TWI622543B - Peeling device and method of substrate, and manufacturing method of electronic component - Google Patents

Abstract

The present invention relates to a peeling device for a substrate, which peels along an interface from the one end side to the other end side by bending and deforming at least one of the substrate and the reinforcing plate at the interface between the substrate and the reinforcing plate that reinforces the substrate. The peeling direction is sequential, and the peeling device includes: a flexible plate that adsorbs and holds the substrate or the reinforcing plate; and a driving device that applies a direction parallel to the interface to the flexible plate. Force to bend and deform one of the above together with the flexible plate.

Description

Peeling device and method of substrate, and manufacturing method of electronic component

The invention relates to a peeling device, a peeling method, and an electronic component manufacturing method for peeling a substrate at the interface between the substrate and the reinforcing plate.

In recent years, along with the reduction in thickness and weight of electronic components such as display panels, solar cells, and thin film secondary batteries, thinner substrates for electronic components are expected. However, if the strength of the substrate is reduced due to thinning, the operability of the substrate is deteriorated, so it is difficult to form electronic components such as thin film transistors (TFTs) and color filters (CFs) on the surface of the substrates. Use the functional layer.

Therefore, the following method is proposed: a laminated board (laminated body in a broad sense) formed by attaching a surface of a reinforcing plate releasably on the back surface of the substrate, and forming a functional layer on the front side of the substrate of the laminated board, peeling the substrate The interface of the reinforcing plate (for example, refer to Patent Document 1). Hereinafter, the surface on which the functional layer is formed is referred to as the “front surface” of the substrate, and the surface on which the reinforcing plate is attached is referred to as the “back surface” of the substrate.

The peeling method of Patent Document 1 is a method in which the interface between the back surface of the substrate and the surface of the reinforcing plate is sequentially peeled from one end side to the other end side, so that at least one of the substrate and the reinforcing plate is bent and deformed, thereby comprehensively peeling interface. The above-mentioned bending deformation is performed by holding at least one of the substrate and the reinforcing plate by using a flexible plate, so that a plurality of movable bodies fixed to the flexible plate are independent in a direction orthogonal to the interface. To move.

FIG. 18 (a) schematically shows the peeling of a substrate using a peeling device of Patent Document 1. FIG. A plan view of the morphological laminated board 100. Fig. 18 (b) is a side view of the peeling form of the substrate shown in Fig. 18 (a).

As shown in FIG. 18 (b), the laminated board 100 includes a substrate 102 and a reinforcing plate 104 attached to the back surface of the substrate 102. The dotted line A in FIG. 18 (a) and the symbol A in FIG. 18 (b) are the boundary lines (hereinafter also referred to as " "Peeling front", hereinafter indicated by symbol A). 18 (b), the plurality of movable bodies 114, 114 of FIG. 18 (b) are moved in such a way that the front line A of the laminated board 100 travels in parallel from the corner 110 side toward the corner 112 side as shown by arrow B in FIG. 18 (a). … Moving in sequence like arrow C.

The front surface of the substrate 102 is vacuum-absorbed and held on a flat plate-shaped platform 116 as a supporting device, and the reinforcing plate 104 is vacuum-absorbed and held on an elastically deformable flexible plate 118. The movable bodies 114, 114... Are fixed to the flexible plate 118 in a grid shape. That is, the plurality of movable bodies 114, 114, which are arranged along the peeling travel direction with respect to the front line A, that is, the arrow B is substantially orthogonal, are simultaneously moved downward to bend and deform the flexible plate 118, thereby peeling the front line A Go in the direction of arrow B.

As described above, the peeling device of Patent Document 1 is a device that peels an interface while keeping the interface in a horizontal direction. That is, the peeling device of Patent Document 1 is a device that applies a load component (a load component in the direction of the arrow C) in the longitudinal direction to the flexible plate 118 in a direction orthogonal to the interface, so that the reinforcing plate 104 and The flexible plates 118 are bent and deformed together, thereby peeling the interface.

In addition, the reinforcing plate 104 may be vacuum-adsorbed and held on the stage 116, the substrate 102 may be vacuum-adsorbed and held on the flexible plate 118, and the substrate 102 and the flexible plate 118 may be deformed together by bending to deform the interface. Further, in Patent Document 1, the flexible plate 118 is bent and deformed by the movable bodies 114, 114, ... so that the curvature radius a of the peeling region 106 becomes 250 mm to 2500 mm.

[Prior technical literature] [Patent Literature]

[Patent Document 1] International Publication No. 11/024689

The substrate peeling device of Patent Document 1 is a device that peels the interface using only the load component in the direction of the arrow C orthogonal to the interface. Therefore, the reinforcing plate 104 (the substrate 102 when the flexible plate 118 adsorbs the substrate 102) ) The bending deformation is large (the curvature radius is small) near the line A before peeling. In this case, there is a problem that if a part of the large bending deformation of the reinforcing plate 104 (the substrate 102) is detached from the flexible plate 118, the flexible plate 118 is used to vacuum-absorb the reinforcing plate 104 (the substrate 102) Since the holding is released, the reinforcing plate 104 (the substrate 102) falls off from the flexible plate 118 and is broken.

In addition, when the object to be peeled is a laminated board 122 in which two substrates 102 and 102 having a functional layer formed thereon are bonded with a sealing material 120 as shown in FIG. 19, there is also a problem that an arrow orthogonal to the interface exists. The load component in the C direction acts on the direction in which the two substrates 102 and 102 are peeled, so that the two substrates 102 and 102 are peeled.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a peeling device, a peeling method, and an electronic component manufacturing method for a substrate that can suppress cracking of a substrate or a reinforcing plate and can suppress peeling of the substrates from each other.

In order to achieve the above object, a peeling device for a substrate of one aspect of the present invention is to bend the interface of the substrate and the reinforcing plate that reinforces the substrate, and at least one of the substrate and the reinforcing plate is bent and deformed to face from one end side. The peeling direction on the other end side is sequentially peeled, and includes a peeling device including a flexible plate that adsorbs and holds the substrate or the reinforcing plate; and a driving device that imparts the flexible plate with the flexible plate. The force in the direction parallel to the interface causes the aforementioned one to deform together with the flexible plate.

In order to achieve the above object, a method for stripping a substrate according to one aspect of the present invention is to remove the substrate The interface with the reinforcing plate for reinforcing the substrate is sequentially peeled in a peeling direction from one end side to the other end by bending and deforming at least one of the substrate and the reinforcing plate, and includes a peeling step. The peeling step is The substrate or the reinforcing plate is held and held by a flexible plate, and the flexible plate is bent and deformed together with the flexible plate by applying a force in a direction parallel to the interface to the flexible plate, thereby peeling the above. interface.

