TWI607106B - Magnetic field generating device for magnetron sputtering - Google Patents

Magnetic field generating device for magnetron sputtering Download PDF

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TWI607106B
TWI607106B TW102103114A TW102103114A TWI607106B TW I607106 B TWI607106 B TW I607106B TW 102103114 A TW102103114 A TW 102103114A TW 102103114 A TW102103114 A TW 102103114A TW I607106 B TWI607106 B TW I607106B
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magnetic field
magnetic
permanent magnet
generating device
field generating
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TW102103114A
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TW201335411A (en
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栗山義彥
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日立金屬股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/345Magnet arrangements in particular for cathodic sputtering apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/345Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452Magnet distribution

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Description

磁控濺鍍用磁場產生裝置 Magnetic field generating device for magnetron sputtering

本發明係有關於一種被裝入為了將薄膜形成於基板表面所使用之磁控濺鍍用裝置的磁場產生裝置。 The present invention relates to a magnetic field generating device incorporated in a device for magnetron sputtering used for forming a film on a surface of a substrate.

將藉由使Ar等之惰性物質高速地碰撞,而擊出構成靶之原子或分子的現象稱為濺鍍,藉由使該被擊出之原子或分子附著於基板上,可形成薄膜。磁控濺鍍法係如下之方法:藉由將磁場裝入陰極內部,可提高靶物質對基板的堆積速度,而且因為未發生電子對基板的碰撞,所以能以低溫成膜。因此,在半導體IC、平板顯示器、太陽能電池等之電子元件、或反射膜等的製程,為了將薄膜形成於基板表面,常使用磁控濺鍍法。 A phenomenon in which an atom or a molecule constituting a target is struck by causing an inert substance such as Ar to collide at a high speed is called sputtering, and a film can be formed by adhering the atom or molecule to be struck on the substrate. The magnetron sputtering method is a method in which the deposition rate of the target substance on the substrate is increased by loading a magnetic field into the inside of the cathode, and since electrons do not collide with the substrate, the film can be formed at a low temperature. Therefore, in the processes of electronic components such as semiconductor ICs, flat panel displays, and solar cells, or reflective films, magnetron sputtering is often used to form a thin film on the surface of the substrate.

磁控濺鍍裝置係在真空腔室內包括:陽極側的基板、配置成與基板相對向之靶(陰極)、及配置於靶之下方的磁場產生裝置。藉由對陽極與陰極之間施加電壓,產生輝光放電,使真空腔室內之惰性氣體(約0.1Pa的Ar氣體等)離子化,另一方面,利用藉磁場產生裝置所形成之磁場捕獲從靶所放出的二次電子,並使其在靶表面進行擺線(cycloid)運動。因為藉電子之擺線運動促進氣體分子的離子化,所以膜之產生速度比未使用磁場的情況快很多,而膜的附著強度變大。 The magnetron sputtering apparatus includes a substrate on the anode side, a target (cathode) disposed to face the substrate, and a magnetic field generating device disposed below the target in the vacuum chamber. By applying a voltage between the anode and the cathode, a glow discharge is generated, and an inert gas (about 0.1 Pa of Ar gas or the like) in the vacuum chamber is ionized, and on the other hand, a magnetic field formed by the magnetic field generating device is used to capture the target. The secondary electrons are emitted and subjected to cycloid motion on the surface of the target. Since the cycloidal motion of electrons promotes ionization of gas molecules, the film is produced at a much faster rate than in the case where no magnetic field is used, and the adhesion strength of the film becomes large.

特開平1-147063號揭示一種技術,該技術係在由圓柱形之中心磁極與外周磁極所構成之磁場產生裝置,將圓形及同心圓形之板狀磁性構件配置於該磁場產生裝 置與靶之間,擴大靶表面之侵蝕區域,而該中心磁極係設置於由磁性材料所構成之軛上,並在高度方向(垂直於靶表面之方向)被磁化,該外周磁極在與該中心磁極相反的方向被磁化,並同心地配置於該中心磁極的周圍。 Japanese Laid-Open Patent No. Hei 1-147063 discloses a technique in which a magnetic field generating device composed of a central magnetic pole and a peripheral magnetic pole of a cylindrical shape is disposed in a magnetic field generating device of a circular and concentric circular plate-shaped magnetic member. Between the target and the target, the erosion region of the target surface is enlarged, and the central magnetic pole is disposed on the yoke formed of the magnetic material, and is magnetized in the height direction (the direction perpendicular to the target surface), and the peripheral magnetic pole is The opposite direction of the center pole is magnetized and concentrically disposed around the center pole.

如在特開平1-147063號的記載所示,為了將磁性構件配置於磁場產生裝置與靶之間,需要將磁性構件埋入支撐板(靶之支撐板)內。另一方面,因為支撐板(靶之支撐板)係為了抑制靶之發熱,亦必須具有冷卻機構,所以支撐板(靶之支撐板)的構造變成複雜,必然地從磁場產生裝置至靶表面的距離變遠。因此,需要產生強的磁場,而使磁場產生裝置變成大型。 As shown in the description of JP-A-1-147063, in order to arrange the magnetic member between the magnetic field generating device and the target, it is necessary to embed the magnetic member in the support plate (the support plate of the target). On the other hand, since the support plate (the support plate of the target) must have a cooling mechanism in order to suppress the heat generation of the target, the configuration of the support plate (the support plate of the target) becomes complicated, necessarily from the magnetic field generating device to the target surface. The distance is getting farther. Therefore, it is necessary to generate a strong magnetic field, and the magnetic field generating device becomes large.

特開2008-156735號係揭示一種磁控濺鍍用磁場產生裝置200,該裝置係如第17圖(a)及第17圖(b)所示,具有:由非磁性體所構成之基底210;設置於其表面之長方形的中央磁極片220;設置於其周圍之長圓形的外周磁極片230;及複數個永久磁鐵240、250,係連設於該中央磁極片與該外周磁極片之間;該永久磁鐵240、250係在水平方向被磁化,而且配置成同極性的磁極與該中央磁極片相對向,同時該中央磁極片之高度及該外周磁極片之高度係形成為該永久磁鐵之高度以上;並記載因為該磁場產生裝置係磁極片與永久磁鐵之各磁極面接觸,所以來自永久磁鐵的漏磁減少,而能以比以往更少的永久磁鐵產生既定磁通。 JP-A-2008-156735 discloses a magnetic field generating apparatus 200 for magnetron sputtering, which has a substrate 210 made of a non-magnetic material as shown in Figs. 17(a) and 17(b). a rectangular central pole piece 220 disposed on a surface thereof; an oblong outer peripheral pole piece 230 disposed around the surface; and a plurality of permanent magnets 240, 250 connected to the central pole piece and the outer peripheral pole piece The permanent magnets 240 and 250 are magnetized in the horizontal direction, and the magnetic poles of the same polarity are disposed opposite to the central pole piece, and the height of the central pole piece and the height of the outer peripheral pole piece are formed as the permanent magnet. It is described that the magnetic field generating device is in contact with the respective magnetic pole faces of the permanent magnet, so that the leakage magnetism from the permanent magnet is reduced, and a predetermined magnetic flux can be generated by a permanent magnet smaller than the conventional one.

根據特開2008-156735號的記載,因為該磁場產生裝置係尤其在角落部,使可封閉惰性氣體所需之強度(磁 通密度水平成分為10mT以上)的磁場區域比以往擴大,所以可使在角落部之侵蝕區域擴大,而可使直線部及角落部的侵蝕變成均勻,但是因為與中央磁極片相對向之部分的磁通密度比較低,所以靶之中央部分(與中央磁極片相對向之部分)的侵蝕進展慢,成為降低靶之使用效率的原因。 According to the description of JP-A-2008-156735, since the magnetic field generating device is particularly in the corner portion, the strength required to block the inert gas is made (magnetic Since the magnetic field region having a density level component of 10 mT or more is larger than the conventional one, the erosion region in the corner portion can be enlarged, and the erosion of the straight portion and the corner portion can be made uniform, but because it is opposed to the central pole piece. Since the magnetic flux density is relatively low, the erosion of the central portion of the target (the portion opposite to the central pole piece) progresses slowly, which is a cause of lowering the efficiency of use of the target.

特開平4-235277號公報係揭示一種用以在靶表面產生甜甜圈狀之磁場的磁性裝置,該裝置係具有:中央磁鐵,係環狀地配置於靶中心附近;及外周磁鐵,係環狀地配置於靶外周附近;各磁鐵之磁化方向或定向係相對靶面傾斜(例如±45°);並記載藉該磁性裝置,在從靶之正上面的中心至外周的範圍,得到在與靶面水平的方向之磁通密度成分呈現雙峰特性,而且在中心與外周之間垂直方向之磁通密度成分的傾斜變成為幾乎零的磁通密度分布,使靶之侵蝕區域變成均勻,而可提高靶之利用效率。 Japanese Laid-Open Patent Publication No. Hei-4-235277 discloses a magnetic device for generating a donut-shaped magnetic field on a target surface, the device having a central magnet disposed annularly near the center of the target, and a peripheral magnet and a loop Arranged in the vicinity of the outer periphery of the target; the magnetization direction or orientation of each magnet is inclined with respect to the target surface (for example, ±45°); and it is described that the magnetic device is in the range from the center to the outer circumference of the target directly to The magnetic flux density component in the horizontal direction of the target surface exhibits a bimodal characteristic, and the inclination of the magnetic flux density component in the vertical direction between the center and the outer periphery becomes a magnetic flux density distribution of almost zero, so that the erosion region of the target becomes uniform, and Can improve the utilization efficiency of the target.

特開平4-235277號公報係作為構成為使各磁鐵之磁化方向或配向相對靶面傾斜之具體的方法,記載一種構成,該構成係將中央磁鐵與外周磁鐵設置成磁化方向與靶面平行,並將環狀的中間磁鐵配置成與該中央磁鐵與外周磁鐵分開。該構成係藉由使環狀的中間磁鐵分開,而將中央及外周之各個永久磁鐵之從N極往S極之小環的磁力線亦積極地利用於靶上的洩漏磁場。可是,因為這種中央磁鐵、外周磁鐵及中間磁鐵彼此分開地配置的構成產生各磁鐵之磁力線彼此抵消的部分,所以具 有磁場產生效率降低的問題。又,因為本方法係僅以永久磁鐵構成,所以磁性效率(磁導)變低,為了得到高磁通密度,需要有超出必要之永久磁鐵體積,而使裝置變成大型。 Japanese Laid-Open Patent Publication No. Hei-4-235277 discloses a configuration in which the magnetization direction or the alignment of each magnet is inclined with respect to the target surface, and the configuration is such that the central magnet and the outer circumference magnet are arranged such that the magnetization direction is parallel to the target surface. The annular intermediate magnet is disposed to be separated from the central magnet and the outer peripheral magnet. In this configuration, by separating the annular intermediate magnets, the magnetic lines of force of the small rings of the central and outer permanent magnets from the N pole to the S pole are also actively utilized for the leakage magnetic field on the target. However, since the central magnet, the outer peripheral magnet, and the intermediate magnet are disposed apart from each other, the magnetic lines of the respective magnets cancel each other. There is a problem that the magnetic field generation efficiency is lowered. Further, since the method is constituted only by a permanent magnet, the magnetic efficiency (magnetic permeability) is lowered, and in order to obtain a high magnetic flux density, it is necessary to make the apparatus larger than the necessary permanent magnet volume.

