TWI610759B - Grinding processing device - Google Patents
Grinding processing device Download PDFInfo
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- TWI610759B TWI610759B TW102123955A TW102123955A TWI610759B TW I610759 B TWI610759 B TW I610759B TW 102123955 A TW102123955 A TW 102123955A TW 102123955 A TW102123955 A TW 102123955A TW I610759 B TWI610759 B TW I610759B
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本發明係關於一種板狀工件的研磨裝置，特別適用於使用在移動電子設備之顯示部的玻璃基板等硬質脆性材料之研磨加工。 The present invention relates to a polishing apparatus for a plate-shaped workpiece, and is particularly suitable for use in a polishing process using a hard brittle material such as a glass substrate on a display portion of a mobile electronic device.
在被稱為媒體播放機、平板終端機、智慧手機等的各種攜帶裝置中，使用著玻璃基板等之顯示面板。 A display panel such as a glass substrate is used in various portable devices called media players, tablet terminals, smart phones, and the like.
該玻璃基板等之板狀工件係不僅需要進行外形研磨加工，還需要配合顯示部的形狀進行孔加工或者凹部加工等之內形研磨加工。 The plate-shaped workpiece such as the glass substrate requires not only the outer shape polishing process but also the inner shape polishing processing such as hole processing or concave portion processing in accordance with the shape of the display portion.
另外，玻璃基板的大小也是多樣的。 In addition, the size of the glass substrate is also diverse.
如果將此等之外形研磨加工、內形研磨加工等複數的加工藉由研磨加工裝置分別地來進行的話，則需要複數台研磨加工裝置，而存在設備大型化、成本增加的問題。 When a plurality of processes such as external polishing or internal polishing are separately performed by the polishing apparatus, a plurality of polishing apparatuses are required, and there is a problem that the equipment is increased in size and cost is increased.
專利文獻1中揭露一種研磨裝置，其對當作為記錄媒體而使用的磁碟來進行內外周加工，藉由將兩組加工單元設置在一台機器上，從而實現節省設置空間。 Patent Document 1 discloses a polishing apparatus that performs inner and outer peripheral processing on a magnetic disk used as a recording medium, and saves installation space by arranging two sets of processing units on one machine.
但是，並不能直接適用於外形形狀為大小不同的板狀工件之研磨加工。 However, it cannot be directly applied to the grinding of a plate-shaped workpiece having a different shape and shape.
專利文獻1：日本專利特開2005-271105號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2005-271105
本發明的目的在於提供一種研磨加工裝置，其能夠對板狀工件進行從外形研磨到孔加工或者凹部加工等多種多樣的研磨加工，且小型化並生產性高。 An object of the present invention is to provide a polishing apparatus capable of performing various types of polishing processing such as from the outer shape polishing to the hole processing or the concave portion processing on a plate-shaped workpiece, and is compact and highly productive.
與本發明相關之研磨加工裝置的特徵在於，包括保持板狀工件並進行旋轉的工作台、及研磨該板狀工件的砥石，而工作台係被C軸旋轉控制，砥石係被X軸方向移動控制，C軸旋轉控制手段係按照板狀工件的大小來進行直接驅動控制或減速控制。 A polishing apparatus according to the present invention is characterized in that it includes a table that holds a plate-like workpiece and rotates, and a vermiculite that grinds the plate-like workpiece, and the table is controlled by C-axis rotation, and the vermiculite is moved in the X-axis direction. Control, C-axis rotation control means direct drive control or deceleration control according to the size of the plate-shaped workpiece.
在本發明中，藉由使板狀工件保持在工作台上，並按照工件軸的旋轉角，對旋轉的砥石進行相對於工件接近/分離控制，且藉由採用進行研磨加工之極座標系統的加工控制，形成由被C軸旋轉控制的工作台和被X軸方向移動控制的旋轉砥石所構成的小型化的裝置。 In the present invention, by rotating the plate-like workpiece on the table and in accordance with the rotation angle of the workpiece axis, the rotating vermiculite is controlled in proximity/separation with respect to the workpiece, and processing by the polar coordinate system for performing the grinding process is employed. The control is performed to form a compact device including a table controlled by the C-axis rotation and a rotating vermiculite controlled by the X-axis direction.
