TWI603090B - A vertical probe, a method of manufacturing the same, and a probe head and a probe card using the same - Google Patents

Description

Vertical probe and manufacturing method thereof, and probe head and probe card using the same

The present invention relates to a vertical probe, and more particularly to a vertical probe having an insulating layer and a method of manufacturing the same, and a probe head and a probe card using the vertical probe (probe card).

Referring to FIG. 1, a conventional probe card 10 using a vertical probe generally includes a circuit board 11, a probe head 12, and a space conversion between the circuit board 11 and the probe head 12. 13. The probe head 12 includes an upper guide 14, a lower guide 15, and a plurality of vertical probes 16. Each of the vertical probes 16 includes a needle tail 161 that is disposed on the upper guide plate 14, a frustrating needle body 163, and a needle 165 that is disposed through the lower guide plate 15. The needle tail 161 is electrically connected to the circuit board 11 through the space converter 13. The needle 165 is used to touch a test object (not shown) so that the object to be tested can pass through the vertical probe 16 . The space converter 13 and the circuit board 11 and the test machine (not shown) electrically connected to the circuit board 11 transmit signals to each other for the purpose of detecting the object to be tested. In addition, the needle body 163 is elastically deformed in a buckling shape, so that the vertical probe 16 is elastically contacted with the object to be tested, that is, the needle 165 can elastically move upward when it touches the object to be tested, thereby The vertical probe 16 and the object to be tested can be prevented from being damaged by being subjected to a force between each other.

Although the probe card using the vertical probe has the advantage of being replaceable and easy to repair, it is difficult to apply because the probe has a long signal transmission path, large interference, or poor matching, which is not conducive to frequency increase. High frequency test. In addition, the aforementioned probe card 10 is usually rotated in the space. The wiring space inside the converter 13 is limited. Under the limitation of the size of the object to be tested, the pitch between the two vertical probes 16 must conform to the Fine Pitch to correspond to the connection on the object to be tested. The dot distance, the insufficient wiring space inside the space converter 13 causes the difficulty in setting the matching circuit to the space converter 13 to increase as the size of the object to be tested is limited.

In view of the above-mentioned deficiencies, the main object of the present invention is to provide a vertical probe and a method of manufacturing the same, wherein the vertical probe can meet high frequency test requirements and is easy to install.

In order to achieve the above object, the vertical probe provided by the present invention has a needle tail for threading on an upper guide, a needle for threading the lower guide and for touching a test object, and a needle body between the needle tail and the needle; the vertical probe is characterized by comprising a structural member fixed to each other, an insulating layer and a conductive member, the structural member including the needle tail and at least part of the The needle body, the conductive member includes at least a portion of the needle, the insulating layer completely separating the conductive member from the structural member to insulate the conductive member from the structural member.

The method for manufacturing the vertical probe comprises the steps of: providing a substrate and a sacrificial layer disposed on the substrate, and forming a photoresist layer on the sacrificial layer by using a lithography and electroplating process, and separately inlaying the spacer layer The structural member and the conductive member of the photoresist layer; the photoresist layer is removed such that a gap exists between the structural member and the conductive member; an insulating material is filled into the gap to form the insulating layer, thereby forming the insulating layer Generating the vertical probe fixed to the sacrificial layer and the substrate; and removing the sacrificial layer to separate the vertical probe from the substrate.

In order to achieve the above object, the present invention further provides another vertical probe having a needle tail for threading on an upper guide plate and a needle for threading a lower guide plate for touching a test object. a head, and a needle body between the needle tail and the needle; the vertical probe is characterized by comprising a structural member, an insulating layer and a conductive member fixed to each other, the structural member having a shape substantially corresponding to a needle tail, the needle body and a needle tail segment of the shape of the needle, a needle body segment and a needle segment, the insulating layer covering at least the needle segment of the structural member, the conductive member is covering at least part of the insulating layer and And a conductive layer for contacting the object to be tested, the insulating layer completely separating the conductive member from the structural member to insulate the conductive member from the structural member.