因此,本發明之目的在於提供一種磁控濺鍍用磁場產生裝置,該裝置係即使是在支撐板中未配置磁性體的構成,亦可擴大靶面上之磁通密度平行成分(與靶表面平行的成分)成為固定的區域,而使靶之侵蝕進展更均勻,藉此,可在基板上形成厚度均勻的薄膜。 Accordingly, it is an object of the present invention to provide a magnetic field generating apparatus for magnetron sputtering which can expand a magnetic flux density parallel component (with a target surface) on a target surface even if a magnetic body is not disposed in the support plate. The parallel component) becomes a fixed region, and the erosion of the target progresses more uniformly, whereby a film having a uniform thickness can be formed on the substrate.

鑑於該目的,本案發明人等,發現在由棒狀之中央磁極構件與外周磁極構件所形成之競賽跑道形狀之區域,設置與靶面平行之方向上被磁化的複數個永久磁鐵而構成的磁控濺鍍用磁場產生裝置中,藉由設計成使垂直於該永久磁鐵之該靶表面之方向的厚度在磁化方向的中央部比兩端部更薄,而可擴大靶面上之磁通密度平行成分成為固定的區域,更藉由將磁性體配置於設計成薄形之該永久磁鐵之中央部的單面或雙面,可使靶之侵蝕進展變成更均勻,因而思及本發明。 In view of the object, the inventors of the present invention have found that a magnetic body composed of a plurality of permanent magnets magnetized in a direction parallel to the target surface is provided in a region of a race track shape formed by a rod-shaped central magnetic pole member and a peripheral magnetic pole member. In the magnetic field generating device for controlling sputtering, the magnetic flux density on the target surface can be enlarged by designing a thickness in a direction perpendicular to the target surface of the permanent magnet in a central portion of the magnetization direction to be thinner than both end portions. The parallel component becomes a fixed region, and the magnetic body is disposed on one or both sides of the central portion of the permanent magnet designed to be thin, so that the progress of erosion of the target can be made more uniform, and the present invention is considered.

即,一種磁控濺鍍用磁場產生裝置,係由與靶相對向且用以在靶表面產生磁場之磁控濺鍍用磁場產生裝置,其特徵為:具有由直線部及角落部所構成之競賽跑道形狀; 在由非磁性體所構成之基底上,具有:(a)棒狀的中央磁極構件;(b)設置成包圍該中央磁極構件的外周磁極構件;及(c)複數個永久磁鐵,係在該中央磁極構件與該外周磁極構件之間,設置成一磁極與該中央磁極構件相對向,另一磁極與該外周磁極構件相對向;設置於該直線部的複數個永久磁鐵係包含至少一個垂直於該靶表面之方向的厚度在磁化方向的中央部比兩端部更薄之磁場調整用永久磁鐵。 That is, a magnetic field generating device for magnetron sputtering is a magnetic field generating device for magnetron sputtering which faces a target and generates a magnetic field on a target surface, and is characterized in that it has a straight portion and a corner portion. Race track shape; On the base made of a non-magnetic body, there are: (a) a rod-shaped central magnetic pole member; (b) an outer peripheral magnetic pole member provided to surround the central magnetic pole member; and (c) a plurality of permanent magnets Between the central magnetic pole member and the outer peripheral magnetic pole member, a magnetic pole is disposed opposite to the central magnetic pole member, and another magnetic pole is opposite to the outer peripheral magnetic pole member; and the plurality of permanent magnets disposed on the linear portion include at least one perpendicular to the A permanent magnet for magnetic field adjustment in which the thickness in the direction of the target surface is thinner at the central portion in the magnetization direction than at both end portions.

設置於該角落部的複數個永久磁鐵係以包含至少一個垂直於該靶表面之方向的厚度在磁化方向的中央部比兩端部更薄之磁場調整用永久磁鐵較佳。 The plurality of permanent magnets provided in the corner portion are preferably magnetic field-adjusting permanent magnets having a thickness at least one perpendicular to the surface of the target, which is thinner at the central portion in the magnetization direction than at both end portions.

較佳為,該磁場調整用永久磁鐵係具有該磁化方向之中央部及兩端部之至少3個區域,該兩端部的區域中垂直於該靶表面之方向的厚度係彼此相等,該中央部的區域之垂直於該靶表面之方向的厚度比該兩端部之區域的厚度更薄,藉此,形成與該中央部之區域對應的凹狀部。 Preferably, the permanent magnet for magnetic field adjustment has at least three regions in a central portion and both end portions of the magnetization direction, and thicknesses in a direction perpendicular to the target surface in the regions of the both end portions are equal to each other, and the center The thickness of the region of the portion perpendicular to the surface of the target is thinner than the thickness of the region of the both end portions, thereby forming a concave portion corresponding to the region of the central portion.

該磁場調整用永久磁鐵較佳為,該中央部之區域之磁化方向的長度是該永久磁鐵之磁化方向之全長的1~99%。 Preferably, the permanent magnet for adjusting the magnetic field has a length in the magnetization direction of the central portion of the central portion of 1 to 99% of the total length of the magnetization direction of the permanent magnet.

該磁場調整用永久磁鐵較佳為,該中央部的區域中垂直於該靶表面之方向的厚度係大於該兩端部的區域中垂直於該靶表面之方向的厚度之0%且為該兩端部的區域中垂直於該靶表面之方向的厚度之99%以下。 Preferably, the permanent magnet for adjusting the magnetic field has a thickness in a direction perpendicular to the surface of the target portion in a region of the central portion greater than 0% of a thickness in a direction perpendicular to the surface of the target portion of the both end portions and is the two The area of the end portion is less than 99% of the thickness perpendicular to the direction of the target surface.

較佳為,該中央部及兩端部之至少3個區域分別由獨立的永久磁鐵所構成,將那些獨立的永久磁鐵黏貼而構成該磁場調整用永久磁鐵。 Preferably, at least three of the central portion and the both end portions are formed of independent permanent magnets, and the independent permanent magnets are adhered to constitute the permanent magnet for magnetic field adjustment.

該磁場調整用永久磁鐵係在該靶側的面及/或該基底側的面具有與該中央部之區域對應的凹狀部較佳。 It is preferable that the permanent magnet for the magnetic field adjustment has a concave portion corresponding to a region of the central portion on a surface on the target side and/or a surface on the base side.

該磁場調整用永久磁鐵係在該靶側及該基底側之雙面具有與該中央部之區域對應的凹狀部較佳。 It is preferable that the permanent magnet for magnetic field adjustment has a concave portion corresponding to a region of the central portion on both sides of the target side and the base side.

具有於該凹狀部配置有磁性體的構成較佳。 It is preferable to have a structure in which a magnetic body is disposed in the concave portion.

配置於該凹狀部之該磁性體的厚度係與該凹狀部之深度相同較佳。 The thickness of the magnetic body disposed in the concave portion is preferably the same as the depth of the concave portion.

該磁場調整用永久磁鐵係在該靶側及該基底側的雙面,具有與該中央部之區域對應的凹狀部及配置於該凹狀部之磁性體較佳。 The magnetic field adjusting permanent magnet is provided on both sides of the target side and the base side, and has a concave portion corresponding to the central portion and a magnetic body disposed in the concave portion.

亦可從磁控濺鍍用磁場產生裝置除去該基底,該磁控濺鍍用磁場產生裝置係利用在該靶側及該基底側的雙面具有與該中央部之區域對應的凹狀部之該磁場調整用永久磁鐵所構成。 The substrate may be removed from a magnetic field generating device for magnetron sputtering, and the magnetic field generating device for magnetron sputtering may have a concave portion corresponding to a region of the central portion on both sides of the target side and the base side. This magnetic field adjustment is composed of a permanent magnet.

亦可從磁控濺鍍用磁場產生裝置除去該基底,該磁控濺鍍用磁場產生裝置係利用在該靶側及該基底側的雙面具有與該中央部之區域對應的凹狀部及配置於該凹狀部之磁性體之該磁場調整用永久磁鐵所構成。 The substrate may be removed from a magnetic field generating device for magnetron sputtering, and the magnetic field generating device for magnetron sputtering may have a concave portion corresponding to a region of the central portion on both sides of the target side and the base side. The magnetic field adjusting permanent magnet disposed in the magnetic body of the concave portion.

亦可具有將該複數個永久磁鐵之至少一個替換成磁場調整用永久磁鐵群的構成,而該磁場調整用永久磁鐵群係由將磁化方向與該永久磁鐵相同且磁化方向之長度短的至少2個永久磁鐵分開地串列配置而構成。 It is also possible to have a configuration in which at least one of the plurality of permanent magnets is replaced with a permanent magnet group for magnetic field adjustment, and the permanent magnet group for magnetic field adjustment is at least 2 in which the magnetization direction is the same as the permanent magnet and the length of the magnetization direction is short. The permanent magnets are constructed separately in a series arrangement.

一種磁控濺鍍用磁場產生裝置,係與靶相對向且用以在靶表面產生磁場之本發明的另一種磁控濺鍍用磁場產生裝置,其特徵為: 具有由直線部及角落部所構成之競賽跑道形狀;在由非磁性體所構成之基底上,具有:(a)棒狀的中央磁極構件;(b)設置成包圍該中央磁極構件的外周磁極構件;及(c)複數個永久磁鐵,係在該中央磁極構件與該外周磁極構件之間,設置成一磁極與該中央磁極構件相對向,另一磁極與該外周磁極構件相對向;具有將該複數個永久磁鐵之至少一個替換成磁場調整用永久磁鐵群的構成,而該磁場調整用永久磁鐵群係由將磁化方向與該永久磁鐵相同且磁化方向之長度短的至少2個永久磁鐵分開地串列配置而構成。 A magnetic field generating device for magnetron sputtering, which is a magnetic field generating device for magnetron sputtering according to the present invention, which is opposite to a target and generates a magnetic field on a target surface, and is characterized in that: The utility model has a race track shape composed of a straight portion and a corner portion; and a base composed of a non-magnetic body: (a) a rod-shaped central magnetic pole member; and (b) a peripheral magnetic pole disposed to surround the central magnetic pole member And (c) a plurality of permanent magnets between the central magnetic pole member and the outer peripheral magnetic pole member, wherein a magnetic pole is disposed opposite to the central magnetic pole member, and the other magnetic pole is opposed to the outer peripheral magnetic pole member; At least one of the plurality of permanent magnets is replaced by a permanent magnet group for magnetic field adjustment, and the permanent magnet group for magnetic field adjustment is separated by at least two permanent magnets having the same magnetization direction as the permanent magnet and having a short magnetization direction. Consisting in a serial configuration.