在採用這樣的極座標系統的控制方法的情況下，由於在使旋轉砥石進行微小移動的同時，必須在加工點以規定的力量來進行按壓，因此，根據板狀工件的大小、研磨加工點之從C軸中心而來的距離，則保持該板狀工件所需要的轉矩會產生差異。 In the case of the control method of such a polar coordinate system, since the rotating vermiculite is minutely moved, it is necessary to press the machining point with a predetermined force. Therefore, depending on the size of the plate-shaped workpiece and the polishing processing point, The distance from the center of the C-axis causes a difference in the torque required to hold the plate-like workpiece.
因此，本發明係為，對應於與智慧手機用的玻璃基板相比外形相對較大的平板終端機用的玻璃基板等之板狀工件的大小，使對工作台進行旋轉角度控制的電動機來進行直接驅動控制，或者在其中間經由減速機來進行者。 Therefore, the present invention is based on the size of a plate-shaped workpiece such as a glass substrate for a tablet terminal having a relatively large outer shape compared with a glass substrate for a smart phone, and is controlled by a motor that controls the rotation angle of the table. Direct drive control, or in the middle through the reducer.
直接驅動電動機雖然能夠得到低旋轉速度和高轉矩，但是也存在 板狀工件變大時被砥石按壓則無法高精度地保持工件的情況，在此情況下，以經由減速機的方式來實現規格的系列化。 Although the direct drive motor can obtain low rotation speed and high torque, it also exists. When the plate-shaped workpiece is large, it is not possible to hold the workpiece with high precision when pressed by the vermiculite. In this case, the specification is serialized by means of a reducer.
作為減速手段，並不限定於齒輪、滑輪、凸輪從動件等之手段。 The means for reducing the speed is not limited to a means such as a gear, a pulley, or a cam follower.
在本發明中，砥石係具有用於研磨板狀工件之外形的外形砥石、及用於對板狀工件進行孔加工或者/以及凹部加工的內形砥石，外形砥石和內形砥石亦可分別地被昇降控制的同時，整體來被進行X軸方向移動控制。 In the present invention, the vermiculite has an outer shape vermiculite for polishing the outer shape of the plate-like workpiece, and an inner-shaped vermiculite for performing hole processing or/or concave portion processing on the plate-shaped workpiece, and the outer shape vermiculite and the inner-shaped vermiculite may be separately While being lifted and controlled, the X-axis direction movement control is performed as a whole.
這樣，由於不是個別地對外形砥石、內形砥石以及其他的砥石來進行X軸方向移動控制而是當作成整體來進行X軸方向移動控制，因此，本發明的研磨加工裝置之部件數量較少，控制系統的構造也被簡單化，所以成為小型化且廉價的加工裝置。 In this way, since the X-axis direction movement control is performed not only on the shape vermiculite, the intrinsic vermiculite, and the other vermiculite, but the X-axis direction movement control is performed as a whole, the number of parts of the polishing apparatus of the present invention is small. Since the structure of the control system is also simplified, it is a compact and inexpensive processing device.
在本發明中，進一步具有用於將板狀工件交接給工作台之交接手臂，而交接手臂亦可於被昇降控制的同時，當作成整體與砥石一併被X軸方向移動控制。 In the present invention, there is further provided a transfer arm for handing over the plate-like workpiece to the table, and the transfer arm can be controlled to be moved together with the meteorite by the X-axis direction while being controlled by the lift.
另外，在前後方向上亦可具備一對由工作台與砥石所構成的加工工作站。 In addition, a pair of processing stations composed of a table and a vermiculite may be provided in the front-rear direction.
這樣，成為更為小型化的加工裝置。 Thus, it becomes a more compact processing apparatus.
