TWI610613B - Far-infrared heat dissipating tape - Google Patents

Abstract

The invention relates to a heat sink patch with far infrared rays. At least one far infrared coating applied to the first surface of a body; at least one adhesive layer bonded to the second surface of the body. Or the far infrared coating is bonded to the surface of the body; the adhesive layer is bonded to the far infrared coating. The adhesive layer can be arbitrarily bonded to the surface of a heat-dissipating object, and the working heat energy of the object to be heat-dissipated is radiated and radiated by the far-infrared radiation through the far-infrared radiation, so that a good heat dissipation effect can be achieved.

Description

Heat sink with far infrared

The invention relates to a patch structure which can be arbitrarily pasted and radiated by far-infrared radiation.

Nowadays, the electronic devices commonly used in the world are heated due to the operation of the internal parts. If the outer casing is closed or long-term use, the heat dissipation is not easy, and the high temperature is easily generated, so that the electronic components are damaged or the service life is shortened. The heat sink or the fan allows the heat generated by the operating temperature of the electronic component to be thermally or thermally convectively diffused by the air to achieve the effect of cooling, so how to improve the heat dissipation efficiency of the heat sink is relatively important. For example, using heat sink fins or a cooling fan to force the convection to discharge hot air, but the required installation space is relatively large, which requires a large space, and cannot be applied to a space-constrained installation position and equipment, especially the electronic product device is increasingly thinner and Under the trend of relatively smaller volume and weight, it is more difficult to dissipate heat by conduction and convection.

For example, the Patent No. I481340, "Method for Manufacturing Heat Sink and Structure" thereof, published on April 11, 104, the Republic of China, discloses: Step 1: Prepare a powder of far-infrared material; Step 2: The powder is surface-modified; and in step 3, the powder is coated on the surface of a substrate by thermal spraying to form a heat dissipation layer on the surface of the substrate. Thereby, the far-infrared material is directly coated on the surface of the substrate by using a thermal spraying process, heat is radiated by the heat radiation effect of the far-infrared material, and the equivalent thermal resistance between the substrate and the air is reduced, and a heat-dissipating fin structure with high heat dissipation rate is formed. It further proposes a structure of a heat sink.

In the prior patent, the powder having the far infrared ray function is coated on the substrate by thermal spraying to form a thin and uniform heat dissipation layer. But the user still has to reduce the substrate that needs to be cooled. It is time consuming to send to the place where it is sprayed for spraying. Moreover, if there is any loss in the transportation process, the substrate may be damaged, which may affect the cost of manufacturing.

There is also a new type of "heat-dissipating patch" patent No. M444700 announced by the Republic of China on January 1, 102, which discloses that it comprises a metal heat conducting layer, a heat dissipating layer and an adhesive layer, and the top surface of the copper foil layer is The roughened surface, the metal heat conduction layer is disposed between the heat dissipation layer and the adhesive layer, and the adhesive layer is made of a heat conductive material; the advantage is that the overall thickness is thin and the volume is small, and does not occupy space; In the production, only a heat dissipation layer and an adhesive layer are respectively disposed on the top surface and the bottom surface of the metal heat conduction layer, so that the heat conduction and heat dissipation effects can be obtained in use, thereby reducing manufacturing cost and achieving economic benefits.

However, the metal heat conduction layer of the prior patent is a sheet, which is only made of copper foil or aluminum foil, and the thickness of the metal heat conduction layer is 5 to 250 μm, so the heat dissipation effect is not good, and it is not ideal in use. The far-infrared radiation heat-dissipating material used in the present invention has graphite, boron nitride, nano-carbon spheres and carbon nanotubes as compared with the heat-dissipating layer material of the patent, and the raw materials thereof are easier to obtain (divided into natural far-infrared minerals and Synthetic materials), the material process only needs to be mixed with a very small amount of 3% or less of glue to make it simpler, the manufacturing cost is more economical and the heat dissipation effect is obviously better.

Accordingly, in view of the conventional heat sink construction, the above disadvantages are encountered in use. Therefore, the present invention provides a heat sink patch having a far infrared ray, comprising: a body having a first surface and a second surface; at least one far infrared ray coating bonded to the first surface; An adhesive layer bonded to the second surface.

