TWI604578B - Stacking module and interposer used therefor - Google Patents
Stacking module and interposer used therefor Download PDFInfo
- Publication number
- TWI604578B TWI604578B TW101119685A TW101119685A TWI604578B TW I604578 B TWI604578 B TW I604578B TW 101119685 A TW101119685 A TW 101119685A TW 101119685 A TW101119685 A TW 101119685A TW I604578 B TWI604578 B TW I604578B
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- semiconductor element
- interposer
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- heat
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- H—ELECTRICITY
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06589—Thermal management, e.g. cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011122906A JP5799360B2 (ja) | 2011-05-31 | 2011-05-31 | 積層モジュール及びそれに用いるインターポーザ |
Publications (2)
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TW201308532A TW201308532A (zh) | 2013-02-16 |
TWI604578B true TWI604578B (zh) | 2017-11-01 |
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Application Number | Title | Priority Date | Filing Date |
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TW101119685A TWI604578B (zh) | 2011-05-31 | 2012-05-31 | Stacking module and interposer used therefor |
Country Status (4)
Country | Link |
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JP (1) | JP5799360B2 (ja) |
CN (1) | CN103748682A (ja) |
TW (1) | TWI604578B (ja) |
WO (1) | WO2012165594A1 (ja) |
Families Citing this family (3)
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JP6540230B2 (ja) * | 2015-05-26 | 2019-07-10 | 富士通株式会社 | 基板 |
EP3357308A1 (en) * | 2015-10-01 | 2018-08-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic component carrier for carrying and cooling a heat generating electronic component |
CN112086417B (zh) * | 2020-10-28 | 2021-02-12 | 广东佛智芯微电子技术研究有限公司 | 一种高效散热的多芯片3d堆叠封装结构及封装方法 |
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JPS59202654A (ja) * | 1983-05-02 | 1984-11-16 | Nippon Telegr & Teleph Corp <Ntt> | 集積回路パツケ−ジ |
JP3842759B2 (ja) * | 2003-06-12 | 2006-11-08 | 株式会社東芝 | 三次元実装半導体モジュール及び三次元実装半導体システム |
JP4710460B2 (ja) * | 2005-07-20 | 2011-06-29 | 株式会社村田製作所 | セラミック多層基板、その製造方法、およびパワー半導体モジュール |
JP2007096252A (ja) * | 2005-08-29 | 2007-04-12 | Kyocera Corp | 液冷式回路基板および液冷式電子装置 |
CN2901578Y (zh) * | 2006-05-22 | 2007-05-16 | 杨开艳 | 一种高效能cpu散热器 |
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2011
- 2011-05-31 JP JP2011122906A patent/JP5799360B2/ja not_active Expired - Fee Related
-
2012
- 2012-05-31 CN CN201280038357.8A patent/CN103748682A/zh active Pending
- 2012-05-31 TW TW101119685A patent/TWI604578B/zh not_active IP Right Cessation
- 2012-05-31 WO PCT/JP2012/064204 patent/WO2012165594A1/ja active Application Filing
Also Published As
Publication number | Publication date |
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JP5799360B2 (ja) | 2015-10-21 |
JP2012253106A (ja) | 2012-12-20 |
TW201308532A (zh) | 2013-02-16 |
CN103748682A (zh) | 2014-04-23 |
WO2012165594A1 (ja) | 2012-12-06 |
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