本發明之磁控濺鍍用磁場產生裝置較佳為,在對該靶表面所施加的磁場之垂直於該靶表面之方向的磁通密度成為零的位置,與該靶表面平行之方向的磁通密度是10mT以上。 Preferably, the magnetic field generating device for magnetron sputtering of the present invention preferably has a magnetic flux density in a direction parallel to the target surface at a position where a magnetic flux density in a direction perpendicular to the target surface of the magnetic field applied to the target surface becomes zero. The pass density is 10 mT or more.

藉由使用本發明之磁場產生裝置,可擴大靶面上之磁通密度平行成分(與靶表面平行的成分)成為固定的區域,因為可使靶之侵蝕的進展變成更均勻,所以可提高靶之利用效率。 By using the magnetic field generating device of the present invention, it is possible to enlarge the parallel component of the magnetic flux density on the target surface (the component parallel to the target surface) to be a fixed region, since the progress of the erosion of the target can be made more uniform, so that the target can be improved. Utilization efficiency.

藉由使用本發明之磁場產生裝置,因為不必將磁性體配置於支撐板,所以可減少元件個數(低耗費化),更可高效率地冷卻靶。又,因為可將支撐板設計成薄,所以可使磁場產生裝置小型化(低耗費化)。 By using the magnetic field generating device of the present invention, since it is not necessary to dispose the magnetic body on the support plate, the number of components can be reduced (low cost), and the target can be cooled more efficiently. Moreover, since the support plate can be designed to be thin, the magnetic field generating device can be miniaturized (low cost).

(1)構成 (1) Composition

本發明之磁控濺鍍用磁場產生裝置1係用以在靶表面產生競賽跑道狀磁場的裝置,如第1圖(a)所示,具有與靶7相對向,並由直線部20及2個角落部30、30所構成之競賽跑道形狀。 The magnetic field generating device 1 for magnetron sputtering according to the present invention is a device for generating a racetrack-like magnetic field on a target surface, and has a direction opposite to the target 7 as shown in Fig. 1(a), and is composed of straight portions 20 and 2 The shape of the race track formed by the corner portions 30, 30.

即,磁場產生裝置1係如第1圖(a)、第1圖(b)及第1圖(c)所示,其特徵為:在由非磁性體所構成之基底6上,具有:(a)棒狀的中央磁極構件2;(b)設置成包圍該中央磁極構件的外周磁極構件3;及(c)複數個直線部用永久磁鐵4及角落部用永久磁鐵5,係在該中央磁極構件2與該外周磁極構件3之間,設置成磁化方向與該靶表面7a平行,而且一磁極與該中央磁極構件2相對向,另一磁極與該外周磁極構件3相對向;設置於該直線部20的複數個永久磁鐵4係包含至少一個磁場調整用永久磁鐵41,該至少一個磁場調整用永久磁鐵41之垂直於該靶表面7a之方向的厚度為磁化方向的中央部4a比兩端部4b、4c更薄。 That is, the magnetic field generating apparatus 1 is characterized in that: on the base 6 made of a non-magnetic material, as shown in Fig. 1 (a), Fig. 1 (b), and Fig. 1 (c), it has: a) a rod-shaped central magnetic pole member 2; (b) an outer peripheral magnetic pole member 3 that surrounds the central magnetic pole member; and (c) a plurality of linear permanent magnets 4 and a corner permanent magnet 5 that are attached to the center Between the pole member 2 and the outer peripheral pole member 3, the magnetization direction is parallel to the target surface 7a, and one magnetic pole is opposite to the central magnetic pole member 2, and the other magnetic pole is opposite to the outer peripheral magnetic pole member 3; The plurality of permanent magnets 4 of the linear portion 20 include at least one magnetic field adjusting permanent magnet 41, and the thickness of the at least one magnetic field adjusting permanent magnet 41 perpendicular to the target surface 7a is the central portion 4a of the magnetization direction than the both ends The portions 4b, 4c are thinner.

(a)直線部的構成 (a) Composition of the straight line

該直線部20係例如如第1圖(a)及第1圖(b)所示,由四角柱狀之中央磁極構件2、四角柱狀之2個外周磁極構件3及複數個直線部用永久磁鐵4所構成;而該中央磁極構件2係設置於由非磁性體所構成之基底6上;該外周磁極構件3係設置成與該中央磁極構件2平行,並與該中央磁極構件2之兩側分開;該直線部用永久磁 鐵4係在該中央磁極構件2與該外周磁極構件3之間,設置成磁化方向與靶表面7a平行,且一同極性的磁極(在圖上為N極)與中央磁極構件2相對向,另一同極性的磁極(在圖上為S極)與外周磁極構件3相對向,該直線部用永久磁鐵4包含至少一個磁場調整用永久磁鐵41。 The linear portion 20 is, for example, as shown in Figs. 1(a) and 1(b), and has a rectangular columnar central magnetic pole member 2, a quadrangular columnar outer peripheral magnetic pole member 3, and a plurality of straight portions for permanent use. The central magnetic pole member 2 is disposed on a base 6 composed of a non-magnetic body; the outer peripheral magnetic pole member 3 is disposed in parallel with the central magnetic pole member 2 and two of the central magnetic pole members 2 Side separated; permanent magnet for the straight portion The iron 4 is disposed between the central magnetic pole member 2 and the outer peripheral magnetic pole member 3 so that the magnetization direction is parallel to the target surface 7a, and magnetic poles of the same polarity (N pole in the figure) are opposed to the central magnetic pole member 2, and The magnetic poles having the same polarity (the S pole in the figure) face the outer peripheral magnetic pole member 3, and the linear portion permanent magnet 4 includes at least one magnetic field adjusting permanent magnet 41.

該磁場調整用永久磁鐵41係例如如第1圖(c)所示,具有磁化方向之中央部4a及兩端部4b、4c之至少3個區域,並藉由該中央部4a的區域之垂直於該靶表面7a之方向的厚度H1比該兩端部4b、4c的區域之垂直於該靶表面7a之方向的厚度H更薄,而形成有凹狀部4d。該中央部4a之區域的厚度H1係以大於該兩端部4b、4c之區域的厚度H之0%且為該兩端部4b、4c之區域的厚度H之99%以下較佳,為30~70%更佳。該兩端部4b、4c的區域之垂直於該靶表面7a之方向的厚度係彼此相等,而且與該外周磁極構件3的厚度相等較佳。該中央部4a之區域之磁化方向的長度L1係以磁場調整用永久磁鐵41之磁化方向的全長L之1~99%較佳,為30~70%更佳。 The magnetic field adjustment permanent magnet 41 has at least three regions of the central portion 4a and the both end portions 4b and 4c in the magnetization direction, as shown in Fig. 1(c), and is perpendicular to the region of the central portion 4a. The thickness H1 in the direction of the target surface 7a is thinner than the thickness H of the region of the both end portions 4b, 4c perpendicular to the direction of the target surface 7a, and a concave portion 4d is formed. The thickness H1 of the region of the central portion 4a is preferably greater than 0% of the thickness H of the region of the both end portions 4b, 4c and 99% or less of the thickness H of the region of the both end portions 4b, 4c, and is preferably 30. ~70% is better. The thickness of the region of the both end portions 4b, 4c perpendicular to the direction of the target surface 7a is equal to each other, and is preferably equal to the thickness of the outer peripheral magnetic pole member 3. The length L1 of the magnetization direction of the region of the central portion 4a is preferably 1 to 99% of the total length L of the magnetization direction of the magnetic field adjustment permanent magnet 41, and more preferably 30 to 70%.

該磁場調整用永久磁鐵41係亦可如第1圖(b)所示,是將凹狀部4d形成於靶7側之面者,亦可如第2圖(a)所示,是將凹狀部4d形成於基底6側之面者,亦可如第2圖(b)所示,是將凹狀部4d形成於靶7側及基底6側之雙面者。在將凹狀部4d形成於靶7側及基底6側之雙面的情況,2個凹狀部4d、4d係以形成於對應位置較佳,其深度係因應於目的,是相等或是相異都可。 The magnetic field adjusting permanent magnet 41 may be formed by forming the concave portion 4d on the side of the target 7 as shown in Fig. 1(b), or may be concave as shown in Fig. 2(a). The surface 4d is formed on the side of the base 6 side, and as shown in FIG. 2(b), the concave portion 4d may be formed on both sides of the target 7 side and the base 6 side. In the case where the concave portion 4d is formed on both sides of the target 7 side and the base 6 side, the two concave portions 4d and 4d are preferably formed at the corresponding positions, and the depths are equal or phase depending on the purpose. Different can be.

該磁場調整用永久磁鐵41係亦可藉由對立方體之永久磁鐵實施研磨等的加工,形成凹狀部4d而製作,亦可將構成該中央部4a及該兩端部4b、4c之3個永久磁鐵黏貼而製作。又,亦可將更多個(4個以上)永久磁鐵黏貼而構成。 The permanent magnet 41 for magnetic field adjustment may be produced by processing a permanent magnet of a cube or the like to form a concave portion 4d, or may constitute three of the central portion 4a and the both end portions 4b and 4c. Permanent magnets are glued and made. Further, more (four or more) permanent magnets may be adhered to each other.

亦可配置於該中央磁極構件2及該外周磁極構件3之間的複數個直線部用永久磁鐵4全部以具有凹狀部4d之磁場調整用永久磁鐵41構成,亦僅將一部分以具有凹狀部4d之磁場調整用永久磁鐵41構成。又,磁場調整用永久磁鐵41的形狀係不必全部相同,亦可因應於目的,將凹狀部之深度(中央部4a之區域的厚度)及磁化方向之長度、或形成凹狀部4d之面相異的複數個磁鐵組合後使用。 The plurality of linear portion permanent magnets 4 that are disposed between the central magnetic pole member 2 and the outer peripheral magnetic pole member 3 may be configured by the magnetic field adjusting permanent magnet 41 having the concave portion 4d, and only a part of the plurality of permanent magnets 41 may have a concave shape. The magnetic field adjustment permanent magnet 41 of the portion 4d is configured. Further, the shape of the permanent magnet 41 for magnetic field adjustment is not necessarily the same, and the depth of the concave portion (the thickness of the region of the central portion 4a) and the length of the magnetization direction or the surface of the concave portion 4d may be formed depending on the purpose. Use a combination of multiple magnets.