To achieve the above object, a method for manufacturing an electronic component according to one aspect of the present invention includes: a functional layer forming step of forming a functional layer on a front surface of a substrate reinforced by a reinforcing plate; and a peeling step by forming the above function At least one of the substrate and the reinforcing plate of the layer is bent and deformed, and the interface between the substrate and the reinforcing plate is sequentially peeled in a peeling direction from one end side to the other end side; and the peeling step is as follows: The flexible plate adsorbs and holds the substrate or the reinforcing plate, and by applying a force in a direction parallel to the interface to the flexible plate, the flexible plate is deformed together with the flexible plate to peel the interface.

One aspect of the peeling form of the present invention is based on the inventor's opinion that if a force is applied to the flexible plate in a direction parallel to the interface, the flexible plate near the front line of the peeling will generate a bending moment, The interface can be peeled off.

If a force is applied to the flexible plate in a direction parallel to the interface, the flexible plate near the peeling front line mainly uses a load component in a direction parallel to the interface to generate a bending moment. One aspect of the peeling form of the present invention is to cause the flexible plate near the peeling front line to generate the aforementioned bending moment and peel the interface. By reducing the tensile load component (the load component in a direction substantially orthogonal to the interface) generated by the bending of the flexible plate or making it a compressive load component, the flexible plate is used to reinforce the plate (or the substrate). The vacuum suction is not released, and the reinforcing plate or the substrate can be prevented from being greatly deformed when the interface is peeled off. Therefore, the substrate or the reinforcing plate can be prevented from being damaged, and the substrates can be prevented from being peeled from each other.

In one aspect of the peeling device of the substrate of the present invention, it is preferable that the peeling device includes: a supporting device that supports the first main body of the laminated body including the substrate and the reinforcing plate. The flexible plate, which holds and holds the second main surface of the laminated body; and the driving device, which is opposite to the suction surface of the flexible plate and is flexible The position where the adsorption surface of the plate is separated in the direction of the interface imparts a force in a direction parallel to the interface, so that the aforementioned one is deformed together with the flexible plate.

In one aspect of the method for peeling a substrate of the present invention, it is preferable that the peeling step includes the following steps: supporting a first main surface of a laminated body including the substrate and the reinforcing plate by a supporting device, and using the flexibility The second main surface of the laminated body is held by the plate adsorption; and the position of the flexible plate opposite to the adsorption surface is separated from the adsorption surface of the flexible plate along the interface by using a driving device. The position is given a force in a direction parallel to the interface, and the one is bent and deformed together with the flexible plate, so that the interface is peeled off.

In one aspect of the manufacturing method of the electronic component of the present invention, it is preferable that the stripping step includes the following steps: supporting the first main surface of the multilayer body including the substrate and the reinforcing plate by a supporting device, and by the flexible The second main surface of the laminated body is adsorbed and held by the flexible plate; and the position of the flexible plate on the side opposite to the adsorbed surface and the direction along the interface with the adsorbed surface of the flexible plate by the driving device The separated position imparts a force in a direction parallel to the interface, so that the one is bent and deformed together with the flexible plate, thereby peeling the interface.

According to one aspect of the peeling form of the present invention, the first main surface of the laminated body is supported by the supporting device, and the second main surface of the laminated body is held by the flexible plate. Further, the driving device applies a force in a direction parallel to the interface to a position on the side of the flexible plate opposite to the adsorption surface and a position separated from the adsorption surface of the flexible plate along the interface direction. Thereby, the above-mentioned bending moment is favorably generated in the flexible plate near the peeling front line.

In one aspect of the present invention, the substrate is preferably a glass substrate having a thickness of 0.2 mm or less.

According to an aspect of the present invention, a glass substrate suitable for coping with the thinning of electronic components Peeling device, peeling method, and manufacturing method of electronic component.

In addition, if the flexible plate is bent and deformed from one end portion to the other end portion, the bending moment generated in the flexible plate increases toward the maximum value. Thereby, the radius of curvature becomes smaller in the vicinity of one end portion including one end portion of the flexible plate than the other portions. If the curvature radius becomes too small, a problem arises that the substrate or the reinforcing plate that is adsorbed on the adsorption surface of the flexible plate is peeled from the flexible plate.

In order to eliminate the above-mentioned problem, in one aspect of the present invention, it is preferable that a restricting member for restricting the amount of bending deformation of the flexible plate is provided on a surface of the flexible plate opposite to the adsorption surface, and the restricting member is from the above. One end of the above-mentioned flexible board, where the flexible board starts to bend and deform, is provided toward the other end.

According to an aspect of the present invention, the amount of bending deformation of at least one end portion of the flexible plate is restricted by the restricting member, so that the problem of peeling the substrate or the reinforcing plate from the flexible plate can be eliminated. In addition, the bending moment generated in the flexible plate is approximately proportional to the length of the line before peeling, and becomes the maximum at the position where the line is longest before peeling.

According to an aspect of the present invention, it is preferable that the restricting member is disposed along a direction from the one end portion to the other end portion through a plurality of blocks having a rigidity higher than the flexible plate. In other words, the specific gap is a gap corresponding to a limit amount that limits the amount of the bending deformation.

According to an aspect of the present invention, as the flexible plate is bent and deformed from one end to the other end, that is, as the radius of curvature of the flexible plate becomes smaller, the gap between the blocks becomes smaller. Furthermore, when the radius of curvature limiting the amount of bending of the flexible plate is reached, the gap between the block and the block disappears, and the blocks abut against each other. This can limit the amount of bending deformation of the flexible plate.

According to the present invention, it is possible to provide a substrate peeling device, a peeling method, and an electronic component manufacturing method capable of suppressing cracking of a substrate or a reinforcing plate and suppressing peeling of the substrates from each other.