在本發明中，亦可具有用於將板狀工件與交接手臂進行交接的裝載裝置，工作台則具有板狀工件的吸引保持手段，而吸引保持手段亦能夠根據板狀工件的大小來進行替換。 In the present invention, a loading device for transferring the plate-shaped workpiece to the delivery arm may be provided, and the table has a suction holding means for the plate-like workpiece, and the suction holding means can also be replaced according to the size of the plate-shaped workpiece. .
在與本發明相關的研磨加工裝置中，由於採用按照板狀工件的大小之工作台的C軸旋轉控制手段，因此能夠對應於多種多樣的板狀工件，在設置有複數個砥石或者工件的交接手臂之情況下，將此 等當作成整體來進行X軸方向移動控制，因此，成為能夠將部件數量加以削減，並成為小型化的裝置。 In the polishing apparatus according to the present invention, since the C-axis rotation control means of the table according to the size of the plate-like workpiece is used, it is possible to provide a plurality of slabs or workpieces in correspondence with a variety of plate-like workpieces. In the case of the arm, this Since the X-axis direction movement control is performed as a whole, the number of components can be reduced and the size can be reduced.
1‧‧‧架台 1‧‧‧Rack
2‧‧‧ATC 2‧‧‧ATC
10‧‧‧研磨加工裝置 10‧‧‧ Grinding and processing equipment
11、111‧‧‧工作台 11, 111‧‧‧ workbench
11a‧‧‧平台旋轉軸 11a‧‧‧ platform rotation axis
11b、14a、14b、41a‧‧‧吸引保持手段 11b, 14a, 14b, 41a‧‧‧ attracting means
12‧‧‧X軸滑塊 12‧‧‧X-axis slider
13‧‧‧Z軸滑塊 13‧‧‧Z-axis slider
14‧‧‧搬送手臂 14‧‧‧Transfer arm
15‧‧‧裝載機 15‧‧‧Loader
16‧‧‧導軌 16‧‧‧rails
17a、17b‧‧‧工件盒 17a, 17b‧‧‧Workpiece box
18‧‧‧預先定位中心部 18‧‧‧Pre-positioning center
19‧‧‧乾燥單元 19‧‧‧Drying unit
21‧‧‧外形砥石 21‧‧‧ Shape meteorite
22‧‧‧外形砥石軸 22‧‧‧ Shaped ochre shaft
23‧‧‧皮帶驅動電動機 23‧‧‧Belt drive motor
23a‧‧‧驅動滑輪 23a‧‧‧Drive pulley
23b‧‧‧從動滑輪 23b‧‧‧driven pulley
24‧‧‧皮帶 24‧‧‧Land
31‧‧‧內形砥石 31‧‧‧Inner meteorite
32‧‧‧內形砥石軸 32‧‧‧Inner-shaped meteorite shaft
33‧‧‧驅動電動機 33‧‧‧Drive motor
34‧‧‧內形砥石昇降機 34‧‧‧Inner-shaped meteorite lift
41‧‧‧交接手臂 41‧‧‧Hand over the arm
42‧‧‧手臂昇降機 42‧‧‧arm lift
W、W1、W2‧‧‧板狀工件 W, W 1 , W 2 ‧‧‧ plate-like workpiece
圖1(a)係示意性地表示出研磨加工裝置的構造，(b)係為工作台與旋轉砥石之主要部分的視圖。 Fig. 1(a) is a view schematically showing the structure of a polishing apparatus, and Fig. 1(b) is a view showing a main part of a table and a rotating vermiculite.
圖2係示意性地表示出外形砥石和內形砥石的動作。(a)係表示出外形砥石下降的狀態，(b)係表示出進行外形研磨的狀態。(c)係表示出內形砥石下降並進行內形研磨的狀態。 Fig. 2 is a schematic view showing the action of the shape vermiculite and the inner shape vermiculite. (a) shows a state in which the appearance vermiculite is lowered, and (b) shows a state in which the outer shape is polished. (c) shows a state in which the intrinsic vermiculite is lowered and the inner shape is ground.
圖3(a)係表示出板狀工件的外形研磨，(b)係表示出內形研磨。 Fig. 3(a) shows the outer shape polishing of the plate-like workpiece, and (b) shows the inner shape polishing.
