TWI623073B - Resin sealing device, resin sealing method, manufacturing method of electronic parts, lead frame - Google Patents

Abstract

The resin sealing device of the present invention includes a plurality of main mold cavities and a plurality of sub mold cavities contained in the cavity. A main hardened resin is formed in a plurality of main mold cavities each containing a plurality of wafers mounted in a plurality of areas of the lead frame, and a sub hardened resin is formed in a plurality of sub mold cavities formed so as to overlap the lead frame frame. . The strength of the lead frame after the resin is sealed by the secondary hardening resin is increased. One region including the wafer and the main hardening resin is equivalent to one electronic component, and one product assembly region composed of a plurality of regions formed in a grid shape is formed in the lead frame. By not providing a reinforced frame of a lead frame, the number of electronic parts per unit area is increased.

Description

Resin sealing device, resin sealing method, manufacturing method of electronic parts, lead frame

The present invention relates to a resin sealing device, a resin sealing method, and electronic components used in the case of resin sealing a diode wafer, a transistor wafer, a sensor wafer, etc. (hereinafter referred to as "wafer" as appropriate). Manufacturing method and lead frame.

Since the beginning, resin molding technology has been used to mount diodes, LED (Light Emitting Diode) wafers, and LEDs mounted on circuit boards consisting of lead frames, printed substrates, and ceramic substrates using hardened resin. Semiconductor wafers such as crystal wafers and IC (Integrated Circuit) wafers are resin-sealed. Electronic components such as diodes, LEDs, transistors, and ICs are completed by resin-sealing semiconductor wafers. As the resin molding technique, a transfer molding method, a compression molding method, an injection molding method, or the like can be used.

For example, resin sealing can be performed by a transfer molding method as described below. First, the upper and lower dies constituting the forming mold are opened. Next, the lead frame on which the wafer is mounted is supplied to a specific position of the lower mold using a substrate transfer mechanism. Next, a material transfer mechanism is used to supply a resin flat plate made of a thermosetting resin into a container provided at a predetermined position in the lower mold. Second, the upper mold and the lower mold are closed. Thereby, the chip mounted on the lead frame is accommodated in the upper mold and the lower mold. Inside of at least one of the mold cavities. Next, the resin flat plate in the container supplied to the lower mold is heated and melted. The molten resin (flowable resin) is pressed by a plunger and injected into a cavity. Next, the fluid resin injected into the cavity is heated and hardened to form a hardened resin. In the steps up to this point, the wafer mounted on the lead frame is resin-sealed with a hardened resin.

The lead frame is manufactured by stamping or etching a flat metal plate to form a necessary pattern. As a material for the lead frame, for example, a copper alloy or an iron-nickel alloy (42 alloy) can be used. Since the thickness of the lead frame is very thin, a reinforcing frame for increasing the strength of the lead frame is provided around the wafer mounting portion on which each wafer is mounted. This reinforcing frame does not help the product's construction and will eventually be discarded. Therefore, if a larger number of reinforcing frames are provided, the number of products manufactured by one lead frame (the number obtained per unit area) is reduced.

As a lead frame used in a semiconductor device and its manufacturing, a lead frame "consisting of two outer frames 36 (roughly) extending in parallel and an inner frame 37 connecting the outer frame 36 at predetermined intervals" has been proposed (for example, refer to Paragraph [0031] of Patent Document 1 and FIG. 4).

[Prior technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 8-31998

However, the lead frame disclosed in Patent Document 1 causes the following problems. As shown in FIG. 4 of Patent Document 1, in order to increase the strength of the lead frame 35, An inner frame 37 is provided on both sides of the sheet. To explain specifically, the inner frame 37 is provided between regions corresponding to semiconductor devices (products) (a rectangular region shown by a two-dot chain line in FIG. 4 of Patent Document 1). Therefore, in the lead frame 35, a part which occupies more than half of the area of the lead frame 35 becomes a part where the inner frame 37 exists, in other words, a part which does not directly contribute to the product. Therefore, the number of electronic parts per unit area is reduced, so the production efficiency of electronic parts is reduced.

The present invention is to solve the above problems, and an object thereof is to provide a resin sealing device, a resin sealing method, a method for manufacturing an electronic component, and a lead, which can increase the strength of a lead frame after resin sealing and improve the production efficiency of electronic parts frame.

In order to solve the above-mentioned problems, the resin sealing device of the present invention includes: a first forming mold; a second forming mold provided opposite to the first forming mold; and a cavity provided in the first forming mold and the second forming mold. At least one of the forming dies; a resin material supplying mechanism that supplies the resin material to the cavity; and a mold clamping mechanism that closes and opens the first forming mold and the second forming mold; and The flowable resin generated from the resin material is hardened to form a hardened resin, and the hardened resin pair is provided on the lead frame and is installed separately from the boundary extending along the first direction and the boundary extending along the second direction. The plurality of wafers in the plurality of regions are resin-sealed to form a resin-sealed body, which are characterized in that: the plurality of first spaces are provided in the cavity and respectively accommodate the plurality of wafers mounted on the lead frame; And a plurality of second spaces, which are provided in the cavity and are frame-weighted outside the plurality of areas in the lead frame The embodiment; forming a first space on the first Hardened resin; forming a second hardened resin in the second space; the lead frame includes: a first outer frame included in the outer frame and extending along the first direction; a second outer frame included in the above An outer frame, and extending along the second direction; and a plurality of connecting portions, which are disposed at the boundary of the plurality of regions and extend along at least one of the first direction and the second direction; One of the above-mentioned areas corresponds to one electronic component; one product collection area composed of the plurality of areas is formed in the lead frame, and the plurality of areas are formed in a grid shape in the one product collection area.

The resin sealing device of the present invention has a configuration in which the first space covers the wafer, and the second space covers at least a part of the outer frame included in the lead frame.

The resin sealing device of the present invention has a form in which the lead frame has a plurality of openings at least the first outer frame provided in the outer frame, and the second space is formed so that the second space accommodates the opening. .

The resin sealing device of the present invention has a form in which one of the forming dies has a communication path that communicates with the plurality of first spaces in the mold cavity along at least one of the directions.

