TW201614082A - Edge exclusion mask, and method and apparatus for layer deposition on substrate by using the same - Google Patents
Edge exclusion mask, and method and apparatus for layer deposition on substrate by using the sameInfo
- Publication number
- TW201614082A TW201614082A TW104118849A TW104118849A TW201614082A TW 201614082 A TW201614082 A TW 201614082A TW 104118849 A TW104118849 A TW 104118849A TW 104118849 A TW104118849 A TW 104118849A TW 201614082 A TW201614082 A TW 201614082A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- layer deposition
- same
- exclusion mask
- edge exclusion
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
An edge exclusion mask for layer deposition on a substrate is described. The edge exclusion mask includes an edge region with an edge, wherein the edge is adapted to have an inclination angle with respect to the substrate of 20 DEG or less.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
??PCT/EP2014/062422 | 2014-06-13 | ||
PCT/EP2014/062422 WO2015188879A1 (en) | 2014-06-13 | 2014-06-13 | Flat edge design for better uniformity and increased edge lifetime |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201614082A true TW201614082A (en) | 2016-04-16 |
TWI652361B TWI652361B (en) | 2019-03-01 |
Family
ID=50942285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104118849A TWI652361B (en) | 2014-06-13 | 2015-06-11 | Edge exclusion mask, and method and apparatus for layer deposition on substrate by using the same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6357252B2 (en) |
KR (1) | KR101942011B1 (en) |
CN (1) | CN106460147B (en) |
TW (1) | TWI652361B (en) |
WO (1) | WO2015188879A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11211233B2 (en) | 2018-09-28 | 2021-12-28 | Shibaura Mechatronics Corporation | Film formation apparatus |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3058075B1 (en) * | 2016-11-02 | 2019-05-10 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | DETOURAGE PLATFORM HAVING A REMOVABLE PART |
US10468221B2 (en) * | 2017-09-27 | 2019-11-05 | Applied Materials, Inc. | Shadow frame with sides having a varied profile for improved deposition uniformity |
JP7013533B1 (en) | 2020-08-06 | 2022-02-15 | ヤス カンパニー リミテッド | Optimized length mask frame |
WO2023041185A1 (en) * | 2021-09-20 | 2023-03-23 | Applied Materials, Inc. | Mask frame support element, edge exclusion mask, mask frame element, substrate support, substrate processing apparatus, and method of manufacturing one or more devices on a substrate |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1060624A (en) * | 1996-08-20 | 1998-03-03 | Matsushita Electric Ind Co Ltd | Sputtering device |
JP3449459B2 (en) * | 1997-06-02 | 2003-09-22 | 株式会社ジャパンエナジー | Method for manufacturing member for thin film forming apparatus and member for the apparatus |
US6051122A (en) * | 1997-08-21 | 2000-04-18 | Applied Materials, Inc. | Deposition shield assembly for a semiconductor wafer processing system |
JP2000017422A (en) * | 1998-07-07 | 2000-01-18 | Toray Ind Inc | Mask for patterning conductive film |
JP2000119841A (en) * | 1998-10-12 | 2000-04-25 | Toray Ind Inc | Mask for electrically conductive film patterning |
US7670436B2 (en) * | 2004-11-03 | 2010-03-02 | Applied Materials, Inc. | Support ring assembly |
US7579067B2 (en) * | 2004-11-24 | 2009-08-25 | Applied Materials, Inc. | Process chamber component with layered coating and method |
SG177902A1 (en) * | 2006-12-19 | 2012-02-28 | Applied Materials Inc | Non-contact process kit |
DE102009034532A1 (en) * | 2009-07-23 | 2011-02-03 | Msg Lithoglas Ag | Process for producing a structured coating on a substrate, coated substrate and semifinished product with a coated substrate |
EP2423350B1 (en) * | 2010-08-27 | 2013-07-31 | Applied Materials, Inc. | Carrier for a substrate and a method for assembling the same |
CN201826007U (en) * | 2010-10-14 | 2011-05-11 | 北京京东方光电科技有限公司 | Anti-adhesion plate and membrane deposition equipment |
CN105177519B (en) * | 2010-10-29 | 2018-03-27 | 应用材料公司 | Deposition ring and electrostatic chuck for physical vapor deposition chamber |
CN201962346U (en) * | 2010-11-09 | 2011-09-07 | 宁波江丰电子材料有限公司 | Anti-adhesion plate structure for vacuum sputtering |
KR101283315B1 (en) * | 2010-12-28 | 2013-07-09 | 엘지디스플레이 주식회사 | Mask |
JP2014522914A (en) * | 2011-08-09 | 2014-09-08 | アプライド マテリアルズ インコーポレイテッド | Adjustable mask |
JP5911958B2 (en) * | 2011-08-25 | 2016-04-27 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Mask structure, apparatus and method for depositing a layer on a rectangular substrate |
KR101547483B1 (en) * | 2012-04-05 | 2015-08-26 | 어플라이드 머티어리얼스, 인코포레이티드 | Flip edge shadow frame |
US10676817B2 (en) * | 2012-04-05 | 2020-06-09 | Applied Materials, Inc. | Flip edge shadow frame |
-
2014
- 2014-06-13 JP JP2016572753A patent/JP6357252B2/en active Active
- 2014-06-13 KR KR1020177000746A patent/KR101942011B1/en active IP Right Grant
- 2014-06-13 CN CN201480079601.4A patent/CN106460147B/en active Active
- 2014-06-13 WO PCT/EP2014/062422 patent/WO2015188879A1/en active Application Filing
-
2015
- 2015-06-11 TW TW104118849A patent/TWI652361B/en active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11211233B2 (en) | 2018-09-28 | 2021-12-28 | Shibaura Mechatronics Corporation | Film formation apparatus |
TWI783178B (en) * | 2018-09-28 | 2022-11-11 | 日商芝浦機械電子裝置股份有限公司 | Film forming device |
TWI817764B (en) * | 2018-09-28 | 2023-10-01 | 日商芝浦機械電子裝置股份有限公司 | Film forming device |
Also Published As
Publication number | Publication date |
---|---|
JP2017519109A (en) | 2017-07-13 |
CN106460147A (en) | 2017-02-22 |
TWI652361B (en) | 2019-03-01 |
KR20170016968A (en) | 2017-02-14 |
KR101942011B1 (en) | 2019-01-25 |
CN106460147B (en) | 2020-02-11 |
JP6357252B2 (en) | 2018-07-11 |
WO2015188879A1 (en) | 2015-12-17 |
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