1‧‧‧ laminated board

1A‧‧‧Laminated board

1B‧‧‧Laminated board

1C‧‧‧Corner

1D‧‧‧Corner

2‧‧‧ substrate

2A‧‧‧ substrate

2B‧‧‧ substrate

3‧‧‧ Reinforcing board

3A‧‧‧ Reinforcing board

3B‧‧‧ Reinforcing board

4‧‧‧ support board

5‧‧‧ resin layer

6‧‧‧ laminated body

7‧‧‧ LCD layer

8‧‧‧ interface

10‧‧‧ peeling device

12‧‧‧ elastic sheet

14‧‧‧platform

16‧‧‧ Elastic sheet

18‧‧‧ flexible board

18A‧‧‧Body

18B‧‧‧ protrusion

18C‧‧‧ protrusion

18D‧‧‧Flexible board

20‧‧‧ abutment

22‧‧‧axis

24‧‧‧bearing

26‧‧‧Servo cylinder

26A‧‧‧Cylinder body

26B‧‧‧Piston

28‧‧‧axis

30‧‧‧bearing

32‧‧‧axis

34‧‧‧bearing

36‧‧‧ Remove device

38‧‧‧Adsorption pad

40‧‧‧ peeling device

50‧‧‧ peeling device

52‧‧‧ abutment

54‧‧‧ flexible board

54B‧‧‧ protrusion

56‧‧‧Servo cylinder

56A‧‧‧Cylinder body

56B‧‧‧Piston

60‧‧‧ peeling device

62‧‧‧Servo cylinder

62A‧‧‧Cylinder

62B‧‧‧Piston

64‧‧‧axis

65‧‧‧bearing

66‧‧‧axis

68‧‧‧bearing

70‧‧‧ peeling device

72‧‧‧ Cylinder for damper

72A‧‧‧Cylinder

72B‧‧‧Piston

74‧‧‧axis

75‧‧‧bearing

76‧‧‧axis

78‧‧‧bearing

80‧‧‧ stripping device

82‧‧‧ Restricted components

84‧‧‧ block

100‧‧‧ laminated board

102‧‧‧ substrate

104‧‧‧ Reinforcing board

106‧‧‧ stripped area

108‧‧‧ Unstriped area

110‧‧‧ Corner

112‧‧‧ Corner

114‧‧‧ movable body

116‧‧‧Platform

118‧‧‧ flexible board

118A‧‧‧ The side opposite to the suction side

118B‧‧‧ Adsorption surface

118C‧‧‧Location

118D‧‧‧Flexible board

120‧‧‧sealing material

122‧‧‧ laminated board

124‧‧‧ interface

a‧‧‧curvature radius

A‧‧‧ stripped front

B‧‧‧ direction

C‧‧‧ direction

E‧‧‧ direction

F‧‧‧ direction

G‧‧‧ direction

H‧‧‧ height

J‧‧‧ Clearance

L‧‧‧ length

P1‧‧‧Load composition

P2‧‧‧force

R‧‧‧Minimal curvature radius

FIG. 1 is an enlarged side view of a main part of a laminated board used for manufacturing steps of electronic components.

FIG. 2 is a side view showing an example of a multilayer body produced in the middle of the manufacturing steps of an electronic component.

FIG. 3 (a) is a schematic diagram showing a previous method for peeling a substrate, and FIG. 3 (b) is a schematic diagram showing a method for peeling a substrate according to the present invention.

Fig. 4 is a plan view of the peeling device of the first embodiment.

FIG. 5 is a side view of the peeling device shown in FIG. 4.

FIG. 6 (a) is an operation explanatory diagram of the peeling device shown in FIG. 4 and a side view of the peeling device after a certain time has elapsed since the start of peeling. Side view of the peeling device immediately after peeling.

FIG. 7 (a) is a side view of the peeling device illustrating the operation of the peeling device shown in FIG. 4 and the peeling reinforcing plate is retracted in the vertical direction. FIG. 7 (b) is a peeling device shown in FIG. 4 An explanatory diagram of the operation and a side view of the peeling device immediately after the peeled reinforcing plate is held by the carrying device.

Fig. 8 is a plan view of a peeling device of a second embodiment.

FIG. 9 is a side view of the peeling device shown in FIG. 8. FIG.

Fig. 10 is a side view of a peeling device of a third embodiment.

Fig. 11 is a plan view of a peeling device of a fourth embodiment.

Fig. 12 is a plan view of a peeling device of a fifth embodiment.

Fig. 13 is a plan view of a peeling device of a sixth embodiment.

FIG. 14 is a side view of the peeling device shown in FIG. 13.

FIG. 15 is an enlarged side view of a main part showing the configuration of the restricting member in a state where the flexible plate is not bent.

FIG. 16 is a side view of a peeling device in which a flexible plate is deformed by bending.

FIG. 17 is an explanatory diagram showing a state where the blocks abut against each other when the flexible plates are bent to a minimum radius of curvature.

FIG. 18 (a) is a plan view of a laminated board schematically showing a peeling form of a substrate of a peeling device of Patent Document 1, and FIG. 18 (b) is a side view of the peeling form shown in FIG. 18 (a).

FIG. 19 is an explanatory diagram showing a state in which a force in a peeling direction acts on two substrates on which a functional layer is formed.

Hereinafter, embodiments of a peeling device, a peeling method, and an electronic component manufacturing method for a substrate of the present invention will be described based on the accompanying drawings.

FIG. 1 is an enlarged side view of a main part of the laminated board 1 provided for the manufacturing steps of electronic components.

[Manufacturing method of electronic components]

The manufacturing method of the electronic component according to the embodiment is to cope with the thinning of the substrate 2 for electronic components, and includes the following steps: a functional layer forming step, which is formed by attaching the surface of the reinforcing plate 3 on the back surface of the substrate 2 The laminated board 1 forms a functional layer on the front surface of the substrate 2 of the laminated board 1; and a peeling step, which peels off the interface between the substrate 2 on which the functional layer is formed and the reinforcing plate 3. The above-mentioned peeling step is a peeling device using the substrate of the embodiment. The peeling device will be described below. In addition, the reinforcing plate 3 does not become a part of the electronic component, but is reused for reinforcing the substrate 2 after being peeled from the substrate 2.

The aforementioned electronic components refer to electronic components such as display panels, solar cells, and thin film secondary batteries. The display panel includes a liquid crystal panel (LCD), a plasma panel (PDP), and an organic EL (electroluminescence) panel (OLED).

[Laminate 1]

As shown in FIG. 1, the laminated board 1 includes a substrate 2 and a reinforcing plate 3 for reinforcing the substrate 2, and is configured by attaching the surface of the reinforcing plate 3 to the rear surface of the substrate 2.

[Substrate 2]

In the middle of the manufacturing steps of the electronic component, a specific functional layer (such as a TFT (Thin Film Transistor), a CF (Conductive Film)) is formed on the front surface of the substrate 2.

The substrate 2 is, for example, a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, a semiconductor substrate, or the like, and those bonded together, but the glass substrate has excellent chemical resistance, moisture resistance, and a small linear expansion coefficient. Therefore, it is better. The reason is that the smaller the linear expansion coefficient, the less likely the pattern of the functional layer formed at high temperature to shift when cooled.

The glass used as the glass substrate is not particularly limited, and examples thereof include alkali-free glass, borosilicate glass, soda-lime glass, high-silica glass, and other oxide-based glasses containing silicon oxide as a main component. The oxide-based glass is preferably a glass having a silicon oxide content of 40 to 90% by mass based on oxide conversion.

Further, as the glass of the glass substrate, it is preferable to use a glass suitable for the type of electronic component and its manufacturing process. For example, the glass substrate for a liquid crystal panel is preferably composed of glass (alkali-free glass) that does not substantially contain an alkali metal component. As such, the glass of the glass substrate is appropriately selected according to the type of the electronic component to be applied and its manufacturing steps.

The resin of the resin substrate may be a crystalline resin or a non-crystalline resin, and is not particularly limited.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, in the case of a glass substrate, in order to reduce the weight and thickness of the electronic component, it is preferably 0.7 mm or less, more preferably 0.2 mm or less, and even more preferably 0.1 mm or less. In the case of 0.2 mm or less, it is possible to impart good flexibility to the glass substrate, and thus it is a better substrate for reducing the thickness of electronic components. When the thickness is less than 0.1 mm, the glass substrate can be wound into a roll shape. In addition, for reasons such as easy manufacture of a glass substrate and easy handling of the glass substrate, the thickness of the glass substrate is preferably 0.03 mm or more.