In order to solve the above-mentioned problems, the resin sealing method of the present invention includes the steps of preparing a first forming mold and a second forming mold disposed opposite to the first forming mold; Supplying a resin material to a cavity provided in at least one of the first forming mold and the second forming mold; and hardening a fluid resin generated from the resin material in the cavity to form a hardened resin; and A resin sealing body is formed by resin-sealing a wafer provided on the lead frame and mounted on a plurality of areas separated by a boundary extending along the first direction and a boundary extending along the second direction from the hardened resin. The method includes the following steps: preparing a completed lead frame, the completed lead frame being installed in the lead frame, and the wafers are respectively installed in the plurality of areas, and the lead frame is provided outside the plurality of areas; The two first outer frames of the frame extending along the first direction, the two second outer frames of the outer frame extending along the second direction, and the edges provided in the boundary of the plurality of areas. A plurality of connecting portions extending at an interface extending in at least one of the first direction and the second direction; in the first forming die and the second Any one of the forming molds aligns the plurality of regions with the plurality of first spaces included in the cavity, and arranges the lead frame after the installation is completed; combining the first forming mold with the second forming mold After the step of forming the hardened resin, opening the first forming mold and the second forming mold; taking out the resin sealing body having the lead frame, the wafer, and the hardening resin; forming the hardening resin The steps include the steps of: forming a first hardened resin in the first space; and including the first hardened resin in the mold cavity so as to overlap the outer frame of the lead frame. In the plurality of second spaces, a second hardened resin is formed; one of the above-mentioned areas is equivalent to one electronic component; and one of a product collection area composed of the plurality of areas is formed in the lead frame, and the one product collection is formed in the above-mentioned one product Among the regions, the plurality of regions are formed in a grid shape.

The resin sealing method of the present invention has the following aspects: in the step of forming the hardened resin, the first hardened resin is formed so that the first hardened resin covers the wafer, and in the step of forming the hardened resin, the first 2 The hardened resin covers at least a part of the outer frame of the lead frame to form the second hardened resin. The first hardened resin has a function of protecting a wafer, and the second hardened resin has a function of reinforcing a resin sealing body.

The resin sealing method of the present invention has the following aspect: the lead frame has a plurality of openings provided in the outer frame and at least the first outer frame; and in the step of forming the hardened resin, the lead frame is covered with the second hardened resin. The form of the opening portion forms the second hardened resin.

The resin sealing method of the present invention has the following aspect: the plurality of first spaces included in the cavity are communicated by a communication path along at least one of the directions.

In order to solve the above-mentioned problems, the method for manufacturing an electronic part of the present invention includes the following steps: preparing a first forming mold and a second forming mold disposed opposite to the first forming mold; and providing the first forming mold and the first forming mold. 2 At least one of the forming dies is formed The cavity of the mold is supplied with a resin material; the fluid resin generated from the resin material is hardened in the cavity to form a hardened resin; and the hardened resin pair is provided on the lead frame and mounted on the lead frame respectively along the first direction. The extended junction and the wafers in a plurality of areas separated by the extension along the second direction are resin-sealed to form a resin-sealed body; and an electronic part is manufactured by singulating the resin-sealed body into a single piece, which is characterized by The following steps: prepare a lead frame for installation, the lead frame being installed is in the lead frame, and the wafers are respectively installed in the plurality of areas; the lead frame has an outer frame disposed outside the plurality of areas; The two first outer frames extending along the first direction, the two second outer frames extending along the second direction in the outer frame, and the two outer frames provided along the boundary of the plurality of areas along the above. A plurality of connecting portions at a boundary extending in at least one of the first direction and the second direction; in the first forming die and the second forming die Either, align the plurality of areas with the plurality of first spaces included in the cavity, respectively, and arrange the completed lead frame; close the first forming mold and the second forming mold; and In a state where the first forming mold and the second forming mold are closed, the fluid resin filled with the cavity is hardened to form the hardened resin; the first forming mold and the second forming mold are opened; Taking out the resin sealing body having the lead frame, the wafer, and the hardened resin; removing a plurality of connecting portions extending along one of the directions among the plurality of connecting portions; and After the removing step, at the boundary of the plurality of regions of the resin sealing body, the boundary of the plurality of regions extending along the first direction and the other direction of the second direction, using a rotary knife, The resin sealing body is singulated; the step of forming the hardened resin includes the steps of forming a first hardened resin in the first space; and a plurality of second spaces included in the cavity so as to overlap the outer frame. Forming a second hardening resin in the step; in the step of removing the plurality of connecting portions, each of the outer frames extending along the other direction is left along all of the parts along the other direction At least a part of the direction; one of the above-mentioned areas is equivalent to one electronic component; one of the product collection areas composed of the plurality of areas is formed in the lead frame, and the plurality of areas in the one product collection area are formed as Grid-like.

The method for manufacturing an electronic part of the present invention has the following aspects: in the step of forming the hardened resin, the first hardened resin is formed so that the first hardened resin covers the wafer, and in the step of forming the hardened resin, The second hardening resin covers at least a part of the outer frame of the lead frame to form the second hardening resin. The first hardening resin has a function of protecting the wafer, and the second hardening resin has a function of strengthening the resin sealing body. .

The method for manufacturing an electronic part of the present invention has the following aspect: the lead frame has a plurality of openings of at least the first outer frame provided in the outer frame; In the mouth portion, in the step of forming the hardened resin, the second hardened resin is formed so that the second hardened resin covers the opening portion.

The method for manufacturing an electronic component of the present invention has the following aspect: the plurality of first spaces included in the cavity are communicated by a communication path along at least one of the directions.

In order to solve the above-mentioned problems, the lead frame of the present invention has a plurality of regions on which wafers are respectively mounted, two first outer frames extending along the first direction, and two outer frames extending in a first direction and provided on outer frames outside the plurality of regions A plurality of second outer frames extending along the second direction, and a plurality of connecting portions provided at the boundary of the plurality of areas and extending along at least one of the first direction and the second direction And used for forming a resin sealing body by resin-sealing the wafer with a hardened resin, the lead frame is characterized by comprising: a covering portion formed on the outer frame and covered with the hardened resin; and an area increasing portion It is provided on the covering portion, so that the adhesion area of the hardened resin to the lead frame is increased.

The lead frame of the present invention has a form in which the covering portion includes a plurality of openings covered with the hardening resin.

The lead frame of the present invention has a form in which the area increasing portion is an unevenness on the outer edge of the opening.

The lead frame of the present invention has an aspect in which the area increasing portion is an unevenness on a surface of the covering portion.

According to the present invention, in the resin sealing device, first, the strength of the lead frame after resin sealing is increased by the second hardened resin formed in the plurality of second spaces. Secondly, one region including the wafer and the first hardened resin is equivalent to one electronic component (product), and one product assembly region composed of a plurality of regions formed in a grid shape is formed in the lead frame. As a result, the quantity of the unit area of the electronic parts is increased, and the production efficiency of the electronic parts is improved.