圖4(a)至(d)係表示出板狀工件的交接的流程。 4(a) to 4(d) show the flow of the transfer of the plate-like workpiece.
圖5(a)係表示出外形砥石、內形砥石、交接手臂以及工作台的位置關係，(b)係為俯視圖。(c)係為外形砥石軸、內形砥石軸的昇降部剖面圖。 Fig. 5(a) shows the positional relationship between the shape vermiculite, the inner vermiculite, the transfer arm, and the table, and (b) is a plan view. (c) is a cross-sectional view of the lifting portion of the shape of the vermiculite axis and the inner-shaped vermiculite axis.
根據以下附圖，來加以說明與本發明相關之研磨加工裝置10的構造例，但是本發明並不限定於此。 The structural example of the polishing apparatus 10 according to the present invention will be described with reference to the drawings below, but the present invention is not limited thereto.
於圖1為表示研磨加工裝置10之主要部分構成圖，而省略顯示操作盤、控制部以及外殼構件等。 FIG. 1 is a view showing a configuration of a main part of the polishing apparatus 10, and the operation panel, the control unit, the outer casing member, and the like are omitted.
在本發明中，將研磨加工裝置的左右方向定義為X軸方向，將上下方向定義為Z軸方向。 In the present invention, the left-right direction of the polishing apparatus is defined as the X-axis direction, and the vertical direction is defined as the Z-axis direction.
在本實施例中，如圖1(a)所示成為一個範例，例如將由工作台11、X軸滑塊12、Z軸滑塊13以及搬送工件之裝載系統所構成的加工工作站於前後方向上形成為一對之兩個工作站。 In the present embodiment, as shown in FIG. 1(a), for example, a processing station including a table 11, an X-axis slider 12, a Z-axis slider 13, and a loading system for transporting workpieces is provided in the front-rear direction. Formed as a pair of two workstations.
如圖1(b)中所示之主要部分放大圖，在被X軸方向移動控 制的X軸滑塊12上，安裝有：藉由外形砥石軸22所旋轉控制的外形砥石21、藉由內形砥石軸32所旋轉控制的內形砥石31、以及用於將板狀工件W交接至工作台11的交接手臂41。 An enlarged view of the main part shown in Figure 1(b), moved in the direction of the X-axis The X-axis slider 12 is mounted with an outer shape vermiculite 21 controlled by the rotation of the outer shape vermiculite shaft 22, an inner-shaped vermiculite 31 controlled by the rotation of the inner-shaped vermiculite shaft 32, and a plate-shaped workpiece W. The delivery arm 41 is handed over to the table 11.
藉此，外形砥石21、內形砥石31以及交接手臂41則當作為一體被X軸方向移動控制。 Thereby, the shape vermiculite 21, the inner-shaped vermiculite 31, and the delivery arm 41 are controlled to be moved in the X-axis direction as a whole.
並且，交接手臂41亦可按照需要來加以設置。 Further, the delivery arm 41 can also be provided as needed.
因此，與分別來進行X軸方向移動控制的構造相比較，部件數量較少，成為小型化的設計。 Therefore, compared with the structure in which the X-axis direction movement control is performed separately, the number of components is small, and it becomes a design of miniaturization.
設置於皮帶驅動電動機23側的驅動皮帶輪23a與設置於外形砥石軸22側的從動皮帶輪23b，則透過皮帶24將旋轉傳遞給外形砥石軸22。 The drive pulley 23a provided on the belt drive motor 23 side and the driven pulley 23b provided on the side of the outline gangue shaft 22 transmit the rotation to the outline gangue shaft 22 through the belt 24.
藉由該外形砥石軸22和皮帶驅動電動機23所構成的驅動系統，係當作為一體安裝於Z軸滑塊13。 The drive system composed of the outer shape rocker shaft 22 and the belt drive motor 23 is integrally attached to the Z-axis slide 13 as a unit.
藉此，藉由Z軸滑塊13外形砥石21被昇降控制。 Thereby, the surface rock 21 is controlled to be lifted and lowered by the Z-axis slider 13.
