TWI604936B - Large single-layer ceramic passive element with composite electrode layer - Google Patents

Description

Large single-layer ceramic passive component with composite electrode layer

The large single-layer ceramic passive component has a composite electrode layer, and the large single-layer ceramic passive component is a square or a positive circular structure, and the following features are produced through ceramic injection molding technology, including: The electrode boss, the edge of the rounded electrode boss, the intersection of the electrode boss and the body of the prime sheet, and the edge of the body of the prime sheet are subjected to composite debonding, atmosphere and pressure control sintering, and then combined by low temperature vacuum sputtering. The electrode layer is a large single-layer ceramic passive component with a composite electrode layer. The technical field to which the present invention pertains includes: ceramic powder injection molding, composite debonding, atmosphere and pressure controlled sintering, and low temperature vacuum sputtering composite coating. technology.

Commercially available single-layer ceramic passive components such as ceramic capacitors (Ceramic Capacitors), varistor (Metal Oxide Varsitor) and piezoelectric ceramics (PIEZO) have been used in electronic devices such as traditional refrigerators and televisions for the past 100 years. Air-conditioners, even in the modern vacuum cleaners, servo power supplies, etc., are indispensable basic electronic passive components. It is estimated that there are about 5 megawatts of market demand in the world every year, but nearly 1 mega-chip is It is a large-sized single-layer ceramic passive component that is applied to precision electronic devices that endure high-end current and voltage.

In recent years, electronic products have paid too much attention to the requirements of miniaturization and high accumulativeness. Everyone's eyes and research and development efforts have focused on the passiveness of small multi-layer ceramics, and it is a pity to ignore the improvement of passive components of large single-layer ceramics. Among them, the collision loss of all ceramic passive components (larger weight of large pieces), density unevenness and poor electrode coating are the longest-running projects in the industry, and must be picked by excess production. After the defective product is coated with expensive silver paste or copper paste, it is sintered at a high temperature again to obtain a firm electrode surface and a good product. In addition to the processing and consumption of expensive electrode materials, multiple high-temperature sintering and process conversion are derived. Functional degradation, energy waste, and carbon emissions should be improved in a better way.

The traditional large single-layer ceramic passive component film process must first It is necessary to mix a large amount of lubricating grease and wax-based material into the ceramic powder, and through the complicated and time-consuming ball milling and granulation method, and then use a large hydraulic pressing machine to suppress the green sheet of the raw material, due to the large ceramic passive component. The size of the plain sheet is large (more than 100mm2) and the thickness is more than 1mm. The compacted green body cannot be designed with a right angle. It is mainly limited by the direct pressing mold. The extra protruding features will cause the stress to be transmitted inaccurately. The characteristics and the right-angled edge, the accumulation of the powder of the bad body at these characteristic positions is different from the center of the green body, and the sintering process is easily distorted. Moreover, the flattening mold design fillet must be formed on the edge of the sharp green body cavity at the die punch, so that the weak sharp edge is easy to collapse and break, which is difficult to maintain and easy to cause the green body. Defects and falling mold debris contaminate the product.

The green body obtained after the direct pressing and pressing must be separated by heat. The process of sticking for at least 12 hours can remove a large amount of lubricant and wax contained in the green body, and then sintering to obtain a large single-layer ceramic passive component. Because there is no effective way to form the boss features and the rounded edges, it is impossible to prevent the post-process collision, even the product suffers from large current and large voltage impact processes, corner rupture and electrode short circuit cause burnt, which is a problem all along.

Subsequently, the large ceramic passive components must be made of traditional silver. If the slurry or copper paste is applied to the electrode surface, at least 5% or more of the low-temperature glaze must be mixed in the slurry as an auxiliary for the adhesion of the sintered metal electrode to the ceramic surface, resulting in a small electrode area that does not play the true function of the large ceramic passive component. Because the glaze addition affects the electrode adhesion (generally lower than 2kg tensile force), it has a great impact on the function of large ceramic passive components.

