧化鋯(YTZ)、二氧化鈦(TiO2
),或此等之組合。於一範例,高熔化溫度組建材料可為一金屬陶瓷(一金屬陶瓷合金)。作為高熔化溫度組建材料之陶瓷可具有範圍從約1000°C至約2000°C,例如,從約1100°C至約1900°C,及作為一進一步例子,從約1200°C至約1800°C之熔點溫度。
高熔化溫度組建材料可為一聚合物。一適合聚合物之非限制性例子包括聚醯胺醯亞胺、高性能聚醯胺、聚醯亞胺、聚酮、聚碸衍生物、氟聚合物、聚醚醯亞胺、聚苯并咪唑.聚對苯二甲酸丁二酯、聚苯硫醚、聚苯乙烯,及間規聚苯乙烯。作為高熔化溫度組建材料之聚合物可具有範圍從約200°C至約400°C,例如,從約250°C至約300°C,及作為一進一步例子,從約270°C至約360°C之熔點溫度。
組成物可包括呈粉末形式之一第一低熔融溫度結合劑,及呈粉末形式之一第二低熔融溫度結合劑。第一低熔融溫度結合劑可不同於第二低熔融溫度結合劑。第一低熔融溫度結合劑及第二低熔融溫度結合劑每一者可為一結晶性聚合物,諸如,聚丙烯及聚乙烯。第一低熔融溫度結合劑及第二低熔融溫度結合劑每一者可為一非結晶性聚合物,諸如,聚氧化乙烯、聚乙二醇(固體)、丙烯腈丁二烯苯乙烯、聚苯乙烯、苯乙烯丙烯腈樹脂,及聚苯醚。於一範例,第一低熔融溫度結合劑可於與第二低熔融溫度結合劑不同之溫度熔融。第一低熔融溫度結合劑及第二低熔融溫度結合劑可獨立地選自由聚丙烯、聚乙烯、低密度聚乙烯、高密度聚乙烯、聚氧化乙烯、聚乙二醇、丙烯腈丁二烯苯乙烯、聚苯乙烯、苯乙烯丙烯腈樹脂、聚苯醚、聚醯胺11、聚醯胺12、聚甲基戊烯、聚甲醛、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚偏二氟乙烯、聚四氟乙烯、全氟烷氧烷、聚苯硫醚,及聚醚醚酮所組成之群組。
第一低熔融溫度結合劑及第二低熔融溫度結合劑可具有少於約250°C之熔點溫度,例如,其範圍可從約50°C至約249°C,例如,從約60°C至約240°C,及作為一進一步例子,從約70°C至約235°C。
第一低熔融溫度結合劑及第二低熔融溫度結合劑可以範圍從約1體積%至約6重量%,例如,從約2體積%至約5體積%,及作為一進一步例子,從約3體積%至約5體積%之量存在於組成物中。於一範例,組成物可具有約95體積%之銅粉末,及約5體積%之聚丙烯粉末。第一低熔融溫度結合劑及第二低熔融溫度結合劑的量可被選擇以於結合劑熔融及固化後提供坯體形狀完整性。
組成物可進一步包括其它適合結合劑,諸如,糖、糖醇、聚合物或寡聚物糖、低或中分子量聚羧酸、聚磺酸、含有羧或磺部份之水溶性聚合物,及聚醚烷氧矽烷。一些特別範例包括葡萄糖(C6
H12
O6
)、蔗糖(C12
H22
O11
)、果糖(C6
H12
O6
)、具有範圍從2單位至20單位的鏈長度之麥芽糊精、山梨糖醇(C6
H14
O6
)、赤蘚醇(C4
H10
O4
)、甘露醇(C6
H14
O6
),或CARBOSPERSE® K7028(一短鏈聚羧酸,M~2,300 Da,可得自Lubrizol)。低或中分子量聚羧酸(例如,具有少於5,000 Da之分子量)可相對較快地溶解。亦瞭解較高分子量之聚羧酸(例如,具有大於5,000 Da最高達10,000 Da之分子量)可被使用;但是,溶解動力學會較慢。
組成物可藉由使高熔化溫度組建材料、第一低熔融溫度結合劑,及第二低熔融溫度結合劑於諸如一雙重行星式混合器、一磨碎機等之一混合器中混合而製備。組成物可用於一三維(3D)印表機以形成3D零件。
首先參考圖1,顯示用於產生、組建,或列印三維零件之一例示3D印表機100之一簡化等角視圖。需瞭解圖1所述之3D印表機100可包括另外組件,且一些此處所述之組件可於未偏離此處揭露之3D印表機100的範圍下移除及/或修改。亦需瞭解圖1所述之3D印表機100的組件可能未依比例繪製,因此,3D印表機100可具有不同於此處所示者之一不同尺寸及/或結構。