如圖3(a)所示，外形砥石21主要用於研磨板狀工件W的外周部外形。 As shown in Fig. 3 (a), the shape vermiculite 21 is mainly used for polishing the outer peripheral shape of the plate-like workpiece W.
板狀工件W被保持於工作台11，該工作台11設置在被C軸旋轉控制的平台旋轉軸11a的上部。 The plate-like workpiece W is held on the table 11, which is disposed at an upper portion of the stage rotating shaft 11a that is rotationally controlled by the C-axis.
如圖3(a)所示，板狀工件W則其旋轉角度θ為被C軸控制之同時來進行旋轉，對此，外形砥石21則沿著板狀工件W的外形線a在X軸方向上進行微小移動。 As shown in Fig. 3(a), the plate-like workpiece W is rotated while being rotated by the C-axis, and the shape-shaped vertex 21 is along the outline a of the plate-like workpiece W in the X-axis direction. Make small moves on it.
這樣，外形砥石21係相對於C軸中心，藉由在極座標系統被位置控制的同時按壓板狀工件W的側面來進行外形研磨。 Thus, the shape vermiculite 21 is shaped to be polished with respect to the center of the C-axis by pressing the side surface of the plate-like workpiece W while the position coordinate system is being controlled.
因此，於保持板狀工件的工作台則負擔由外形砥石21所產生的按壓力，其大小由板狀工件W的大小來決定。 Therefore, the table which holds the plate-like workpiece bears the pressing force generated by the shape vermiculite 21, and the size thereof is determined by the size of the plate-like workpiece W.
因此，對於對平台旋轉軸進行C軸旋轉控制的電動機，本發明能夠配合板狀工件的大小來選擇使用為直接地加以連結的直接驅動控制與介由減速機所進行減速控制的方法。 Therefore, in the motor for controlling the C-axis rotation of the platform rotating shaft, the present invention can select a direct drive control that is directly coupled and a method of performing deceleration control by the reducer in accordance with the size of the plate-shaped workpiece.
內形砥石31係藉由驅動電動機33並經由內形砥石軸32而被旋轉控制。 The intrinsic meteorite 31 is rotationally controlled by the drive motor 33 and via the intrinsic vermiculite shaft 32.
另外，內形砥石31係隨著驅動電動機33，藉由內形砥石昇降機34來進行Z軸方向的移動控制。 Further, the intrinsic vermiculite 31 is controlled to move in the Z-axis direction by the inner-shaped vermiculite lifter 34 in accordance with the drive motor 33.
如圖3(b)所示，內形砥石31係主要用於以削去板狀工件W的表面或者裡面的一部分的方式來進行凹部加工或者圓孔、長孔等之孔加工。 As shown in Fig. 3 (b), the intrinsic vermiculite 31 is mainly used for performing the processing of the concave portion or the hole processing such as the round hole or the long hole so as to remove the surface of the plate-like workpiece W or a part of the inside.
這種情況與外形研磨相同，以得到板狀工件W的內形線b的方式，在被C軸旋轉控制的板狀工件W上，使用極座標系統對內形砥石31進行X軸方向移動控制。 In this case, in the same manner as the outer shape polishing, the inner shape line b of the plate-like workpiece W is obtained, and the inner-shaped vermiculite 31 is subjected to the X-axis direction movement control using the polar coordinate system on the plate-like workpiece W controlled by the C-axis rotation.
參照圖2對外形研磨以及內形研磨的方法例進行說明。 An example of a method of outer shape polishing and inner shape polishing will be described with reference to Fig. 2 .
板狀工件W被保持於工作台11，在進行外形研磨時，如圖2(a)、(b)所示，外形砥石21係藉由Z軸滑塊13下降，配合板狀工件W的C軸旋轉角θ並藉由X軸滑塊12在X軸方向上被微小移動控制。 The plate-shaped workpiece W is held by the table 11, and when the outer shape is polished, as shown in Figs. 2(a) and 2(b), the shape vermiculite 21 is lowered by the Z-axis slider 13 to match the C of the plate-shaped workpiece W. The shaft rotation angle θ is controlled by the X-axis slider 12 being slightly moved in the X-axis direction.