[Boost plate 3]

The reinforcing plate 3 has the following functions: if it is attached to the substrate 2, Front reinforcement substrate 2. After forming the functional layer, the reinforcing plate 3 is peeled from the substrate 2 by the substrate peeling device of the embodiment in the middle of the manufacturing steps of the electronic component.

In order to suppress warpage or peeling due to temperature changes, the difference between the linear expansion coefficient of the reinforcing plate 3 and the substrate 2 is preferably small. When the substrate 2 is a glass substrate, the reinforcing plate 3 preferably includes a glass plate. The glass of the glass plate is preferably the same type as the glass of the glass substrate.

The reinforcing plate 3 includes a support plate 4 as a base, and a resin layer 5 formed on a surface of the support plate 4. The substrate 2 is releasably attached to the support plate 4 via the resin layer 5 by a Van Der Waals force acting between the resin layer 5 and the substrate 2 or an adhesive force of the resin layer 5.

The reinforcing plate 3 in FIG. 1 is composed of the supporting plate 4 and the resin layer 5, but may be composed of only the supporting plate 4. In this case, the support plate 4 and the substrate 2 are detachably attached by a Van der Waals force or the like acting between the support plate 4 and the substrate 2. In this case, it is preferable that an inorganic thin film is formed on a side surface of the support plate 4 such that the support plate 4 as a glass plate and the substrate 2 as a glass substrate are not adhered at a high temperature.

Although the support plate 4 in FIG. 1 is one sheet and the resin layer 5 is one layer, the support plate 4 may be formed by a plurality of support plates 4 and the resin layer 5 may be formed by a plurality of layers.

[Support board 4]

The supporting plate 4 supports the substrate 2 through the resin layer 5, so that the substrate 2 is reinforced by the reinforcing plate 3. The support plate 4 also has a function of preventing deformation, abrasion, damage, etc. of the substrate 2 in the manufacturing steps of the electronic component.

Examples of the support plate 4 include a glass plate, a ceramic plate, a resin plate, a semiconductor plate, and a metal plate. The type of the support plate 4 is appropriately selected according to the type of the electronic component, the type of the substrate 2, and the like. If the support plate 4 and the substrate 2 are of the same type, it is preferable to reduce warpage and peeling due to temperature changes.

The difference (absolute value) between the average linear expansion coefficients of the support plate 4 and the substrate 2 is appropriately set depending on the size and shape of the substrate 2, and is preferably 35 × 10 ^-7 / ° C. or lower. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ° C (JIS R 3102: 1995).

The thickness of the support plate 4 is preferably 0.7 mm or less, for example. In order to reinforce the substrate 2, the thickness of the support plate 4 is preferably 0.4 mm or more. The thickness of the support plate 4 may be thicker than the substrate 2 or thinner than the substrate 2.

The outer dimension of the support plate 4 is preferably such that the outer dimension of the resin layer 5 is the same as or larger than the outer dimension of the resin layer 5 as shown in FIG. 1.

[Resin layer 5]

The resin layer 5 has a function of preventing the position of the substrate 2 from being shifted relative to the support plate 4 after closely contacting the substrate 2 and before performing a peeling operation. The resin layer 5 also has a function of easily peeling from the substrate 2 by a peeling operation. By easily peeling the substrate 2, it is possible to prevent the substrate 2 from being damaged during peeling. Furthermore, the resin layer 5 is formed so that the bonding force with the support plate 4 is relatively higher than the bonding force with the substrate 2.

The resin of the resin layer 5 is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polysiloxane resin, and a polyimide polysiloxane resin. In addition, a plurality of resins may be mixed and used. From the viewpoint of heat resistance and peelability, polysiloxane resins and polyimide polysiloxane resins are preferred.

The thickness of the resin layer 5 is not particularly limited, but is preferably 1 to 50 μm, and more preferably 4 to 20 μm. The reason is that by setting the thickness of the resin layer 5 to 1 μm or more, when bubbles or foreign matter are mixed between the resin layer 5 and the substrate 2, the resin layer 5 is deformed so as to absorb the thickness of the bubbles or foreign matter. . On the other hand, if the thickness of the resin layer 5 is 50 μm or less, the formation time of the resin layer 5 can be shortened, and the resin of the resin layer 5 is not used more than necessary, which is economical.

The outer dimension of the resin layer 5 is preferably such that the entirety of the substrate 2 can be closely contacted by the resin layer 5. The formula is the same as or larger than the outer dimension of the substrate 2 as shown in FIG. 1.

The resin layer 5 may include two or more layers. In this case, the "thickness of the resin layer" means the total thickness of all the resin layers. When the resin layer 5 includes two or more layers, the types of resins forming the respective layers may be different. Furthermore, the configuration of the laminated board 1 is not limited to that shown in FIG. 1. For example, instead of the resin layer 5, an inorganic layer containing at least one selected from the group consisting of metal silicide, nitride, and carbide (WSi ₂ , AlN, TiN, Si ₃ N _4, and SiC) may be used. . In addition, instead of using the resin layer 5, the surface of each of the substrate 2 and the reinforcing plate 3 can be mirror-polished to reduce the surface roughness of the joint surfaces and the substrate 2 and the reinforcing plate 3 can be joined together. .

FIG. 2 is an enlarged side view of a main part of the multilayer body 6 produced in the middle of the manufacturing steps of the electronic component.

[Laminated body 6]

The laminated body 6 is constituted by combining two laminated plates 1 and 1 having functional layers formed on the front surface of the substrate 2 of the laminated plate 1 of FIG. 1 so that their respective functional layers face each other. The type of the functional layer is selected according to the type of the electronic component. A plurality of functional layers can also be sequentially laminated on the front surface of the substrate 2. As a method for forming the functional layer, a general method can be used. For example, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, or a sputtering method can be used. . The functional layer is formed into a specific pattern by a photolithography method and an etching method.

The laminated body 6 in FIG. 2 includes a reinforcing plate 3A, a substrate 2A, a liquid crystal layer (functional layer) 7, a substrate 2B, and a reinforcing plate 3B from the upper layer to the lower layer. That is, a laminated board 1A including a substrate 2A and a reinforcing plate 3A is provided on the upper side via a liquid crystal layer 7 in the center, and a laminated board 1B including the substrate 2B and a reinforcing plate 3B is provided on the lower side.

The laminated body 6 in FIG. 2 is produced in the middle of the manufacturing steps of the LCD. A thin film transistor (TFT) is formed on the surface of the liquid crystal layer 7 side of the substrate 2A, that is, the front surface of the substrate 2A, and a color filter is formed on the surface of the liquid crystal layer 7 side of the substrate 2B, that is, the front surface of the substrate 2B. (CF) A liquid crystal layer 7 as a functional layer is formed of a thin film transistor and a color filter.