亦可在形成於該磁場調整用永久磁鐵41之凹狀部4d,如第3圖(a)~第3圖(c)所示,配置填充用磁性體8。該填充用磁性體8亦可具有與凹狀部4d之形狀對應的形狀,即具有與凹狀部4d之深度相等的厚度,在配置於凹狀部4d時,可無間隙地填充凹狀部4d的形狀,亦可相對凹狀部4d之深度,薄或厚都可,再者,亦可是僅填充凹狀部4d之一部分的形狀。藉由變更該填充用磁性體8的形狀及厚度,可調整磁場強度。 The filling magnetic body 8 may be disposed in the concave portion 4d formed in the magnetic field adjusting permanent magnet 41 as shown in FIGS. 3(a) to 3(c). The filling magnetic body 8 may have a shape corresponding to the shape of the concave portion 4d, that is, a thickness equal to the depth of the concave portion 4d, and when disposed in the concave portion 4d, the concave portion may be filled without a gap. The shape of 4d may be thin or thick with respect to the depth of the concave portion 4d, or may be a shape that fills only a portion of the concave portion 4d. The magnetic field strength can be adjusted by changing the shape and thickness of the filling magnetic body 8.

亦可將該複數個永久磁鐵4的至少一個,如第4圖所示替換成磁場調整用永久磁鐵群42,而構成磁場產生裝置,而該磁場調整用永久磁鐵群42係由磁化方向與該永久磁鐵4相同,且磁化方向之長度短之至少2個永久 磁鐵所構成,其中將一個永久磁鐵42a與該中央磁極構件2相對向,另一個永久磁鐵42b與該外周磁極構件3相對向之方式分開地串列配置。即,此構成係從該中央部4a之區域在靶7方向上之厚度變薄的該磁場調整用永久磁鐵41,除去與該中央部4a之區域對應的部分。 At least one of the plurality of permanent magnets 4 may be replaced with a magnetic field adjusting permanent magnet group 42 as shown in FIG. 4 to constitute a magnetic field generating device, and the magnetic field adjusting permanent magnet group 42 is composed of a magnetization direction and The permanent magnets 4 are identical, and the length of the magnetization direction is at least 2 permanent A magnet is formed in which one permanent magnet 42a faces the central magnetic pole member 2, and the other permanent magnet 42b is arranged in series with the outer peripheral magnetic pole member 3 so as to be spaced apart from each other. In other words, the magnetic field adjusting permanent magnet 41 whose thickness is reduced in the direction of the target 7 from the region of the central portion 4a is removed from the portion corresponding to the region of the central portion 4a.

該永久磁鐵42a、42b之磁化方向的長度、及其間隔係因應於目的適當調整較佳。在該永久磁鐵42a、42b之間,亦可配置磁性體,亦可配置非磁性體,亦可都不配置。 The length of the magnetization directions of the permanent magnets 42a and 42b and the interval thereof are preferably adjusted as appropriate for the purpose. A magnetic body may be disposed between the permanent magnets 42a and 42b, and a non-magnetic material may or may not be disposed.

在第1圖(a),在該中央磁極構件2與該外周磁極構件3之間連接複數個直線部用永久磁鐵4,而構成直線部20的磁路,但是亦可使用一體形成之直線部用永久磁鐵4構成直線部20的磁路,來替換由這些複數個直線部用永久磁鐵4所構成。又,亦可因應所需之磁場強度或磁鐵的材質,將複數個直線部用永久磁鐵4分開地排列而構成直線部20的磁路。在分開地配置的情況,永久磁鐵與永久磁鐵之間係亦可以非磁性的間隔片填充物,亦可未放置任何東西。直線部用永久磁鐵4之個數及大小係未特別限定,亦可分割成根據製造上或易組裝之觀點的大小,亦可各個的大小相異。 In the first diagram (a), a plurality of linear permanent magnets 4 are connected between the central magnetic pole member 2 and the outer peripheral magnetic pole member 3 to form a magnetic path of the linear portion 20. However, an integral linear portion may be used. The permanent magnet 4 constitutes a magnetic circuit of the linear portion 20, and is replaced by the plurality of linear permanent magnets 4. Further, in accordance with the required magnetic field strength or the material of the magnet, a plurality of linear portions can be arranged separately by the permanent magnets 4 to form a magnetic path of the linear portion 20. In the case of separate arrangement, the permanent magnet and the permanent magnet may also be non-magnetic spacer filler or may not be placed. The number and size of the linear permanent magnets 4 are not particularly limited, and may be divided into sizes depending on the viewpoint of manufacturing or ease of assembly, and may be different in size.

(b)角落部的構成 (b) The composition of the corner

角落部30係如第1圖(a)所示,由中央磁極構件2之端部2a、角落部外周磁極構件3c及複數個角落部用永久磁鐵5所構成,該角落部外周磁極構件3c係以該中央磁極構件2之端部2a為中心設置成半多角形,該角落部 用永久磁鐵5係在該中央磁極構件2的端部2a與角落部外周磁極構件3c之間,設置成磁化方向與靶表面7a平行,且一同極性的磁極(在圖上為N極)與中央磁極構件2的端部2a相對向,另一同極性的磁極(在圖上為S極)與角落部外周磁極構件3c相對向。該中央磁極構件2的端部2a與角落部外周磁極構件3c在第1圖(a)中為半多角形,但是亦可是半圓形。 As shown in Fig. 1(a), the corner portion 30 is composed of an end portion 2a of the center magnetic pole member 2, a corner portion outer peripheral magnetic pole member 3c, and a plurality of corner portion permanent magnets 5, and the corner portion outer peripheral magnetic pole member 3c is formed. A semi-polygon is disposed around the end portion 2a of the central magnetic pole member 2, and the corner portion is provided The permanent magnet 5 is disposed between the end portion 2a of the central magnetic pole member 2 and the corner peripheral magnetic pole member 3c, and is provided with a magnetization direction parallel to the target surface 7a, and magnetic poles of the same polarity (N pole in the figure) and the center The end portions 2a of the magnetic pole members 2 face each other, and the other magnetic poles of the same polarity (S poles in the figure) face the corner outer peripheral magnetic pole members 3c. The end portion 2a of the central magnetic pole member 2 and the corner outer peripheral magnetic pole member 3c are semi-polygonal in Fig. 1(a), but may be semicircular.

角落部用永久磁鐵5係亦可如第5圖所示,使用垂直於該靶表面之方向的厚度沿著磁化方向均勻的磁鐵,但是亦可如第6圖(b)及第6圖(c)所示,與上述的直線部用永久磁鐵4一樣,包含至少一個垂直於該靶表面7a之方向的厚度為磁化方向的中央部5a比兩端部5b、5c更薄之磁場調整用永久磁鐵51。 The permanent magnet 5 for the corner portion may have a magnet having a thickness uniform to the magnetization direction in a direction perpendicular to the surface of the target as shown in Fig. 5, but may be as shown in Figs. 6(b) and 6(c). As shown in the above-described linear portion permanent magnet 4, the central portion 5a having at least one magnetization direction perpendicular to the target surface 7a is a thinner magnetic field adjusting permanent magnet than the both end portions 5b and 5c. 51.

磁場調整用永久磁鐵51係例如如第6圖(c)所示,具有磁化方向之中央部5a及兩端部5b、5c之至少3個區域,並藉由該中央部5a的區域中垂直於該靶表面7a之方向的厚度Hc1比該兩端部5b、5c的區域中垂直於該靶表面7a之方向的厚度Hc更薄,而形成有凹狀部5d。該中央部5a之區域的厚度Hc1係以大於該兩端部5b、5c之區域的厚度Hc之0%且為該兩端部5b、5c之區域的厚度Hc之99%以下較佳,是30~70%更佳。該兩端部5b、5c的區域之垂直於該靶表面7a之方向的厚度係彼此相等,而且與該外周磁極構件3c的厚度相等較佳。該中央部5a之區域之磁化方向的長度Lc1是磁場調整用永久磁鐵51之磁化方向的全長Lc之1~99%較佳,是30~70%更佳。 The magnetic field adjustment permanent magnet 51 has at least three regions of the central portion 5a and the both end portions 5b and 5c in the magnetization direction, as shown in Fig. 6(c), and is perpendicular to the region of the central portion 5a. The thickness Hc1 in the direction of the target surface 7a is thinner than the thickness Hc in the direction perpendicular to the target surface 7a in the region of the both end portions 5b, 5c, and the concave portion 5d is formed. The thickness Hc1 of the region of the central portion 5a is preferably greater than 0% of the thickness Hc of the region of the both end portions 5b, 5c and 99% or less of the thickness Hc of the region of the both end portions 5b, 5c. ~70% is better. The thickness of the region of the both end portions 5b, 5c perpendicular to the direction of the target surface 7a is equal to each other, and is preferably equal to the thickness of the outer peripheral magnetic pole member 3c. The length Lc1 of the magnetization direction of the region of the central portion 5a is preferably 1 to 99% of the total length Lc of the magnetization direction of the magnetic field adjustment permanent magnet 51, and more preferably 30 to 70%.

角落部磁場調整用永久磁鐵51係與該直線部磁場調整用永久磁鐵41一樣,亦可是將凹狀部5d形成於靶7側之面者,亦可是將凹狀部5d形成於基底6側之面者,亦可是將凹狀部5d形成於靶7側及基底6側之雙面者。在將凹狀部5d形成於靶7側及基底6側之雙面的情況,2個凹狀部5d、5d係形成於對應位置者較佳,其深度係因應於目的,是相等或是相異都可。 Similarly to the linear portion magnetic field adjusting permanent magnet 41, the corner magnetic field adjusting permanent magnet 51 may be formed by forming the concave portion 5d on the side of the target 7, or forming the concave portion 5d on the base 6 side. Alternatively, the concave portion 5d may be formed on both sides of the target 7 side and the base 6 side. In the case where the concave portion 5d is formed on both sides of the target 7 side and the base 6 side, it is preferable that the two concave portions 5d and 5d are formed at the corresponding positions, and the depth is equal or phase depending on the purpose. Different can be.