The invention may also be a heat sink patch with far infrared rays, comprising: a body having a surface; a far infrared coating applied to the surface; at least one adhesive layer coupled to the far infrared coating On the floor.

The above system is a flexible material, and the flexible material is one of a woven fabric, a non-woven fabric, and an aluminum foil, or a combination thereof.

The above system is a rigid material, and the rigid material is one of silver, copper, gold, aluminum, brass, iron, tin or a combination thereof.

The adhesive layer is an adhesive, a glue or a double-sided sticker.

The far infrared ray coating is bonded to the first surface in a drape manner.

The above far-infrared coating is obtained by natural far-infrared minerals, and the minerals including tourmaline, clay, mullite, cordierite or a combination thereof are ground and sieved to obtain far-infrared powder, or artificially synthesized. The method comprises the following steps: using a solution of an inorganic metal salt as a first material, mixing the first material with a water and an acidic solution, adjusting a pH of less than 3, and forming a gel by a sol-gel method, or a material is mixed with a water, an alkaline solution, and the pH is adjusted to be between 8 and 10, and then a gel is formed by a sol-gel method, and the obtained gel is applied to the first surface, and then The body is calcined at a temperature of from 500 ° C to 900 ° C to form the gel into minute crystal grains which are cooled to form the far infrared ray coating.

The above system is made of a porous material which is infiltrated into the porous material.

The above far-infrared coating is obtained by natural far-infrared minerals, and the minerals including tourmaline, clay, mullite, cordierite or a combination thereof are ground and sieved to obtain far-infrared powder, or artificially synthesized. The method comprises the following steps: using a solution of an inorganic metal salt as a first material, mixing the first material with a water and an acidic solution, adjusting a pH of less than 3, and forming a gel by a sol-gel method, or A material is mixed with a water, an alkaline solution, and the pH is adjusted to be between 8 and 10, and then a gel is formed by a sol-gel method, and the body is completely immersed in the above gel to make it completely Infiltrating into the porous material of the body, and then calcining the body after taking out, the calcination temperature is between 500 ° C and 900 ° C, so that the gel forms minute crystal grains, and the far infrared ray coating layer is formed after cooling.

The inorganic metal salt is a monochlorinated salt, a monosulfate salt, a mononitrate salt, an alkoxy compound or a tetraethoxy decane, and the acidic solution is monohydrochloric acid, monoacetic acid or mono nitric acid, and the alkaline solution is It is a sodium hydroxide.

According to the above technical features, the following advantages are obtained:

1. It can be affixed to any surface of various shapes of heat-dissipating objects, and can be purchased and torn by the user. Therefore, the application range is wide, and it is convenient, repeatable and immediate. Especially in line with environmental requirements.

2. The far infrared ray is radiated through the far infrared ray coating, thereby lowering the working temperature of the workpiece to be heat-dissipated, thereby avoiding the accumulation of heat energy and resulting in a short service life, and completely preventing the internal electronic components from being damaged by overheating.

3. The coating method of the far-infrared coating can replace the structure of the conventional heat sink, and has the advantages of reducing weight, volume, and weight, and reducing the manufacturing cost.

4. Fixing by adhesive means and dissipating heat by far-infrared radiation, eliminating the need of conventional through-holes and corresponding threads to fix the heat-dissipating fins, thereby eliminating manual assembly time and cost.

5. When you use the body, you can attach it to any object that you want to dissipate. You don't have to transport the object to be heat-dissipated to the factory for far-infrared spraying, saving time and manufacturing costs.

(1) ‧‧‧ Ontology

(11) ‧‧‧ first surface

(12) ‧‧‧second surface

(2) ‧‧‧ far infrared coating

(3) ‧‧‧Adhesive layer

(1A) ‧‧‧ Ontology

(13A) ‧‧‧ Surface

(2A)‧‧‧ far infrared coating

(3A) ‧‧‧Adhesive layer

(1B) ‧‧‧ Ontology

(13B) ‧‧‧ surface

(2B)‧‧‧ far infrared coating

(3B) ‧‧‧Adhesive layer

(1C) ‧‧‧ Ontology

(2C)‧‧‧ far infrared coating

(3C)‧‧‧Adhesive layer

(D) ‧‧‧heating objects to be cooled

(D1)‧‧‧LED

(D2)‧‧‧ boards

(E) ‧ ‧ items to be cooled

[First Figure] is a perspective view of a first embodiment of the present invention.