3D印表機100係描述為包括一組建區域平台102、含有組成物106之一組成物供應104,及一散佈機108。組建區域平台102可與3D印表機100整合,或可為可分開始嵌入3D印表機100內之一組件,例如,組建區域平台102可為可與3D印表機100分開地獲得之一模組。組成物供應104可為一容器或表面,其係使組成物106置於散佈機108與組建區域平台102之間。組成物供應104可為一給料斗,其上可供應組成物106。散佈機108可以如以箭頭110所示之方向,例如,沿著y-軸,於組成物供應104上且橫越組建區域平台102而移動,以使一層組成物106散佈於組建區域平台102之一表面上。
3D印表機100進一步描述為包括一噴墨頭130,其可以箭頭132所示之方向,例如,沿著y-軸橫越組建區域平台102掃瞄。噴墨頭130可為,例如,一熱噴墨式噴墨頭、一壓電式噴墨頭等,且可延伸組建區域平台102之寬度。雖然一單噴墨頭130於圖1中描述,但需瞭解多個噴墨頭可被使用,其等係橫跨組建區域平台102之寬度。另外,噴墨頭130可以置放於多個印刷桿。噴墨頭130亦可使一試劑沉積於一層組成物106之一選擇區域上。
試劑可為包括可被施用於此層組成物106之各種組份之一組成物。試劑之組份的非限制性例子包括一色料、一染料、一溶劑、一共溶劑、一界面活性劑、一分散劑、一殺生物劑、一抗凝劑、黏度改質劑、緩衝劑、安定劑,及此等之組合。一共溶劑、一界面活性劑,及/或一分散劑於試劑中存在可有助於此組成物獲得一特別濕潤行為。
界面活性劑可用以改良試劑之濕潤性質及噴射性。適合界面活性劑之例子可包括以炔二醇化學為主之一可自行乳化的非離子性濕潤劑(例如,來自Air Products and Chemicals, Inc.之SURFYNOL® SEF)、一非離子性氟界面活性劑(例如,來自DuPon之CAPSTONE®氟界面活性劑,先前稱為ZONYL FSO),及此等之組合。於其它範例,界面活性劑可為乙氧基化低發泡濕潤劑(例如,來自Air Products and Chemical Inc.之SURFYNOL® 440或SURFYNOL® CT-111)或一乙氧基化浸潤劑及分子消泡劑(例如,來自Air Products and Chemical Inc.之SURFYNOL® 420)。其它適合界面活性劑包括非離子性浸潤劑及分子消泡劑(例如,來自Air Products and Chemical Inc.之SURFYNOL® 104E),或水溶性非離子性界面活性劑(例如,來自The Dow Chemical Company之TERGITOL™ TMN-6)。於某些範例,所欲地可使用具有少於10之親水性親脂性平衡(HLB)之一界面活性劑。
一共溶劑之某些例子包括1-(2-羥基乙基)-2-吡咯啶酮、2-吡咯啶酮、1,5-戊二醇、三乙二醇、四乙二醇、2-甲基-1,3-丙二醇、1,6-己二醇、三丙二醇甲醚、N-甲基吡咯酮、乙氧基化丙三醇-1(LEG-1),及此等之組合。
適合殺生物劑之例子包括1,2-苯并異噻唑啉-3-酮之水溶液(例如,來自Arch Chemicals, Inc.之PROXEL® GXL from)、四級銨化合物(例如,Bardac® 2250及2280、Barquat® 50-65B,及Carboquat® 250-T,皆來自Lonza Ltd. Corp.),及甲基異噻唑酮之水溶液(例如,來自The Dow Chemical Co.之Kordek® MLX)。