In addition, the laminated body 6 in FIG. 2 has a structure in which the reinforcing plates 3A and 3B are arranged on both sides, but as a laminated body, a structure in which the reinforcing plate is arranged only on one side may be used.

The laminated body 6 is peeled from the reinforcing plates 3A and 3B in the peeling step. Electronic components such as a backlight are mounted on the back surfaces of the substrates 2A and 2B of the stripped reinforcing plates 3A and 3B, thereby manufacturing an LCD as a product. The peeling of the reinforcing plates 3A and 3B was performed using the following peeling device.

[Peeling method of substrate of the present invention]

First, before describing the substrate peeling device of the embodiment, the differences between the previous method for peeling a substrate and the method for peeling a substrate according to the present invention will be described.

FIG. 3 (a) is a schematic diagram showing a previous method for peeling a substrate, and FIG. 3 (b) is a schematic diagram showing a method for peeling a substrate according to the present invention. In addition, in FIGS. 3 (a) and 3 (b), description is made using the symbols attached to FIGS. 18 (a) and 18 (b).

As shown in FIG. 3 (a), the previous method for peeling the substrate is the method of adding the load component P1 in the direction of the arrow C orthogonal to the interface 124 to the interface 124 of the substrate 102 and the reinforcing plate 104 of the laminate 100 and peeling it off. Interface 124.

In contrast, the method of peeling the substrate of the present invention shown in FIG. 3 (b) is a method in which the reinforcing plate 104 is reinforced by applying a force P2 to the flexible plate 118 in the direction of the arrow D parallel to the interface 124. (Or the substrate 102) is bent and deformed together with the flexible plate 118, so that the interface 124 is peeled off. Specifically, a force P2 is applied to a position 118C of the flexible plate 118 on the side opposite to the suction surface 118A side and separated from the suction surface 118B of the flexible plate 118 in the direction of the interface 124, and the interface 124 is peeled off. That is, the position 118C refers to a position where the laminated board 100 does not exist directly below it.

As shown in FIG. 3 (b), if a force P2 is applied to the flexible plate 118 in the direction of the arrow D that is parallel to the surface 118A opposite to the adsorption surface, the flexible plate 118D near the front line A is mainly peeled by The load component in the parallel direction of the interface 124 generates a bending moment. The method for peeling the substrate of the present invention causes the flexible plate 118D near the peeling line A to generate the above-mentioned bending moment. And peeling interface 124. The tensile load component (approximately orthogonal to the interface 124 and the load component in the direction of peeling the interface 124) generated by the bending of the flexible plate 118 is reduced, or the compressive load component (approximately orthogonal to the interface 124) is reduced. (The load component in the direction opposite to the direction of the peeling interface 124) becomes larger, whereby the vacuum adsorption of the reinforcing plate 104 (or the substrate 102) by the flexible plate 118D near the peeling line A is not released, and the It is possible to prevent the reinforcing plate 104 (or the substrate 102) from being greatly bent and deformed when the interface 124 is peeled off. Therefore, it is possible to suppress the damage of the reinforcing plate 104 (or the substrate 102) and to prevent the substrates 102 and 102 from peeling from each other (see FIG. 19).

Next, the substrate peeling device of the present invention will be described.

[Configuration of the substrate peeling device 10 of the first form]

FIG. 4 is a plan view of the peeling device 10 in the first form, and FIG. 5 is a side view of the peeling device 10 shown in FIG. 4. The peeling object described in FIGS. 4 and 5 is the laminated board 1 shown in FIG. 1, but it may also be the laminated body 6 shown in FIG. 2 (the same thing as the laminated board 122 shown in FIG. 19).

The peeling device 10 is a device that holds the interface 8 of the multilayer board 1 in a horizontal direction, and positions the interface 8 from the corner (one end) 1C of the laminate 1 toward the corner (the other end) 1D. Order stripping. When the interface 8 is peeled, the boundary line between the peeled area and the non-peeled area of the peeled interface 8, that is, the front line A (see FIG. 4), advances in the direction of the arrow E. In addition, the peeling device 10 supports the substrate 2 so that it cannot be deformed and bends and deforms the reinforcing plate 3 to peel the interface 8. However, it can also support the reinforcing plate 3 so that it cannot deform and bends and deforms the substrate 2 to peel the interface 8.

The peeling device 10 includes: a platform 14 (supporting device) that vacuum-holds the front surface (the first main surface) of the substrate 2 that is rectangular in plan view through a rubber-made elastic sheet 12 so that it cannot be deformed; and flexibility The plate 18 has a back surface (a second main surface) of the reinforcing plate 3 having a rectangular shape in a plan view by vacuum suction through an elastic sheet 16 made of rubber. The platform 14 is fixed on the upper surface of the base 20.

The flexible plate 18 includes a rectangular-shaped main body portion 18A that vacuum-retains and holds the reinforcing plate 3. The main body portion 18A has a shape that is sufficiently larger in area than the reinforcing plate 3 and follows the outer shape of the reinforcing plate 3. to One end of the main body portion 18A is provided with a rectangular-shaped protruding portion 18B protruding from the corner portion 1C of the laminated board 1 toward the outside in the horizontal direction. Further, at the other end of the main body portion 18A, a rectangular-shaped protruding portion 18C protruding from the corner portion 1D of the laminate 1 in a horizontal direction to the outside is provided. The protruding portions 18B and 18C are provided along the traveling direction (direction of the arrow E) of the front line A for peeling.

The bending rigidity per unit width (1 mm) of the flexible plate 18 is preferably 1,000 to 40,000 N · mm ² / mm. For example, in a portion where the width of the flexible plate 18 is 100 mm, the bending rigidity is 100,000 to 4000000 N · mm ² . By setting the bending rigidity per unit width (1mm) of the flexible plate 18 to 1000 N‧ mm ² / mm or more, the bending of the plate (the reinforcing plate 3 in the embodiment) which is held by the flexible plate 18 can be prevented. fold. In addition, by setting the bending rigidity per unit width (1 mm) of the flexible plate 18 to be 40,000 N · mm ² / mm or less, the plate held and held by the flexible plate 18 can be appropriately bent and deformed. As the flexible plate 18, a metal plate can be used in addition to resin plates such as polyvinyl chloride (PVC) resin, polycarbonate resin, acrylic resin, and polyacetal (POM) resin.

A shaft 22 is provided at an end of the protruding portion 18C of the flexible plate 18 in a horizontal direction, and the shaft 22 is rotatably supported by bearings 24 and 24 fixed on the upper surface of the base 20. Therefore, the flexible plate 18 is tiltably provided with respect to the base 20 around the shaft 22.