The missing points that come down to the conventional technology include the following:

The large-scale ceramic passive component green body adopts the dry hydraulic press direct pressing method. When the demand of large-area and thick-thickness products is encountered, the powder is not uniform enough in pressure distribution, and the powder is easy to form uneven density distribution in the corner, surface and central area, and sintering After the plain piece is distorted and deformed.

In order to solve the above production problems, dry pressing is used to add more lubricants, resulting in a long process of debonding and debinding, and low production efficiency. The use of too much lubricant results in a shrinkage ratio greater than 1.2 (meaning that the green body is controlled to 1.2 mm when a size of 1 mm is obtained) and the time for debonding and debinding must be increased.

Due to the limitation of the dry pressing method, the edges of the above-mentioned large ceramic passive element sheets are right angles, and the characteristics of the electrode pads and the main body of the main body cannot be created. When the electrode surface coating is applied, the overflow is very easy. With different minds and other issues. Affect the electrical function of the product.

After the traditional silver paste and copper paste are screen-printed and then subjected to secondary sintering, or the traditional vacuum-sputtered copper electrode, the resistance to solder alloying is weaker, and under the impact of large voltage and current, it cannot withstand high temperature. The electrode is liquefied and the impedance is increased.

In view of the above-mentioned shortcomings, the main object of the present invention is to provide a large single-layer ceramic passive component with a composite electrode layer, the large single-layer ceramic passive component plain is a square or a positive circular structure. Through the ceramic injection molding technology, the following features are produced, including: electrode bosses on both sides, rounded electrode boss edges, electrode bosses and the intersection of the prime body and the edge of the plain body, after the composite debonding method After the atmosphere and pressure control sintering, the composite electrode layer is applied by a low-temperature vacuum sputtering cloth to form a large-sized single-layer ceramic passive component with a composite electrode layer, in order to overcome the difficulties of the products manufactured by the prior art.

In order to achieve the above object, the technical means adopted by the present invention are as follows: powder body and polymer binder of ceramic passive component Mixture, wherein the high molecular polymer binder comprises paraffin: zinc stearate: high density linear polyethylene (HDPE): ethylene, vinyl acetate copolymer (EVA), uniformly mixed to make 2~8mm particles or Multi-angle fragments for injection molding.

Injecting the above materials into a special electric machine through an injection molding machine In the pole boss and the filleted product mold, a green part of a large single-layer ceramic passive component is formed.

The green body can adopt a composite debonding technique, that is, in an organic solvent Quickly remove the paraffin wax and zinc stearate contained in the high molecular polymer binder by at least over 95% by volume; then, remove the remaining high density linear polyethylene (HDPE) and ethylene, acetic acid by thermal debonding Vinyl ester copolymer (EVA) and residual low melting point binder. The green body after the debonding of the large single-layer ceramic passive component obtained by this process is called a brown part. Usually the thermal debonding stage is carried out in conjunction with the last stage of the high temperature sintering furnace.

Thermal debonding and high temperature sintering use controlled atmosphere and pressure In the hot debonding section, the nitrogen atmosphere is used under the pressure of 60~80kpa (0.5~0.6atm) to facilitate the residual polymer binder to be converted into gas under low pressure, vaporized and decomposed to remove heat. After the debonding temperature is about 600 ° C, it is converted into high temperature sintering; then in the high temperature sintering section, it is switched to normal air and the pressure is set at a pressure of 102~110 kPa (1.0~1.1 atm). After sintering, a large single layer ceramic passive component is obtained. Tablets.

Clean the electrode boss on the surface of the sintered sheet, simple to high pressure Air blown with a brush to remove dust from the surface.