1‧‧‧resin sealing device

2‧‧‧ lower mold abutment

3‧‧‧ connecting rod

4‧‧‧ Upper mold abutment

5‧‧‧ Lifting plate

6‧‧‧ Upper mold plate

7‧‧‧ Upper mold (1st mold, 2nd mold)

8‧‧‧ lower die plate

9‧‧‧ lower die (second forming die, first forming die)

10‧‧‧Forming mold

11‧‧‧Clamping mechanism

12‧‧‧lead frame

13‧‧‧ frame

13a‧‧‧frame (frame 1)

13b‧‧‧frame (frame 2)

14‧‧‧Connection Department

15, 15a, 15b ‧‧‧ opening pattern

16‧‧‧line

17‧‧‧ area

18‧‧‧ opening

19‧‧‧Chip Mounting Department

20‧‧‧Wire Joint

21‧‧‧The first lead

22‧‧‧ 2nd Lead

23‧‧‧Chip

24‧‧‧ bonding wire

25‧‧‧Mould cavity

25a‧‧‧Main mold cavity (first space)

25b‧‧‧Vice cavity (2nd space)

26‧‧‧hardened resin

26a‧‧‧Main hardening resin (first hardening resin)

26b‧‧‧Sub-hardened resin (second hardened resin)

27‧‧‧resin seal

28‧‧‧ opening

29, 30‧‧‧ junction

31‧‧‧SOD (electronic parts)

B‧‧‧ rotating knife

L‧‧‧ Lead

P‧‧‧Product collection area

Fig. 1 is a front view showing an outline of a device in a resin sealing device of the present invention.

FIG. 2A is a plan view showing a lead frame used in the resin sealing device shown in FIG. 1. FIG.

FIG. 2B is a plan view showing an area corresponding to one electronic component in the lead frame.

FIG. 3A is a schematic plan view showing a state where a wafer is mounted on the lead frame shown in FIGS. 2A and 2B.

Fig. 3B is a sectional view taken along the line A-A in Fig. 3A.

Fig. 3C is a sectional view taken along the line B-B in Fig. 3A.

FIG. 4A is a schematic plan view showing a resin sealing body formed by resin-sealing the wafer mounted on the lead frame shown in FIGS. 3A and 3B.

Fig. 4B is a sectional view taken along the line C-C of Fig. 4A with an upper die added.

Fig. 4C is a cross-sectional view taken along the line D-D of Fig. 4A with an upper die added.

FIG. 5A is a schematic plan view showing a state in which the connecting portion of the lead frame is removed in the resin sealing body shown in FIGS. 4A to 4C.

Fig. 5B is a sectional view taken along the line E-E of Fig. 5A.

Fig. 5C is a sectional view taken along the line F-F in Fig. 5A.

FIG. 6A is a schematic plan view showing a state where the resin sealing body shown in FIGS. 5A to 5C is cut and singulated.

Fig. 6B is a sectional view taken along the line G-G in Fig. 6A.

Fig. 6C is a sectional view taken along the line H-H in Fig. 6A.

As shown in FIG. 4A to FIG. 4C, in the lead frame 12, a plurality of openings 18 are formed in the frame 13a, and the frame 13a is provided in a product collection area P formed in a grid pattern from areas 17 each corresponding to an electronic component Outside and along the length direction of the lead frame 12 (hereinafter referred to as "length direction"). The wafer 23 and the plurality of openings 18 mounted in each region 17 are collectively sealed with resin. First, in the lead frame 12 (resin sealing body 27) after resin sealing, the sub-hardened resin 26b is formed at a plurality of locations along the longitudinal direction outside the product assembly region P corresponding to the entirety of the plurality of electronic components. Therefore, the resin sealing body 27 is strengthened along the longitudinal direction. Second, a sub-hardened resin 26 b is formed to overlap the plurality of openings 18, and a main hardened resin 26 a is formed along a short-side direction of the lead frame 12 (hereinafter referred to as a “short-side direction”). A row 16 composed of a plurality of (5) regions 17 arranged along the short-side direction and a plurality of (2 × 2 = 4) openings 18 located outside the row 16 are provided by a main hardening resin 26a and a sub hardening resin 26b is integrally resin-sealed. As a result, the upper part of the frame 13a (including the two openings 18) and the lower frame 13a (including the two openings 18) in the resin sealing body 27 outside the product collection area P are hardened in the short-side direction. The resin 26 is connected. Therefore, the resin sealing body 27 is strengthened along the short-side direction. With such a structure, the strength of the resin sealing body 27 can be increased as compared with the case where the hardened resin 26 covering the two opening portions 18 provided on the upper and lower side frames 13a is not provided.

(Example 1)

A resin sealing device and a lead frame according to an embodiment of the present invention will be described with reference to FIG. 1. For any figure in this application document, in order to make it easy to understand, schematic drawing is omitted or exaggerated appropriately. The same components are assigned the same reference numerals, and descriptions thereof are appropriately omitted.

As shown in FIG. 1, the resin sealing device 1 includes a lower base 2. Four links 3 as support members are fixed to the four corners of the lower abutment 2. An upper base 4 opposite to the lower base 2 is fixed to an upper portion of the four links 3 extending upward. Between the lower base 2 and the upper base 4, the lifting plates 5 opposite to the lower base 2 and the upper base 4 are respectively embedded in four links 3.

An upper die plate 6 is fixed to the lower surface of the upper base table 4. An upper mold 7 for resin molding is provided below the upper mold plate 6. A lower die plate 8 is disposed directly below the upper die plate 6 so as to face the upper die plate 6. A lower mold 9 for resin molding is provided on the upper side of the lower mold plate 8. The upper mold 7 and the lower mold 9 are opposite to each other and collectively constitute a one-component mold 10 (hereinafter referred to simply as a "molding mold 10"). The upper mold 7 and the lower mold 9 are replaced in the upper mold plate 6 and the lower mold plate 8 according to the object to be resin-sealed. A heater (not shown) for heating the resin material is provided on the upper mold plate 6 and the lower mold plate 8.

A mold clamping mechanism 11 is fixed on the lower base 2. The mold clamping mechanism 11 is a driving mechanism for raising and lowering the lifting plate 5 for mold clamping and mold opening. For example, by using a mold clamping mechanism 11 composed of a toggle mechanism or a hydraulic cylinder to raise and lower the lifting plate 5, the mold clamping and opening of the upper mold 7 and the lower mold 9 are performed.