A servo cylinder 26 as a driving device is mounted on the flexible plate 18. Furthermore, in the embodiment, the servo cylinder 26 is exemplified as a driving device, but the driving device may be a direct driving device including a rotary servo motor, a ball screw mechanism, or the like, or a hydraulic cylinder (for example, a pneumatic cylinder). The driving device and the flexible plate 18 constitute a peeling device of the present invention.

The servo cylinder 26 includes a cylinder body 26A and a piston 26B. In the plan view of FIG. 4, the servo cylinder 26 is arranged such that the axis of the piston 26B and the straight line between the connecting corner portion 1C and the corner portion 1D coincide. That is, the piston 26B expands and contracts in the traveling direction (arrow E direction) of the front line A of peeling.

A shaft 28 is provided at the base end portion of the cylinder body 26A in the horizontal direction, and the shaft 28 is rotatably supported by a bearing 30 fixed on the upper surface of the protruding portion 18C of the flexible plate 18, 30. A shaft 32 is provided in the horizontal direction at the front end of the piston 26B. The shaft 32 is rotatably supported by bearings 34 and 34 fixed to the upper surface of the protruding portion 18B of the flexible plate 18.

[Function of Peeling Device 10]

When the piston 26B of the servo cylinder 26 is retracted from the extended state in FIG. 5 by a control unit (not shown), a force in a direction parallel to the interface 8 is applied to the protruding portion 18B of the flexible plate 18. That is, the servo cylinder 26 is given a force to the protruding portion 18B of the flexible plate 18 at a position opposite to the suction surface and at a position separated from the suction surface of the flexible plate 18 in the direction of the interface 8. By the force of the servo cylinder 26, the peeling front A of FIG. 4 moves in the direction of the arrow E, and the interface 8 peels in sequence from the corner 1C toward the corner 1D.

FIG. 6 (a) is an operation explanatory diagram of the peeling device 10 shown in FIG. 4 and is a side view of the peeling device 10 after a specific time has elapsed since the peeling started. FIG. 6 (b) is an operation explanatory diagram of the peeling device 10 shown in FIG. 4 and is a side view of the peeling device 10 immediately after the interface 8 is peeled.

As shown in FIG. 6 (a), when the piston 26B performs a contraction operation in the direction of the arrow F, a force in a direction parallel to the interface 8 is applied to the protruding portion 18B via the shaft 32 and the bearings 34 and 34. With this force, the flexible plate 18 starts to bend and deform. Then, the servo cylinder 26 follows the bending deformation of the flexible plate 18, and is tilted around the shaft 28 by the rotation of the shaft 28 and the shaft 32. In addition, due to the bending deformation of the flexible plate 18, the flexible plate 18D near the peeling front line A mainly generates a bending moment by a load component in a direction parallel to the interface 8. By this bending moment, the interface 8 is peeled off in sequence following the telescopic movement of the piston 26B, as shown in FIG. 6 (b).

The peeling device 10 of the first form peels the interface 8 by causing the flexible plate 18D near the peeling line A to generate the bending moment described above. Therefore, when the interface 8 is peeled, the tensile force generated by the bending of the flexible plate 18 is used. The tensile load component (a load component in a direction substantially orthogonal to the interface 8) becomes smaller or becomes a compressive load component (a compressive load component in FIG. 6), and the flexible plate 18D near the front line A is used to strengthen the reinforcing plate. The vacuum adsorption of 3 (or substrate 2) remains unaffected When it is released, the reinforcing plate 3 (or the substrate 2) near the peeling front line A can be prevented from being greatly deformed. Thereby, breakage of the reinforcing plate 3 (or the substrate 2) can be suppressed. Moreover, when the object to be peeled is the laminated body 6 of FIG. 2, peeling of the substrates 2A and 2B from each other can be suppressed.

FIG. 7 (a) is an explanatory view of the operation of the peeling device 10 shown in FIG. 4 and is a side view of the peeling device 10 in which the peeled reinforcing plate 3 is retracted in the vertical direction. FIG. 7 (b) is an operation explanatory diagram of the peeling device 10 shown in FIG. 4 and is a side view of the peeling device 10 immediately after the peeled reinforcing plate 3 is held by the carrying-out device 36.

As shown in FIG. 6 (b), if the interface 8 is completely peeled off, the flexible plate 18 is tilted to the retreat position of FIG. 7 (a) by the tilting device (not shown) with the shaft 22 as the center. Thereafter, the flexible plate 18 is released from the bending deformation by the extension recovery operation indicated by the arrow G of the piston 26B, and is restored to the original shape shown in FIG. 7 (b). Thereby, the posture of the reinforcing plate 3 is changed in the vertical direction. Thereafter, the carrying-out device 36 moves in and out of the reinforcing plate 3, and the suction pads 38, 38,... Of the carrying-out device 36 are adsorbed on the surface of the reinforcing plate 3. Thereafter, the vacuum suction holding of the reinforcing plate 3 by the flexible plate 18 is released, and the reinforcing plate 3 is carried out from the peeling device 10 by the carrying-out device 36.

Similarly, an unillustrated unloading device moves in and out of the substrate 2, and the suction pad of the unloading device is adsorbed on the back surface of the substrate 2. Thereafter, the vacuum suction holding of the substrate 2 by the platform 14 is released, and the substrate 2 is carried out from the peeling device 10 by a carrying-out device. With the above operation, the peeling operation of the laminated board 1 by the peeling device 10 is completed.

Furthermore, in the peeling device 10, it is preferable that the length of the substrate 2 (reinforcing plate 3) and the length of the flexible plate 18 in a direction orthogonal to the traveling direction (arrow E in FIG. 4) of the front line A for peeling. The size of the body portion 18A of the flexible plate 18 is set so that the ratios are equal. Thereby, the amount of bending deformation (curvature radius) of the main body portion 18A when the front line A passes through is peeled, and the peeling operation is stable.

Moreover, it is preferable that the traveling speed of the peeling front line A when the peeling front line A becomes short is lower than the traveling speed of the peeling front line A when the peeling front line A becomes long. Thereby, the flexible plate 18 which is generated immediately after the peeling due to the spring back action of the flexible plate 18 can be suppressed. Vibration (bound).

[Configuration of Substrate Peeling Device 40 of the Second Form]

FIG. 8 is a plan view of the peeling device 40 in the second form, and FIG. 9 is a side view of the peeling device 40 shown in FIG. 8. In describing the structure of the peeling device 40, the same or similar components as those of the peeling device 10 shown in Figs.

The difference between the structure of the peeling device 40 and the peeling device 10 is that the bearings 30 and 30 supporting the shaft 28 of the servo cylinder 26 are fixed to the upper surface of the base 20, and the other structures are the same.

[Function of Peeling Device 40]

Similarly to the peeling device 10, when the piston 26B performs a shrinking operation in the direction of the arrow F, a force in a direction parallel to the interface 8 is applied to the protruding portion 18B via the shaft 32 and the bearings 34 and 34. The flexible plate 18 starts to bend and deform by this force, and the servo cylinder 26 follows the bending deformation of the flexible plate 18, and tilts around the shaft 28 by the rotation of the shaft 28 and the shaft 32. Further, due to the bending deformation of the flexible plate 18, the flexible plate 18D (see FIG. 6 (a)) near the peeling line A mainly generates a bending moment by a load component in a direction parallel to the interface 8. By this bending moment, the interface 8 is sequentially peeled following the telescopic movement of the piston 26B.

When the interface 8 is completely peeled off, the flexible plate 18 is tilted to the retracted position around the shaft 22 by a tilting device (not shown) (see FIG. 7 (a)). At this time, the servo cylinder 26 also follows and rotates around the shaft 28.

[Configuration of the substrate peeling device 50 of the third form]

FIG. 10 is a side view of the peeling device 50 according to the third embodiment. In describing the structure of the peeling device 50, the same reference numerals are given to members that are the same as or similar to those of the peeling device 10 shown in FIGS. 4 to 7, and descriptions thereof are omitted.

The difference between the structure of the peeling device 50 and the peeling device 10 is that the flexible plate 18 on the upper side is freely arranged in an L-shape in side view through the bearing 24 and the shaft 22 On the upper surface of the base 52, the lower flexible plate 54 and the flexible plate 18 are arranged in parallel on the upper surface of the base 52, and the substrate 2 is vacuum-held and held to the flexibility via the elastic sheet 12. The plate 54 and the servo cylinder 56 having the same configuration as the servo cylinder 26 are disposed on the flexible plate 54. The servo cylinder 56 is similar to the servo cylinder 26 in that the cylinder body 56A is supported by the flexible plate 54 via the shaft 28 and the bearing 30, and the piston 56B is supported by the protruding portion 54B of the flexible plate 54 via the shaft 32 and the bearing 34.

[Function of Peeling Device 50]

The piston 26B of the servo cylinder 26 is contracted to deform the flexible plate 18, and the piston 56B of the servo cylinder 56 is contracted to deform the flexible plate 54. Thereby, a bending moment is applied to the substrate 2 and the reinforcing plate 3 near the front line of peeling, and the interface 8 is peeled.

[Configuration of Substrate Peeling Device 60 in the Fourth Form]

FIG. 11 is a plan view of a peeling device 60 in a fourth embodiment. In describing the configuration of the peeling device 60, the same or similar components as those of the peeling device 10 shown in Figs. 4 to 7 are denoted by the same reference numerals and description thereof will be omitted.

The difference between the structure of the peeling device 60 and the peeling device 10 is that in addition to the servo cylinder 26, two servo cylinders 62 and 62 are also arranged on the flexible plate 18, and the other structures are the same.

On the entire length of the peeling line passing from the corner 1C to the corner 1D, the servo cylinder 26 is responsible for performing the peeling of the first half, and the servo cylinders 62, 62 are responsible for performing the peeling of the second half. Therefore, the cylinder body 26A of the servo cylinder 26 is supported at the substantially central portion of the body portion 18A of the flexible plate 18 via the shaft 28 and the bearing 30. The pistons 62B and 62B of each of the servo cylinders 62 and 62 are arranged parallel to the piston 26B of the servo cylinder 26 and are arranged on both sides of the cylinder body 26A of the servo cylinder 26.

In addition, the pistons 62B and 62B are supported by the central portion of the main body portion 18A via the shaft 64 and the bearing 65, and the cylinders 62A and 62A are supported by the protruding portion via the shaft 66 and the bearing 68, respectively. 18C.

[Function of Peeling Device 60]

When the piston 26B of the servo cylinder 26 is retracted, the flexible plate 18 is bent and deformed, and a bending moment is applied to the reinforcing plate 3 near the peeling line to peel the interface. Then, the contraction operation of the piston 26B is ended, and the contraction operations of the pistons 62B, 62B of the servo cylinders 62, 62 are started, and the flexible plate 18 is continuously deformed by bending. Thereby, the bending moment is continued to be given to the reinforcing plate 3 near the peeling front line. Then, the interface is completely peeled off immediately before the contraction of the pistons 62B, 62B.

The peeling device 60 provided with three servo cylinders 26, 62, 62 is advantageous when peeling the interface of the large-scale laminated board 1.

[Configuration of the substrate peeling device 70 of the fifth form]

FIG. 12 is a plan view of a peeling device 70 in a fifth embodiment. When describing the structure of the peeling device 70, the same or similar components as those of the peeling device 10 shown in Figs. 4 to 7 are assigned the same reference numerals and descriptions thereof are omitted.

The difference between the structure of the peeling device 70 and the peeling device 10 is that the two damper cylinders 72 and 72 are arranged on the flexible plate 18, and the other structures are the same.

The pistons 72B and 72B of each of the damper cylinders 72 and 72 are arranged parallel to the piston 26B of the servo cylinder 26 and are arranged on both sides of the cylinder body 26A of the servo cylinder 26.

The pistons 72B and 72B are supported by the main body portion 18A via the shaft 74 and the bearing 75, respectively, and the cylinders 72A and 72A are supported by the protruding portion 18C via the shaft 76 and the bearing 78, respectively.

[Function of the peeling device 70]

The damper cylinders 72 and 72 can absorb the vibration (joint) of the flexible plate 18 generated immediately after the peeling due to the rebound effect of the flexible plate 18.

[Configuration of the substrate peeling device 80 of the sixth form]

FIG. 13 is a plan view of the peeling device 80 in the sixth form, and FIG. 14 is a side view of the peeling device 80 view. In describing the structure of the peeling device 80, the same or similar components as those of the peeling device 10 shown in Figs. 4 to 7 are assigned the same reference numerals and descriptions thereof are omitted.

When the flexible plate 18 is bent and deformed from the corner portion 1C toward the corner portion 1D, the bending moment generated at the flexible plate 18 increases toward the maximum value. Thereby, in the vicinity of the corner portion 1C including the corner portion 1C of the flexible plate 18, the radius of curvature becomes smaller than that of other portions. If the curvature radius becomes too small, a problem arises that the reinforcing plate 3 (substrate 2) that is adsorbed on the adsorption surface of the flexible plate 18 is peeled from the flexible plate 18.

In order to eliminate the above-mentioned problems, in the peeling device 80, a restricting member 82 that restricts the amount of bending deformation of the flexible plate 18 is fixed to the surface of the flexible plate 18 opposite to the suction surface. The restricting member 82 is provided from a protruding portion (one end portion) 18B that is bent and deformed from the flexible plate 18 toward the protruding portion (the other end portion) 18C.

Specifically, the restricting member 82 is disposed in a symmetrical position in pairs with respect to the line segment connecting the corner portion 1C and the corner portion 1D, and is disposed in parallel along the line segment. The restricting member 82 is arranged from the protruding portion 18B to the center position of the main body portion 18A. The central position of the main body portion 18A is the position where the front line A is the longest and is at the position where the bending moment generated by the flexible plate 18 is the maximum.