[Second figure] is a sectional view of a combination of the first embodiment of the present invention.

[Third Figure] is a schematic view showing the use of the first embodiment of the present invention.

[Fourth figure] is a sectional view of a combination of a second embodiment of the present invention.

[Fifth Figure] is a sectional view of a combination of a third embodiment of the present invention.

[Sixth Drawing] is a schematic view showing the use of the fourth embodiment of the present invention.

[Table 1] is a temperature result data table for performing heat dissipation experiments by using the conventional heat sink fins and the heat sink patches (copper and aluminum foil materials) of the present invention.

Referring to the first embodiment and the second figure, the first embodiment of the present invention comprises a body (1), at least one far infrared ray coating (2) and at least one adhesive layer (3), wherein: a body (1) ) is provided with one of the first surface (11) and a second surface (12). The body (1) can be made of a rigid aluminum material such as silver, copper, gold, aluminum, brass, iron, tin, etc., thereby providing better thermal conductivity.

At least one far infrared ray coating (2) bonded to the first surface (11) of the body (1), the far infrared ray coating (2) being bonded to the first surface (11) on. Again, the far infrared coating (2) is made in the following steps:

a. Obtained from natural far-infrared minerals, minerals including tourmaline, clay, mullite, cordierite or a combination thereof are ground and sieved to obtain a far-infrared powder.

b. Or artificially synthesize a solution of an inorganic metal salt as the first material. The first material is mixed with a water, an acidic solution, and the pH is adjusted to be less than 3, and then gelled by a sol-gel method. Alternatively, the first material is mixed with a water, an alkaline solution, and the pH is adjusted to be between 8 and 10, and then gelled by a sol-gel method, and the gel obtained above is applied to the body ( After the first surface (11) of 1), the body (1) is calcined, and the calcination temperature is between 500 ° C and 900 ° C, so that the gel forms minute crystal grains, and the far infrared ray coating is formed after cooling. (2).

The above inorganic metal salt is a monochlorinated salt, a monosulfate salt, a mononitrate salt, an alkoxy compound or a tetraethoxydecane. The acidic solution is monohydrochloric acid, monoacetic acid or mononitrous acid. The alkaline solution is a sodium hydroxide.

At least one adhesive layer (3) is bonded to the second surface (12) of the body (1). The adhesive layer (3A) is an adhesive, a glue or a double-sided sticker, thereby being disposed at any position on the second surface (12).

When used, as shown in the first figure and the third figure, it is used for dissipating a heat-dissipating object (D) for heat dissipation. This embodiment uses a circuit board (D2) having an LED (D1) as a description. . Directing the second surface (12) of the body (1) toward the circuit board (D2) of the object to be heat-dissipated (D), and then using the adhesive layer (3) on the second surface (12) to be relatively bonded. On the circuit board (D2) of the object (D) to be heat-dissipated, the second surface (12) of the body (1) can be closely adhered to the object (D) to be heat-dissipated.

In this way, when the LED (D1) on the circuit board (D2) generates a light source that can be projected in one direction, and the working heat generated by the LED (D1) during illumination can pass through the circuit board ( D2) is quickly conducted to the second surface (12) of the body (1), and then conducted to the first surface (11) and the far infrared ray coating (2) via the body (1), using the far infrared ray The coating (2) can generate a far infrared ray, and the working heat energy generated by the LED (D1) is transmitted through the far infrared ray coating (2), and the working heat energy of the object to be heat-dissipated can be used to achieve a good heat dissipation effect. . Radiation heat is radiated from the outside by far-infrared radiation, so that the object to be cooled (D) can be quickly dissipated to avoid damage due to high temperature.