Referring to FIG. 2A to FIG. 2C, for the resin sealing device 1 used in the present invention, The lead frame 12 will be described. The lead frame 12 shown in FIGS. 2A to 2C has a rectangular shape, that is, a rectangular shape (excluding a square shape). The lead frame 12 is manufactured by forming a specific opening pattern using a thin metal plate using a stamping process and an etching process. The lead frame 12 is made of a metal such as a copper alloy or an iron-nickel alloy (42 alloy). FIG. 2A to FIG. 2C show a lead frame 12 used in the case of manufacturing a semiconductor device (an electronic component as a product) composed of a diode called a small outline diode (SOD). . Hereinafter, in this specification, SOD means a product obtained by resin-sealing a diode wafer.

The lead frame 12 shown in FIG. 2A has an outer frame 13 which is not equivalent to an electronic component as a product. The lead frame 12 includes two frames 13a extending in the longitudinal direction, two frames 13b extending in the short-side direction, and a plurality of (three in the figure) connecting portions 14 extending in the short-side direction. The connecting portion 14 connects the frame 13a on the upper side in the figure and the frame 13a on the lower side in the figure. Two frames 13 a and two frames 13 b are included in the outer frame 13. The outer frame 13 is a portion that does not correspond to an electronic component, and will eventually be discarded.

In the lead frame 12, a specific opening pattern 15 is formed between the frame 13b and the connection portion 14 extending along the short-side direction, and between the adjacent connection portion 14 and the connection portion 14. Each of the opening patterns 15 is composed of one opening pattern 15a extending along the short-side direction and a plurality of opening patterns 15b extending in the longitudinal direction orthogonal to the one opening pattern 15a.

The regions 17 between the adjacent opening patterns 15b (the regions surrounded by the single-dot chain line in the figure) correspond to the respective electronic components. In the lead frame 12, a plurality of regions 17 corresponding to one electronic component are provided in a grid pattern. In FIG. 2A, five regions 17 along the short-side direction and four regions 17 along the longitudinal direction are provided in a grid pattern. Therefore, the lead frame 12 as a whole A total of 20 (= 5 × 4) electronic parts were manufactured. In FIG. 2A, a lead frame 12 for manufacturing 20 products is shown for convenience. Actually, hundreds to thousands of products can be manufactured from a single lead frame 12.

The 20 regions 17 arranged in a grid pattern constitute a single product collection region P with the entire 20 regions. A reinforcing frame for increasing the strength of the lead frame 12 is not provided in the one product collection area P. Therefore, there is no portion corresponding to 20 areas 17 of the electronic component in one product assembly area P. A part of the lead frame 12 outside the one product collection area P constitutes the outer frame 13.

In the lead frame 12, a plurality of openings 18 for reinforcement are provided in the frame 13a extending in the longitudinal direction. The plurality of openings 18 are adjacent to both ends (upper and lower ends in the figure) of the row 16 composed of five regions 17 arranged in the short-side direction, thereby forming one frame 13a. That is, the plurality of openings 18 are provided in the frame 13a in a row 16 extending in the short-side direction (a row of five regions 17 arranged in the short-side direction and four rows arranged in the lengthwise direction). ) Outside. In the plurality of openings 18, a hardened resin is formed so as to accommodate the openings 18 (including the openings 18) in a plan view (see the sub-hardened resin 26 b in FIGS. 4A to 4C). Thereby, a hardened resin is formed inside the plurality of openings 18 and around the plurality of openings 18. Therefore, the strength of the resin-sealed body (refer to the resin-sealed body 27 of FIGS. 4A to 4C) composed of the resin-sealed lead frame 12 is increased. In other words, the plurality of openings 18 are formed in advance as reinforcement openings in the lead frame 12 in order to increase the strength of the resin sealing body 12.

In the lead frame 12 shown in FIG. 2A, a reinforcing frame for increasing the strength of the lead frame is not provided along the length direction as before. Therefore, products can also be manufactured in the area where the reinforcing frame was previously provided. Therefore, the number of products per unit area obtained from one lead frame 12 can be obtained. The amount increases. However, since a reinforcing frame extending in the longitudinal direction is not provided, the strength of the lead frame 12 may be insufficient. In the present embodiment, the resin sealing body 27 is strengthened by providing the frame 13a of the lead frame 12 with a plurality of openings 18 for reinforcement and resin sealing (see FIGS. 4A to 4C). Therefore, the strength of the resin sealing body 27 is increased as compared with a case where the hardened resin 26 covering one opening portion 18 provided on the upper and lower side frames 13a is not provided.

Specifically, first, in the periphery of the lead frame 12 including the plurality of openings 18 for reinforcing the outer frame 13, a hardened resin is generated on the upper surface of the lead frame 12 (see FIGS. 4A to 4C). The coating portion covered by the sub-hardening resin 26b). Thereby, the upper surface of the covered portion of the outer frame 13 of the lead frame 12 and the cured resin are brought into close contact with each other only by a certain area (adhesive area). Therefore, the strength of the resin sealing body 27 (see FIGS. 4A to 4C) is increased by the hardened resin formed on the outer frame 13 of the lead frame 12.

Second, the hardened resin on the outer frame 13 of the lead frame 12 is formed at a plurality of locations (four locations) along the length direction of each frame 13a. Thereby, the strength along the longitudinal direction of the resin sealing body 27 (refer FIG. 4A-FIG. 4C) increases.

Third, the inside of the plurality of openings 18 is filled with a hardening resin so that the hardening resin is in close contact with the inner walls of the plurality of openings 18. As a result, a close contact area between the inner wall surface and the hardened resin is generated in the inner wall of the plurality of openings 18. Inside each of the plurality of openings 18, a hardened resin that is integrated with the hardened resin that is in close contact with the upper surface is formed, and a contact area between the inner wall surface and the hardened resin is generated. Thereby, the strength of the resin sealing body 27 (refer FIG. 4A-FIG. 4C) is further increased.

Fourth, the outer part of the product collection area P in the resin sealing body 27 is the upper frame 13a (including the two openings 18) and the lower frame 13a (including the two openings 18) in the short side direction by Connected with hardened resin. Therefore, the resin sealing body 27 (refer to FIG. 4A to FIG. 4C) The intensity increases along the short-side direction.

FIG. 2A illustrates a case where one circular opening portion 18 is provided at each end of each row 16. Not limited to this, a plurality of openings 18 may be provided at both ends of each row 16. Furthermore, the shape of the opening portion 18 is not limited to a circular shape, and may be any of an elliptical shape, a square shape, a rectangular shape, a triangular shape, a quadrangular shape, and a polygonal shape.