適合抗凝劑之非限制性例子包括油醇聚醚-3-磷酸鹽(例如,可以來自Croda之CRODAFOS™ O3A或CRODAFOS™ N-3酸購得),或油醇聚醚-3-磷酸鹽及一低分子量(例如,<5,000)聚丙烯酸聚合物(例如,可以來自Lubrizol之CARBOSPERSE™ K-7028聚丙烯酸酯購得)之組合物。
於使試劑沉積於此層組成物106的選擇區域上之後,組建區域平台102可以箭頭112所示般,例如,沿著z-軸降低。此外,散佈機108可橫越組建區域平台102移動,於先前形成之層的頂部上形成一新層之組成物106。再者,噴墨頭130可使試劑沉積於此新層之組成物106的預定區域上。上述程序可重複至一預定數量之層形成而製造一所欲3D零件之一坯體為止。
亦如圖1所示,3D印表機100可包括一控制器140,其可控制組建區域平台102、組成物供應104、散佈機108、能源120,及噴墨頭130之操作。控制器140亦可描述為與一資料貯存150連通。資料貯存150可包括與將以3D印表機100列印之一3D零件有關之資料。
一坯體可自組成物106之已接收來自噴墨頭130之試劑的區域或組成物之尚未接收試劑之區域產生。為了成功形成一坯體,散佈組成物與選擇性沉積之試劑間需具有至少約15%至約20%之吸收差異。例如,若散佈組成物於其外觀顏色係淡的,此可為包括一高熔化溫度陶瓷或聚合物組建材料之組成物的情況,則選擇性施用之試劑於其外觀之顏色需為暗的。可具有淡外觀之組成物弱吸收施用之能量,即,大部分之施用能量被反射。於一範例,於其外觀顏色係淡的之一散佈組成物可包括作為高熔化溫度組建材料之鋁、鋁合金、銅,或大部份陶瓷金屬氧化物。
相似地,若散佈組成物於其外觀顏色係暗的,此可為包括一高熔化溫度之金屬或金屬合金組建材料之組成物的情況,則選擇性施用之試劑於其外觀顏色需為淡的。具有暗外觀之組成物強烈吸收施用之能量,例如,於相對應於能源120之發射的光譜範圍。於一範例,散佈組成物之最大吸收可落於近紅外線及可見光範圍之長波長部份。於一範例,於其外觀顏色係暗的之一散佈組成物可包括作為高熔化溫度組建材料之不銹鋼、Ni-Mo-Cr合金,或鈷鉻合金。
於一範例,當組成物於其外觀顏色係淡的是,於外觀具有暗顏色之一試劑可選擇性地沉積於散佈組成物之將形成坯體之一第一區域上。此會留下散佈組成物之將不形成坯體之一第二區域。於施用能量122時,諸如,藉由加熱燈、紫外線等,選擇性沉積之試劑可吸收能量,及使散佈組成物中之第一低熔融溫度結合劑及第二低熔融溫度結合劑熔融。經熔融之結合劑可提供坯體形狀完整性。散佈組成物之第二區域可反射施用之能量,此可抑制散佈組成物中之第一低熔融溫度結合劑及第二低熔融溫度結合劑熔融。
於另一範例,當組成物於其外觀顏色係暗的是,於不觀具有淡顏色之一試劑可被選擇性地沉積於散佈組成物之將不形成坯體之一第二區域上。此會留下散佈組成物之將形成坯體之一第一區域。於施用能量時,諸如,藉由加熱燈、紫外線等,選擇性沉積之試劑會反射施用之能量,此會抑制散佈組成物中之第一低熔融溫度結合劑及第二低熔融溫度結合劑熔融。散佈組成物之第一區域會吸收施用之能量,此會使散佈組成物中之第一低熔融溫度結合劑及第二低熔融溫度結合劑熔融。經熔融之結合劑可提供坯體形狀完整性。
施用之能量可被移除,且坯體可藉由移除能量而冷卻。於冷卻時,形成之坯體會固化。形成之坯體可自組建平台移除。
一例示3D零件可被製造之各種方式係以相關於個別於圖2及3描述之例示方法200及300更詳細地探討。對熟習此項技藝者明顯的是方法200及300可表示一般性例示,且其它操作可於未偏離方法200及300之範圍下添加或存在之操作可被移除、修改,或重整。