該中央部4a之區域之磁化方向的長度L1相對該直線部磁場調整用永久磁鐵41之磁化方向之全長L的比例、與該中央部5a之區域之磁化方向的長度Lc1相對該角落部磁場調整用永久磁鐵51之磁化方向之全長Lc的比例亦可相同,亦可相異。該直線部磁場調整用永久磁鐵41之該中央部4a的區域之垂直於該靶表面7a之方向的厚度H1、與該角落部磁場調整用永久磁鐵51之該中央部5a的區域之垂直於該靶表面7a之方向的厚度Hc1係以相同較佳。又,該直線部磁場調整用永久磁鐵41之該中央部4a之區域的該厚度H1相對該直線部磁場調整用永久磁鐵41之該兩端部4b、4c之區域的該厚度H的比例、與該角落部磁場調整用永久磁鐵51之該中央部5a之區域的該厚度Hc1相對該角落部磁場調整用永久磁鐵51之該兩端部5b、5c的區域之該厚度Hc的比例亦可相同,亦可相異。 The ratio of the length L1 of the magnetization direction of the central portion 4a to the total length L of the magnetization direction of the linear portion magnetic field adjustment permanent magnet 41 and the length Lc1 of the magnetization direction of the region of the central portion 5a are adjusted with respect to the magnetic field of the corner portion. The ratio of the total length Lc of the magnetization direction of the permanent magnet 51 may be the same or different. The thickness H1 of the region of the central portion 4a of the linear portion magnetic field adjusting permanent magnet 41 perpendicular to the target surface 7a is perpendicular to the region of the central portion 5a of the corner portion magnetic field adjusting permanent magnet 51. The thickness Hc1 in the direction of the target surface 7a is preferably the same. Moreover, the ratio of the thickness H1 of the region of the central portion 4a of the linear portion magnetic field adjusting permanent magnet 41 to the thickness H of the region of the both end portions 4b and 4c of the linear portion magnetic field adjusting permanent magnet 41 is The thickness Hc1 of the region of the central portion 5a of the corner magnetic field adjusting permanent magnet 51 may be the same as the thickness Hc of the region of the both end portions 5b and 5c of the corner magnetic field adjusting permanent magnet 51. Can also be different.

磁場調整用永久磁鐵51係例如亦可藉由對平靣圖上梯形之柱狀體之永久磁鐵實施研磨等的加工,形成凹狀部5d而製作,亦可將構成該中央部5a及該兩端部5b、 5c之3個永久磁鐵黏貼而製作。又,亦可將更多個(4個以上)永久磁鐵黏貼而構成。 The magnetic field adjustment permanent magnet 51 may be produced by, for example, performing a polishing process on a permanent magnet of a trapezoidal columnar body in a plan view to form a concave portion 5d, or may constitute the central portion 5a and the two End 5b, 5c of 3 permanent magnets are glued and made. Further, more (four or more) permanent magnets may be adhered to each other.

亦可將配置於該中央磁極構件2的端部2a與該外周磁極構件3c之間的複數個角落部用永久磁鐵5全部以具有凹狀部5d之磁場調整用永久磁鐵51構成,亦僅將一部分以具有凹狀部5d之磁場調整用永久磁鐵51構成。又,磁場調整用永久磁鐵51的形狀係不必全部相同,亦可因應於目的,將凹狀部5d之深度(中央部5a之區域的厚度)及磁化方向之長度、或形成凹狀部5d之面相異的複數個磁鐵組合後使用。 The plurality of corner portion permanent magnets 5 disposed between the end portion 2a of the central magnetic pole member 2 and the outer peripheral magnetic pole member 3c may be formed of the magnetic field adjusting permanent magnet 51 having the concave portion 5d, and only A part of the permanent magnet 51 for magnetic field adjustment having the concave portion 5d is formed. Further, the shape of the permanent magnet 51 for magnetic field adjustment is not necessarily the same, and the depth of the concave portion 5d (the thickness of the region of the central portion 5a) and the length of the magnetization direction or the concave portion 5d may be formed depending on the purpose. A plurality of magnets with different faces are combined and used.

亦可在形成於該角落部磁場調整用永久磁鐵51之凹狀部5d,與該直線部磁場調整用永久磁鐵41一樣,配置填充用磁性體8。該填充用磁性體8亦可具有與凹狀部5d之形狀對應的形狀,即具有與凹狀部5d之深度相等的厚度,在配置於凹狀部5d時,可無間隙地填充凹狀部5d的形狀,亦可相對凹狀部5d之深度,薄或厚都可,再者,亦可是僅填充凹狀部5d之一部分的形狀。藉由變更該填充用磁性體8的形狀及厚度,可調整磁場強度。 In the concave portion 5d formed in the corner portion magnetic field adjusting permanent magnet 51, the filling magnetic body 8 may be disposed in the same manner as the linear portion magnetic field adjusting permanent magnet 41. The filling magnetic body 8 may have a shape corresponding to the shape of the concave portion 5d, that is, a thickness equal to the depth of the concave portion 5d, and when disposed in the concave portion 5d, the concave portion may be filled without a gap. The shape of 5d may be thin or thick with respect to the depth of the concave portion 5d, or may be a shape that fills only a portion of the concave portion 5d. The magnetic field strength can be adjusted by changing the shape and thickness of the filling magnetic body 8.

亦可將該複數個永久磁鐵5的至少一個,如第7圖所示替換成磁場調整用永久磁鐵群52,而構成磁場產生裝置,而該磁場調整用永久磁鐵群52係由磁化方向與該永久磁鐵5相同,且磁化方向之長度短之至少2個永久磁鐵所構成,其中將一個永久磁鐵52a與該中央磁極構件2的端部2a相對向,另一個永久磁鐵52b與該角落部 外周磁極構件3c相對向之方式分開地串列配置。在此,第7圖係將在第6圖(b)所示之C-C剖面圖的磁場調整用永久磁鐵51替換成磁場調整用永久磁鐵群52的剖面圖。即,此構成係從該中央部5a的區域在垂直於靶表面7a之方向的厚度變薄的該磁場調整用永久磁鐵51,除去與該中央部5a之區域對應的部分。 At least one of the plurality of permanent magnets 5 may be replaced with a magnetic field adjusting permanent magnet group 52 as shown in FIG. 7 to constitute a magnetic field generating device, and the magnetic field adjusting permanent magnet group 52 is composed of a magnetization direction and The permanent magnets 5 are identical and have at least two permanent magnets having a short magnetization direction, wherein one permanent magnet 52a faces the end portion 2a of the central magnetic pole member 2, and the other permanent magnet 52b and the corner portion The outer peripheral magnetic pole members 3c are arranged side by side in a manner of being spaced apart from each other. Here, Fig. 7 is a cross-sectional view of the permanent magnet 51 for magnetic field adjustment in the C-C sectional view shown in Fig. 6(b). In other words, the magnetic field adjusting permanent magnet 51 whose thickness is reduced from the region of the central portion 5a in the direction perpendicular to the target surface 7a is removed from the portion corresponding to the region of the central portion 5a.

該永久磁鐵52a、52b之磁化方向的長度、及其間隔係因應於目的適當調整較佳。在該永久磁鐵52a、52b之間,亦可配置磁性體,亦可配置非磁性體,亦可都不配置。 The lengths of the magnetization directions of the permanent magnets 52a and 52b and the intervals thereof are preferably adjusted as appropriate for the purpose. A magnetic body may be disposed between the permanent magnets 52a and 52b, and a non-magnetic material may or may not be disposed.

角落部用永久磁鐵5之平面圖上的形狀係因應於角落部外周磁極構件3c的形狀設定較佳。角落部用永久磁鐵5係如第1圖(a)、第6圖(a)或第8圖所示,在角落部外周磁極構件3c是半多角形的情況,在平面圖上呈大致梯形較佳,如第9圖所示,在角落部外周磁極構件3c是半圓形的情況,在平面圖上呈大致扇形較佳。又,亦可如第10圖所示,在平面圖上呈長方形。角落部用永久磁鐵5之個數及大小係未特別限定,亦可分割成根據製造上或易組裝之觀點的大小,亦可各個的大小相異。 The shape of the corner portion permanent magnet 5 in plan view is preferably set in accordance with the shape of the corner peripheral magnetic pole member 3c. The corner portion permanent magnet 5 is a semi-polygonal shape in the corner portion as shown in Fig. 1 (a), Fig. 6 (a) or Fig. 8, and is substantially trapezoidal in plan view. As shown in Fig. 9, the outer peripheral magnetic pole member 3c is semicircular in the corner portion, and is preferably substantially fan-shaped in plan view. Further, as shown in Fig. 10, it may have a rectangular shape in plan view. The number and size of the corner permanent magnets 5 are not particularly limited, and may be divided into sizes depending on the viewpoint of manufacturing or easy assembly, or may be different in size.

角落部用永久磁鐵5係亦可如第1圖(a)及第6圖(a)所示,配置成完全填充中央磁極構件2之端部2a、與以中央磁極構件2之端部2a為中心設置成半多角形之角落部外周磁極構件3c的間隙,亦可如第8圖所示,配置成在角落部用永久磁鐵5與角落部用永久磁鐵5之間空出間隙5e。藉由依此方式將角落部用永久磁鐵5配置成空 出間隙5e,可調整靶表面上的磁通密度。亦可將非磁性體的間隔片填充於間隙5e。角落部用永久磁鐵5相對中央磁極構件2之端部2a與角落部外周磁極構件3c之間隙的總面積的佔有率係以30%以上較佳,以30~80%更佳。 The corner portion permanent magnet 5 may be arranged to completely fill the end portion 2a of the central magnetic pole member 2 and the end portion 2a of the central magnetic pole member 2 as shown in Figs. 1(a) and 6(a). The gap of the outer peripheral magnetic pole member 3c which is provided in the corner portion of the semi-polygon shape may be arranged such that a gap 5e is formed between the corner portion permanent magnet 5 and the corner portion permanent magnet 5 as shown in Fig. 8. By configuring the corner portion permanent magnet 5 to be empty in this manner With the gap 5e, the magnetic flux density on the surface of the target can be adjusted. A non-magnetic spacer may be filled in the gap 5e. The occupation ratio of the corner portion permanent magnet 5 to the total area of the gap between the end portion 2a of the central magnetic pole member 2 and the corner peripheral magnetic pole member 3c is preferably 30% or more, more preferably 30 to 80%.

(c)侵蝕區域 (c) Erosion area

在直線部不使用該直線部磁場調整用永久磁鐵41或直線部磁場調整用永久磁鐵群42所構成之以往的磁場產生裝置中,沿著磁化方向繪製靶表面之磁通密度平行成分(與靶表面平行的成分)時,因為該磁通密度平行成分是山形(參照第15圖及第16圖的第1比較例),所以靶在磁化方向上之侵蝕(erosion)成為不均勻,而無法高效率地利用靶。 In the conventional magnetic field generating device including the linear portion magnetic field adjusting permanent magnet 41 or the linear portion magnetic field adjusting permanent magnet group 42 in the straight portion, the magnetic flux density parallel component (with the target) is plotted along the magnetization direction. When the parallel component of the magnetic flux density is a mountain shape (see the first comparative example of FIGS. 15 and 16), the erosion of the target in the magnetization direction becomes uneven, and cannot be high. Use the target efficiently.