Applying a composite electrode to a large single-layer ceramic with a low-temperature vacuum sputtering On the electrode boss of the passive component of porcelain, the electrode structure is coated by first applying the transition layer of the first composite layer, and using nickel-chromium alloy (Cr-Ni) and other alloys as the ceramic passive component. Bonding and transitioning function between the plain material and the conductive layer of the first composite layer, and then applying the conductive layer of the first composite layer again, such as copper (Cu)/aluminum (Al), etc., conductive metal, first composite layer It The transition layer is combined with the conductive layer to form a basic composite electrode layer, such that the construction is repeated at least once.

Complete a large single-layer ceramic passive component with composite electrode Layer of plain tablets.

In addition, the present invention further discloses a large single-layer ceramic passive component with a composite electrode layer: the large single-layer ceramic passive component plain is a square or a positive circular structure, and the following features are fabricated through ceramic injection molding technology; Come out, including: electrode bosses on both sides, edge of electrode bosses with rounded corners, intersection of electrode bosses and plain body, and edges of the body of the prime sheet, which are shaped after the features of the conventional direct-pressing mold cannot be mass-produced. Improve the production efficiency of the manufactured sheets to reduce the loss of collision angles in subsequent processes.

Subsequently, after the composite debonding method, the atmosphere and the pressure control sintering, the composite electrode layer is applied by the low temperature vacuum sputtering, and the composite layer with the transition layer and the conductive layer is used, which can greatly improve the adhesion of the electrode caused by the solder etching electrode. The function of reducing the force and withstanding the voltage difference, and effectively increasing the electrode area and improving the function of the overall ceramic passive component.

11‧‧‧Transition layer

12‧‧‧ Conductive layer

21‧‧‧Ceramic powder and coagulant

22‧‧‧Scissors

23‧‧‧Particles

24‧‧‧Injection molding machine

241‧‧‧green

25‧‧‧Composite debonding equipment

251‧‧‧Brown (Brownpart)

26‧‧‧Sintering furnace

261‧‧‧Segment/sintered body

31‧‧‧ solvent debonding

310‧‧‧Microporous channel

311‧‧‧bonding aid collapse layer

32‧‧‧ Debonding texture map

320‧‧‧ as a finger-shaped channel

321‧‧‧Bindering aid

322‧‧‧Powder

33‧‧‧Brown briquettes

331‧‧‧ links

41‧‧‧ square film

42‧‧‧正片

51‧‧‧Asymmetric electrode

52‧‧‧electrode symmetry

53‧‧‧External leads

71‧‧‧Leader

72‧‧‧ Solder

S‧‧‧ prime film

C‧‧‧electrode

W‧‧‧Lead

The first figure is a flow chart of a large single-layer ceramic passive component with a composite electrode layer of the present invention.

The second figure is a diagram of a ceramic powder injection molding embodiment of a large single-layer ceramic passive component with a composite electrode layer of the present invention.

The third figure is a basic example of the composite debonding of the large single-layer ceramic passive component with the composite electrode layer.

The fourth figure is a view showing an embodiment of a large-sized single-layer ceramic passive component having a composite electrode layer and having an electrode bump and a fillet.

The fifth figure is a functional explanation example of the characteristics of the upper electrode boss of the prime sheet of the large single-layer ceramic passive component with the composite electrode layer of the present invention.

Fig. 6 is a view showing an embodiment of a composite plating layer described in the sheet of a large single-layer ceramic passive component with a composite electrode layer of the present invention.

Fig. 7 is a view showing an embodiment in which the composite plating layer of the large single-layer ceramic passive component with a composite electrode layer of the present invention can be used as a tin-copper eutectic melting barrier.

The eighth figure is a reference example for providing the phenomenon of eutectic melting of tin-copper alloy.

The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention.

The embodiments of the present invention are described below with reference to the drawings, in which the following drawings are simplified, and the basic concept of the present invention is only illustrated in a schematic manner, and only the structure related to the present invention is illustrated in the drawings. Rather than drawing according to the number, shape and size of the components in actual implementation, the types, quantities and proportions of the components in actual implementation are not limited to the illustrations, and can be changed according to the actual design requirements.