方法200及300之說明係為了列示目的係參考圖1例示之3D印表機100進行。但是,需清楚地瞭解具有其它結構之3D印表機及其它型式之裝置可在未偏離方法200及300之範圍下被執行以實行方法200及300之任一者或二者。
於執行方法200或方法200之部份前,3D印表機100可獲得與將被列印之一3D零件有關之資料。舉例而言,控制器140可獲得貯存於資料貯存150中之與將被列印之一3D零件有關之資料。控制器140可判定欲被形成之組成物106之層數量及來自噴墨頭130之試劑欲被沉積於組成物106之個別層的每一者上之位置以便列印3D零件。
首先參考圖2,於方塊202,一組成物106可散佈於一組建區域平台102上。如此處所探討,組成物106可由呈一高溫組建材料形式之粉末、一第一低溫結合劑,及一第二低溫結合劑形成。此外,於方塊204,一試劑可選擇性地沉積於第二組成物106之區域上。如上所探討,依組成物106及欲被施用之試劑而定,試劑可沉積於組成物106之欲形成一坯體的一部份或多個部份之區域上,或可沉積於組成物106之將不形成一坯體的一部份或多個部份之區域上。此外,於某些例子 多個試劑可選擇性沉積於組成物106上。於此等範例,此等試劑之一者可施用於將不形成坯體的一部份之區域,且此等試劑之另一者可施用於將不形成坯體的一部份之區域。
於方塊206,能量122可被施用於散佈組成物106及經選擇性沉積之試劑上形成一坯體。方塊206可表示多層多個操作,其中,多層之組成物106被散佈,以試劑選擇性沉積,且供以能量形成坯體,其中,坯體之多個部份係於連續形成之層的每一者形成。
於方塊208,施用於坯體之溫度可從一第一溫度逐步增至一第二溫度,及至一高溫。即,坯體可接受一第一溫度持續一第一時期,一第二溫度持續一第二時期,然後,接受一高溫持續一第三時期。此外,第一溫度可約等於第一低熔融溫度結合劑之一熔融溫度,第二溫度可約等於第二低溫度結合劑之一熔融溫度,且高溫可約等於高熔化溫度組建材料之一熔融溫度。
現換到圖3,於方塊302,組成物106可被散佈,且於方塊304,一試劑可選擇性沉積於散佈組成物106上。方塊302及304可相似於如上關於圖2所探討之方塊202及204。此外,於方塊306,能量122可以相似於如上關於方塊206所探討者之方式施用。於方塊308,一另外層之組成物106是否將被形成之判定可藉由,例如,3D印表機100之一處理器進行。於回應此另外層之組成物106將被形成之判定,方塊302-308可於一先前沉積之層的頂部上重複。
但是,於回應一另外層之組成物106將不被形成之判定,形成之層,例如,坯體,可自3D印表機100移除。移除坯體可冷卻,此會使含於坯體之熔融結合劑固化。
作為對坯體之一進一步加工操作,無意中附貼於坯體之外來組成物可被移除。舉例而言,坯體可被置於一介質噴射櫃中,且外來組成物可自坯體噴砂掉。作為另一例子,外來組成物可經由機械式振動或其它移除技術移除。
移除外來組成物之後,熱或輻射可自一加或輻射來源(未示出)施用至坯體。舉例而言,坯體可被置於能使坯體於不同溫度加熱之一爐或烘箱內,其中,不同溫度範圍可從約等於第一低溫度結合劑之熔融溫度的一溫度至足以使坯體中之高溫度熔融材料熔融及/或燒結之一溫度。於另外例子,坯體於連續時期期間可置於多個每一者係於不同溫度爐或烘箱中,其中,此等溫度可個別係約等於第一低溫度結合劑、第二低溫度結合劑,及高溫度結合劑材料之熔融溫度。
施用熱之溫度可從一第一溫度逐步增加至一第二溫度,及至一高溫度。即,方塊310,熱可於一第一溫度施用至坯體,其可約得於第一低熔融溫度結合劑之一熔融溫度。於方塊312,其可於方塊310後之一預定時期後實施,熱可於一第二溫度施用至坯體,其可約等於第二低熔融溫度結合劑之一熔融溫度。於方塊314,其可於方塊312後之一預定時期後實施,熱可於一高溫度施用至坯體,其可約等於高熔化溫度組建材料之一熔融溫度。