Since the plurality of openings 18 are formed in the frame 13 a extending in the longitudinal direction, the area of the lead frame 12 is not increased by providing the plurality of openings 18. Therefore, the quantity of the product per unit area can be increased without increasing the area of the lead frame 12, and the strength of the lead frame 12 can be increased. Moreover, although not shown, a lead-free plating is formed on the surface of the lead frame 12 before forming the plurality of opening patterns 15 and the plurality of opening portions 18 or after forming the plurality of opening patterns 15 and the plurality of opening portions 18. Floor. The plating layer is formed using, for example, an electroplating method or an electroless plating method.

As shown in FIG. 2B, a set of leads (electrodes) L made of two metal pieces facing each other is provided on the lead frame 12 in a region 17. Two leads L connected to the connection portion 14 or the frame 13b are provided on both sides (left-right direction in the figure) of the opening pattern 15a in each region 17 of each product. The leads L included in the regions 17 adjacent to each other in the longitudinal direction are connected to each other by a connecting portion 14.

Specifically, each region 17 corresponding to a diode of a product includes a wafer mounting portion 19 that mounts a wafer, a wire bonding portion 20 that connects a lead wire, a first lead 21 that includes a wafer mounting portion 19, and The 2 lead 22 has a wire bonding part 20. Depending on the specifications of the electronic component, the number of leads L may be three or more.

2A to 2C show the wafer mounting portion 19, the wire bonding portion 20, When the first lead 21 and the second lead 22 each have the same width. The width of the chip mounting portion 19 and the wire bonding portion 20 may be larger than the width of the first lead 21 and the second lead 22.

(Example 2)

The steps for manufacturing the SOD using a lead frame having a different shape from the resin sealing device 1 of the present invention will be described with reference to FIGS. 3A to 3C. 3A to 3C show that a plurality of openings 18 for reinforcement are formed adjacent to both ends (upper and lower ends in the figure) of each row 16, and two lead frames 12 are formed respectively. In order to increase the strength of the resin sealing body 27 (see FIGS. 4A to 4C), it is preferable to form a plurality of openings 18 adjacent to both ends of each row 16. The openings 18 are provided adjacent to both ends of each row 16 at any position in the outer frame 13 of the lead frame 12. Including the embodiments described so far, in order to increase the strength of the resin sealing body 27, it is desirable to position the openings 18 as close to the outer edge of the lead frame 12 as possible, and to form the openings 18 covering the openings The hardened resin 26 (see FIGS. 4A to 4C).

First, as shown in FIGS. 3A to 3C, in the lead frame 12, a wafer (diode wafer) 23 is mounted on each of a plurality of wafer mounting portions 19. For example, a wafer 23 on which a Schottky diode, a Zener diode, or the like is fabricated is mounted on each of the plurality of wafer mounting portions 19. Connection electrodes (not shown) included in each of the wafers 23 mounted on the plurality of wafer mounting portions 19 are connected to the wire bonding portions 20 through bonding wires 24 made of, for example, gold or copper wires.

Next, as shown in FIGS. 4A to 4C, each of the wafers 23 and the plurality of openings 18 mounted on the lead frame 12 are resin-sealed using a resin sealing device 1 (see FIG. 1). As the resin sealing device 1, for example, a resin sealing device of a transfer molding method is used. In the resin sealing device 1, first, as shown in FIGS. 4B and 4C, the upper mold 7 and the lower mold constituting the forming mold 10 The mold 9 is opened (see FIG. 1). 4A to 4C show a case where the upper mold 7 is provided with a plurality of (four in the figure) mold cavities 25 in parallel with each other (see FIG. 4B). One cavity 25 has one main cavity 25a for accommodating five wafers 23 arranged along the short-side direction, and two sub cavity 25b for accommodating a plurality of openings 18 (see FIG. 4C). FIG. 4A shows a configuration in which one main cavity 25a and two sub-molds 25b are integrally connected to each other.

Next, the lead frame 12 on which the plurality of wafers 23 are mounted is supplied to a predetermined position of the lower mold 9 using a substrate transfer mechanism (not shown). Next, a resin flat plate made of a thermosetting resin is supplied to a container (not shown) provided at a predetermined position of the lower mold 9 using a material transfer mechanism (not shown).

Next, from the state shown in FIGS. 4B and 4C, the upper mold 7 and the lower mold 9 are clamped by using the mold clamping mechanism 11 (see FIG. 1). Thereby, in each row 16 of the lead frame 12, a plurality of (5) wafers 23 mounted in each region 17 are housed inside each (1) main mold cavity 25a provided in the upper mold 7. A plurality of (2) openings 18 are housed inside each (1) sub-mold cavity 25b provided in the upper mold 7.

Next, the resin flat plate in the container supplied to the lower mold 9 is heated and melted. The molten resin (flowing resin) is pressed by the plunger. A fluid resin is injected into each of the mold cavities 25 through a storage section, a flow path, and a gate (not shown). The fluid resin injected into each cavity 25 is heated for the time required for hardening, thereby forming the hardened resin 26. The plurality of wafers 23 and the plurality of openings 18 mounted on the lead frame 12 are resin-sealed with a hardened resin 26 to form a resin sealing body 27. Next, after the upper mold 7 and the lower mold 9 are opened, the resin sealing body 27 is taken out.

As shown in FIG. 4C, the hardened resin 26 has: a main hardened resin 26a, which covers A plurality of wafers 23 mounted on each area 17 are resin-sealed; and a sub-hardening resin 26b covers the plurality of openings 18 and is resin-sealed. The main hardening resin 26a is a hardening resin 26 hardened in the main cavity 25a. The main hardening resin 26 a has a function of protecting each wafer 23 by covering each wafer 23. The auxiliary hardened resin 26b is a hardened resin 26 hardened in the auxiliary cavity 25b. The sub-hardening resin 26 b has a function of increasing the strength of the resin sealing body 27 by covering the plurality of openings 18. In other words, it has a function of strengthening the resin sealing body 27.

Next, as shown in FIG. 5A to FIG. 5C, in the resin sealing body 27, a portion of the frame 13a extending along the length direction of the lead frame 12 remains, and each connecting portion 14 extending along the short side direction is removed (see FIG. 4A). ) To form a plurality of openings 28. For example, each connecting portion 14 is removed using a press process, an etching process, or the like. In the same step, the frame 13b is completely removed from the left and right sides of the lead frame 12 shown in FIG. 5A.

With the steps so far, in the resin sealing body 27, all the metal constituting the lead frame 12 is removed around the area 17 corresponding to each product. In each row 16 of the resin sealing body 27, each region 17 and each of the plurality of openings 18 are connected to each other by a hardened resin 26 formed in a short-side direction. All the metal around the area 17 is removed by removing each connecting portion 14. Therefore, the rotary blade B is not in contact with the metal in the steps shown in FIGS. 6A to 6C. This makes it possible to reduce the cutting load that the rotary blade B receives when the resin sealing body 27 is cut using the rotary blade B and singulated.