相對地,在直線部20使用具有凹狀部4d之直線部磁場調整用永久磁鐵41、或由分開之至少2個之永久磁鐵42a、42b所構成之直線部磁場調整用永久磁鐵群42之本發明的磁場產生裝置中,因為在該靶表面之磁通密度平行成分所繪製的值在磁化方向上呈梯形(參照第15圖的第1實施例),所以靶在磁化方向上之侵蝕(erosion)被均勻化,而靶之利用效率提高。 In contrast, in the linear portion 20, the linear portion magnetic field adjusting permanent magnet 41 having the concave portion 4d or the linear portion magnetic field adjusting permanent magnet group 42 composed of the separated at least two permanent magnets 42a and 42b is used. In the magnetic field generating device of the invention, since the value drawn by the parallel component of the magnetic flux density on the surface of the target is trapezoidal in the magnetization direction (refer to the first embodiment of Fig. 15), the target is eroded in the magnetization direction (erosion) ) is homogenized, and the utilization efficiency of the target is improved.

又,藉由在角落部30亦使用具有凹狀部5d之角落部磁場調整用永久磁鐵51、或由分開之至少2個之永久磁鐵52a、52b所構成之角落部磁場調整用永久磁鐵群52,因為在角落部30,在該靶表面之磁通密度平行成分所繪製的值亦在磁化方向上成為梯形(參照第16圖的第 1實施例),所以靶在磁化方向之侵蝕(erosion)被均勻化,而靶之利用效率提高。 Further, the corner portion magnetic field adjusting permanent magnet 51 having the concave portion 5d having the concave portion 5d or the corner magnetic field adjusting permanent magnet group 52 composed of the at least two separated permanent magnets 52a and 52b is also used in the corner portion 30. Because in the corner portion 30, the value drawn by the parallel component of the magnetic flux density on the surface of the target also becomes trapezoidal in the magnetization direction (refer to the figure of Fig. 16). 1 embodiment), so the erosion of the target in the magnetization direction is uniformized, and the utilization efficiency of the target is improved.

(d)永久磁鐵 (d) permanent magnet

構成直線部及角落部之永久磁鐵係可藉周知之永久磁鐵材料形成。永久磁鐵材料之材質係只要根據設備之構成(從磁場產生裝置至靶的距離)或所需之磁場強度適當地設定即可。在本發明,以在靶表面7a之磁場之磁通密度的垂直成分成為零的位置,磁通密度的平行成分成為10mT以上的方式選擇永久磁鐵較佳。 The permanent magnets constituting the straight portion and the corner portion can be formed by a known permanent magnet material. The material of the permanent magnet material may be appropriately set depending on the configuration of the apparatus (the distance from the magnetic field generating device to the target) or the required magnetic field strength. In the present invention, it is preferable to select the permanent magnet so that the parallel component of the magnetic flux density becomes 10 mT or more at a position where the vertical component of the magnetic flux density of the magnetic field of the target surface 7a becomes zero.

在想得到高磁通密度的情況,只要使用以R(Nd等之稀土類元素中的至少一種)、T(Fe或Fe及Co)及B為必需成分之R-T-B系各向異性燒結磁鐵等的稀土類磁鐵(從耐腐蝕性之觀點實施各種表面處理者)即可,而在所需之磁通密度不太高時亦可是鐵酸鹽(ferrite)磁鐵。又,在想改變直線部與角落部之磁通密度的情況,只要配合各自所需的磁通密度,設定直線部用永久磁鐵、角落部用永久磁鐵、中央部永久磁鐵及端部永久磁鐵之材質或尺寸即可。 When a high magnetic flux density is desired, a rare earth such as an RTB anisotropic sintered magnet in which R (at least one of rare earth elements such as Nd), T (Fe or Fe and Co), and B are essential components is used. A magnet of the type (for various surface treatments from the viewpoint of corrosion resistance) may be used, and a ferrite magnet may be used when the required magnetic flux density is not too high. Further, when it is desired to change the magnetic flux density of the straight portion and the corner portion, the permanent magnet for the straight portion, the permanent magnet for the corner portion, the central permanent magnet, and the end permanent magnet are set in accordance with the magnetic flux density required for each of them. Material or size can be.

(e)磁極構件及填充用磁性體 (e) Magnetic pole member and magnetic body for filling

磁極構件及填充用磁性體係以使用周知的磁性體(軟磁性體)較佳,尤其,使用具有磁性的鋼材較佳。 It is preferable to use a well-known magnetic body (soft magnetic material) for the magnetic pole member and the magnetic system for filling, and it is preferable to use a steel material having magnetic properties.

(2)其他的形態 (2) Other forms

作為磁控濺鍍用磁場產生裝置1之其他的形態,如第11圖(a)所示,列舉將該凹狀部4d、5d形成於該磁場調整用永久磁鐵41、51之雙面,並除去該基底的構成。 進而,作為其他的形態,如第11圖(b)所示,列舉在該磁場調整用永久磁鐵41、51之雙面具有該凹狀部4d、5d及配置於該凹狀部4d、5d之填充用磁性體8,並除去該基底的構成。藉由依此方式除去該基底而構成磁場產生裝置1,可將靶7、7配置於磁場產生裝置1的雙面並在雙面濺鍍。此外,在第11圖(a)及第11圖(b),因為角落部磁場調整用永久磁鐵51係與直線部磁場調整用永久磁鐵41一樣,所以省略。 As another aspect of the magnetron sputtering magnetic field generating apparatus 1, as shown in Fig. 11(a), the concave portions 4d and 5d are formed on both sides of the magnetic field adjusting permanent magnets 41 and 51, and The composition of the substrate is removed. Further, as another aspect, as shown in FIG. 11(b), the magnetic field-adjusting permanent magnets 41 and 51 have the concave portions 4d and 5d and the concave portions 4d and 5d. The magnetic body 8 is filled and the structure of the substrate is removed. By removing the substrate in this manner, the magnetic field generating device 1 is constructed, and the targets 7 and 7 can be placed on both sides of the magnetic field generating device 1 and sputtered on both sides. In addition, in the eleventh (a) and the eleventh (th)th, the corner magnetic field adjustment permanent magnet 51 is the same as the linear portion magnetic field adjustment permanent magnet 41, and therefore will not be described.

進而,將本發明之磁場產生裝置以既定間隔並列地配置複數台,並使各磁場產生裝置移動(滑動)與該間隔大致相同的距離,藉此,可使用一體型的靶7成膜於大型基板。又,亦可在磁場產生裝置,設置調整磁場產生裝置之上面與靶面之距離的機構。 Further, the magnetic field generating device of the present invention is arranged in parallel at a predetermined interval, and each magnetic field generating device is moved (sliding) at substantially the same distance as the interval, whereby the integral type target 7 can be used to form a large film. Substrate. Further, a mechanism for adjusting the distance between the upper surface of the magnetic field generating device and the target surface may be provided in the magnetic field generating device.

[實施例] [Examples]

根據實施例更詳細說明本發明,但是本發明限定為這些實施例。 The invention will be described in more detail based on examples, but the invention is limited to these examples.

第1比較例 First comparative example

在第12圖(a)、第12圖(b)及第12圖(c)所示的構成中,在Al-Mg系合金(A5052)製之基底6上,配置鐵酸鹽系不銹鋼(SUS430)製之中央磁極構件2、其端部2a、外周磁極構件3與角落部外周磁極構件3c、及由鐵酸鹽燒結磁鐵(日立金屬製NMF-3B,最大能量積:約4MGOe)所構成之直線部用永久磁鐵4、角落部用永久磁鐵5,而製成磁場產生裝置1(W=360mm、L1=260mm、L2=50mm、a=110mm、b=26mm、c=10mm、d=8mm、e=20mm、f=42mm、g=42mm、h=18mm及i=8mm)。 In the configuration shown in Fig. 12 (a), Fig. 12 (b), and Fig. 12 (c), ferrite-based stainless steel (SUS430) is placed on the base 6 made of Al-Mg-based alloy (A5052). The central magnetic pole member 2, the end portion 2a, the outer peripheral magnetic pole member 3, the corner outer peripheral magnetic pole member 3c, and the ferrite sintered magnet (NMF-3B manufactured by Hitachi Metal Co., Ltd., maximum energy product: about 4 MGOe) The linear portion permanent magnet 4 and the corner portion permanent magnet 5 are used to form the magnetic field generating device 1 (W = 360 mm, L1 = 260 mm, L2 = 50 mm, a = 110 mm, b = 26 mm, c = 10 mm, d = 8 mm, e = 20 mm, f = 42 mm, g = 42 mm, h = 18 mm, and i = 8 mm).

第1實施例 First embodiment

如第13圖(a)、第13圖(b)及第13圖(c)所示,除了將直線部用永久磁鐵4及角落部用永久磁鐵5替換成分別具有凹狀部4d及凹狀部5d之直線部磁場調整用永久磁鐵41及角落部磁場調整用永久磁鐵51以外,其餘構成係與第1比較例一樣而製成磁場產生裝置1(W=360mm、L1=260mm、L2=50mm、a=110mm、b=26mm、c=10mm、d=8mm、e=20mm、f=42mm、g=42mm、h=18mm、h1=13mm、hc=18mm、hc1=13mm、i=8mm、j=26mm、k=8mm、l=8mm、m=26mm、n=8m及o=8mm)。 As shown in Fig. 13 (a), Fig. 13 (b), and Fig. 13 (c), the linear portion permanent magnet 4 and the corner portion permanent magnet 5 are replaced with concave portions 4d and concave portions, respectively. The magnetic field generating device 1 is formed in the same manner as in the first comparative example except for the linear magnetic field adjusting permanent magnet 41 and the corner magnetic field adjusting permanent magnet 51 of the portion 5d (W = 360 mm, L1 = 260 mm, L2 = 50 mm). , a=110mm, b=26mm, c=10mm, d=8mm, e=20mm, f=42mm, g=42mm, h=18mm, h1=13mm, hc=18mm, hc1=13mm, i=8mm, j = 26 mm, k = 8 mm, l = 8 mm, m = 26 mm, n = 8 m, and o = 8 mm).

藉磁場分析,求得在距離第1實施例及第1比較例之磁場產生裝置1的表面(與靶相對向的面)17mm之位置(相當於靶表面之位置)的磁通密度,並將該磁通密度之與靶表面平行的成分(磁通密度平行成分)及垂直的成分(磁通密度垂直成分),如第14圖所示般沿著A線(直線部中央)及B線(角落部),分別繪製在第15圖及第16圖。 By the magnetic field analysis, the magnetic flux density at a position (corresponding to the position of the target surface) 17 mm away from the surface (the surface facing the target) of the magnetic field generating apparatus 1 of the first embodiment and the first comparative example was obtained, and The component of the magnetic flux density parallel to the target surface (parallel component of magnetic flux density) and the vertical component (vertical component of magnetic flux density) are along the A line (center of the straight line portion) and the B line as shown in FIG. 14 ( The corners are drawn in Figures 15 and 16, respectively.