逐步增加之溫度可使第一低熔融溫度結合劑及第二低熔融溫度結合劑溶解。於一例子,當溫度逐步增加,一第一低熔融溫度結合劑會開始熔融且可提供坯體某些形狀完整性。當溫度持續增加,第一低熔融溫度結合劑會於第二低熔融溫度結合劑開始熔融時開始溶解。熔融之第二低熔融溫度結合劑可於其熔融於坯體之藉由溶解第一低熔融溫度結合劑而空出之區域內時提供坯體某些形狀完整性。當溫度持續增加,第二低熔融溫度結合劑於高熔化溫度組建材料開始燒結時開始溶解。
舉例而言,溫度可從約室溫逐步增至約100°C,至約230°C,至高於約1000°C,且於其它例子,至高於約1500°C。此外,增加溫度會造成坯體密度增加。施加熱的時間長度會依,例如,下列之一或多者而定:熱或輻射來源之特徵、組建材料之特徵;及/或試劑之特徵。於一範例,熱可於一氧化或還原氛圍及具有或不具有惰性氣體中施用。於另外例子,氧化及還原氛圍亦可於坯體退火期間使用,以促進熔融結合劑自加熱坯體之內部及附近移除。
雖然於本揭露之全部各處作明確說明,本揭露之代表範例於廣泛應用範圍具有用途,且上述探討並不打算且不應被作為限制而闡釋,而係被提供作為本揭露各方面之例示探討。
於此處說明及例示者係本揭露之連同其某些變化一起之一範例。此處使用之術語、說明及圖式係僅作為例示而陳述,且非意指作為限制。許多變化於本揭露之精神及範圍內係可能,其係打算以下列申請專利範圍--及其等之等化物--界定,其中,除非其它指示,所有術語係意指其等之最廣合理含意。
100‧‧‧3D印表機
102‧‧‧組建區域平台
104‧‧‧組成物供應
106‧‧‧組成物
108‧‧‧散佈機
110‧‧‧箭頭
112‧‧‧箭頭
120‧‧‧能源
122‧‧‧箭頭
130‧‧‧噴墨頭
132‧‧‧箭頭
140‧‧‧控制器
150‧‧‧資料貯存
200‧‧‧方法
202,204,206,208‧‧‧方塊
300‧‧‧方法
302,304,306,308,310,312,314‧‧‧方塊
圖式簡要說明 本揭露之特徵係以範例作例示且非限於下列圖式,其中,相同數字指示相同元素,其中:
圖1顯示用於產生、組建,或列印三維零件之一例示三維(3D)印表機之一簡化等角視圖;及
圖2及3個別顯示製造3D零件的例示方法之流程圖。
Claims (14)
- 一種用於三維(3D)列印之組成物,其包含:一高熔化溫度組建材料,其係呈粉末形式;一第一低熔融溫度結合劑,其係呈粉末形式;以及一第二低熔融溫度結合劑,其係呈粉末形式;且其中該第一低熔融溫度結合劑係於不同於該第二低熔融溫度結合劑之一溫度下熔融;其中該高熔化溫度組建材料係選自由金屬、金屬合金、陶瓷,及聚合物所組成之群組。
- 如請求項1之組成物,其中該第一低熔融溫度結合劑及該第二低熔融溫度結合劑係獨立地選自由聚丙烯、聚乙烯、低密度聚乙烯、高密度聚乙烯、聚氧化乙烯、聚乙二醇、丙烯腈丁二烯苯乙烯、聚苯乙烯、苯乙烯丙烯腈樹脂、聚苯醚、聚醯胺11、聚醯胺12、聚甲基戊烯、聚甲醛、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚偏二氟乙烯、聚四氟乙烯、全氟烷氧烷、聚苯硫醚,及聚醚醚酮所組成之群組。
- 如請求項1之組成物,其中該第一低熔融溫度結合劑及該第二低熔融溫度結合劑各具有低於約250℃之一熔點溫度。
- 如請求項1之組成物,其中該第一低熔融溫度結合劑及該第二低熔融溫度結合劑係以範圍從約1體積%至約6體積%之量存在於該組成物中。
- 如請求項1之組成物,其中該第一低熔融溫度結合劑及該第二低熔融溫度結合劑係一結晶性聚合物。
- 如請求項1之組成物,其中該第一低熔融溫度結合劑及該第二低熔融溫度結合劑係一非結晶性聚合物。