Next, as shown in FIG. 6A to FIG. 6C, the resin sealing body 27 is cut by a cutting device (not shown) to be singulated. For example, the resin sealing body 27 is cut using a rotary blade B provided in a cutting device. First, the resin is extended along the boundary lines 29 and 30 of the plurality of areas 17 extending along the length direction (thin lines shown by single-point chain lines in the figure) extending along the length direction. The sealing body 27 is cut. In this case, the rotary blade B cuts only the main hardened resin 26a formed on the opening pattern 15b (see FIG. 3A). In this step, the frames 13 a on the upper and lower sides of the lead frame 12 (see FIGS. 5A to 5C) are all removed as corner materials.

Through the steps so far, the resin sealing body 27 shown in FIGS. 4A to 4C is singulated into a total of 20 SOD31 as a plurality of products (electronic parts). In other words, a plurality of products (electronic parts) SOD31 are manufactured by singulating the resin sealing body 27 into pieces. The metal portion protruding from the self-curing resin 26a functions as a terminal for external connection of an electronic component.

Depending on the specifications of the electronic component as a product, a step of bending the metal portion protruding from the self-curing resin 26a may be provided after the step of cutting each connecting portion 14 or after the step of singulating the resin sealing body 27. The protruding metal portion of the self-curing resin 26a (including the case of bending) corresponds to a terminal for external connection of an electronic component for electrically connecting the electronic component to a terminal such as a printed circuit board.

According to the present embodiment, as shown in FIGS. 3A and 4A, the plurality of openings 18 are both ends of a row 16 composed of five regions 17 arranged in the up-down direction (the direction of the short side of the lead frame 12). Adjacent to each other, two are formed at each end. The two openings 18 (four locations in total) formed at both ends of each row 16 are respectively connected by a hardened resin 26 formed along the short side direction. Therefore, the two (upper and lower) frames 13a extending along the length direction of the lead frame 12 are reinforced by the following two types of hardening resins 26. The first system is a pair of auxiliary hardened resins 26b formed in the plurality of openings 18 (four each in the longitudinal direction on the upper side and the lower side in the figure). The second system is a main hardened resin 26a (4 rows) that is resin-sealed to the five wafers 23 arranged in the short-side direction. The four frames of hardened resin 26 are passed through, and the two frames 13a are connected at four locations along the short side direction. With this, the hardened resin 26 is different from the hardened resin 26 provided separately from the frames 13a on the upper and lower sides. In comparison, the strength of the resin sealing body 27 can be increased.

In addition, two openings 18 are formed at both ends of one row 16. Therefore, compared with the case shown in FIG. 2A, the contact area between the inner wall surface of the opening portion 18 of the two opening portions 18 and the sub-hardening resin 26 b is increased at one end of one row 16. Thereby, the strength of the resin sealing body 27 can be further increased.

According to this embodiment, a reinforcing frame for increasing the strength of the lead frame 12 is not provided along the length direction. Products can also be arranged in the area where the reinforced frame was previously set, so the number of products per unit area can be increased. Furthermore, a plurality of openings 18 are formed by the frame 13a extending in the longitudinal direction, and the lead frame 12 is reinforced by the molded hardening resin 26. This increases the strength of the resin sealing body 27. Since the plurality of openings 18 are formed in the frame 13 a, the area of the lead frame 12 does not increase by providing the plurality of openings 18. Therefore, it is possible to increase the quantity per unit area of the product without increasing the area of the lead frame 12 and increase the strength of the resin sealing body 27.

According to this embodiment, only the portion of the frame 13 a constituting the outer periphery (outer frame) of the resin sealing body 27 shown in FIGS. 5A to 5C and 6A to 6C remains the metal portion constituting the lead frame 12. The remaining part of the frame 13a is removed as a corner material in the step of cutting the resin sealing body 27 along the plurality of boundary lines 29 extending in the longitudinal direction using the rotary blade B. Thereby, in the step of cutting the resin sealing body 27 using the rotary blade B, the rotary blade B does not cut the metal portion. Therefore, the cutting load to which the rotary blade B is received can be reduced significantly. Thereby, abrasion of the rotary blade B provided in the cutting device can be suppressed. Therefore, the life of the rotary blade B can be extended in the cutting device, and thus the productivity at the time of manufacturing electronic parts can be improved.

In FIGS. 4A to 4C, four independent mold cavities 25 are set on the upper mold 7, A plurality of wafers 23 are collectively resin-sealed in each cavity 25. Depending on the configuration of the lead frame 12, each cavity 25 may be further divided into a plurality of cavities. In this case, in each mold cavity 25, each of the divided mold cavities can be connected by a communication path to perform resin sealing.

FIG. 4A to FIG. 4C show an example in which the mold cavity 25 is formed by the main mold cavity 25 a and the auxiliary mold cavity 25 b provided in one body and four mold cavities 25 are provided. One cavity 25 is configured by communicating five spaces corresponding to one wafer 23 with the auxiliary cavity 25b at both ends. It is not limited to this, and the main cavity 25a and the auxiliary cavity 25b may be separately provided and the main cavity 25a and the auxiliary cavity 25b may be communicated through a communication path. In addition, a configuration may be adopted in which one main cavity 25 covering all 20 areas 17 shown in FIG. 4A is provided instead of the four cavity 25.

In FIGS. 4A to 4C, each cavity 25 is provided only on the upper mold 7. It is not limited to this, and the mold cavities opposite to the mold cavities 25 provided in the upper mold 7 may be respectively provided in the lower mold 9. In this case, the plurality of wafers 23 and the plurality of openings 18 mounted on the lead frame 12 are housed between the cavity 25 provided in the upper mold 7 and the cavity provided in the lower mold 9 and sealed with resin. The hardened resin 26 formed on the front surface of the lead frame 12 and the sub-hardened resin 26b formed on the back surface of the lead frame 12 are connected through the plurality of opening portions 18 and the plurality of opening patterns 15 formed in the frame 13a of the lead frame 12. Therefore, the hardened resins 26 formed on both surfaces of the lead frame 12 are connected to each other through the plurality of opening portions 18 and the plurality of opening patterns 15. This can increase the strength of the resin sealing body 27. In short, the side on which the reinforcing sub-hardening resin 26b for forming is formed may be one side of the lead frame 12 or both sides.