從第15圖及第16圖得知,藉由將直線部用永久磁鐵4及角落部用永久磁鐵5替換成設有凹狀部4d及凹狀部5d之直線部磁場調整用永久磁鐵41及角落部磁場調整用永久磁鐵51,在直線部及角落部之磁通密度平行成分都沿著磁化方向成為梯形,而提供更均勻的磁場。從這些結果可預測,本發明之磁場產生裝置與以往相比,靶之侵蝕變成更均勻,靶之利用效率更加提高。 As can be seen from Fig. 15 and Fig. 16, the linear portion permanent magnet 41 and the linear portion permanent magnet 5 are replaced with the linear portion magnetic field adjusting permanent magnet 41 having the concave portion 4d and the concave portion 5d. In the corner portion magnetic field adjusting permanent magnet 51, the parallel components of the magnetic flux density in the straight portion and the corner portion are trapezoidal along the magnetization direction, thereby providing a more uniform magnetic field. From these results, it is predicted that the magnetic field generating apparatus of the present invention becomes more uniform in erosion than the conventional one, and the utilization efficiency of the target is further improved.

1‧‧‧磁控濺鍍用磁場產生裝置 1‧‧‧Magnetic magnetron sputtering magnetic field generating device

2‧‧‧中央磁極構件 2‧‧‧Central magnetic pole member

2a‧‧‧端部 2a‧‧‧End

3‧‧‧外周磁極構件 3‧‧‧External magnetic pole members

3c‧‧‧角落部外周磁極構件 3c‧‧‧outer peripheral magnetic pole members

4‧‧‧直線部用永久磁鐵 4‧‧‧ permanent magnets for straight parts

4a‧‧‧中央部 4a‧‧‧Central Department

4b、4c‧‧‧兩端部 4b, 4c‧‧‧ both ends

4d‧‧‧凹狀部 4d‧‧‧ concave

41‧‧‧磁場調整用永久磁鐵 41‧‧‧ permanent magnet for magnetic field adjustment

42‧‧‧磁場調整用永久磁鐵群 42‧‧‧Permanent magnet group for magnetic field adjustment

42a、42b‧‧‧永久磁鐵 42a, 42b‧‧‧ permanent magnet

5‧‧‧角落部用永久磁鐵 5‧‧‧ permanent magnets for corners

5a‧‧‧中央部 5a‧‧‧Central Department

5b、5c‧‧‧兩端部 5b, 5c‧‧‧ both ends

5d‧‧‧凹狀部 5d‧‧‧ concave

5e‧‧‧間隙 5e‧‧‧ gap

51‧‧‧磁場調整用永久磁鐵 51‧‧‧ permanent magnet for magnetic field adjustment

52‧‧‧磁場調整用永久磁鐵群 52‧‧‧Permanent magnet group for magnetic field adjustment

52a、52b‧‧‧永久磁鐵 52a, 52b‧‧‧ permanent magnet

6‧‧‧基底 6‧‧‧Base

7‧‧‧靶 7‧‧‧ target

7a‧‧‧靶表面 7a‧‧‧ target surface

8‧‧‧填充用磁性體 8‧‧‧ Filling magnetic body

20‧‧‧直線部 20‧‧‧ Straight line

30‧‧‧角落部 30‧‧‧ corner

200‧‧‧磁控濺鍍用磁場產生裝置 200‧‧‧Magnetic magnetron sputtering magnetic field generating device

210‧‧‧基底 210‧‧‧Base

220‧‧‧中央磁極片 220‧‧‧Central pole piece

230‧‧‧外周磁極片 230‧‧‧External pole pieces

240、250‧‧‧永久磁鐵 240, 250‧‧‧ permanent magnets

第1圖(a)係表示本發明之磁控濺鍍用磁場產生裝置之一例的平面圖。 Fig. 1(a) is a plan view showing an example of a magnetic field generating device for magnetron sputtering according to the present invention.

第1圖(b)係第1圖(a)之A-A剖面圖。 Fig. 1(b) is a cross-sectional view taken along line A-A of Fig. 1(a).

第1圖(c)係從第1圖(b)僅抽出直線部用磁鐵所表示的部分剖面圖。 Fig. 1(c) is a partial cross-sectional view showing only the magnet for the linear portion taken out from Fig. 1(b).

第2圖(a)係表示本發明之磁控濺鍍用磁場產生裝置的直線部用磁鐵之其他的例子的剖面圖。 Fig. 2(a) is a cross-sectional view showing another example of the magnet for a linear portion of the magnetic field generating device for magnetron sputtering according to the present invention.

第2圖(b)係表示本發明之磁控濺鍍用磁場產生裝置的直線部用磁鐵之另外之例子的剖面圖。 Fig. 2(b) is a cross-sectional view showing another example of the magnet for the linear portion of the magnetic field generating device for magnetron sputtering according to the present invention.

第3圖(a)係表示將磁性體配置於本發明之磁控濺鍍用磁場產生裝置的直線部用磁鐵所設置之凹狀部之一例的剖面圖。 Fig. 3(a) is a cross-sectional view showing an example in which a magnetic body is disposed in a concave portion provided in a linear portion magnet of the magnetron sputtering magnetic field generating device of the present invention.

第3圖(b)係表示將磁性體配置於本發明之磁控濺鍍用磁場產生裝置的直線部用磁鐵所設置之凹狀部之其他的例子的剖面圖。 (b) is a cross-sectional view showing another example of the concave portion provided in the linear portion magnet of the magnetron sputtering magnetic field generating device of the present invention.

第3圖(c)係表示將磁性體配置於本發明之磁控濺鍍用磁場產生裝置的直線部用磁鐵所設置之凹狀部之另外之例子的剖面圖。 Fig. 3(c) is a cross-sectional view showing another example in which a magnetic body is disposed in a concave portion provided in a linear portion magnet of the magnetron sputtering magnetic field generating apparatus of the present invention.

第4圖係表示本發明之磁控濺鍍用磁場產生裝置的直線部用磁鐵之另外之例子的剖面圖。 Fig. 4 is a cross-sectional view showing another example of a magnet for a linear portion of the magnetic field generating device for magnetron sputtering according to the present invention.

第5圖係第1圖(a)之B-B剖面圖。 Fig. 5 is a cross-sectional view taken along line B-B of Fig. 1(a).

第6圖(a)係表示本發明之磁控濺鍍用磁場產生裝置之其他的例子的部分平面圖。 Fig. 6(a) is a partial plan view showing another example of the magnetic field generating device for magnetron sputtering according to the present invention.

第6圖(b)係第6圖(a)之C-C剖面圖。 Fig. 6(b) is a cross-sectional view taken along line C-C of Fig. 6(a).

第6圖(c)係從第6圖(b)僅抽出角落部用磁鐵所表示的部分剖面圖。 Fig. 6(c) is a partial cross-sectional view showing only the corner portion magnets taken out from Fig. 6(b).

第7圖係表示本發明之磁控濺鍍用磁場產生裝置的角落部用磁鐵之另外之例子的剖面圖。 Fig. 7 is a cross-sectional view showing another example of a magnet for a corner portion of the magnetic field generating device for magnetron sputtering according to the present invention.

第8圖係表示本發明之磁控濺鍍用磁場產生裝置的角落部之其他的例子的平面圖。 Fig. 8 is a plan view showing another example of the corner portion of the magnetic field generating device for magnetron sputtering according to the present invention.

第9圖係表示本發明之磁控濺鍍用磁場產生裝置的角落部之另外之例子的平面圖。 Fig. 9 is a plan view showing another example of a corner portion of the magnetic field generating device for magnetron sputtering according to the present invention.

第10圖係表示本發明之磁控濺鍍用磁場產生裝置的角落部之另外之例子的平面圖。 Fig. 10 is a plan view showing another example of the corner portion of the magnetic field generating device for magnetron sputtering of the present invention.

第11圖(a)係表示本發明之磁控濺鍍用磁場產生裝置之其他的形態的剖面圖。 Fig. 11(a) is a cross-sectional view showing another embodiment of the magnetic field generating device for magnetron sputtering according to the present invention.

第11圖(b)係表示本發明之磁控濺鍍用磁場產生裝置之另外的形態的剖面圖。 Fig. 11(b) is a cross-sectional view showing another embodiment of the magnetic field generating device for magnetron sputtering according to the present invention.

第12圖(a)係表示第1比較例之磁場產生裝置的平面圖。 Fig. 12 (a) is a plan view showing a magnetic field generating apparatus of a first comparative example.

第12圖(b)係第12圖(a)之D-D剖面圖。 Fig. 12(b) is a cross-sectional view taken along line D-D of Fig. 12(a).

第12圖(c)係第12圖(a)之E-E剖面圖。 Fig. 12(c) is a cross-sectional view taken along line E-E of Fig. 12(a).

第13圖(a)係表示第1實施例之磁場產生裝置的平面圖。 Fig. 13 (a) is a plan view showing the magnetic field generating device of the first embodiment.

第13圖(b)係第13圖(a)之F-F剖面圖。 Fig. 13(b) is a cross-sectional view taken along line F-F of Fig. 13(a).

第13圖(c)係第13圖(a)之G-G剖面圖。 Fig. 13(c) is a G-G sectional view of Fig. 13(a).

第14圖係表示在第1比較例及第1實施例之磁場產生裝置之A線及B線的模式圖。 Fig. 14 is a schematic view showing the A line and the B line of the magnetic field generating apparatus of the first comparative example and the first embodiment.

第15圖係將藉由第1比較例及第1實施例之磁場產生裝置而產生於靶面上的磁通密度之平行成分及垂直成分,沿著A線繪製而成的圖形。 Fig. 15 is a graph in which the parallel components and the vertical components of the magnetic flux density generated on the target surface by the magnetic field generating devices of the first comparative example and the first embodiment are plotted along the line A.

第16圖係將藉由第1比較例及第1實施例之磁場產生裝置而產生於靶面上的磁通密度之平行成分及垂直成分,沿著B線繪製而成的圖形。 Fig. 16 is a graph in which the parallel component and the vertical component of the magnetic flux density generated on the target surface by the magnetic field generating device of the first comparative example and the first embodiment are plotted along the line B.

第17圖(a)係表示以往之磁控濺鍍用磁場產生裝置之一例的平面圖。 Fig. 17 (a) is a plan view showing an example of a conventional magnetic field generating device for magnetron sputtering.

第17圖(b)係第17圖(a)之H-H剖面圖。 Fig. 17(b) is a cross-sectional view taken along line H-H of Fig. 17(a).