- 一種用於三維(3D)列印之方法,其包含:使一組成物散佈於一平台上,其中該組成物係一粉末混合物,其包含一高熔化溫度組建材料、一第一低熔融溫度結合劑及一第二低熔融溫度結合劑;使一試劑選擇性積覆於該散佈組成物上;施用能量以自該散佈組成物形成一坯體;以及使施用至坯體之一溫度從一第一溫度逐步增至一第二溫度,及至一高溫度,其中該第一溫度係約等於該第一低熔融溫度結合劑之一熔融溫度,該第二溫度係約等於該第二低溫度結合劑之一熔融溫度,且該高溫度係該高熔化溫度組建材料之一熔融溫度。
- 如請求項7之方法,其中該試劑係選擇性積覆於該散佈組成物之將形成該坯體之一第一區域上,留下該散佈組成物之將不形成該坯體之一第二區域。
- 如請求項8之方法,其中該選擇性積覆之試劑吸收該施用能量,且使於該散佈組成物中之該第一低熔融溫度結合劑及該第二低熔融溫度結合劑熔融。
- 如請求項7之方法,其中該試劑係選擇性積覆於該散佈組成物之將不形成該坯體之一第二區域上,留下該散佈組成物之將形成該坯體之一第一區域。
- 如請求項10之方法,其中該選擇性積覆之試劑反射該施用能量,且抑制該散佈組成物中之該第一低熔融溫度結合劑及該第二低熔融溫度結合劑熔融。
- 如請求項10之方法,其中該散佈組成物之該第一區域吸收該施用能量,且使該散佈組成物中之該第一低熔融溫度結合劑及該第二低熔融溫度結合劑熔融。
- 如請求項7之方法,其進一步包含於逐步增加該溫度之前移除該施用能量以及冷卻該坯體。
- 如請求項7之方法,其中該逐步增加之溫度使該第一低熔融溫度結合劑及該第二低熔融溫度結合劑溶解、以及使該高熔化溫度組建材料燒結。
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US20230405683A1 (en) * | 2020-12-01 | 2023-12-21 | Hewlett-Packard Development Company, L.P. | Three-dimensional printed objects with regions of differing porosity |
DE102021213053A1 (de) | 2021-11-19 | 2023-05-25 | Volkswagen Aktiengesellschaft | Herstellung eines dreidimensionalen Bauteils nach einem pulverbasierten additiven 3D-Druck-Verfahren sowie Vorrichtung zur Durchführung des Verfahrens |
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DE19909882C2 (de) * | 1999-03-06 | 2002-01-10 | Fraunhofer Ges Forschung | Material zur schichtweisen Herstellung von Werkzeugen, Formen oder Bauteilen durch das Lasersinterverfahren |
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CN108698313B (zh) | 2022-01-07 |
US20190001558A1 (en) | 2019-01-03 |
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