In FIGS. 4A to 4C, a plurality of (2) openings 18 are provided at both ends of a row 16 composed of a plurality of (5) regions 17, and two ends of each row 16 are respectively covered with 2 openings. The sub-hardening resins 26b of 18 are formed individually in each row 16. Covers 2 openings 18 The secondary hardening resins 26b are formed at both ends of each row 16, and the secondary hardening resins 26b of each row 16 are separated from each other. It is not limited to this, and the sub-hardening resin 26b which is formed on both ends of each row 16 so as to cover the two openings 18 and communicate with each other in the longitudinal direction may be formed. Thereby, one sub-hardening resin 26b extending in the lengthwise direction across the entire frame 13a on the upper side and one sub-hardening resin 26b extending in the lengthwise direction across the entire frame 13a on the lower side are formed. Therefore, the strength of the resin sealing body 27 can be further increased.

This embodiment shows a case where the lead frame 12 is resin-sealed using a resin molding apparatus of a transfer injection molding method. The resin sealing device is not limited to this, and a compression molding method or an injection molding method may be used.

The wafer is not limited to a semiconductor wafer. The chip can also be a chip of passive components such as resistors, capacitors, and inductors. In addition to these, the chip may be a chip of a sensor (including a light sensor), a filter, an oscillator, or the like. The chip may also be a device including MEMS (Micro Electro Mechanical Systems, Micro Electro Mechanical System). Multiple wafers can be installed in one area, and different types of wafers can also be installed in one area.

The connection portion may be provided in a lattice shape. In this case, for example, in a lead frame having the same structure as that shown in FIGS. 3A to 3C, except for a connecting portion (short-side connecting portion) located at the boundary line along the short-side direction, it is equivalent to that shown in FIG. 3A. In addition to the connecting portion 14), a connecting portion (length connecting portion) located at a boundary line along the longitudinal direction is additionally provided. After removing the long-side connecting portion or the short-side connecting portion by press working or the like, the short-side connecting portion or the long-side connecting portion is cut by the rotary blade B. In this case, compared with the case where the rotary blade B cuts both the length connection portion and the short-side connection portion, the moving distance of the rotary blade B to cut the lead frame is also shorter. Therefore, the life of the rotary blade B can be extended.

As shown in FIG. 2A, the connecting portions 14 are provided along the boundary between the regions 17. The connecting portion 14 is not limited to this, and the connecting portion 14 may be provided so that the connecting portion 14 intersects the boundary between the respective regions 17. In this case, a plurality of (for example, two) connecting portions 14 included in the adjacent regions 17 are provided across a gap at which the regions 17 border each other. The two connecting portions 14 and the gap are removed by press working, etching processing, or the like.

Optionally, in the lead frame 12 shown in FIG. 3A, a plurality of openings 18 are provided in the frame 13 b extending along the short side direction. A plurality of openings 18 may be provided in at least one of the frame 13a extending in the longitudinal direction and the frame 13b extending in the short-side direction. One frame 18a may be provided in one frame 13a, and one frame 18 may be provided in one frame 13b. In these cases, two openings 18 are provided in the entire frame 13a or the entire frame 13b.

The planar shape of the lead frame 12 may be a square. In addition, the planar shape of the lead frame 12 may be a rectangle close to a square. If necessary, a plurality of openings 18 are formed at appropriate positions in the outer frame 13 of the lead frame 12.

The lead frame 12 may be provided with an opening portion 18 instead of a portion of the lead frame 12 that does not correspond to the outer frame 13 of the product, or a cover portion covered with a hardened resin. More preferably, the area-enlarged portion that increases the contact area between the hardened resin and the lead frame is provided on the coating portion. One or a plurality of openings 18 may be provided in the area increasing portion. As the area increasing portion, first, the unevenness provided on the surface of the lead frame is mentioned. The unevenness may be a satin-finished surface. Secondly, when the opening portion 18 is included in the covering portion, the area increasing portion may be provided on the edge portion of the opening portion 18 (the boundary portion between the lead frame 12 and the opening portion 18). Concave and convex formed by a concave portion having a center depression and a protruding convex portion. These irregularities are formed by press working, etching processing, and the like.

The plurality of openings 18 provided in the lead frame 12 may be provided on the opposite side of the surface on which the wafer 23 is mounted (the lower surface in FIGS. 5B and 5C) to include an enlarged recessed portion including the opening 18 in a plan view. The enlarged recessed portion corresponds to an enlarged area. The enlarged recessed part is manufactured by forming a necessary pattern by press working or etching. When the enlarged concave portion is provided, the secondary hardened resin 26 b hardened in the enlarged concave portion surrounding the opening portion 18 prevents peeling of the hardened resin 26 in the resin sealing body 27. In addition, the secondary hardening resin 26b hardened in the enlarged recessed portion further increases the strength of the resin sealing body 27.

The present invention is not limited to the above-mentioned embodiments, and can be combined, changed, or selected arbitrarily and appropriately as needed without departing from the spirit of the present invention.

Claims (14)