Therefore, the present invention radiates heat by means of heat radiation, which is different from the conventional technology in that heat is radiated by heat conduction and heat convection to overcome the disadvantages of mounting a large installation space due to heat dissipation fins. The far-infrared coating (2) heats the working heat energy and dissipates it to the outside air, thereby having a good heat dissipation effect to reduce the LED (D1) and the circuit board inside the object to be heat-dissipated (D). (D2) working temperature, to avoid the accumulation of working heat energy is too high, which affects the LED (D1) or circuit board (D2) of the object to be heat-dissipated (D) due to high temperature light decay or shortened due to high temperature life, so It can effectively prevent the object to be cooled (D), LED (D1) and circuit board (D2) from being damaged by overheating, thereby prolonging its service life.

In addition to the above illumination device having the LED (D1) and the circuit board (D2), the object to be heat-dissipated (D) of the present invention may also be an electronic component capable of generating working heat energy, such as a CPU, an IC, a wafer, etc., but not This is limited to this. The electronic component can also be a component of an electronic device and the electronic device itself. The electronic device can be used for communication, calculation, navigation, entertainment, data recording, etc., including computers, tablets, mobile phones, GPS navigators, digital cameras, game consoles, digital recorders, etc., but not limited thereto, The scope of the patent application of the present invention is included.

In addition, the adhesive layer (3) of the present invention is an adhesive, a glue or a double-sided sticker, so the size of the adhesive layer (3) can be adjusted according to the size of the different objects to be heat-dissipated (D). The manufacturing is provided by any position on the second surface (12) of the body (1). With the adhesive layer (3), the surface of the object to be heat-dissipated (D) can be relatively bonded. Moreover, if the adhesive layer (3) is a double-sided sticker, it can be purchased by the user and adhered to the surface of the object to be heat-dissipated (D) as needed, or can be torn when not in use. Next, paste a new double-sided sticker to re-stick it. Therefore, the invention can not only be affixed to the surface of different objects to be heat-dissipated (D), but also has a wide application range, and has convenience, repeatability and immediateness, especially environmental protection requirements.

A second embodiment of the present invention, as shown in the fourth figure, is provided with a body (1A), and a surface of the body (1A) is entirely covered with a far infrared ray coating (2A). Again, the far infrared coating (2A) is made in the following steps:

a. Obtained from natural far-infrared minerals, minerals including tourmaline, clay, mullite, cordierite or a combination thereof are ground and sieved to obtain a far-infrared powder.

b. Or artificially synthesize a solution of an inorganic metal salt as the first material. The first material is mixed with a water, an acidic solution, and the pH is adjusted to be less than 3, and then gelled by a sol-gel method. Alternatively, the first material is mixed with a water, an alkaline solution, and the pH is adjusted to be between 8 and 10, and then gelled by a sol-gel method. The body (1A) is completely immersed in the gel obtained above, and then taken out, and the body (1A) is calcined at a temperature of 500 ° C to 900 ° C to form a minute knot of the gel. The crystal grains, after cooling, form the far-infrared coating (2A) on the surface (13A) of the body (1A). At least one adhesive layer (3A) is bonded to the far infrared ray coating (2A). Thus, the far-infrared coating (2A) can also be used to dissipate heat in a far-infrared radiation manner.

A third embodiment of the present invention is shown in the fifth figure. The body (1B) is made of a porous material, and the body (1B) is completely immersed in the above-mentioned gel, so that it completely penetrates into the porous material of the body (1B), and after being taken out, The body (1B) is calcined, and after cooling, the far-infrared coating (2B) is formed inside the body (1B) and on the surface (13B). At least one adhesive layer (3B) is bonded to the far infrared ray coating (2B). Thus, the far-infrared coating (2B) can also be used to dissipate heat in a far-infrared radiation manner.

According to a fourth embodiment of the present invention, as shown in the sixth figure, the body (1C) is made of a flexible material such as woven fabric, non-woven fabric, or aluminum foil. The embodiment is mainly made of an aluminum foil material, and has a flexible function, so that it can be arbitrarily bent and attached to the surface of a heat-dissipating object (E) having different planar shapes, and the body (1C) utilizes The adhesive layer (3C) can conform to the curved shape of the heat-dissipating object (E) and has better thermal conductivity. In this way, the far infrared ray coating (2C) can also be used to dissipate heat in a far infrared ray manner.