另外，在進行內形研磨時，如圖2(c)所示，藉由外形砥石21上昇且使內形砥石31下降而來加以進行。 Further, when the inner shape polishing is performed, as shown in FIG. 2(c), the shape vermiculite 21 rises and the inner shape vermiculite 31 is lowered.
下面，對板狀工件W的裝載系統來進行說明。 Next, the loading system of the plate-like workpiece W will be described.
如圖1所示，在架台1上，具有收納研磨前之工件以及研磨後之工件的工件盒17a、17b。 As shown in Fig. 1, the gantry 1 has workpiece boxes 17a and 17b for accommodating a workpiece before polishing and a workpiece after polishing.
搬送板狀工件W的搬送手臂14係安裝於朝向Y軸方向以及Z軸方向而被移動控制的裝載機15上，而裝載機15則沿著導軌16朝向X軸方向而被移動控制。 The transport arm 14 that transports the plate-shaped workpiece W is attached to the loader 15 that is moved and controlled in the Y-axis direction and the Z-axis direction, and the loader 15 is moved and controlled along the guide rail 16 in the X-axis direction.
該搬送手臂14、裝載機15、導軌16也是前後兩個設置成一對。 The transfer arm 14, the loader 15, and the guide rail 16 are also provided in a pair of front and rear.
藉由搬送手臂14從工件盒取出的板狀工件W，係臨時放置於預先定位中心部18的位置，且在完成板狀工件對位之後，交給交接手臂41。 The plate-like workpiece W taken out from the workpiece cassette by the transfer arm 14 is temporarily placed at a position where the center portion 18 is positioned in advance, and is delivered to the delivery arm 41 after the alignment of the plate-like workpiece is completed.
另一方面，研磨加工完成後之板狀工件W，係經由交接手臂41由搬送手臂14接收，在乾燥單元19使其乾燥，收納於工件盒。 On the other hand, the plate-like workpiece W after the completion of the polishing process is received by the transfer arm 14 via the delivery arm 41, dried in the drying unit 19, and stored in the workpiece case.
如圖1(b)所示，交接手臂41係藉由手臂昇降機42來進行昇降控制，且藉X軸滑塊12來進行X軸方向移動控制。 As shown in FIG. 1(b), the delivery arm 41 is lifted and controlled by the arm lifter 42, and the X-axis direction movement control is performed by the X-axis slider 12.
在本實施例中，作為交接手臂41以及搬送手臂14的工件保持手段，例如使用吸引保持手段41a、14a、14b。 In the present embodiment, as the workpiece holding means for the delivery arm 41 and the transfer arm 14, for example, the suction holding means 41a, 14a, 14b are used.
如圖4(a)所示，藉由搬送手臂14而搬送到來之加工前的板狀工件W2，係交給交接手臂41，然後如圖4(b)所示，將已完成之研磨加工的板狀工件W1藉由下側的吸引手段14b來取回。 As shown in Fig. 4 (a), the plate-shaped workpiece W 2 before being conveyed by the transfer arm 14 is delivered to the delivery arm 41, and then the finished polishing process is performed as shown in Fig. 4 (b). The plate-shaped workpiece W 1 is retrieved by the lower suction means 14b.
而交給交接手臂41的加工前的板狀工件W2，則如圖4(d)所示，搬送至工作台11側。 On the other hand, the plate-shaped workpiece W 2 before the processing of the delivery arm 41 is conveyed to the table 11 side as shown in FIG. 4(d).
外形砥石21、內形砥石31、交接手臂41係均被安裝於X軸滑塊12，而於圖5表示出與工作台11的位置關係。 The outline vermiculite 21, the inner-shaped vermiculite 31, and the transfer arm 41 are attached to the X-axis slider 12, and the positional relationship with the table 11 is shown in FIG.
(a)為側視圖，(b)為俯視圖，而於(c)則參考地表示出昇降部的剖面圖。 (a) is a side view, (b) is a top view, and (c) is a cross-sectional view of the elevation part by reference.