Referring to the first figure, the present invention is a large single-layer ceramic passive component with a copper electrode. The manufacturing procedure has been described in the above description, and the detailed description is not repeated here. Please refer to the second to eighth figures for further cooperation.

The forming technique of the large single-sided ceramic passive component sheet, as described in the second figure, is a program diagram of ceramic-powder injection molding (CIM), and (21) first prepares ceramics. The ceramic powder of the passive component and the binder composed of the necessary high molecular polymer are placed in a shearing chain mixer (22) for heating and mixing to form an injection for injection. Then, the shot is subjected to hot extrusion into a particle size of 2-8 mm for injection according to the method of (23), and the green body of the large single-layer ceramic passive component is injected by the special injection molding machine of (24) ( Green part) is injection molded by a special mold. After injection molding, the composite debonding equipment of Figure (25), first The high-molecular polymer contained in the binder having a low melting point is rapidly extracted by a solvent. When the solvent debinding step is completed, the green body from which the binder is removed is called a brown part, and the brown body is moved into the drawing ( 26) The sintering furnace is vacuum-heated to perform high-temperature debonding, and the high-molecular polymer contained in the relatively high-temperature binder is burned off, followed by high-temperature sintering to obtain a large-sized single-layer ceramic passive component.

The first table describes the operating parameters of the two types of ceramic passive components in the process shown in Figure 2. Since the density of each large single-layer ceramic passive component is not the same, The parameters are not all the same, please understand it carefully.

In addition, in order to facilitate the review committee members to fully understand the ceramic powder injection The formed bulk/oversize Shrinkage Factor (OSF), as shown in the second table, is a calculation procedure in which the ceramic sheet obtained is assumed to be zinc oxide with a density of 5.61 g/cm3; The agent was 1.02 g/cm3. The mathematical method must be used to calculate the weight ratio of zinc oxide to the binder before it can be used as production data.

The composite debonding and sintering referred to in the present invention are shown in the third figure. The debonding step in the second figure (26) belongs to the composite debonding low temperature debonding section, as shown in Figure (31). The description of the viscosity mechanism is carried out by using a low-temperature (60 ° C) immersion extraction of a low-melting high-molecular polymer such as PW/SA/ZS in an organic solvent (a petroleum-based organic solvent such as n-heptane and n-hexane). The porous body is made porous to facilitate the next debonding process. After the low temperature solvent is debonded, it is then transferred to the sintering furnace shown in the second figure (27) for vacuum thermal decomposition and debonding in the high temperature section, such as the debonding mechanism diagram of the third figure (32), and the high temperature binder is used. High temperature and vacuum twitching action, vaporization decomposition of high temperature binder (HDPE/PE/EVA) is lower The path after temperature debonding is excluded. Subsequently, as shown in the third diagram (33), high-temperature positive pressure sintering can be performed, and the porous ceramic body from which the porous powder of the binder is removed is subjected to high-temperature sintering to obtain a high-density ceramic sheet.

The fourth figure shows the cross-sectional graphic features of the large single-layer ceramic passive component of the present invention, wherein (41) is a square piece; the figure (42) is a perfect disk, and the detail is enlarged. The oblique portion of the B section is a large single layer. Sectional view of ceramic passive components; where S: is the side length of the square piece (15mm S or D 100mm); if it is a perfect circle, then S = D = the diameter of the circle. T: the thickness of the ceramic sheet (1mm T 50mm); t: the height of the electrode boss (0.1mm t 1/2T), the boss is higher than the maximum area of the large single-layer ceramic passive component for the subsequent electrode application. TR: the edge of the bulk body of a large single-layer ceramic passive component with a rounded corner. The size range of R is (0.05mm). R 1/2T). Tr: the edge of the electrode boss of the fillet is connected to the body of the single-layer ceramic passive component, and the r size range is (0.05mm r 1/2t).