The invention is also tested by the heat dissipation temperature of an 18W high power LED bulb. However, the working temperature of the normal normal lamp strain needs to be ensured below 85 °C, so as to avoid long-term light decay (illumination reduction), and the luminous efficiency is lowered, thereby affecting the service life. The experimental results are shown in the following list 1. The temperature of the heat dissipation method is only 92.4 °C, which is obviously higher than the heat dissipation requirement of the normal lamp. By using the heat dissipation method of the far-infrared heat-dissipating patch of the present invention, the working temperature is lowered to 75.6~78.5 °C, which is obviously superior to the heat dissipation method using the rear heat-dissipating fins, and can meet the heat-dissipating demand of the normal lamp. Therefore, long-term defects such as light decay (illumination reduction) and reduction in luminous efficiency can be avoided, and the service life can be improved.

Table I

However, the above description is only the fourth embodiment of the present invention, and the scope of the patent application and the simple equivalent changes and replacements of the contents of the specification according to the present invention are not limited thereto. It is still within the scope of the protection covered by the scope of the invention.

(1) ‧‧‧ Ontology

(11) ‧‧‧ first surface

(12) ‧‧‧second surface

(2) ‧‧‧ far infrared coating

(3) ‧‧‧Adhesive layer

Claims (7)

A heat sink patch with far infrared rays, comprising: a body having a first surface and a second surface; at least one far infrared coating bonded to the first surface; at least one adhesive layer, The far infrared ray coating is bonded to the first surface in a drape manner, and the far infrared ray coating is obtained from natural far infrared ray minerals, including tourmaline, clay, mullite And the mineral of one or a combination of cordierite is ground and sieved to obtain a far-infrared powder, or a solution of an inorganic metal salt as a first material by artificial synthesis, the first material and one water, acid Mixing the solution and adjusting its pH to less than 3, and then forming a gel by sol-gel method, or mixing the first material with water and alkaline solution, and adjusting the pH to 8 to 10, and then Forming a gel by sol-gel method, coating the obtained gel on the first surface, and then calcining the body, the calcination temperature is between 500 ° C and 900 ° C, so that the gel is minutely formed. Crystal grain, after cooling To the far-infrared coating. A heat sink patch with far infrared rays, comprising: a body having a surface, the system being made of a porous material; and a far infrared coating bonded to the surface, the far infrared coating system Infiltrating into the porous material; at least one adhesive layer bonded to the far infrared coating. The heat-dissipating patch with far-infrared rays according to claim 1 or 2, wherein the system is a flexible material, and the flexible material is one of a woven fabric, a non-woven fabric, and an aluminum foil, or a combination thereof. The heat sink with far infrared rays according to claim 1 or 2, wherein the system is a rigid material, and the rigid material is one of silver, copper, gold, aluminum, brass, iron, and tin. Or a combination thereof. The heat-dissipating patch with far-infrared rays as described in claim 1 or 2, wherein the adhesive layer is an adhesive, a glue or a double-sided sticker. The far-infrared heat-dissipating patch according to claim 2, wherein the far-infrared coating is obtained by natural far-infrared minerals, including one of tourmaline, clay, mullite, cordierite or a combination thereof. The mineral is processed by grinding and sieving to obtain a far-infrared powder, or a solution of an inorganic metal salt is artificially synthesized as a first material, and the first material is mixed with a water and an acidic solution, and the pH thereof is adjusted to be less than 3, and then gelatinized by a sol-gel method, or the first material is mixed with a water, an alkaline solution, and the pH is adjusted to be between 8 and 10, and then formed into a sol gel method. Gel, and completely immersing the body in the above gel, completely infiltrating into the porous material of the body, and then calcining the body after taking out, the calcination temperature is between 500 ° C and 900 ° C, so that The gel forms minute crystal grains which are formed upon cooling to form the far infrared ray coating. The heat-dissipating patch with far-infrared rays according to claim 1 or 6, wherein the inorganic metal salt is a monochlorinated salt, a monosulfate salt, a mononitrate salt, an alkoxy compound or a tetraethoxy group. The decane, the acidic solution is monohydrochloric acid, monoacetic acid or nitric acid, and the alkaline solution is a sodium hydroxide.