TWI610760B - 多層化學機械硏磨墊 - Google Patents
多層化學機械硏磨墊 Download PDFInfo
- Publication number
- TWI610760B TWI610760B TW103106005A TW103106005A TWI610760B TW I610760 B TWI610760 B TW I610760B TW 103106005 A TW103106005 A TW 103106005A TW 103106005 A TW103106005 A TW 103106005A TW I610760 B TWI610760 B TW I610760B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- polishing
- pad
- avg
- porous
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 223
- 239000000126 substance Substances 0.000 title claims abstract description 72
- 238000000227 grinding Methods 0.000 claims abstract description 71
- 238000001514 detection method Methods 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims description 262
- 239000000758 substrate Substances 0.000 claims description 65
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 22
- 230000002427 irreversible effect Effects 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 239000012939 laminating adhesive Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000006261 foam material Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 31
- 239000002243 precursor Substances 0.000 description 12
- 239000011148 porous material Substances 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- -1 poly (amine ester Chemical class 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000004831 Hot glue Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004821 Contact adhesive Substances 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000012812 sealant material Substances 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/788,594 US9108290B2 (en) | 2013-03-07 | 2013-03-07 | Multilayer chemical mechanical polishing pad |
| US13/788,594 | 2013-03-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201505771A TW201505771A (zh) | 2015-02-16 |
| TWI610760B true TWI610760B (zh) | 2018-01-11 |
Family
ID=51385643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103106005A TWI610760B (zh) | 2013-03-07 | 2014-02-24 | 多層化學機械硏磨墊 |
Country Status (7)
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160354896A1 (en) * | 2014-02-10 | 2016-12-08 | President And Fellows Of Harvard College | 3d-printed polishing pad for chemical-mechanical planarization (cmp) |
| US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| TW201627658A (zh) * | 2015-01-30 | 2016-08-01 | 陶氏全球科技責任有限公司 | 拋光層分析器及方法 |
| US9446498B1 (en) * | 2015-03-13 | 2016-09-20 | rohm and Hass Electronic Materials CMP Holdings, Inc. | Chemical mechanical polishing pad with window |
| EP3272457B1 (en) * | 2016-07-21 | 2019-03-27 | Delamare Sovra | A method for manufacturing in series optical grade polishing tools |
| EP3272456B1 (en) * | 2016-07-21 | 2019-03-13 | Delamare Sovra | A method for manufacturing in series optical grade polishing tools |
| EP3272458B1 (en) * | 2016-07-21 | 2019-03-27 | Delamare Sovra | A method for manufacturing in series optical grade polishing tools |
| KR101904322B1 (ko) * | 2017-01-23 | 2018-10-04 | 에스케이씨 주식회사 | 연마패드 및 이의 제조방법 |
| US10569383B2 (en) * | 2017-09-15 | 2020-02-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Flanged optical endpoint detection windows and CMP polishing pads containing them |
| CN108818300A (zh) * | 2018-08-03 | 2018-11-16 | 成都时代立夫科技有限公司 | 一种分体式窗口cmp抛光垫的制备方法及cmp抛光垫 |
| KR102777772B1 (ko) * | 2018-11-27 | 2025-03-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 |
| US11633830B2 (en) * | 2020-06-24 | 2023-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP polishing pad with uniform window |
| CN112757153B (zh) * | 2021-03-09 | 2022-07-12 | 万华化学集团电子材料有限公司 | 一种多结构体化学机械抛光垫、制造方法及其应用 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1322374A (zh) * | 1999-03-31 | 2001-11-14 | 株式会社尼康 | 抛光体、抛光设备、抛光设备调节方法、抛光膜厚度或抛光终点测量方法及半导体器件的制造方法 |
| US20040248501A1 (en) * | 2003-06-05 | 2004-12-09 | Jin-Kook Kim | Polishing pad for chemical mechanical polishing apparatus |
| TW201020068A (en) * | 2008-10-17 | 2010-06-01 | Rohm & Haas Elect Mat | Chemical mechanical polishing pad having sealed window |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US6524164B1 (en) | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
| JP2003133270A (ja) * | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
| KR20050059123A (ko) * | 2002-08-30 | 2005-06-17 | 도레이 가부시끼가이샤 | 연마 패드, 정반 홀 커버 및 연마장치 및 연마방법 및 반도체 디바이스의 제조방법 |
| TW200530378A (en) * | 2003-03-11 | 2005-09-16 | Toyo Tire & Rubber Co | Polishing pad and semiconductor device manufacturing method |
| US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| KR100953928B1 (ko) * | 2004-12-10 | 2010-04-23 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 연마 패드의 제조 방법 |
| US7764377B2 (en) | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
| US7210980B2 (en) | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
| JP2007260827A (ja) * | 2006-03-28 | 2007-10-11 | Toyo Tire & Rubber Co Ltd | 研磨パッドの製造方法 |
| US8662957B2 (en) | 2009-06-30 | 2014-03-04 | Applied Materials, Inc. | Leak proof pad for CMP endpoint detection |
| US9446497B2 (en) * | 2013-03-07 | 2016-09-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad |
-
2013
- 2013-03-07 US US13/788,594 patent/US9108290B2/en active Active
-
2014
- 2014-02-24 TW TW103106005A patent/TWI610760B/zh active
- 2014-02-25 DE DE102014002615.9A patent/DE102014002615A1/de not_active Withdrawn
- 2014-03-06 JP JP2014043781A patent/JP2014172169A/ja active Pending
- 2014-03-06 CN CN201410080619.8A patent/CN104029114B/zh active Active
- 2014-03-07 FR FR1451889A patent/FR3002873B1/fr not_active Expired - Fee Related
- 2014-03-07 KR KR1020140027123A patent/KR20140110785A/ko not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1322374A (zh) * | 1999-03-31 | 2001-11-14 | 株式会社尼康 | 抛光体、抛光设备、抛光设备调节方法、抛光膜厚度或抛光终点测量方法及半导体器件的制造方法 |
| US20040248501A1 (en) * | 2003-06-05 | 2004-12-09 | Jin-Kook Kim | Polishing pad for chemical mechanical polishing apparatus |
| TW201020068A (en) * | 2008-10-17 | 2010-06-01 | Rohm & Haas Elect Mat | Chemical mechanical polishing pad having sealed window |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140110785A (ko) | 2014-09-17 |
| DE102014002615A1 (de) | 2014-09-11 |
| TW201505771A (zh) | 2015-02-16 |
| US20140256230A1 (en) | 2014-09-11 |
| CN104029114B (zh) | 2017-04-26 |
| JP2014172169A (ja) | 2014-09-22 |
| FR3002873A1 (fr) | 2014-09-12 |
| FR3002873B1 (fr) | 2017-05-12 |
| US9108290B2 (en) | 2015-08-18 |
| CN104029114A (zh) | 2014-09-10 |
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