Please see the fifth figure when completing a large single sheet with electrode boss features. Layer ceramic passive components, you need to start the application of the composite electrode surface. Due to the expensive metal powder (silver paste or copper paste) used in the past, even the traditional vacuum sputtering and evaporation methods, because there is no boss design, the plain film is prone to the problem of inaccuracy of movement and alignment. Causes the two electrodes to be asymmetrical or dissimilar, as shown in Figure 51 (51). In the present invention, as shown in the fifth figure (52), we can use a metal such as aluminum alloy or stainless steel to cut out a suitable shielding jig, and use the special electrode boss feature of the present invention to accurately position the metal regardless of the metal used. The slurry can be accurately positioned and symmetrical without the slurry or vacuum evaporation, vacuum sputtering or vacuum multi-arc ion plating. At the same time, as shown in the fifth figure (53), since the electrode boss is higher than the body surface of the large single-layer ceramic passive component, when the external lead bonding is performed, the bottom of the lead does not overlap with the large single-layer ceramic passive component. The surface contact of the plain film avoids the corona effect (Corona Effect, a kind of arcing caused by contact and non-contact micro-space between the lead and the ceramic passive component, which is the least noticeable electrical interference of the passive component of the ceramic in the past). It is also a novel solution.

The sixth figure shows an example of the composite coating layer used in the present invention, which is a demonstration of a two-layer composite coating layer. First, a first composite layer is applied by vacuum sputtering on a large single-sided ceramic passive component sheet. a transition layer, the transition layer acts as a surface material of the ceramic passive component and interacts with the conductive layer material of the first composite layer; subsequently, the conductive layer of the first composite layer is applied; then the transition layer and the conductive layer are combined to become the first The composite layer is repeated as an example of the implementation of this figure.

The implementation of this conductive composite layer is shown in the third table as a vacuum sputtering parameter.

The seventh figure is an example of the composite coating layer used in the present invention to explain how the composite coating resists solder erosion and high temperature melting, please first Please see Figure 8 for the phase diagram of the tin-copper binary alloy. The data is provided by the International Thermodynamic Databank System (www.factsage.com), in a random situation and At atmospheric pressure, tin-copper undergoes a so-called Eutectic melting at a temperature of 214 ° C (where Cu:Sn = 97:3), which is much lower than the conventional solder temperature range (230 to 260 ° C). Once the eutectic phenomenon occurs, the phenomenon of tin-copper eutectic melting continues to spread until the temperature is lower than the melting point. Therefore, the present invention utilizes a third metal or other alloy having a melting point of tin eutectic higher than this temperature as a barrier to block tin-copper eutectic melting, and is also a transition of the composite plating used in the present invention. The layer material, which is a nickel-chromium alloy (Cr-Ni) and other alloys thereof, can effectively block the tin-copper eutectic melting.

Looking at the above, it can be seen that the present invention has achieved the desired effect under the prior art, and is not familiar to those skilled in the art. Moreover, the present invention has not been disclosed before the application, and it has Progressive and practical, it has already met the requirements for patent application, and has filed a patent application according to law. You are requested to approve the application for this invention patent to encourage invention.

While the foregoing description of the preferred embodiments of the invention, the embodiments of the invention The spirit and scope of the principles of the invention. Modifications of many forms, structures, arrangements, ratios, materials, components and components can be made by those skilled in the art to which the invention pertains. Therefore, the embodiments disclosed herein are to be considered as illustrative and not restrictive. The scope of the present invention is defined by the scope of the appended claims, and the legal equivalents thereof are not limited to the foregoing description.