The method for manufacturing the vertical probe includes the following steps: providing a structural member having a needle tail segment, a needle segment and a needle body segment connecting the needle tail segment and the needle segment; forming an at least covering An insulating layer of the needle segment of the structural member; and forming a metal plating film on the insulating layer to form a conductive member covering at least a portion of the insulating layer and contacting the object to be tested, and the insulating layer completely aligns the conductive member The structure is separated from the structural member to insulate the conductive member from the structural member.

Therefore, the vertical probe only transmits the signal by the conductive member, so the signal transmission path is short, which can meet the requirements of high frequency testing, and the structural member, the insulating layer and the conductive member of the vertical probe described above. They are fixed to each other, so the vertical probe is easy to install.

Another object of the present invention is to provide a probe head and a probe card using the above-described vertical probe, which can meet the requirements of high frequency testing, easy to mount the probe, and easy to set the matching circuit.

To achieve the above object, the probe head of the present invention comprises an upper guide, a lower guide unit, and a plurality of vertical probes as described above. The lower guide plate unit includes at least a lower guide plate, at least one signal conductor fixedly disposed on the at least one lower guide plate for transmitting a test signal, and at least one ground conductor electrically connected to a ground potential, and The at least one signal through hole and the at least one ground through hole of the at least one lower guide plate have a conductive inner wall connected to the signal conductor, and the ground through hole has a conductive inner wall connected to the ground conductor. Vertical The needle end of the probe is disposed on the upper guide plate, and the needles of the vertical probes are disposed on the at least one lower guide plate. The vertical probes include at least one signal pin and at least one ground pin. The needle of the signal pin is connected to the signal through hole and electrically connected to the signal conductor through the conductive inner wall of the signal hole. The needle of the ground pin is disposed in the conductive hole of the ground through hole and penetrates the ground through hole. The wall is electrically connected to the ground conductor.

In order to achieve the above object, a probe card provided by the present invention comprises a probe head as described above, a circuit board, and a conductive connecting member, and the circuit board is connected to the upper and lower guide plates of the probe head. Fixedly, and providing a test signal transmitted by the signal conductor and a ground potential electrically connected to the ground conductor, the two ends of the conductive connector are electrically connected to the signal conductor and the circuit board respectively, thereby being on the circuit board and the circuit board A test signal is transmitted between the signal conductors.

Thereby, the conductive members of the vertical probes can be electrically connected to the circuit board by the lower guide unit and the conductive connector, thereby electrically connecting the object to be tested and the test machine electrically connected to the circuit board. Transmitting signals to each other, so that the signal transmission path is short to meet the requirements of high frequency testing, and each of the vertical probes has the advantage of being easy to install as described above, and the lower guide plate can be used to set a matching circuit when used. When the flexible circuit board is used as the conductive connecting member, the conductive connecting member can also be provided with a matching circuit. Therefore, the probe head and the probe card of the present invention are easier to set the matching circuit than the conventional one.

The detailed configuration, features, assembly or use of the vertical probe provided by the present invention and the method of manufacturing the same, and the probe head and the probe card using the vertical probe will be described in the detailed description of the subsequent embodiments. description. However, it should be understood by those of ordinary skill in the art that the present invention is not limited by the scope of the invention.

[Prior technology]

10‧‧‧ probe card

11‧‧‧ boards

12‧‧‧ probe head

13‧‧‧ Space Converter

14‧‧‧Upper guide

15‧‧‧ lower guide

16‧‧‧Vertical probe

161‧‧‧needle tail

163‧‧‧ needle body

165‧‧‧ needle

17‧‧‧Electronic components

[Examples]

20‧‧‧Probe head

30‧‧‧Upper guide

31‧‧‧Perforation

40‧‧‧ lower guide unit

41‧‧‧ lower guide

42‧‧‧ Signal Piercing

421‧‧‧Electrically conductive inner wall

43‧‧‧ Grounding perforation

431‧‧‧Electrically conductive inner wall

44‧‧‧ Signal conductor

441‧‧‧Round Department

443‧‧‧Extension

445‧‧‧External Department

45‧‧‧ Grounding conductor

451‧‧‧Round Department

453‧‧‧Extension

455‧‧‧External Department

46‧‧‧ gap

50‧‧‧Vertical probe (signal pin)