在工作台11上，設置有吸引保持手段11b來當作為工件的保持手段，並根據板狀工件的大小，能夠與平台上面之寬度所不同的其他的工作台111來進行互換。 The table 11 is provided with a suction holding means 11b as a holding means for the workpiece, and is interchangeable with another table 111 different from the width of the upper surface of the platform depending on the size of the plate-like workpiece.
另外，如圖1(a)所示，在架台的左側前部設置有用於自動交換砥石的ATC(工具自動交換裝置)2。 Further, as shown in Fig. 1(a), an ATC (Tool Automatic Switching Device) 2 for automatically exchanging vermiculite is provided at the front left side of the gantry.
1‧‧‧架台 1‧‧‧Rack
2‧‧‧ATC 2‧‧‧ATC
10‧‧‧研磨加工裝置 10‧‧‧ Grinding and processing equipment
11‧‧‧工作台 11‧‧‧Workbench
11a‧‧‧平台旋轉軸 11a‧‧‧ platform rotation axis
12‧‧‧X軸滑塊 12‧‧‧X-axis slider
13‧‧‧Z軸滑塊 13‧‧‧Z-axis slider
14‧‧‧搬送手臂 14‧‧‧Transfer arm
15‧‧‧裝載機 15‧‧‧Loader
16‧‧‧導軌 16‧‧‧rails
17a、17b‧‧‧工作盒 17a, 17b‧‧‧ work box
18‧‧‧預先定位中心部 18‧‧‧Pre-positioning center
19‧‧‧乾燥單元 19‧‧‧Drying unit
21‧‧‧外形砥石 21‧‧‧ Shape meteorite
22‧‧‧外形砥石軸 22‧‧‧ Shaped ochre shaft
23‧‧‧皮帶驅動電動機 23‧‧‧Belt drive motor
23a‧‧‧驅動滑輪 23a‧‧‧Drive pulley
23b‧‧‧從動滑輪 23b‧‧‧driven pulley
24‧‧‧皮帶 24‧‧‧Land
31‧‧‧內形砥石 31‧‧‧Inner meteorite
32‧‧‧內形砥石軸 32‧‧‧Inner-shaped meteorite shaft
33‧‧‧驅動電動機 33‧‧‧Drive motor
34‧‧‧內形砥石昇降機 34‧‧‧Inner-shaped meteorite lift
41‧‧‧交接手臂 41‧‧‧Hand over the arm
42‧‧‧手臂昇降機 42‧‧‧arm lift
W‧‧‧板狀工件 W‧‧‧plate workpiece
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102123955A TWI610759B (en) | 2013-07-04 | 2013-07-04 | Grinding processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102123955A TWI610759B (en) | 2013-07-04 | 2013-07-04 | Grinding processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201501863A TW201501863A (en) | 2015-01-16 |
| TWI610759B true TWI610759B (en) | 2018-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102123955A TWI610759B (en) | 2013-07-04 | 2013-07-04 | Grinding processing device |
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| Country | Link |
|---|---|
| TW (1) | TWI610759B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009297882A (en) * | 2008-06-17 | 2009-12-24 | Daitron Technology Co Ltd | Machining device |
| TWM412027U (en) * | 2011-03-17 | 2011-09-21 | Onano Ind Corp | Combined glass surface grinding device |
| TWM444904U (en) * | 2011-06-24 | 2013-01-11 | Nakamura Tome Precision Ind | Edge processing device for hard brittle board |
-
2013
- 2013-07-04 TW TW102123955A patent/TWI610759B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009297882A (en) * | 2008-06-17 | 2009-12-24 | Daitron Technology Co Ltd | Machining device |
| TWM412027U (en) * | 2011-03-17 | 2011-09-21 | Onano Ind Corp | Combined glass surface grinding device |
| TWM444904U (en) * | 2011-06-24 | 2013-01-11 | Nakamura Tome Precision Ind | Edge processing device for hard brittle board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201501863A (en) | 2015-01-16 |
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