FIG. 15 is an enlarged side view showing a main part of the configuration of the restricting member 82 in a state where the flexible plate 18 is not bent.

The restricting member 82 is configured by arranging a plurality of blocks 84 made of, for example, an aluminum alloy having a higher rigidity than a flexible plate, from the protruding portion 18B toward the central position of the main body portion 18A with a specific gap (J). In addition, the specific gap (J) is set to a gap corresponding to a restriction amount that restricts the amount of bending deformation of the flexible plate 18.

Specifically, the height (H) of the block 84 is 4 mm, and the length (L) is 10 mm. In addition, the limit value of the bending deformation amount of the flexible plate 18 is defined as the minimum radius of curvature (R) of the flexible plate 18, and when the minimum radius of curvature (R) is set to 1000 mm, a specific gap ( J) is 0.04 mm.

FIG. 16 is a side view of the peeling device 80 of the flexible plate 18 undergoing bending deformation, and FIG. 17 is a diagram showing the gap between the block 84 and the block 84 when the flexible plate 18 is bent to the minimum radius of curvature (R = 1000 mm) (J ) Is an explanatory view of a state where the blocks 84 are brought into contact with each other by disappearing.

As shown in FIG. 16, as the flexible plate 18 bends and deforms from the protruding portion 18B toward the central portion of the main body portion 18A, that is, as the radius of curvature of the flexible plate 18 becomes smaller, the distance between the block 84 and the block 84 becomes smaller. The gap (J) becomes smaller. When the flexible plate 18 is bent to the minimum radius of curvature (R = 1000 mm), as shown in FIG. 17, the gap (J) between the block 84 and the block 84 disappears, the blocks 84 abut against each other, and the restricting member 82 becomes The rigid body can limit the amount of bending deformation of the flexible plate 18.

Thereby, the problem that the reinforcing plate 3 (substrate 2) which is adsorbed on the adsorption surface of the flexible plate 18 is peeled from the flexible plate 18 can be eliminated.

As mentioned above, although the preferable aspect of this invention was described, this invention is not limited to the said aspect. Various modifications and substitutions can be added to the above-mentioned forms without departing from the scope of the present invention.

This application is based on Japanese Patent Application 2013-012415 filed on January 25, 2013, and Japanese Patent Application 2013-232957 filed on November 11, 2013, and the contents thereof are incorporated by reference. Introduced in this article.

Claims (10)

A peeling device for a substrate is a device for sequentially peeling an interface between a substrate and a reinforcing plate for reinforcing the substrate by bending and deforming at least one of the substrate and the reinforcing plate in a peeling direction from one end side to the other end side. And includes a peeling device including: a flexible plate that adsorbs and holds the substrate or the reinforcing plate; and a driving device that applies a force in a direction parallel to the interface to the flexible plate to make the above One is bent and deformed together with the flexible plate, and a restricting member for restricting the amount of bending deformation of the flexible plate is provided on the surface of the flexible plate opposite to the adsorption surface, and the restricting member is from the flexible plate. One end portion of the flexible plate that starts to bend and deform is provided toward the other end portion. For example, the peeling device of the substrate of claim 1, wherein the peeling device includes: a supporting device that supports the first main surface of the laminated body including the substrate and the reinforcing plate; and the flexible plate that adsorbs and holds the laminated body. A second main surface; and the driving device, which is provided to the above-mentioned flexible plate by a position on the side opposite to the adsorption surface of the flexible plate and a position separated from the adsorption surface of the flexible plate in the direction of the interface. The force in the direction parallel to the interface causes the aforementioned one to deform together with the flexible plate. For example, the substrate peeling device of claim 1 or 2, wherein the substrate is a glass substrate having a thickness of 0.2 mm or less. For example, the peeling device of the substrate of claim 1 or 2, wherein the restricting member is formed by moving a plurality of blocks having higher rigidity than the flexible board from the one end toward the other end through a specific gap. It is configured by arranging directions, and the specific gap is set to a gap corresponding to a restriction amount that restricts the bending deformation amount. A method for peeling a substrate, in which the interface between the substrate and a reinforcing plate that reinforces the substrate is sequentially deformed by bending and deforming at least one of the substrate and the reinforcing plate in a peeling direction from one end side to the other end side. It includes a peeling step. The peeling step is to hold and hold the substrate or the reinforcing plate by a flexible plate, and apply a force in a direction parallel to the interface to the flexible plate to make the one and the flexible plate. The flexible plate is bent and deformed together to peel off the interface, and the flexible plate is bent and deformed by a restricting member provided on a surface of the flexible plate opposite to the adsorption surface to restrict the amount of bending deformation, wherein the restricting member One end portion of the flexible plate that is bent and deformed from the flexible plate is provided toward the other end portion. For example, the method for stripping a substrate according to claim 5, wherein the stripping step includes the following steps: supporting the first main surface of the laminated body including the substrate and the reinforcing plate by a supporting device, and holding the above by the flexible plate adsorption. The second main surface of the laminated body; and a position of the flexible plate opposite to the adsorption surface and a position separated from the adsorption surface of the flexible plate along the interface by using a driving device. The force in the direction parallel to the interface causes the one of the interface and the flexible plate to bend and deform together, thereby peeling the interface. The method for peeling a substrate according to claim 5 or 6, wherein the substrate is a glass substrate having a thickness of 0.2 mm or less. An electronic component manufacturing method includes: a functional layer forming step of forming a functional layer on a front surface of a substrate reinforced by a reinforcing plate; and a peeling step by using the substrate and the reinforcing plate on which the functional layer is formed. At least one of them is bent and deformed, and the interface between the substrate and the reinforcing plate is sequentially peeled along a peeling direction from one end side to the other end side; the peeling step is as follows: the substrate or the substrate is held by a flexible plate adsorption The reinforcing plate is configured to bend and deform together with the flexible plate by applying a force in a direction parallel to the interface to the flexible plate, thereby peeling off the interface, and the flexible plate is provided by The restricting member on the surface of the flexible plate opposite to the suction surface restricts the amount of bending deformation to perform the bending deformation, wherein the restricting member is one end of the flexible plate that is bent and deformed from the flexible plate toward the other. It is provided at one end. For example, the method for manufacturing an electronic component according to claim 8, wherein the stripping step includes the following steps: supporting the first main surface of the laminated body including the substrate and the reinforcing plate by a supporting device, and holding and holding the flexible plate by adsorption; A second main surface of the laminated body; and a position at a side of the flexible plate opposite to the suction surface and separated from the suction surface of the flexible plate in a direction of the interface by using a driving device A force in a direction parallel to the interface causes the aforementioned one to bend and deform together with the flexible plate, thereby peeling the interface. The method for manufacturing an electronic component according to claim 8 or 9, wherein the substrate is a glass substrate having a thickness of 0.2 mm or less.