Claims (10)

A large single-layer ceramic passive component with a copper electrode, the large single-layer ceramic passive component is formed into a square or a positive circular structure, and the features are produced through ceramic injection molding technology, and the features include: The side has an electrode boss, a rounded electrode boss edge, a body intersection and an edge of the body of the sheet. After composite debonding, atmosphere and pressure control sintering, the copper electrode is applied by a low temperature vacuum sputtering cloth to become a large Single-layer ceramic passive components with a copper electrode. The large single-layer ceramic passive component according to claim 1 is provided with a copper electrode, wherein the large single-layer ceramic passive component is formed into a square or a positive circular structure, and the square has a side length of more than 15 mm. Or the diameter of the perfect circle is greater than 15 mm, and the overall thickness is greater than 1 mm. The large single-layer ceramic passive component according to claim 1 is provided with a copper electrode, wherein the electrode boss is characterized by being on the largest two-area side of the single-layer ceramic element sheet and being within 0.5~1 mm from the edge to form an upward direction. The side protrusions are at least 0.1 mm or more but not more than 1/2 of the thickness of the body for use in subsequent processes. The large single-layer ceramic passive component according to claim 1 has a copper electrode, wherein the radius of the electrode boss edge and the body intersection has a radius of more than 0.05 mm, but not More than 1/2 of the height of the boss is used for precise positioning of the coating on both sides and subsequent processes. The large single-layer ceramic passive component according to claim 1 has a copper electrode, wherein the edge of the rounded plain body has a radius of a radius of more than 0.05 mm but no more than ceramic The 1/2 thickness of the sheet body provides a buffer for subsequent processes and impact concentration of the ceramic passive component during operation and rapid expansion of stress concentration. The large single-layer ceramic passive component according to claim 3 is provided with a copper electrode, wherein the electrode boss provides precise positioning of the copper electrode by vacuum sputtering, prevents deviation of the electrode construction process, and ensures Both sides of the same electrode The heart or the same projected area, and therefore does not cause the arcing and short circuit problems caused by the overflow of the two electrodes. The large single-layer ceramic passive component according to claim 1 is provided with a copper electrode, wherein the ceramic raw material powder must be mixed with a volume ratio of more than 30% and less than 50% of the total shot. The high molecular polymer binder is used after sufficient dense chain bonding, and the linear amplification ratio of the green body body and the sintered ceramic material sheet is controlled to be in a range of more than 1.05 but less than 1.19. The large single-layer ceramic passive component according to claim 7 is provided with a copper electrode, wherein the high molecular polymer binder comprises a low melting point portion, which is stearic acid/zinc stearate/hard fat. Acid metal base or the like as an activator, paraffin / microcrystalline wax / Brazilian wax / beeswax can be used as a filler, and the total volume ratio of activator and filler is equal to 50% of the total volume of the binder: 50% of the remaining adhesive The volume is a high temperature resistant adhesive, which is a high density polyethylene (HDPE) / polyethylene / ethylene, vinyl acetate copolymer (EVA) / polypropylene (PP), can be mixed in a single or any ratio . The large single-layer ceramic passive component according to claim 6 is provided with a copper electrode, wherein the electrode boss feature provides precise positioning of the copper electrode for vacuum sputtering and avoids external lead contact ceramic passive element The body of the film, and the coating design of the vacuum sputtering is a composite coating, with nickel chrome and its alloy as the transition layer material of the surface of the passive component of the ceramic passive component and the conductive layer, the conductive layer and the conductive layer, the thickness of which is 10 nm. The range of ~1500nm can be; the conductive layer material is made of copper/aluminum with high conductivity of pure metal, and the thickness of vacuum sputtering is 300nm~3000nm. The first composite plating combination composed of the transition layer-conductive layer can be continuously implemented from a single level to a complex level range. The large single-layer ceramic passive component as claimed in claim 6 is provided with a copper electrode, wherein the electrode boss provides precise positioning of the copper electrode by vacuum sputtering, in addition to providing a vacuum layer to apply the composite layer. In addition to the precise positioning of the electrodes, it can also be used as screen printing, stenciling and embossing various conductive metals or alloy pastes to form electrodes that are correct and do not overflow the metal paste.