TW201714245A - Position correcting device and electronic component conveying device equipped with same - Google Patents

Position correcting device and electronic component conveying device equipped with same

Info

Publication number
TW201714245A
TW201714245A TW105124620A TW105124620A TW201714245A TW 201714245 A TW201714245 A TW 201714245A TW 105124620 A TW105124620 A TW 105124620A TW 105124620 A TW105124620 A TW 105124620A TW 201714245 A TW201714245 A TW 201714245A
Authority
TW
Taiwan
Prior art keywords
electronic component
position correcting
conveying device
same
component conveying
Prior art date
Application number
TW105124620A
Other languages
Chinese (zh)
Other versions
TWI608561B (en
Inventor
Hajime Takamatsu
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of TW201714245A publication Critical patent/TW201714245A/en
Application granted granted Critical
Publication of TWI608561B publication Critical patent/TWI608561B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Registering Or Overturning Sheets (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Feeding Of Articles To Conveyors (AREA)

Abstract

Provided are a position correcting device and an electronic component conveying device equipped with the same that can shorten the time required to correct the position of an electronic component without increasing the physical stress acting on the electronic component. A position correcting device 1, which is installed in an electronic component conveying device 2, is provided with: a motor 15 that causes a rotating shaft 16 to rotate clockwise or anticlockwise; and a hole part 11 that is formed in a base 14 which is rotated about the rotating shaft by the motor 15, that is wider than an electronic component 4 and that accommodates the electronic component 4. The hole part 11 is formed at a position that is deviated from the rotating shaft 16, is rotatingly moved through one lap by the motor 15 and guides the electronic component 4 inside thereof to a prescribed position by using the edge of the hole part 11.
TW105124620A 2015-08-04 2016-08-03 Position correcting device and electronic component carrying device provided with the position correcting device TWI608561B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/072058 WO2017022074A1 (en) 2015-08-04 2015-08-04 Position correcting device and electronic component conveying device equipped with same

Publications (2)

Publication Number Publication Date
TW201714245A true TW201714245A (en) 2017-04-16
TWI608561B TWI608561B (en) 2017-12-11

Family

ID=56871744

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105124620A TWI608561B (en) 2015-08-04 2016-08-03 Position correcting device and electronic component carrying device provided with the position correcting device

Country Status (5)

Country Link
JP (1) JP5988530B1 (en)
CN (1) CN106233828B (en)
MY (1) MY161713A (en)
TW (1) TWI608561B (en)
WO (1) WO2017022074A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107087386B (en) * 2017-06-13 2018-07-20 永州市福源光学技术有限公司 Surface mount elements apparatus for correcting
DE102017008869B3 (en) 2017-09-21 2018-10-25 Mühlbauer Gmbh & Co. Kg component centering
DE102019125134A1 (en) 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Component handling, component inspection
DE102019125127A1 (en) * 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Component handling, component inspection
CN110767580B (en) * 2019-10-31 2022-10-04 京东方科技集团股份有限公司 Micro light-emitting diode correction substrate, display panel and preparation method of micro light-emitting diode correction substrate
CN110747443A (en) * 2019-11-14 2020-02-04 安徽顺彤包装材料有限公司 Part position correction device for winding film coating machine and working method thereof
DE102021111953A1 (en) 2021-05-07 2022-11-10 Mühlbauer Gmbh & Co. Kg Optical component inspection

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3166186B2 (en) * 1991-02-28 2001-05-14 関西日本電気株式会社 Apparatus and method for aligning minute work
JPH0739280Y2 (en) * 1991-09-13 1995-09-06 株式会社テセック Electronic component direction changing device
US5332463A (en) * 1992-01-15 1994-07-26 Cray Research, Inc. Self-aligned sealing fixture for use in assembly of microelectronic packages
JPH09318332A (en) * 1996-05-29 1997-12-12 Toshiba Microelectron Corp Apparatus and method for measuring
JP2000238884A (en) * 1999-02-24 2000-09-05 Fujitsu Ltd Semiconductor device housing tray, and fitting of semiconductor device into semiconductor device housing tray
JP3978584B2 (en) * 2002-01-16 2007-09-19 ソニー株式会社 Article placement method, electronic component mounting method, and display device manufacturing method
JP4301393B2 (en) * 2002-12-03 2009-07-22 上野精機株式会社 Semiconductor device manufacturing equipment
CN104105389B (en) * 2014-07-30 2017-02-15 东莞市新泽谷机械制造股份有限公司 Bulk special-shaped electronic component material feeder
CN204145902U (en) * 2014-07-30 2015-02-04 东莞市新泽谷机械制造股份有限公司 Two forks piece location feed mechanism

Also Published As

Publication number Publication date
JPWO2017022074A1 (en) 2017-08-03
WO2017022074A1 (en) 2017-02-09
CN106233828A (en) 2016-12-14
CN106233828B (en) 2018-07-27
JP5988530B1 (en) 2016-09-07
MY161713A (en) 2017-05-15
TWI608561B (en) 2017-12-11

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