A resin sealing device includes: a first forming mold; a second forming mold provided opposite to the first forming mold; and a cavity provided in at least one of the first forming mold and the second forming mold. A forming mold; a resin material supplying mechanism for supplying a resin material to the cavity; and a mold clamping mechanism for clamping or opening the first molding mold and the second molding mold; The flowable resin is hardened to form a hardened resin, and the hardened resin pair is provided on the lead frame and is installed in a plurality of areas separated by a boundary extending along the first direction and a boundary extending along the second direction, respectively. Each of the wafers is sealed with a resin to form a resin-sealed body, comprising: a plurality of first spaces, which are provided in the cavity, and respectively accommodate the plurality of wafers mounted on the lead frame; and a plurality of second The space is provided in the cavity, and is formed in such a manner as to overlap the outer frame provided on the outside of the plurality of regions in the lead frame; A first hardened resin is formed in one space; a second hardened resin is formed in the second space; the lead frame includes a first outer frame that is included in the outer frame and extends along the first direction; and a second outer frame that Included in the outer frame and extending along the second direction; and a plurality of connecting portions that are provided in the boundary of the plurality of regions and extend along at least one of the first direction and the second direction The boundary; wherein the lead frame has a plurality of openings provided in the outer frame and at least the first outer frame, and the second hardened resin is formed so as to cover the openings; one of the areas is equivalent to one of electronic parts ; Forming one product assembly region composed of the plurality of regions in the lead frame, and forming the plurality of regions in a lattice shape in the one product assembly region. For example, in the resin sealing device of the first scope of the application, the first space covers the wafer, and the second space covers at least a part of the outer frame of the lead frame. For example, the resin sealing device of the first patent application range, wherein the lead frame has a plurality of openings at least the first outer frame provided in the outer frame, and the second space accommodates the openings in the second space. Way of forming. For example, the resin sealing device according to the first item of the patent application scope, wherein one of the forming molds has a communication path that communicates the plurality of first spaces in the mold cavity along at least one of the directions. A resin sealing method includes the steps of preparing a first forming mold and a second forming mold disposed opposite to the first forming mold; and providing at least one of the first forming mold and the second forming mold. The cavity of the forming mold is supplied with a resin material; and the fluid resin generated from the resin material is hardened in the cavity to form a hardened resin; and the hardened resin pair is provided on the lead frame and mounted on the lead frame respectively. The wafer extending from the junction extending in one direction and the wafers separated by a plurality of regions extending along the junction extending in the second direction are resin-sealed to form a resin-sealed body. It is characterized by including the following steps: preparing a lead frame for installation, and completing the installation. The lead frame is mounted on the lead frame and the wafers are respectively mounted on the plurality of regions, and the lead frame has two first outer portions extending along the first direction and disposed in an outer frame on the outer side of the plurality of regions. Frame, two second outer frames extending along the second direction in the outer frame, and borders provided on the plurality of regions A plurality of connecting portions at an interface extending along at least one of the first direction and the second direction; and in any one of the first forming mold and the second forming mold, the plurality of regions and the The plurality of first spaces included in the cavity are aligned and arranged respectively, and the completed lead frame is assembled; the first forming mold and the second forming mold are clamped; after the step of forming the hardening resin, the above Opening the first forming mold and the second forming mold; and taking out the resin sealing body having the lead frame, the wafer, and the hardened resin; forming the hardened resin includes the following steps: forming a first part in the first space; 1 hardened resin; and a second hardened resin included in the plurality of second spaces of the mold cavity in such a manner as to overlap the outer frame of the lead frame; 1 of the above-mentioned area corresponds to 1 electronic component; Forming one product collection area composed of the plurality of areas in the lead frame, and forming the plurality of areas in the one product collection area The grid has a shape in which the lead frame has a plurality of openings at least the first outer frame provided in the outer frame, and in the step of forming the hardened resin, the second hardened resin covers the openings. The above-mentioned second cured resin is formed. For example, the method for sealing a resin according to item 5 of the patent application, wherein in the step of forming the hardened resin, the first hardened resin is formed so that the first hardened resin covers the wafer, and in the step of forming the hardened resin, The second hardening resin is formed so that at least a part of the outer frame of the lead frame is covered by the second hardening resin, the first hardening resin has a function of protecting the wafer, and the second hardening resin has a function of strengthening the resin sealing body. Features. For example, the method for sealing a resin according to item 5 of the application, wherein the plurality of first spaces in the cavity are communicated through a communication path along at least one of the directions. An electronic component manufacturing method includes the following steps: preparing a first forming mold and a second forming mold disposed opposite to the first forming mold; and installing a first forming mold and the second forming mold in the second forming mold. The cavity of at least one forming mold is supplied with a resin material; the flowable resin generated from the resin material is hardened in the cavity to form a hardened resin; and the hardened resin pair is provided on the lead frame and mounted on the lead frame respectively. Wafers in a plurality of areas separated by a boundary extending in the first direction and a plurality of areas separated along the boundary extending in the second direction are resin-sealed to form a resin-sealed body; and an electronic component is manufactured by singulating the resin-sealed body into a single piece, It is characterized by including the following steps: preparing a lead frame for installation, the lead frame being installed is in the lead frame, the wafers are respectively installed in the plurality of areas, and the lead frame has a plurality of areas disposed outside the plurality of areas; Two first outer frames extending along the first direction in the outer frame, and two second outer frames extending along the first direction in the outer frame A plurality of connecting portions extending along two first outer frames and a boundary extending along at least one of the first direction and the second direction among the boundaries of the plurality of regions; Either the forming mold and the second forming mold, respectively align the plurality of regions with the plurality of first spaces included in the cavity, and arrange the completed lead frame; place the first forming mold with the Clamping the second molding die; curing the flowable resin filled with the cavity in the state where the first molding die and the second molding die are clamped to form the cured resin; and molding the first molding die. Opening the mold with the second forming mold; taking out the resin sealing body having the lead frame, the wafer, and the hardened resin; removing the plurality of connecting portions that extend along one of the directions; and After the removing step, the boundary between the plurality of regions of the resin sealing body is along the other direction of the first direction and the second direction. At the boundary of the extended plurality of areas, the resin sealing body is singulated using a rotary knife; the step of forming the hardened resin includes the steps of forming a first hardened resin in the first space; and overlapping the outer frame with the outer frame. The method includes forming a second hardened resin in the plurality of second spaces of the mold cavity; in the step of removing the plurality of connecting portions, each of the outer frames extending along the other direction is extended along the All the parts in the other direction remain at least a part in one of the above directions; one of the above-mentioned areas is equivalent to one of the electronic parts; and one product assembly area composed of the plurality of areas is formed in the lead frame, and The plurality of regions in the one product collection region are formed in a lattice shape. For example, in the method for manufacturing an electronic component according to item 8 of the scope of patent application, in the step of forming the hardened resin, the first hardened resin is formed so that the first hardened resin covers the wafer, and the step of forming the hardened resin Wherein the second hardening resin is formed so that at least a part of the outer frame of the lead frame is covered by the second hardening resin, the first hardening resin has a function of protecting the wafer, and the second hardening resin has a function of strengthening the resin seal. Body function. For example, the method for manufacturing an electronic component according to item 8 of the patent application, wherein the lead frame has a plurality of openings provided in the outer frame and at least the first outer frame. The second hardened resin is formed so that the second hardened resin covers the opening. For example, the method for manufacturing an electronic component according to item 8 of the scope of patent application, wherein the plurality of first spaces included in the mold cavity are communicated through a communication path along at least one of the directions. A lead frame includes a plurality of regions on which wafers are respectively mounted, two first outer frames extending along a first direction, and two outer frames extending along a first direction and arranged on outer frames outside the plurality of regions, and along the second The two second outer frames extending in the direction, and the plurality of connecting portions provided at the boundary of the plurality of areas and extending along at least one of the first direction and the second direction, and The hardened resin is used when resin sealing the wafer to form a resin sealed body, and includes a coating portion formed on the outer frame and covered with the hardened resin, and an area increasing portion provided on the coating portion and Increasing the adhesion area of the hardened resin to the lead frame, wherein the covering portion includes a plurality of openings covered with the hardened resin. For example, in the lead frame of claim 12, the area increasing portion is an unevenness on the outer edge of the opening. For example, the lead frame of the scope of application for patent No. 12, wherein the area increasing portion is an unevenness on a surface of the covering portion.