TWI618672B - 硒化氫混合氣體的供給方法及供給裝置 - Google Patents

硒化氫混合氣體的供給方法及供給裝置 Download PDF

Info

Publication number
TWI618672B
TWI618672B TW102138027A TW102138027A TWI618672B TW I618672 B TWI618672 B TW I618672B TW 102138027 A TW102138027 A TW 102138027A TW 102138027 A TW102138027 A TW 102138027A TW I618672 B TWI618672 B TW I618672B
Authority
TW
Taiwan
Prior art keywords
gas
flow rate
hydrogen
flow path
selenide
Prior art date
Application number
TW102138027A
Other languages
English (en)
Chinese (zh)
Other versions
TW201427896A (zh
Inventor
山脇正也
Original Assignee
大陽日酸股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陽日酸股份有限公司 filed Critical 大陽日酸股份有限公司
Publication of TW201427896A publication Critical patent/TW201427896A/zh
Application granted granted Critical
Publication of TWI618672B publication Critical patent/TWI618672B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B19/00Selenium; Tellurium; Compounds thereof
    • C01B19/04Binary compounds including binary selenium-tellurium compounds
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • C23C14/5846Reactive treatment
    • C23C14/5866Treatment with sulfur, selenium or tellurium
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • G01F25/15Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters specially adapted for gas meters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/032Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
    • H01L31/0322Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/541CuInSe2 material PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Photovoltaic Devices (AREA)
  • Flow Control (AREA)
  • Fuel Cell (AREA)
TW102138027A 2012-10-22 2013-10-22 硒化氫混合氣體的供給方法及供給裝置 TWI618672B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-232832 2012-10-22
JP2012232832 2012-10-22

Publications (2)

Publication Number Publication Date
TW201427896A TW201427896A (zh) 2014-07-16
TWI618672B true TWI618672B (zh) 2018-03-21

Family

ID=50544613

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102138027A TWI618672B (zh) 2012-10-22 2013-10-22 硒化氫混合氣體的供給方法及供給裝置

Country Status (5)

Country Link
JP (1) JP6065329B2 (ko)
KR (1) KR101661483B1 (ko)
CN (1) CN104769727B (ko)
TW (1) TWI618672B (ko)
WO (1) WO2014065233A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016003875A1 (de) * 2016-03-31 2017-10-05 Linde Aktiengesellschaft Volumetrischer und gravimetrischer Füllstand zur Herstellung von Gasgemischen
JP6904231B2 (ja) * 2017-12-13 2021-07-14 東京エレクトロン株式会社 基板処理方法、記憶媒体及び原料ガス供給装置
KR20200050607A (ko) 2018-11-02 2020-05-12 알엠아이텍(주) 징크 셀레나이드 기반의 셀렌화수소 제조방법
JP2020105577A (ja) * 2018-12-27 2020-07-09 株式会社フジキン 流体供給装置
CN109865440B (zh) * 2019-03-29 2021-08-31 国网山东省电力公司电力科学研究院 一种标准气体配制装置
EP4060076A4 (en) * 2019-11-12 2023-01-25 Showa Denko K.K. METHODS FOR REMOVAL OF ADHESIVE SUBSTANCES AND FILM FORMING METHODS
CN112097114A (zh) * 2020-08-07 2020-12-18 安徽亚格盛电子新材料有限公司 一种精确制备液态mo源和氢气混合气的装置
KR102431346B1 (ko) * 2022-02-11 2022-08-09 박재기 공정 중단 없이 질량유량제어기의 교체가 가능한 가스 공급 시스템
JP2024027372A (ja) * 2022-08-17 2024-03-01 大陽日酸株式会社 混合ガス供給装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265218A (ja) * 1998-03-18 1999-09-28 Kokusai Electric Co Ltd 自動流量/流量比変換データ校正装置及びガス供給装置
TW201136657A (en) * 2009-09-04 2011-11-01 Taiyo Nippon Sanso Corp Supplying method and supplier of hydrogen selenide-mixed gas

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5518404B2 (ja) * 2009-09-04 2014-06-11 大陽日酸株式会社 太陽電池用セレン化水素混合ガスの供給方法及び供給装置
JP5663488B2 (ja) 2009-10-14 2015-02-04 大陽日酸株式会社 太陽電池用セレン化水素混合ガスの供給方法及び供給装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265218A (ja) * 1998-03-18 1999-09-28 Kokusai Electric Co Ltd 自動流量/流量比変換データ校正装置及びガス供給装置
TW201136657A (en) * 2009-09-04 2011-11-01 Taiyo Nippon Sanso Corp Supplying method and supplier of hydrogen selenide-mixed gas

Also Published As

Publication number Publication date
CN104769727B (zh) 2016-12-07
CN104769727A (zh) 2015-07-08
KR20150044437A (ko) 2015-04-24
WO2014065233A1 (ja) 2014-05-01
KR101661483B1 (ko) 2016-09-30
JPWO2014065233A1 (ja) 2016-09-08
TW201427896A (zh) 2014-07-16
JP6065329B2 (ja) 2017-01-25

Similar Documents

Publication Publication Date Title
TWI618672B (zh) 硒化氫混合氣體的供給方法及供給裝置
JP5518404B2 (ja) 太陽電池用セレン化水素混合ガスの供給方法及び供給装置
EP2466412B1 (en) Gas concentration controller system
US8074677B2 (en) Method and apparatus for controlling gas flow to a processing chamber
TWI498152B (zh) 硒化氫混合氣體之供應方法及供應裝置
JP5663488B2 (ja) 太陽電池用セレン化水素混合ガスの供給方法及び供給装置
KR20140013024A (ko) 동적 가스 블렌딩
CN111408289A (zh) 一种工业化连续高精度混合气体的方法及系统
CN103309369B (zh) 光学系统内部腔室精密气体控制方法及其装置
JP5873231B2 (ja) 太陽電池用セレン化水素混合ガスの供給装置及び供給方法
JP5378122B2 (ja) 太陽電池用セレン化水素混合ガスの供給方法及び供給装置
JP6008688B2 (ja) 太陽電池用セレン化水素混合ガスの供給方法
KR20080082818A (ko) Mfc를 이용한 가스 희석 장치
JP2013105299A (ja) 混合ガス流量制御装置および排ガス浄化触媒評価装置
JP4155654B2 (ja) ガス混合供給方法およびその装置
US20110052794A1 (en) Vapor-phase growth apparatus and thin-film vapor-phase growth method
JP4089816B2 (ja) 半導体エピタキシャルウェーハの製造装置およびドーパントガスの希釈装置
US20220395792A1 (en) Liquid supply system and liquid supply method
US20230285911A1 (en) Facility and method for distributing a gas mixture for doping silicon wafers
JP2021159900A (ja) 混合ガス供給装置及び方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees