TWI608561B - Position correcting device and electronic component carrying device provided with the position correcting device - Google Patents

Position correcting device and electronic component carrying device provided with the position correcting device Download PDF

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Publication number
TWI608561B
TWI608561B TW105124620A TW105124620A TWI608561B TW I608561 B TWI608561 B TW I608561B TW 105124620 A TW105124620 A TW 105124620A TW 105124620 A TW105124620 A TW 105124620A TW I608561 B TWI608561 B TW I608561B
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electronic component
hole portion
motor
edge
position correcting
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TW105124620A
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Chinese (zh)
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TW201714245A (en
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Hajime Takamatsu
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Ueno Seiki Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Description

位置校正裝置及具備該位置校正裝置的電子零組件搬運裝置 Position correcting device and electronic component handling device provided with the position correcting device

本發明是有關電子零組件之位置校正的位置校正裝置,及一邊搬運電子零組件,並進行各種處理,且為各種處理而進行電子零組件之位置校正的電子零組件的搬運裝置。 The present invention relates to a position correcting device for position correction of an electronic component, and an electronic component carrying device that carries an electronic component and performs various processes, and performs position correction of the electronic component for various processes.

電子零組件是使用於電氣製品的零組件,進行半導體元件等封裝,半導體元件可舉例如電晶體或二極管或電容器或電阻等的離散半導體或積體電路等。該電子零組件是經過組裝及檢查等的各種處理來完成。半導體元件的場合,在組裝等的前步驟與檢查等的後步驟中,經過切割、裝配、結合及密封、標記處理、外觀檢查、電特性檢查、分類及安裝等。電特性檢查的場合,將檢查裝置側的端子接觸電子零組件的電極,使電流流動,施加電壓或輸入訊號,測量其結果的輸出。 The electronic component is a component used for an electric product, and is packaged by a semiconductor element or the like. The semiconductor element may be, for example, a discrete semiconductor or an integrated circuit such as a transistor or a diode, a capacitor, or a resistor. The electronic component is completed by various processes such as assembly and inspection. In the case of a semiconductor element, it is subjected to dicing, assembly, bonding and sealing, marking processing, visual inspection, electrical property inspection, classification, and mounting in a subsequent step such as assembly and the like. In the case of electrical characteristic inspection, the terminal on the inspection device side is brought into contact with the electrode of the electronic component, current is supplied, voltage or input signal is applied, and the output of the result is measured.

為獲得良品的電子零組件,至少有良好的組裝及檢查等的必要。因此,在各種處理時電子零組件的定 位重要。例如,電子零組件從正規位置偏離導致電極與端子的接觸不良時,不能進行精度高的電特性檢查。但是,電子零組件是例如藉著振動以一定的方向及整列姿勢的振動式供料方式供應電子零組件至搬運路徑,被吸附噴嘴吸引而循著搬運路徑進行各種處理,或以輸送機一邊移送並進行各種處理,但並非必需與正規位置一致的姿勢進行搬運,或維持一貫與正規位置一致的姿勢。 In order to obtain good electronic components, at least good assembly and inspection are necessary. Therefore, in the various processing, the electronic components are fixed. Important. For example, when the electronic component is deviated from the normal position and the contact between the electrode and the terminal is poor, the electrical property inspection with high accuracy cannot be performed. However, the electronic component supplies the electronic component to the conveyance path by, for example, vibrating feeding in a certain direction and a column posture by vibration, and is sucked by the adsorption nozzle to perform various processes along the conveyance path, or is transferred by the conveyor side. Various treatments are performed, but it is not necessary to carry them in a posture that is consistent with a normal position, or to maintain a posture that consistent with a regular position.

為此,在各種處理之前多以位置校正裝置來校正電子零組件的位置。位置校正裝置自以往即有匯集方式與滑落方式。匯集方式是在位置校正用的載台上載放電子零組件,藉著從四方延伸的引導部使電子零組件向載台中心靠攏(參閱專利文獻1)。採用該匯集方式的位置校正裝置具有動力源的馬達,及將馬達的旋轉轉換成直線運動的凸輪機構,各引導部是與從動凸輪連結。又,滑落方式是將電子零組件抵接嵌入具有方形凹部的孔,藉著孔的內壁取得與正規位置一致的姿勢的電子零組件(參閱專利文獻2)。 To this end, the position of the electronic component is corrected by the position correcting means before various processes. The position correction device has a collection method and a slide method since the past. In the collection method, the electronic component is placed on the stage for position correction, and the electronic component is brought closer to the center of the stage by the guide portion extending from the square (see Patent Document 1). The position correcting device using the collecting method includes a motor of a power source and a cam mechanism that converts the rotation of the motor into a linear motion, and each of the guide portions is coupled to the driven cam. In addition, the slipping method is an electronic component in which an electronic component is abutted in a hole having a square recess, and a posture conforming to a normal position is obtained by the inner wall of the hole (see Patent Document 2).

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

專利文獻1:日本特開2009-26936號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-26936

專利文獻2:日本特開2005-203711號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2005-203711

近年來,電氣製品的需要是以世界性規模地增大,而要求電子零組件的生產速度進一步的提升。針對以組裝工程或檢查工程進行的電子零組件之位置校正的處理也不例外,期待位置校正所需時間的進一步短縮。 In recent years, the demand for electrical products has increased on a worldwide scale, and the production speed of electronic components has been further increased. The processing for position correction of electronic components by assembly engineering or inspection engineering is no exception, and the time required for position correction is expected to be further shortened.

採用匯集方式的位置校正裝置是在馬達與引導部之間具有凸輪機構等的各種的傳達機構。各傳達機構是使得一構件的物理動作對其他構件的物理動作產生影響而達成力的傳達。為此,使各構件不固定地動作時,會導致遊隙等有某程度不穩定性的必要。此不穩定性對傳達機構的反應性會產生限制,即使以超過反應性的速度運轉,其他構件仍不能追隨一構件的動作而不能正確地傳達動力。因此,在採用匯集方式的位置校正裝置中成為動力源的馬達的旋轉速度會受到限制,使得電子零組件的位置校正所需時間的短縮有所限制。 The position correcting device using the collecting method is a variety of transmitting mechanisms such as a cam mechanism between the motor and the guide portion. Each communication mechanism is a communication that achieves a force by causing physical actions of one component to affect the physical actions of other components. For this reason, when the members are not fixedly operated, it is necessary to have a certain degree of instability such as play. This instability imposes limitations on the responsiveness of the communication mechanism. Even if it is operated at a speed exceeding the reactivity, other members cannot follow the action of one member and cannot properly transmit the power. Therefore, the rotational speed of the motor that becomes the power source in the position correcting device using the collecting mode is limited, so that the shortening of the time required for the positional correction of the electronic component is limited.

採用滑落方式的位置校正裝置中,在具有方形凹部的孔內電子零組件插入速度提高時,位置校正所需的時間可以短縮。但是,電子零組件一邊與方形凹部磨擦進行位置校正,因此一旦提高插入速度時電子零組件容易造成損傷。在不損傷執行位置校正時,不得不限制插入速度,因此採用滑落方式的位置校正裝置在位置校正所需時間的短縮也受到限制。 In the position correcting device using the slipping method, when the insertion speed of the electronic component is increased in the hole having the square recess, the time required for the position correction can be shortened. However, the electronic component is positionally corrected while rubbing against the square recess, so that the electronic component is liable to be damaged once the insertion speed is increased. When the position correction is performed without damaging, the insertion speed has to be limited, and therefore the shortening of the time required for the position correction by the position correcting device using the slip mode is also limited.

本發明是為解決如上述的問題點所研創而 成,以提供不增加施於電子零組件的物理應力,可縮短電子零組件的位置校正所需時間之位置校正裝置及具備該位置校正裝置的電子零組件搬運裝置為目的。 The present invention is to solve the problem as described above. The present invention provides a position correcting device capable of shortening the time required for position correction of an electronic component and an electronic component carrying device including the position correcting device without increasing the physical stress applied to the electronic component.

本發明相關的位置校正裝置是電子零組件的位置校正裝置,其特徵為,具備:使轉軸旋轉的馬達;軸支在上述轉軸,藉上述馬達旋轉的底座;及形成於上述底座上,比上述電子零組件更寬,收納電子零組件的孔部,上述馬達是使轉軸朝著順時鐘方向及逆時鐘方向旋轉,上述底座是朝順時鐘方向及逆時鐘方向旋轉,上述孔部是形成在與上述轉軸偏位的位置,藉上述馬達擺動,以該孔部的邊緣將內部的上述電子零組件引導至預定的正規位置,引導上述電子零組件之相對兩邊的孔部的兩邊緣較該相對兩邊所成的角度僅分開預定角度α量,引導上述電子零組件一方之相對邊的一方邊緣是藉著上述馬達進行順時鐘方向的旋轉,追隨上述正規位置的一邊,引導上述電子零組件另一方之相對邊的另一方邊緣是藉著上述馬達進行逆時鐘方向的旋轉,追隨與上述正規位置之上述一邊的相對邊。 A position correcting device according to the present invention is a position correcting device for an electronic component, comprising: a motor that rotates a rotating shaft; a base that is pivoted on the rotating shaft and rotated by the motor; and is formed on the base, The electronic component is wider, and the hole of the electronic component is accommodated. The motor rotates the rotating shaft in a clockwise direction and a counterclockwise direction, and the base rotates in a clockwise direction and a counterclockwise direction, and the hole is formed in the The position of the above-mentioned rotating shaft is deflected by the motor, and the inner electronic component is guided to a predetermined normal position by the edge of the hole, and the two edges of the opposite side of the electronic component are guided to the opposite sides. The angle formed is separated by only a predetermined angle α, and one edge of the opposite side of the electronic component is guided to rotate clockwise by the motor, and the other side of the normal position is guided to guide the other side of the electronic component. The other side of the opposite side is rotated in the counterclockwise direction by the above motor, following the above regular The opposite side of the facing edges.

上述孔部也可以是在電子零組件收納之前及脫離之前,使引導上述電子零組件一方的相對邊之一方的邊緣成為從引導的上述正規位置的一邊僅旋轉預定角度β量的狀態,上述預定角度β<預定角度α。 The hole portion may be in a state in which one of the opposite sides guiding the one side of the electronic component is rotated by only a predetermined angle β from one side of the normal position to be guided before and after the electronic component is stored. Angle β < predetermined angle α.

上述孔部也可以是貫穿上述底座形成,位於上述底座的下層,形成上述孔部的底面,進一步具備位置不動的載台。 The hole portion may be formed through the base, and may be located on a lower layer of the base to form a bottom surface of the hole portion, and further include a stage that does not move.

上述孔部也可與邊緣及底面成一體,以旋轉移動使上述電子零組件藉著慣性使上述底面滑動而與上述邊緣抵接。 The hole portion may be integrally formed with the edge and the bottom surface, and the rotation of the electronic component causes the electronic component to slide against the edge by inertia.

上述孔部,也可以具有:角,及抵接於上述電子零組件的邊,並與上述角接觸的兩個邊緣,在上述角具有使上述孔部擴張所成的異物滯留部。 The hole portion may have an angle, and two edges that are in contact with the side of the electronic component and that are in contact with the corner, and have a foreign matter retention portion formed by expanding the hole portion at the corner.

又,本發明相關的電子零組件搬運裝置,係一邊搬運電子零組件並進行工程處理的電子零組件搬運裝置,其特徵為,具備:上述電子零組件的搬運路徑;保持上述電子零組件沿著上述搬運路徑間歇移動的保持手段;配置在上述搬運路徑上的一地點,對上述電子零組件進行各種處理的各種處理單元;及配置在上述搬運路徑上的一地點,為了上述處理單元,進行上述電子零組件之位置校正的位置校正單元,上述位置校正單元,包括:使上述轉軸旋轉的馬達;軸支於上述轉軸,藉上述馬達旋轉的底座;及形成在上述底座上,比上述電子零組件更寬,收納電子零組件的孔部,上述孔部是在上述搬運路徑的正下方,形成在與上述轉軸偏位的位置,藉上述保持手段將上述電子零組件插入內部,並藉上述馬達移動,藉著該孔部的邊緣將內部的上述電子零組件引導至預定的正規位置, 引導上述電子零組件之相對兩邊的孔部的兩邊緣較該相對兩邊所成的角度僅分開預定角度α量,引導上述電子零組件一方之相對邊的一方邊緣是藉著上述馬達進行順時鐘方向的旋轉,追隨上述正規位置的一邊,引導上述電子零組件另一方之相對邊的另一方邊緣是藉著上述馬達進行逆時鐘方向的旋轉,追隨與上述正規位置之上述一邊的相對邊。 Further, an electronic component transporting apparatus according to the present invention is an electronic component transporting apparatus that transports an electronic component and performs engineering processing, and includes: a transport path of the electronic component; and the electronic component is held along a holding means for intermittently moving the transport path; a plurality of processing units for performing various processes on the electronic component at a place on the transport path; and a place disposed on the transport path, wherein the processing unit performs the above a position correcting unit for correcting the position of the electronic component, the position correcting unit comprising: a motor for rotating the rotating shaft; a base pivotally supported by the motor on the rotating shaft; and being formed on the base than the electronic component Further, the hole portion for accommodating the electronic component is formed at a position deviated from the rotation axis directly under the conveyance path, and the electronic component is inserted into the inside by the holding means, and is moved by the motor Leading the internal electronic components described above by the edge of the hole Predetermined regular position, The angle between the two edges of the opposite side portions of the electronic component is separated by the predetermined angle α from the opposite sides, and one edge of the opposite side of the electronic component is guided by the motor to be clockwise. The rotation follows the one of the normal positions, and the other edge of the opposite side of the electronic component is guided to rotate in the counterclockwise direction by the motor, and follows the opposite side of the normal position.

上述保持手段也可以使上述電子零組件從上述孔部的底面浮起的狀態,維持保持著,上述孔部是藉該孔部的邊緣使上述電子零組件相對於上述保持手段上升,引導至上述正規位置。 The holding means may maintain the electronic component in a state of being floated from the bottom surface of the hole portion, and the hole portion raises the electronic component with respect to the holding means by the edge of the hole portion, and guides the above to the above Regular location.

根據本發明,在電子零組件的位置校正時,只需擺動孔部即可,可減少傳達馬達的旋轉,或進行力的方向轉換用的傳達機構的數量,因此孔部擺動動作的反應性非常地高,可縮短位置校正所需的時間。 According to the present invention, it is only necessary to swing the hole portion when correcting the position of the electronic component, and it is possible to reduce the number of transmission mechanisms for transmitting the rotation of the motor or for changing the direction of the force. Therefore, the reactivity of the hole swinging operation is very high. The ground height reduces the time required for position correction.

1‧‧‧位置校正裝置 1‧‧‧ position correction device

11‧‧‧孔部 11‧‧‧ Hole Department

11a‧‧‧第1邊緣 11a‧‧‧1st edge

11b‧‧‧第2邊緣 11b‧‧‧2nd edge

11c‧‧‧第3邊緣 11c‧‧‧3rd edge

11d‧‧‧第4邊緣 11d‧‧‧4th edge

11e‧‧‧角 11e‧‧‧ corner

11f‧‧‧角 11f‧‧‧ corner

11g‧‧‧異物滯留部 11g‧‧‧ Foreign Body Retention Department

12‧‧‧正規位置 12‧‧‧Regular location

13‧‧‧塊體 13‧‧‧ Block

14‧‧‧底座 14‧‧‧Base

15‧‧‧馬達 15‧‧‧Motor

16‧‧‧轉軸 16‧‧‧ shaft

17‧‧‧載台 17‧‧‧ stage

2‧‧‧電子零組件搬運裝置 2‧‧‧Electronic component handling device

21‧‧‧搬運路徑 21‧‧‧Transportation path

22‧‧‧保持部 22‧‧‧ Keeping Department

23‧‧‧轉台 23‧‧‧ turntable

24‧‧‧直接驅動馬達 24‧‧‧Direct drive motor

25‧‧‧進退驅動部 25‧‧‧Advance and Rescue Drive Department

25a‧‧‧致動器 25a‧‧‧Actuator

25b‧‧‧桿 25b‧‧‧ pole

25c‧‧‧壓縮彈簧 25c‧‧‧Compressed spring

3‧‧‧處理單元 3‧‧‧Processing unit

4‧‧‧電子零組件 4‧‧‧Electronic components

第1圖為第1實施形態相關之定位裝置的透視圖。 Fig. 1 is a perspective view of a positioning device according to a first embodiment.

第2圖是從開口側顯示第1實施形態相關的孔部的平面圖。 Fig. 2 is a plan view showing a hole portion according to the first embodiment from the opening side.

第3圖是表示第1實施形態相關之孔部的第1動作過 程的平面圖。 Fig. 3 is a view showing the first operation of the hole portion according to the first embodiment. Plan of the process.

第4圖是表示第1實施形態相關之孔部的第2動作過程的平面圖。 Fig. 4 is a plan view showing a second operation process of the hole portion according to the first embodiment.

第5圖是表示第1實施形態相關之孔部的第3動作過程的平面圖。 Fig. 5 is a plan view showing a third operation process of the hole portion according to the first embodiment.

第6圖是表示第1實施形態相關之孔部的第4動作過程的平面圖。 Fig. 6 is a plan view showing a fourth operation process of the hole portion according to the first embodiment.

第7圖為第1實施形態相關之電子零組件搬運裝置的上面圖。 Fig. 7 is a top view of the electronic component conveying device according to the first embodiment.

第8圖為第1實施形態相關之電子零組件搬運裝置的側面圖。 Fig. 8 is a side view showing the electronic component conveying device according to the first embodiment.

第9圖是表示在第2實施形態相關之電子零組件搬運裝置中電子零組件插入孔部時的狀態的剖面圖。 FIG. 9 is a cross-sectional view showing a state in which an electronic component is inserted into a hole portion in the electronic component conveying device according to the second embodiment.

第10圖是表示在第2實施形態相關之電子零組件搬運裝置中藉孔部引導電子零組件的樣態的剖面圖。 Fig. 10 is a cross-sectional view showing a state in which an electronic component is guided by a hole portion in the electronic component conveying device according to the second embodiment.

第11圖為第3實施形態相關之定位裝置的孔部附近的剖面圖。 Fig. 11 is a cross-sectional view showing the vicinity of a hole portion of the positioning device according to the third embodiment.

以下,一邊參閱圖示並詳細說明本發明相關之位置校正裝置及具備該位置校正裝置的電子零組件搬運裝置的第1至第3實施形態。 Hereinafter, the first to third embodiments of the position correcting device according to the present invention and the electronic component conveying device including the position correcting device will be described in detail with reference to the drawings.

(第1實施形態) (First embodiment)

(位置校正裝置) (position correction device)

如第1圖表示,第1實施形態有關的位置校正裝置1是保持在保持部22將電子零組件4沿著搬運路徑21校正成正確姿勢。正確姿勢是在搬運路徑21執行各種處理時,電子零組件4被以正確的位置及方向安置在處理載台與所預先採取的保持部22的位置關係。將保持部22與處理載台預先定位,位置校正裝置1是將電子零組件4的中心與保持部22的中心對齊,將電子零組件4的方向校正成規定方向。藉此,保持部22將電子零組件4運至處理載台時,電子零組件4被以正確位置及方向載放於處理載台。 As shown in Fig. 1, the position correcting device 1 according to the first embodiment holds the holding unit 22 to correct the electronic component 4 along the transport path 21 to the correct posture. The correct posture is that when the transportation path 21 performs various processes, the electronic component 4 is placed in the correct position and orientation in the positional relationship between the processing stage and the pre-taken holding portion 22. The holding portion 22 and the processing stage are positioned in advance, and the position correcting device 1 aligns the center of the electronic component 4 with the center of the holding portion 22, and corrects the direction of the electronic component 4 to a predetermined direction. Thereby, when the holding unit 22 transports the electronic component 4 to the processing stage, the electronic component 4 is placed on the processing stage in the correct position and direction.

電子零組件4具有0402尺寸(0.4mm×0.2mm)或0603尺寸(0.6mm×0.3mm)等的四角隅為直角的正方形或長方形。保持部22是保持電子零組件4在搬運路徑21移動的單元,例如吸附噴嘴、靜電夾頭、伯努利夾頭或機械式夾頭,藉吸引力、靜電力或物理卡合來保持電子零組件4,接受其他裝置的外力在搬運路徑21移動。 The electronic component 4 has a square or rectangular shape with a square angle of 0402 size (0.4 mm × 0.2 mm) or 0603 size (0.6 mm × 0.3 mm). The holding portion 22 is a unit that holds the electronic component 4 moving on the transport path 21, such as an adsorption nozzle, an electrostatic chuck, a Bernoulli chuck, or a mechanical chuck, and holds the electron zero by attraction, electrostatic force, or physical engagement. The assembly 4 receives an external force from another device and moves on the transport path 21.

位置校正裝置1是在搬運路徑21的正下方具備孔部11,將電子零組件4從保持部22短暫接受後收容於孔部11。孔部11具有朝向正上方的搬運路徑21的開口,以較電子零組件4更大的面積更寬而有底。該孔部11收容電子零組件4,在與深度正交的水平方向移動。 The position correcting device 1 includes a hole portion 11 directly under the conveyance path 21, and receives the electronic component 4 from the holding portion 22 for a short period of time, and then accommodates it in the hole portion 11. The hole portion 11 has an opening toward the transport path 21 directly above, which is wider and has a larger bottom area than the electronic component 4. The hole portion 11 houses the electronic component 4 and moves in a horizontal direction orthogonal to the depth.

電子零組件4是在擺動的孔11內依慣性的法則滑動,被孔部11的邊緣引導而靠近電子零組件4的正 規位置12(參閱第2圖)。正規位置12是將採正確姿勢的電子零組件4朝向孔部11投影的區域,與電子零組件4對應四角隅為直角且相對邊成平行的矩形。孔部11是調整設置處、形狀及移動範圍,使得與電子零組件4抵接的各邊緣擺動的結果分別沿著正規位置12的對應邊。因此,在以邊緣進行的引導過程,將電子零組件4校正成正規位置12。在吸引電子零組件4的過程,電子零組件4的邊緣沿著孔部11的邊緣對齊,也可矯正電子零組件4的方向。 The electronic component 4 slides in the oscillating hole 11 by the law of inertia, and is guided by the edge of the hole 11 to approach the positive of the electronic component 4. Position 12 (see Figure 2). The normal position 12 is a region in which the electronic component 4 in the correct posture is projected toward the hole portion 11, and the electronic component 4 corresponds to a rectangle in which the four corners are at right angles and the opposite sides are parallel. The hole portion 11 is an adjustment setting place, a shape, and a movement range such that the edges of the edges abutting on the electronic component 4 are respectively along the corresponding sides of the normal position 12. Therefore, the electronic component 4 is corrected to the normal position 12 during the guiding process by the edge. In the process of attracting the electronic component 4, the edges of the electronic component 4 are aligned along the edge of the hole 11, and the direction of the electronic component 4 can also be corrected.

該位置校正裝置1具備將平面朝向搬運路徑21的圓筒狀的底座14及使該底座14旋轉的馬達15。底座14是將平面正交軸支於馬達15的轉軸16。孔部11是形成在底座14的平面,將開口朝向搬運路徑21側。孔部11也可以是藉著圍繞一區域組裝豎立於底座14平面的四個塊體13,形成圍繞塊體13的空間,也可在底座14的平面凹設形成。 The position correcting device 1 includes a cylindrical base 14 that faces a conveyance path 21 and a motor 15 that rotates the base 14. The base 14 is a rotating shaft 16 that supports a plane orthogonal to the motor 15. The hole portion 11 is formed on the plane of the chassis 14 and faces the opening toward the conveyance path 21 side. The hole portion 11 may also be formed by assembling four blocks 13 standing on the plane of the base 14 around a region to form a space surrounding the block 13, or may be recessed in the plane of the base 14.

如第2圖表示,孔部11是形成在從轉軸16偏位的位置。馬達15是移動底座14。因此,孔部11也以轉軸16為中心移動。孔部11是包括電子零組件4的正規位置12的區域,也可以藉著擺動將各處放大以經常完全地包含正規位置12。 As shown in Fig. 2, the hole portion 11 is formed at a position deviated from the rotating shaft 16. The motor 15 is a moving base 14. Therefore, the hole portion 11 also moves around the rotation shaft 16. The hole portion 11 is an area including the regular position 12 of the electronic component 4, and may be enlarged by swing to often completely include the regular position 12.

電子零組件4也有從正規位置12朝轉軸16的順時鐘方向偏位的可能性,也有朝著逆時鐘方向偏位的可能性。馬達15一旦將底座14朝著逆時鐘方向旋轉時,孔 部11朝著逆時鐘方向旋轉移動,使得朝順時鐘方向偏位的電子零組件4追隨正規位置12。馬達15一旦將底座14朝著順時鐘方向旋轉時,孔部11朝著順時鐘方向旋轉移動,使得朝逆時鐘方向偏位的電子零組件4追隨正規位置12。 The electronic component 4 also has the possibility of being offset from the normal position 12 toward the clockwise direction of the rotary shaft 16, and may also be biased toward the counterclockwise direction. When the motor 15 rotates the base 14 in the counterclockwise direction, the hole The portion 11 is rotationally moved in the counterclockwise direction such that the electronic component 4 that is offset toward the clockwise direction follows the normal position 12. When the motor 15 rotates the chassis 14 in the clockwise direction, the hole portion 11 is rotationally moved in the clockwise direction, so that the electronic component 4 offset in the counterclockwise direction follows the normal position 12.

位置校正裝置1在可預先辨識電子零組件4朝著順時鐘方向或逆時鐘方向的一方偏位的場合,只需將孔部11朝著與電子零組件4的偏位方向相反側旋轉移動即可。例如,位置校正裝置1具備可檢測電子零組件4的偏位的攝影機等,將孔部11朝著與電子零組件4的偏位方向的相反側旋轉移動。 When the position correcting device 1 can recognize in advance that the electronic component 4 is biased toward the clockwise direction or the counterclockwise direction, it is only necessary to rotate the hole portion 11 toward the side opposite to the offset direction of the electronic component 4. can. For example, the position correcting device 1 includes a camera or the like that can detect the deviation of the electronic component 4, and rotates the hole portion 11 toward the side opposite to the offset direction of the electronic component 4.

又,馬達15也可以將底座14朝著順時鐘方向及逆時鐘方向旋轉,使孔部11往返擺動。無需檢測電子零組件4的偏位方向,即可以使電子零組件4追隨正規位置12。 Further, the motor 15 may rotate the chassis 14 in the clockwise direction and the counterclockwise direction to swing the hole portion 11 back and forth. It is not necessary to detect the misalignment direction of the electronic component 4, that is, the electronic component 4 can follow the normal position 12.

該孔部11至少具有對應電子零組件4的四方各邊的四個邊緣11a、11b、11c及11d。邊緣11a與11b的組與邊緣11c與11d的組是夾著正規位置12相對。其他的邊緣是在不阻礙電子零組件4的程度後退到從正規位置12分開的位置。亦即,孔部11具有四角形以上的多角形形狀。四個邊緣以外也可具備彎曲部份。 The hole portion 11 has at least four edges 11a, 11b, 11c, and 11d corresponding to the four sides of the electronic component 4. The set of edges 11a and 11b and the set of edges 11c and 11d are opposed to each other with a normal position 12. The other edges are retracted to a position separated from the regular position 12 to the extent that they do not obstruct the electronic component 4. That is, the hole portion 11 has a polygonal shape of a quadrangular shape or more. Curved parts are also available outside the four edges.

首先,孔部11具有與一處的角11e接觸的第1邊緣11a與第2邊緣11b。又,孔部11具有從角11e通過孔部11的中心與位在對角的其他處的角11f接觸的第3 邊緣11c與第4邊緣11d。角11e、11f為直角。第1邊緣11a與第3邊緣11c是較從轉軸16分開的方向平行僅擴開預定角度α。又,第2邊緣11b與第4邊緣11d也僅較平行僅擴開預定角度α。 First, the hole portion 11 has a first edge 11a and a second edge 11b which are in contact with the corner 11e at one place. Further, the hole portion 11 has the third contact from the corner 11e through the center of the hole portion 11 and the corner 11f located at the other corner of the diagonal The edge 11c and the fourth edge 11d. The corners 11e and 11f are right angles. The first edge 11a and the third edge 11c are expanded by a predetermined angle α in parallel with the direction separated from the rotation shaft 16. Further, the second edge 11b and the fourth edge 11d are also expanded only by a predetermined angle α only in parallel.

孔部11是調整方向及大小,朝逆時鐘方向旋繞時,使第1邊緣11a追隨正規位置12的邊ab,朝順時鐘方向旋繞時,使第3邊緣11c追隨正規位置12的邊ab相對的邊cd。換言之,孔部11是調整方向及大小,朝逆時鐘方向旋繞時,使第2邊緣11b追隨正規位置12的邊ab,朝順時鐘方向旋繞時,使第4邊緣11d追隨正規位置12的邊bc。 When the hole portion 11 is adjusted in the direction and size and is wound in the counterclockwise direction, when the first edge 11a follows the side ab of the normal position 12 and is wound in the clockwise direction, the third edge 11c follows the side ab of the normal position 12. Side cd. In other words, when the hole portion 11 is adjusted in the direction and size and is wound in the counterclockwise direction, when the second edge 11b follows the side ab of the normal position 12 and is wound in the clockwise direction, the fourth edge 11d follows the side bc of the regular position 12. .

又,該孔部11在與電子零組件4抵接的邊緣的角隅,例如將第1緣11a與第2緣11b對接所成的角11e具有異物滯留部11g。異物滯留部11g是捕獲與塵埃等的電子零組件4不同的異物的空間,使孔部11變寬地將與電子零組件4抵接的邊緣的角隅擴張所形成。該異物滯留部11g可形成於第1緣11a與第2緣11b對接的角11e、第3緣11c與第4緣11d對接的角11f或其雙方。 Further, the hole portion 11 has a foreign matter retention portion 11g at a corner 11e formed by abutting the first edge 11a and the second edge 11b at a corner of the edge abutting on the electronic component 4. The foreign matter retention portion 11g is a space for trapping foreign matter different from the electronic component 4 such as dust, and is formed by expanding the corner portion of the edge that abuts on the electronic component 4 by widening the hole portion 11. The foreign matter retention portion 11g can be formed at an angle 11e where the first edge 11a and the second edge 11b abut, and an angle 11f where the third edge 11c and the fourth edge 11d abut each other.

根據第3圖至第6圖說明如以上的位置校正裝置1的具體動作。如第3圖表示,孔部11是以第1緣11a從正規位置12的一邊ab朝著順時鐘方向僅旋繞角度β的位置為初期狀態。角度β<角度α。僅預先旋繞角度β是為可將位置偏移的電子零組件4不與孔部11的邊緣衝突地進行收納。該初期狀態中,孔部11的各邊緣11a、 11b、11c及11d是從正規位置12分開。因此,電子零組件4不與孔部11的邊緣接觸,可進入孔部11內。 The specific operation of the position correcting device 1 as described above will be described based on Figs. 3 to 6 . As shown in Fig. 3, the hole portion 11 is an initial state in which the first edge 11a is rotated from the one side ab of the normal position 12 toward the clockwise direction by only the angle β. Angle β < angle α. Only the pre-winding angle β is such that the electronic component 4 that can shift the position does not collide with the edge of the hole portion 11. In the initial state, each edge 11a of the hole portion 11 is 11b, 11c and 11d are separated from the regular position 12. Therefore, the electronic component 4 does not come into contact with the edge of the hole portion 11, and can enter the hole portion 11.

接著,如第4圖表示,馬達15是從孔部11的初期狀態,將孔部11朝著逆時鐘方向僅以第1緣11a和正規位置12的一邊ab一致的角度β旋繞。此時,電子零組件4朝著順時鐘方向從正規位置12偏位的場合,電子零組件4在孔部11內滑動,抵接於迎面而來的第1緣11a與第2緣11b,進一步被旋繞的第1緣11a與第2緣11b壓入正規位置12。 Next, as shown in FIG. 4, the motor 15 is in an initial state from the hole portion 11, and the hole portion 11 is wound in the counterclockwise direction only at an angle β at which the first edge 11a and the one side ab of the normal position 12 coincide. At this time, when the electronic component 4 is displaced from the normal position 12 in the clockwise direction, the electronic component 4 slides in the hole portion 11 and comes into contact with the first edge 11a and the second edge 11b which are oncoming, and further The first edge 11a and the second edge 11b that are wound are pressed into the normal position 12.

另外,如第5圖表示,馬達15將孔部11朝著順時鐘方向僅以第1緣11a和第3緣11c的開角α旋繞,使第3緣11c追隨正規位置12的相對邊cd。此時,電子零組件4朝著逆時鐘方向從正規位置12偏位的場合,電子零組件4在孔部11內滑動,抵接於迎面而來的第3緣11c與第4緣11d,進一步被旋繞的第3緣11c與第4緣11d壓入正規位置12。 Further, as shown in Fig. 5, the motor 15 winds the hole portion 11 only in the clockwise direction by the opening angle α of the first edge 11a and the third edge 11c, and causes the third edge 11c to follow the opposite side cd of the regular position 12. At this time, when the electronic component 4 is displaced from the normal position 12 in the counterclockwise direction, the electronic component 4 slides in the hole portion 11, and abuts against the oncoming third edge 11c and the fourth edge 11d, and further The third edge 11c and the fourth edge 11d that are wound are pressed into the normal position 12.

並且,如第6圖表示,馬達15將孔部11朝著逆時鐘方向僅以角度(α-β)量旋繞,使孔部11回到初期狀態,解除正規位置12的電子零組件4與孔部11的第3緣11c及第4緣11d的卡合。此後,藉保持部22再度保持電子零組件4,從孔部11脫離。 Further, as shown in Fig. 6, the motor 15 rotates the hole portion 11 by an angle (α - β) in the counterclockwise direction, returns the hole portion 11 to the initial state, and releases the electronic component 4 and the hole at the regular position 12. The third edge 11c and the fourth edge 11d of the portion 11 are engaged. Thereafter, the holding unit 22 holds the electronic component 4 again and is detached from the hole portion 11.

該一連續的驅動時,如在孔部11存在有異物時,異物被以第1緣11a與第2緣11b引導至異物滯留部11g,貯留於異物滯留部11g。因此,異物被從電子零組 件4的正規位置12除去,可抑制附著於接下來收納的電子零組件4。 When there is a foreign matter in the hole portion 11 during the continuous driving, the foreign matter is guided to the foreign matter retention portion 11g by the first edge 11a and the second edge 11b, and is stored in the foreign matter retention portion 11g. Therefore, foreign matter is taken from the electronic zero group The regular position 12 of the member 4 is removed, and adhesion to the electronic component 4 to be accommodated next can be suppressed.

(電子零組件搬運裝置) (electronic component handling device)

針對如以上的位置校正裝置1的電子零組件搬運裝置說明。 The electronic component handling device of the position correcting device 1 as described above will be described.

第7圖為電子零組件搬運裝置的上面圖,第8圖為電子零組件搬運裝置的側面圖。 Fig. 7 is a top view of the electronic component handling device, and Fig. 8 is a side view of the electronic component handling device.

第7及8圖表示的電子零組件搬運裝置2具備保持部22,搬運電子零組件4。該電子零組件搬運裝置2具有:轉台23,及間歇旋轉該轉台23的直接驅動馬達24。沿著轉台23的外圍以圓周等配位置安裝有複數個保持部22。搬運路徑21是藉著該轉台23的旋轉所形成,換言之,藉轉台23旋轉之保持部22的移動軌跡。保持部22的配置間隔與轉台23之一間距的旋轉角度相等,所有的保持部22依序停止在各角度的相同停止位置。 The electronic component conveying device 2 shown in FIGS. 7 and 8 includes a holding portion 22 for carrying the electronic component 4. The electronic component conveying device 2 has a turntable 23 and a direct drive motor 24 that intermittently rotates the turntable 23. A plurality of holding portions 22 are attached to the periphery of the turntable 23 at a circumferential position or the like. The conveyance path 21 is formed by the rotation of the turntable 23, in other words, the movement locus of the holding portion 22 rotated by the turntable 23. The arrangement interval of the holding portions 22 is equal to the rotation angle of one of the turns of the turntable 23, and all the holding portions 22 are sequentially stopped at the same stop position of each angle.

保持部22具有和轉台23的擴開平面正交的軸,從轉台23朝向下方垂下。轉台23在外緣具有軸承,保持部22可上下移動地被支撐於該軸承。保持部22是例如吸附噴嘴。吸附噴嘴為內部是中空的管。管內部是透過未圖示的真空產生裝置的氣壓迴路與軟管連通。該吸附噴嘴所成的保持部22是藉真空產生裝置之負壓的產生來吸附電子零組件4,以真空破壞將電子零組件4脫離。 The holding portion 22 has an axis orthogonal to the expansion plane of the turntable 23, and is suspended downward from the turntable 23. The turntable 23 has a bearing on the outer edge, and the holding portion 22 is supported by the bearing so as to be movable up and down. The holding portion 22 is, for example, an adsorption nozzle. The adsorption nozzle is a hollow tube inside. The inside of the tube communicates with the hose through a pneumatic circuit of a vacuum generating device (not shown). The holding portion 22 formed by the adsorption nozzle adsorbs the electronic component 4 by the generation of the negative pressure of the vacuum generating device, and detaches the electronic component 4 by vacuum destruction.

位置校正裝置1是設置在轉台23的外緣正下 方,以使得孔部11位於保持部22之停止位置的正下方。夾著搬運路徑21在與孔部11的相反側,設有進退驅動部25。進退驅動部25具備:將保持部22向下方推出的桿25b,及對該桿25b賦予推力的致動器25a。進退驅動部25使致動器25a動作將桿25b朝著保持部22前進使得桿25b的前端與保持部22的後端抵接,並進一步使桿25b前進,朝向孔部11移動保持部22。並且,進退驅動部25進一步具備將保持部22朝著上方彈推的壓縮彈簧25c,解除致動器25a對於桿25b的推力賦予時,壓縮彈簧25c將保持部22推回到上方。 The position correcting device 1 is disposed directly below the outer edge of the turntable 23 The square is such that the hole portion 11 is located directly below the stop position of the holding portion 22. The advancing and retracting drive unit 25 is provided on the side opposite to the hole portion 11 with the conveyance path 21 interposed therebetween. The advancing and retracting drive unit 25 includes a lever 25b that pushes the holding portion 22 downward, and an actuator 25a that applies a thrust to the lever 25b. The advancing and retracting drive unit 25 operates the actuator 25a to advance the rod 25b toward the holding portion 22 such that the tip end of the rod 25b abuts against the rear end of the holding portion 22, and further advances the rod 25b to move the holding portion 22 toward the hole portion 11. Further, the advancing and retracting drive unit 25 further includes a compression spring 25c that pushes the holding portion 22 upward, and when the thrust of the lever 25b is released by the actuator 25a, the compression spring 25c pushes the holding portion 22 upward.

轉台23的周圍,除了位置校正裝置1之外,將各種的處理單元3配置在保持部22的停止位置。作為處理單元3,例如舉例有比位置校正裝置1配置在搬運方向更下游側的測試單元、供料器、標記單元、外觀檢查單元、分類等級單元、纏帶單元、不良品排出單元等。 In addition to the position correcting device 1, around the turntable 23, various processing units 3 are disposed at the stop position of the holding portion 22. As the processing unit 3, for example, a test unit, a feeder, a marking unit, an appearance inspection unit, a classification level unit, a tape winding unit, a defective product discharge unit, and the like, which are disposed on the downstream side in the conveyance direction, are exemplified.

測試單元具備對電子零組件4通電用的觸點。在藉著位置校正裝置1正確校正電子零組件4與保持部22的位置關係的狀態,電子零組件4的電極與觸點接觸。該測試單元是電流透過觸點流動於電子零組件4,或施加電壓,測量電子零組件4的電壓、電流、電阻或頻率等的電特性。 The test unit has contacts for energizing the electronic components 4. In a state where the positional relationship between the electronic component 4 and the holding portion 22 is correctly corrected by the position correcting device 1, the electrodes of the electronic component 4 are in contact with the contacts. The test unit is a current flowing through the contact member to the electronic component 4, or applying a voltage to measure electrical characteristics such as voltage, current, resistance or frequency of the electronic component 4.

供料器是朝電子零組件搬運裝置2供應電子零組件4的裝置。該供料器是例如組合圓形的振動供料器與直線型的供應振動反饋器,整列多數的電子零組件4連續 搬運至轉台23的外圍端正下方的搬運路徑21終端為止。 The feeder is a device that supplies the electronic component 4 to the electronic component handling device 2. The feeder is, for example, a combined circular vibrator and a linear supply vibration feedback device, and the entire series of electronic components 4 are continuous It is conveyed to the end of the conveyance path 21 immediately below the peripheral end of the turntable 23.

標記單元是鄰接於電子零組件4具有雷射照設用的透鏡,將雷射照射於電子零組件4進行標記。相對於藉位置校正裝置1正確校正與保持部22的位置關係的電子零組件4,在正確的位置及範圍進行標記。外觀檢查單元具有攝影機,攝影電子零組件4,從影像檢查電子零組件4的電極形狀、表面的缺陷、損傷、髒污、異物等的有無。分類等級單元是根據電特性及外觀檢查的結果將電子零組件4分類成不良品與良品,根據其等級分類排出。纏帶單元是收納判定為良品的電子零組件4。不良品排出單元是將未纏帶捆包的電子零組件4從電子零組件搬運裝置2排出。 The marking unit is a lens for laser illumination adjacent to the electronic component 4, and the laser is irradiated onto the electronic component 4 for marking. The electronic component 4 that correctly corrects the positional relationship with the holding portion 22 with respect to the borrowing position correcting device 1 is marked at the correct position and range. The visual inspection unit includes a camera and a photographing electronic component 4, and checks the electrode shape of the electronic component 4, the surface defects, damage, dirt, foreign matter, and the like from the image. The classification level unit classifies the electronic components 4 into defective products and good products based on the electrical characteristics and visual inspection results, and discharges them according to their classification. The tape wrapping unit is an electronic component 4 that is judged to be a good product. The defective product discharge unit discharges the unwrapped electronic component 4 from the electronic component conveying device 2.

該電子零組件搬運裝置2是以保持部22保持從供料器所供應的電子零組件4,循各處理單元3沿著搬運路徑21搬運電子零組件4。保持電子零組件4的保持部22到達位置校正裝置1的正上方停止時,進退驅動部25將保持部22朝向位置校正裝置1推出。保持部22是藉著進退驅動部25朝著孔部11下降,一旦將電子零組件4插入孔部11時,使電子零組件4從孔部11內脫離。保持部22為吸附噴嘴的場合,藉真空破壞或大氣破壞來解除吸引力時,將電子零組件4載放於孔部11的底部。 The electronic component conveying device 2 holds the electronic components 4 supplied from the feeder with the holding portion 22, and carries the electronic components 4 along the conveyance path 21 by the respective processing units 3. When the holding portion 22 of the electronic component 4 is stopped and stopped right above the position correcting device 1, the advancing and retracting driving portion 25 pushes the holding portion 22 toward the position correcting device 1. The holding portion 22 is lowered toward the hole portion 11 by the advancing and retracting driving portion 25, and when the electronic component 4 is inserted into the hole portion 11, the electronic component 4 is detached from the inside of the hole portion 11. When the holding portion 22 is a suction nozzle, when the suction force is released by vacuum destruction or atmospheric destruction, the electronic component 4 is placed on the bottom of the hole portion 11.

電子零組件4一旦收容於孔部11時,位置校正裝置1使孔部11進行一往返擺動,進行將電子零組件4與正規位置12配合的位置校正。位置校正一旦完成 時,保持部22保持著孔部11內的電子零組件4。保持部22為吸附噴嘴的場合,藉真空產生裝置以吸附噴嘴的前端吸引電子零組件4。進退驅動部25是對保持電子零組件4的保持部22,解除桿25b產生的推進力,發揮壓縮彈簧25c的彈推力,使保持位置校正後的電子零組件4的保持部22上升。 When the electronic component 4 is housed in the hole portion 11, the position correcting device 1 causes the hole portion 11 to swing back and forth, and performs position correction for fitting the electronic component 4 to the normal position 12. Once the position correction is completed At this time, the holding portion 22 holds the electronic component 4 in the hole portion 11. When the holding portion 22 is a suction nozzle, the vacuum generating device sucks the electronic component 4 at the tip end of the adsorption nozzle. The advancing and retracting drive unit 25 lifts the holding force of the compression spring 25c to the holding portion 22 that holds the electronic component 4, and releases the holding force 22 of the electronic component 4 after the holding position is corrected.

位置校正後的電子零組件4在經過位置校正裝置1之後,成為依循測試單元、標記單元、外觀檢查單元、分類等級單元及纏帶單元。此時,與保持部22的位置關係正確校正後的電子零組件4也正確保持著與測試單元等的處理單元3的位置關係,進行具可靠度的處理。 After passing through the position correcting device 1, the position-corrected electronic component 4 becomes a follow-up test unit, a marking unit, an appearance inspection unit, a classification level unit, and a tape winding unit. At this time, the electronic component 4 that has been correctly corrected in the positional relationship with the holding portion 22 also correctly maintains the positional relationship with the processing unit 3 such as the test unit, and performs processing with reliability.

(作用效果) (Effect)

如以上說明,位置校正裝置1具備:順時鐘方向及逆時鐘方向旋轉轉軸16的馬達15,及藉馬達15形成在以轉軸16為中心的底座14上,比電子零組件16寬,收納電子零組件4的孔部11。孔部11是形成在與轉軸16偏位的位置,藉馬達15進行一往返擺動,利用該孔部11的邊緣引導內部的電子零組件4至預定位置。 As described above, the position correcting device 1 includes the motor 15 that rotates the rotating shaft 16 in the clockwise direction and the counterclockwise direction, and the motor 15 is formed on the base 14 centered on the rotating shaft 16, and is wider than the electronic component 16, and houses the electronic zero. The hole portion 11 of the assembly 4. The hole portion 11 is formed at a position offset from the rotating shaft 16, and is reciprocated by the motor 15, and the inner electronic component 4 is guided to the predetermined position by the edge of the hole portion 11.

該位置校正裝置1只要一往返旋轉移動孔部11即可,並無在形成有孔部11的底座14與馬達15之間多數設置傳達力,或變換力的方向之複數段的傳達機構的必要。為此,孔部11擺動動作的反應性變得非常高,可高速進行孔部11的擺動動作。因此,根據該位置校正裝 置1,可縮短位置校正所需的時間。 The position correcting device 1 only needs to reciprocate the moving hole portion 11, and it is not necessary to provide a communication force between the base 14 and the motor 15 in which the hole portion 11 is formed, or a plurality of transmission mechanisms for changing the direction of the force. . For this reason, the reactivity of the swing operation of the hole portion 11 is extremely high, and the swing operation of the hole portion 11 can be performed at high speed. Therefore, according to the position correction Set to 1 to shorten the time required for position correction.

又,孔部11是使得引導電子零組件4的相對兩邊的兩端,較此相對兩邊所成的角度更擴開預定角度量。並且,引導電子零組件4一方之相對邊的一方邊緣是藉著馬達15順時鐘方向的旋轉,追隨區劃正規位置12之上述電子零組件4所佔據區域的一邊,又,引導電子零組件4另一方之相對邊的另一方邊緣是藉著馬達15逆時鐘方向的旋轉,追隨區劃正規位置12的上述電子零組件4所佔據區域之上述一邊的相對邊。藉此,可精度良好地進行電子零組件4的位置及方向的位置校正。 Further, the hole portion 11 is such that both ends of the opposite sides of the electronic component 4 are guided, and the angle formed by the opposite sides is expanded by a predetermined angle. Further, one edge of the opposite side of the guiding electronic component 4 is rotated clockwise by the motor 15, and follows one side of the area occupied by the electronic component 4 of the regular position 12, and the electronic component 4 is guided. The other edge of the opposite side of the one side is rotated by the motor 15 in the counterclockwise direction, and follows the opposite side of the one side of the area occupied by the electronic component 4 at the regular position 12 of the division. Thereby, the positional correction of the position and direction of the electronic component 4 can be performed with high precision.

並且,孔部11是在與電子零組件4的邊抵接的兩個邊緣接觸的角11e,具有擴張孔部11所成的異物滯留部11g。藉此,將孔部11內的異物引導至異物滯留部11g,可防止附著於電子零組件4。 Further, the hole portion 11 is a corner 11e that is in contact with both edges abutting on the side of the electronic component 4, and has a foreign matter retention portion 11g formed by the expansion hole portion 11. Thereby, the foreign matter in the hole portion 11 is guided to the foreign matter retaining portion 11g, and adhesion to the electronic component 4 can be prevented.

(第2實施形態) (Second embodiment)

(電子零組件搬運裝置) (electronic component handling device)

一邊參閱圖示並詳細說明第2實施形態相關的電子零組件搬運裝置2。位置校正裝置1及電子零組件搬運裝置2中,針對與第1實施形態的相同構成與相同功能賦予相同符號並省略詳細說明。 The electronic component conveying device 2 according to the second embodiment will be described in detail with reference to the drawings. In the position correcting device 1 and the electronic component conveying device 2, the same configurations and the same functions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

如第9圖表示,設藉著進退驅動部25解除下降力的保持部22與孔部11的底面之間的距離為D1,電子零組件4的厚度為T1。進退驅動部25在將電子零組件 4收納於孔部11時,使保持部22僅下降距離(D1-T1-D2)。設孔部11的深度為D3時,0<D2≦D3,D2大於零且在孔部11的深度以內。 As shown in Fig. 9, the distance between the holding portion 22 that releases the downward force by the advancing and retracting drive unit 25 and the bottom surface of the hole portion 11 is D1, and the thickness of the electronic component 4 is T1. The advance and retreat drive unit 25 is in the electronic component 4 When the hole portion 11 is housed, the holding portion 22 is lowered by only the distance (D1-T1-D2). When the depth of the hole portion 11 is D3, 0 < D2 ≦ D3, and D2 is larger than zero and within the depth of the hole portion 11.

又,保持部22在以位置校正裝置1進行電子零組件4的位置校正時,保持著電子零組件4的狀態。保持部22為吸附噴嘴的場合,保持部22預先維持著吸引力。亦即,收納於孔部11的電子零組件4是未著地於孔部11的底面而是在內部維持浮在空中的狀態。位置校正裝置1是以電子零組件4在孔部11的內部浮於空中的狀態,使孔部11一往返擺動,進行電子零組件4的位置校正。 Further, when the position correcting device 1 performs position correction of the electronic component 4, the holding unit 22 holds the state of the electronic component 4. When the holding portion 22 is a suction nozzle, the holding portion 22 maintains the suction force in advance. In other words, the electronic component 4 accommodated in the hole portion 11 is in a state of not floating on the bottom surface of the hole portion 11, but is kept floating in the air inside. The position correcting device 1 is in a state in which the electronic component 4 floats in the air inside the hole portion 11, and the hole portion 11 is oscillated back and forth to perform positional correction of the electronic component 4.

如第10圖表示,孔部11將邊緣抵接於電子零組件4,藉此朝著與吸引力或靜電力的保持力作用的方向正交的水平方向賦予移動力。藉此移動力,使電子零組件4相對於保持部22水平上升,使得電子零組件4移動追隨正規位置12。在此,設保持部22賦予電子零組件4的保持力為N,設作用於保持部22與電子零組件4之間的磨擦力為μN,設孔部11的邊緣賦予電子零組件4的移動力為F。 As shown in Fig. 10, the hole portion 11 abuts the edge of the electronic component 4, thereby imparting a moving force in a horizontal direction orthogonal to the direction in which the attraction force or the electrostatic force holding force acts. Thereby, the moving force causes the electronic component 4 to rise horizontally with respect to the holding portion 22, so that the electronic component 4 moves to follow the normal position 12. Here, it is assumed that the holding force of the holding portion 22 to the electronic component 4 is N, the frictional force acting between the holding portion 22 and the electronic component 4 is μN, and the edge of the hole portion 11 is provided to the movement of the electronic component 4. The force is F.

此時,在使保持部22及孔部11旋繞的馬達15中,調整保持力N及移動力F成為μN<F,且在位置校正時電子零組件4不從保持部22脫離的程度。保持力N包括沿著搬運路徑21的移動中也可設為一定,或僅在位置校正時變更成為μN<F。 At this time, in the motor 15 in which the holding portion 22 and the hole portion 11 are wound, the holding force N and the moving force F are adjusted to be μN < F, and the electronic component 4 is not detached from the holding portion 22 at the time of position correction. The holding force N may be set to be constant along the movement along the conveyance path 21, or may be changed to μN<F only at the time of position correction.

如上述,該電子零組件搬運裝置2中,保持部22使電子零組件4從孔部11的底面浮起的狀態,維持著保持。並且,孔部11是藉著該孔部11的邊緣使電子零組件4相對於保持部22上升,引導至預定位置。藉此,孔部11的底面與電子零組件4不彼此卡合,即使在將電子零組件4從孔部11取出時孔部11回到初期狀態時,位置校正後的電子零組件4不會有再度偏位之虞,可進行精度高的位置校正。 As described above, in the electronic component conveying device 2, the holding portion 22 maintains the state in which the electronic component 4 is floated from the bottom surface of the hole portion 11. Further, the hole portion 11 raises the electronic component 4 with respect to the holding portion 22 by the edge of the hole portion 11, and guides it to a predetermined position. Thereby, the bottom surface of the hole portion 11 and the electronic component 4 do not engage with each other, and even when the hole portion 11 returns to the initial state when the electronic component 4 is taken out from the hole portion 11, the position-corrected electronic component 4 does not With re-biasing, high-precision position correction is possible.

再者,如第1實施形態將電子零組件4載放於孔部11的底面,根據慣性的法則滑動的場合,電子零組件4在孔部11的內部,無使其下降至不與底面接觸的狀態的必要,所以將電子零組件4收納於孔部11內之用的保持部22的控制簡便。因此,有鑒於電子零組件4的重量等,選擇第1實施形態或第2實施形態即可。 Further, in the first embodiment, when the electronic component 4 is placed on the bottom surface of the hole portion 11 and slides according to the law of inertia, the electronic component 4 does not fall into contact with the bottom surface inside the hole portion 11. Since the state is necessary, the control of the holding portion 22 for housing the electronic component 4 in the hole portion 11 is simple. Therefore, the first embodiment or the second embodiment may be selected in view of the weight of the electronic component 4 and the like.

(第3實施形態) (Third embodiment)

(位置校正裝置) (position correction device)

一邊參閱圖示並詳細說明第3實施形態相關的位置校正裝置1。位置校正裝置1及電子零組件搬運裝置2中,針對與第1實施形態的相同構成與相同功能賦予相同符號並省略詳細說明。 The position correcting device 1 according to the third embodiment will be described in detail with reference to the drawings. In the position correcting device 1 and the electronic component conveying device 2, the same configurations and the same functions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

第11圖為位置校正裝置1具備之孔部11附近的剖面圖。如第11圖表示,孔部11是貫穿底座14形成。孔部11為兩面開口,僅具有邊緣而無底。位置校正 裝置1具有將底座14層疊在上面的載台17。孔部11的底面是以此載台17所形成。馬達15的轉軸16是遊動貫穿載台17而延設至底座14,與底座14接觸。載台17與馬達14的轉軸16為非接觸。亦即,底座14是藉著馬達15在載台17上滑動旋轉。另一方面,載台17是不動的。 Fig. 11 is a cross-sectional view showing the vicinity of the hole portion 11 provided in the position correcting device 1. As shown in Fig. 11, the hole portion 11 is formed through the base 14. The hole portion 11 is open on both sides and has only an edge without a bottom. Position correction The device 1 has a stage 17 on which the base 14 is stacked. The bottom surface of the hole portion 11 is formed by the stage 17. The rotating shaft 16 of the motor 15 is moved through the stage 17 and extended to the base 14 to be in contact with the base 14. The stage 17 is non-contact with the rotating shaft 16 of the motor 14. That is, the base 14 is slidably rotated on the stage 17 by the motor 15. On the other hand, the stage 17 is stationary.

根據此位置校正裝置1時,孔部11的邊緣在抵接至電子零組件4為止電子零組件4是呈靜止的狀態。電子零組件4被推壓至孔部11的邊緣在載台17的表面滑動而被引導至正規位置12。 According to this position correcting device 1, the edge of the hole portion 11 is in a state of being stationary when it abuts against the electronic component 4. The electronic component 4 is pushed to the edge of the hole portion 11 to slide on the surface of the stage 17 to be guided to the normal position 12.

如上述,該位置校正裝置1中,孔部11是貫穿底座14形成。在底座14的下層配置位置不動的載台17,以此載台17形成孔部11的底面。亦即,即使孔部11擺動載放著電子零組件4的載台17仍是不動。藉此,孔部11的底面與電子零組件4不彼此卡合,即使在將電子零組件4從孔部11取出時孔部11回到初期狀態時,位置校正後的電子零組件4不會有再度偏位之虞,可進行精度高的位置校正。 As described above, in the position correcting device 1, the hole portion 11 is formed through the base 14. A stage 17 that does not move is placed in the lower layer of the chassis 14, and the bottom surface of the hole portion 11 is formed by the stage 17. That is, even if the hole portion 11 swings the stage 17 on which the electronic component 4 is placed, it is still stationary. Thereby, the bottom surface of the hole portion 11 and the electronic component 4 do not engage with each other, and even when the hole portion 11 returns to the initial state when the electronic component 4 is taken out from the hole portion 11, the position-corrected electronic component 4 does not With re-biasing, high-precision position correction is possible.

(其他實施形態) (Other embodiments)

如以上的電子零組件搬運裝置2中,除了使用轉台23的旋轉搬運方式之外,也可使用直線搬運方式,或以複數轉台23構成一搬運路徑21。並且,只要是具有位置校正裝置1,則不限於上述種類的處理單元3,可以和實 施其他種類之工程處理的單元置換,並且配置順序也可以適當變更。 In the above-described electronic component conveying device 2, in addition to the rotary conveyance method using the turntable 23, a linear conveyance method may be used, or a plurality of turntables 23 may constitute a conveyance path 21. Further, as long as the position correcting device 1 is provided, it is not limited to the above-described type of processing unit 3, and Unit replacement for other types of engineering processing is performed, and the order of arrangement can be changed as appropriate.

又,該位置校正裝置1是不限於矩形的電子零組件4,也可因應各種多角形的電子零組件4。孔部11的形狀也相較於電子零組件4的一邊與另外的一邊所成的角度,使對應該等各邊的各邊緣所成的角度僅擴張預定角度,可藉著偏位後的孔部11的擺動來接近正規位置12。 Further, the position correcting device 1 is not limited to the rectangular electronic component 4, and may be adapted to various polygonal electronic components 4. The shape of the hole portion 11 is also compared with the angle formed by one side of the electronic component 4 and the other side, so that the angle formed by the edges of the respective sides is only expanded by a predetermined angle, and the hole can be deflected by the offset. The portion 11 is swung to approach the normal position 12.

1‧‧‧位置校正裝置 1‧‧‧ position correction device

2‧‧‧電子零組件搬運裝置 2‧‧‧Electronic component handling device

3‧‧‧處理單元 3‧‧‧Processing unit

4‧‧‧電子零組件 4‧‧‧Electronic components

11‧‧‧孔部 11‧‧‧ Hole Department

13‧‧‧塊體 13‧‧‧ Block

15‧‧‧馬達 15‧‧‧Motor

16‧‧‧轉軸 16‧‧‧ shaft

22‧‧‧保持部 22‧‧‧ Keeping Department

23‧‧‧轉台 23‧‧‧ turntable

24‧‧‧直接驅動馬達 24‧‧‧Direct drive motor

25‧‧‧進退驅動部 25‧‧‧Advance and Rescue Drive Department

25a‧‧‧致動器 25a‧‧‧Actuator

25b‧‧‧桿 25b‧‧‧ pole

25c‧‧‧壓縮彈簧 25c‧‧‧Compressed spring

Claims (7)

一種位置校正裝置,係電子零組件的位置校正裝置,其特徵為,具備:馬達,使轉軸旋轉;底座,軸支在上述轉軸,藉上述馬達旋轉;及孔部,形成於上述底座上,比上述電子零組件更寬,收納電子零組件,上述馬達是使轉軸朝著順時鐘方向及逆時鐘方向旋轉,上述底座是朝順時鐘方向及逆時鐘方向旋轉,上述孔部是形成在與上述轉軸偏位的位置,藉上述馬達擺動,以該孔部的邊緣將內部的上述電子零組件引導至預定的正規位置,引導上述電子零組件之相對兩邊的孔部的兩邊緣較該相對兩邊所成的角度僅分開預定角度α量,引導上述電子零組件一方之相對邊的一方邊緣是藉著上述馬達進行順時鐘方向的旋轉,追隨上述正規位置的一邊,引導上述電子零組件另一方之相對邊的另一方邊緣是藉著上述馬達進行逆時鐘方向的旋轉,追隨與上述正規位置之上述一邊的相對邊。 A position correcting device is a position correcting device for an electronic component, comprising: a motor for rotating a rotating shaft; a base supported by the motor on the rotating shaft; and a hole formed on the base The electronic component is wider and houses an electronic component. The motor rotates the rotating shaft in a clockwise direction and a counterclockwise direction. The base rotates in a clockwise direction and a counterclockwise direction, and the hole is formed in the rotating shaft. The position of the offset is oscillated by the motor, and the inner electronic component is guided to a predetermined normal position by the edge of the hole portion, and the two edges of the opposite sides of the electronic component are guided to be formed by the opposite sides. The angle is only separated by a predetermined angle α, and one edge of the opposite side of the electronic component is guided to rotate clockwise by the motor, and one side of the normal position is followed to guide the opposite side of the other electronic component. The other side edge is rotated in the counterclockwise direction by the motor, following the normal position Said opposite side edges. 如申請專利範圍第1項記載的位置校正裝置,其中,上述孔部是在電子零組件收納之前及脫離之前,使引導上述電子零組件一方的相對邊之一方的邊緣成為從引導 的上述正規位置的一邊僅旋轉預定角度β量的狀態,上述預定角度β<上述預定角度α。 The position correcting device according to claim 1, wherein the hole portion guides one of the opposite sides of the opposite side of the electronic component before and after the electronic component is stored. One side of the normal position is rotated only by a predetermined angle β, and the predetermined angle β is < the predetermined angle α described above. 如申請專利範圍第1項或第2項記載的位置校正裝置,其中,上述孔部是貫穿上述底座形成,位於上述底座的下層,形成上述孔部的底面,並進一步具備位置不動的載台。 The position correcting device according to the first or second aspect of the invention, wherein the hole portion is formed through the base, is located below the base, forms a bottom surface of the hole portion, and further includes a stage that does not move. 如申請專利範圍第1項或第2項記載的位置校正裝置,其中,上述孔部是與邊緣及底面成一體,以旋轉移動使上述電子零組件藉著慣性使上述底面滑動而與上述邊緣抵接。 The position correcting device according to the first or second aspect of the invention, wherein the hole portion is integrally formed with the edge and the bottom surface, and the electronic component is slidably moved by the inertia by the rotation to the edge Pick up. 如申請專利範圍第1項或第2項記載的位置校正裝置,其中,上述孔部,具有:角,及抵接於上述電子零組件的邊,並與上述角接觸的兩個邊緣,在上述角具有使上述孔部擴張所成的異物滯留部。 The position correcting device according to claim 1 or 2, wherein the hole portion has an angle, and two edges that abut against the side of the electronic component and are in contact with the corner, The corner has a foreign matter retention portion formed by expanding the hole portion. 一種電子零組件搬運裝置,係一邊搬運電子零組件並進行工程處理的電子零組件搬運裝置,其特徵為,具備:上述電子零組件的搬運路徑;保持手段,保持上述電子零組件沿著上述搬運路徑間歇移動;各種處理單元,配置在上述搬運路徑上的一地點,對上述電子零組件進行各種處理;及位置校正單元,配置在上述搬運路徑上的一地點,為了上述處理單元,進行上述電子零組件的位置校正, 上述位置校正單元,包括:馬達,使上述轉軸旋轉;底座,軸支於上述轉軸,藉上述馬達旋轉;及孔部,形成在上述底座上,比上述電子零組件更寬,收納電子零組件,上述孔部是在上述搬運路徑的正下方,形成在與上述轉軸偏位的位置,藉上述保持手段將上述電子零組件插入內部,並藉上述馬達移動,藉著該孔部的邊緣將內部的上述電子零組件引導至預定的正規位置,引導上述電子零組件之相對兩邊的孔部的兩邊緣較該相對兩邊所成的角度僅分開預定角度α量,引導上述電子零組件一方之相對邊的一方邊緣是藉著上述馬達進行順時鐘方向的旋轉,追隨上述正規位置的一邊,引導上述電子零組件另一方之相對邊的另一方邊緣是藉著上述馬達進行逆時鐘方向的旋轉,追隨與上述正規位置之上述一邊的相對邊。 An electronic component transport device that is an electronic component transport device that transports electronic components and performs engineering processing, and includes: a transport path of the electronic component; and a holding means for holding the electronic component along the transporting The path is intermittently moved; various processing units are disposed at a location on the transport path to perform various processing on the electronic component; and a position correcting unit is disposed at a location on the transport path for performing the electronic Position correction of components, The position correcting unit includes: a motor that rotates the rotating shaft; a base that is pivoted on the rotating shaft and rotated by the motor; and a hole portion formed on the base, which is wider than the electronic component and houses the electronic component, The hole portion is formed at a position deviated from the rotation axis directly under the conveyance path, and the electronic component is inserted into the inside by the holding means, and is moved by the motor to be internal by the edge of the hole portion. The electronic component is guided to a predetermined normal position, and the edges of the opposite sides of the electronic component are guided to be separated from the opposite sides by an angle of a predetermined angle α, and the opposite sides of the electronic component are guided. One of the edges is rotated in the clockwise direction by the motor, and the other side of the opposite side of the electronic component is guided to rotate in the counterclockwise direction by the motor while following the normal position. The opposite side of the above side of the regular position. 如申請專利範圍第6項記載的電子零組件搬運裝置,其中,上述保持手段是將上述電子零組件從上述孔部的底面浮起的狀態,維持保持著,上述孔部是藉該孔部的邊緣使上述電子零組件相對於上述保持手段上升,引導至上述正規位置。 The electronic component transport device according to claim 6, wherein the holding means holds the electronic component in a state of being floated from a bottom surface of the hole portion, and the hole portion is supported by the hole portion. The edge raises the electronic component with respect to the holding means and guides to the normal position.
TW105124620A 2015-08-04 2016-08-03 Position correcting device and electronic component carrying device provided with the position correcting device TWI608561B (en)

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