1‧‧‧磁控濺鍍用磁場產生裝置 1‧‧‧Magnetic magnetron sputtering magnetic field generating device

2‧‧‧中央磁極構件 2‧‧‧Central magnetic pole member

2a‧‧‧端部 2a‧‧‧End

3‧‧‧外周磁極構件 3‧‧‧External magnetic pole members

3c‧‧‧角落部外周磁極構件 3c‧‧‧outer peripheral magnetic pole members

4‧‧‧直線部用永久磁鐵 4‧‧‧ permanent magnets for straight parts

4a‧‧‧中央部 4a‧‧‧Central Department

4b、4c‧‧‧兩端部 4b, 4c‧‧‧ both ends

4d‧‧‧凹狀部 4d‧‧‧ concave

5‧‧‧角落部用永久磁鐵 5‧‧‧ permanent magnets for corners

6‧‧‧基底 6‧‧‧Base

7‧‧‧靶 7‧‧‧ target

7a‧‧‧靶表面 7a‧‧‧ target surface

20‧‧‧直線部 20‧‧‧ Straight line

30‧‧‧角落部 30‧‧‧ corner

41‧‧‧磁場調整用永久磁鐵 41‧‧‧ permanent magnet for magnetic field adjustment

H‧‧‧兩端部的區域之垂直於靶表面之方向的厚度 H‧‧‧ Thickness of the area at both ends perpendicular to the direction of the target surface

H1‧‧‧中央部的區域之垂直於靶表面之方向的厚度 H1‧‧‧The thickness of the area of the central part perpendicular to the direction of the target surface

L‧‧‧磁場調整用永久磁鐵之磁化方向的全長 L‧‧‧Full length of magnetization direction of permanent magnet for magnetic field adjustment

L1‧‧‧中央部之區域之磁化方向的長度 Length of magnetization direction of the area of the central part of L1‧‧‧

Claims (15)

一種磁控濺鍍用磁場產生裝置,係由與靶相對向且用以在靶表面產生磁場之由直線部及角落部所構成之競賽跑道形狀的磁控濺鍍用磁場產生裝置,其特徵為:在由非磁性體所構成之基底上,具有:(a)棒狀的中央磁極構件;(b)設置成包圍該中央磁極構件的外周磁極構件;及(c)複數個永久磁鐵,係在該中央磁極構件與該外周磁極構件之間,設置成一磁極與該中央磁極構件相對向,另一磁極與該外周磁極構件相對向;設置於該直線部的複數個永久磁鐵包含至少一個磁場調整用永久磁鐵,該磁場調整用永久磁鐵係具有磁化方向之中央部及兩端部之至少3個區域,該兩端部的區域係垂直於該靶表面之方向的厚度彼此相等,該中央部的區域之垂直於該靶表面之方向的厚度為,大於該兩端部的垂直於該靶表面之方向的厚度之0%且為該兩端部的垂直於該靶表面之方向的厚度之99%以下。 A magnetic field generating device for magnetron sputtering is a magnetic field sputtering magnetic field generating device which is formed by a straight line portion and a corner portion which is opposed to a target and which generates a magnetic field on a target surface, and is characterized by : on a substrate composed of a non-magnetic body, having: (a) a rod-shaped central magnetic pole member; (b) an outer peripheral magnetic pole member disposed to surround the central magnetic pole member; and (c) a plurality of permanent magnets Between the central magnetic pole member and the outer peripheral magnetic pole member, a magnetic pole is disposed opposite to the central magnetic pole member, and another magnetic pole is opposed to the outer peripheral magnetic pole member; and the plurality of permanent magnets disposed on the linear portion include at least one magnetic field adjustment In the permanent magnet, the permanent magnet for magnetic field adjustment has at least three regions of a central portion and both end portions in a magnetization direction, and the regions of the both end portions are equal in thickness to each other in a direction perpendicular to the target surface, and the central portion is equal to each other. a thickness perpendicular to a direction of the target surface, greater than 0% of a thickness of the both ends perpendicular to the target surface and a direction perpendicular to the target surface of the both ends Thickness 99% or less. 如申請專利範圍第1項之磁控濺鍍用磁場產生裝置,其中該中央部的區域之垂直於該靶表面之方向的厚度為,該兩端部的垂直於該靶表面之方向的厚度之30%至70%。 The magnetic field generating apparatus for magnetron sputtering according to claim 1, wherein a thickness of a region of the central portion perpendicular to the surface of the target is a thickness of the both end portions perpendicular to a direction of the target surface. 30% to 70%. 如申請專利範圍第1或2項之磁控濺鍍用磁場產生裝置,其中設置於該角落部的複數個永久磁鐵係包含至少一個磁場調整用永久磁鐵,該至少一個磁場調整用永久磁鐵之垂直於該靶表面之方向的厚度為磁化方向 的中央部比兩端部薄。 The magnetic field generating device for magnetron sputtering according to claim 1 or 2, wherein the plurality of permanent magnets disposed at the corner portion comprise at least one permanent magnet for magnetic field adjustment, and the vertical axis of the at least one permanent magnet for magnetic field adjustment The thickness in the direction of the target surface is the magnetization direction The central portion is thinner than the ends. 如申請專利範圍第1或2項之磁控濺鍍用磁場產生裝置,其中該中央部之區域之磁化方向的長度是該永久磁鐵之磁化方向之全長的1~99%。 The magnetic field generating apparatus for magnetron sputtering according to the first or second aspect of the invention, wherein the length of the magnetization direction of the central portion is 1 to 99% of the total length of the magnetization direction of the permanent magnet. 如申請專利範圍第1或2項之磁控濺鍍用磁場產生裝置,其中該中央部及兩端部之至少3個區域分別由獨立的永久磁鐵所構成,將那些獨立的永久磁鐵黏貼而構成該磁場調整用永久磁鐵。 The magnetic field generating device for magnetron sputtering according to claim 1 or 2, wherein at least three regions of the central portion and both end portions are respectively formed by independent permanent magnets, and those independent permanent magnets are pasted and formed. This magnetic field is adjusted with a permanent magnet. 如申請專利範圍第2項之磁控濺鍍用磁場產生裝置,其中該磁場調整用永久磁鐵係在該靶側的面及/或該基底側的面具有與該中央部之區域對應的凹狀部。 The magnetic field generating device for magnetron sputtering according to the second aspect of the invention, wherein the surface of the magnetic field adjusting permanent magnet has a concave shape corresponding to a region of the central portion on a surface on the target side and/or a surface on the base side. unit. 如申請專利範圍第6項之磁控濺鍍用磁場產生裝置,其中該磁場調整用永久磁鐵係在該靶側及該基底側的雙面具有與該中央部之區域對應的凹狀部。 The magnetic field generating device for magnetron sputtering according to the sixth aspect of the invention, wherein the magnetic field adjusting permanent magnet has a concave portion corresponding to a region of the central portion on both sides of the target side and the base side. 如申請專利範圍第6項之磁控濺鍍用磁場產生裝置,其中於該凹狀部配置有磁性體。 A magnetic field generating device for magnetron sputtering according to claim 6, wherein a magnetic body is disposed in the concave portion. 如申請專利範圍第8項之磁控濺鍍用磁場產生裝置,其中配置於該凹狀部之該磁性體的厚度係與該凹狀部之深度相同。 The magnetic field generating device for magnetron sputtering according to the eighth aspect of the invention, wherein the thickness of the magnetic body disposed in the concave portion is the same as the depth of the concave portion. 如申請專利範圍第8或9項之磁控濺鍍用磁場產生裝置,其中該磁場調整用永久磁鐵係在該靶側及該基底側的雙面,具有與該中央部之區域對應的凹狀部及配置於該凹狀部之磁性體。 The magnetic field generating device for magnetron sputtering according to claim 8 or 9, wherein the magnetic field adjusting permanent magnet has a concave shape corresponding to a region of the central portion on both sides of the target side and the base side. a portion and a magnetic body disposed in the concave portion. 如申請專利範圍第1或2項之磁控濺鍍用磁場產生裝置,其中具有將該複數個永久磁鐵之至少一個替換成 磁場調整用永久磁鐵群的構成,而該磁場調整用永久磁鐵群係由將磁化方向與該永久磁鐵相同且磁化方向之長度短的至少2個永久磁鐵分開地串列配置而構成。 The magnetic field generating device for magnetron sputtering according to claim 1 or 2, wherein at least one of the plurality of permanent magnets is replaced with In the configuration of the permanent magnet group for magnetic field adjustment, the permanent magnet group for magnetic field adjustment is configured by arranging at least two permanent magnets having the same magnetization direction as the permanent magnet and having a short magnetization direction. 一種磁控濺鍍用磁場產生裝置,其特徵為:具有從如申請專利範圍第7項之磁控濺鍍用磁場產生裝置除去該基底的構成。 A magnetic field generating apparatus for magnetron sputtering, comprising: a structure for removing the substrate from a magnetic field generating device for magnetron sputtering according to claim 7 of the patent application. 一種磁控濺鍍用磁場產生裝置,其特徵為:具有從如申請專利範圍第10項之磁控濺鍍用磁場產生裝置除去該基底的構成。 A magnetic field generating device for magnetron sputtering, comprising: a structure for removing the substrate from a magnetic field generating device for magnetron sputtering according to claim 10 of the patent application. 一種磁控濺鍍用磁場產生裝置,係由與靶相對向且用以在靶表面產生磁場之由直線部及角落部所構成之競賽跑道形狀的磁控濺鍍用磁場產生裝置,其特徵為:在由非磁性體所構成之基底上,具有:(a)棒狀的中央磁極構件;(b)設置成包圍該中央磁極構件的外周磁極構件;及(c)複數個永久磁鐵,係在該中央磁極構件與該外周磁極構件之間,設置成一磁極與該中央磁極構件相對向,另一磁極與該外周磁極構件相對向;具有將該複數個永久磁鐵之至少一個替換成磁場調整用永久磁鐵群的構成,而該磁場調整用永久磁鐵群係由將磁化方向與該永久磁鐵相同且磁化方向之長度短的至少2個永久磁鐵分開地串列配置而構成。 A magnetic field generating device for magnetron sputtering is a magnetic field sputtering magnetic field generating device which is formed by a straight line portion and a corner portion which is opposed to a target and which generates a magnetic field on a target surface, and is characterized by : on a substrate composed of a non-magnetic body, having: (a) a rod-shaped central magnetic pole member; (b) an outer peripheral magnetic pole member disposed to surround the central magnetic pole member; and (c) a plurality of permanent magnets Between the central magnetic pole member and the outer peripheral magnetic pole member, a magnetic pole is disposed opposite to the central magnetic pole member, and the other magnetic pole is opposed to the outer peripheral magnetic pole member; and at least one of the plurality of permanent magnets is replaced with a permanent magnetic field adjustment In the configuration of the magnet group, the permanent magnet group for magnetic field adjustment is configured by arranging at least two permanent magnets having the same magnetization direction as the permanent magnet and having a short magnetization direction. 如申請專利範圍第1、2及14項中任一項之磁控濺鍍用磁場產生裝置,其中在對該靶表面所施加的磁場之垂直於該靶表面之方向的磁通密度為零的位置,與該靶表面平行之方向的磁通密度是10mT以上。 The magnetic field generating device for magnetron sputtering according to any one of claims 1, 2, and 14, wherein the magnetic flux density applied to the surface of the target perpendicular to the surface of the target is zero. The magnetic flux density in the direction parallel to the target surface is 10 mT or more.
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