50'‧‧‧Vertical probe (grounding pin)

51‧‧‧needle tail

52‧‧‧ needle body

53‧‧‧stops

54‧‧‧ needle

55‧‧‧Structural parts

551‧‧‧ Groove

56‧‧‧Insulation

561‧‧‧Main section

563‧‧‧Bench

57‧‧‧Electrical parts

571‧‧‧ Ontology

573‧‧‧Bumps

574‧‧‧ Connection section

575‧‧‧ embedded card section

576‧‧‧ arc surface

577‧‧‧ Large rectangular section

578‧‧‧Small rectangle

61‧‧‧Substrate

62‧‧‧ Sacrifice layer

63‧‧‧Photoresist layer

64‧‧‧ gap

65‧‧‧Insulation materials

70‧‧‧ probe card

71‧‧‧Circuit board

72‧‧‧ Space Converter

73‧‧‧Electrical connectors

74‧‧‧Vertical needle body

741‧‧‧needle tail

743‧‧‧ needle body

745‧‧‧ needle

75, 76‧‧‧ socket

80‧‧‧Vertical probe

81‧‧‧needle tail

82‧‧‧ needle

83‧‧‧ needle body

84‧‧‧Structural parts

85‧‧‧Insulation

86‧‧‧Electrical parts

L1‧‧‧ vertical axis

L2‧‧‧ horizontal axis

D‧‧‧Width

Lt, Lh‧‧‧ length

1 is a schematic cross-sectional view of a conventional probe card; FIG. 2 is a perspective view of a probe head according to a first preferred embodiment of the present invention; and FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. FIG. 4 is a front view of the vertical probe provided by the first preferred embodiment of the present invention; and FIGS. 5 to 8 are perspective views showing the first preferred embodiment of the present invention. A flow chart of a method for manufacturing a vertical probe; FIG. 9 is a cross-sectional view of a probe card according to the first preferred embodiment of the present invention; and FIG. 10 is a second preferred embodiment of the present invention. A perspective view of the probe head is provided, showing that the lower guide unit has a two-layer lower guide; the eleventh figure is similar to the tenth figure, but the guide is not drawn below the upper layer to illustrate the probe head. 12 is a perspective view of a probe head according to a third preferred embodiment of the present invention; and FIG. 13 is a cross-sectional view of the probe head according to the third preferred embodiment of the present invention; FIG. 3 is a perspective view of a probe head according to a fourth preferred embodiment of the present invention, showing a lower guide unit The second lower guide; the 15th is similar to the 14th, but the lower guide located in the upper layer is not drawn to illustrate the structure of the probe head; the 16th to 21st is the other six vertical Front view of the probe; Fig. 22 to Fig. 24 are partial front views of the other three vertical probes; Fig. 25 is a perspective view of another vertical probe; and Fig. 26 is a sectional view of Fig. 25 Cutaway view of 26-26.

The Applicant first describes the same or similar elements or structural features thereof in the embodiments and the drawings which will be described below.

Referring to FIGS. 2 and 3, a probe head 20 according to a first preferred embodiment of the present invention includes an upper guide 30, a lower guide unit 40, and four vertical probes 50, 50'. The two vertical probes 50 are respectively a signal needle, and the other two vertical probes 50' are respectively a grounding pin. The vertical probes 50 and 50' have the same structure, but each of the signal pins 50 is The test signal is transmitted, and each of the ground pins 50' is used to transmit a ground potential.

The upper guide 30 is electrically non-conductive and has four perforations 31. The lower guide plate unit 40 includes a lower guide plate 41, two signal through holes 42 and two grounding through holes 43 disposed on the lower guide plate 41, and is fixedly laid on the upper surface of the lower guide plate 41 (also can be laid on the lower surface) The second signal conductor 44 and a ground conductor 45. In detail, the lower guiding plate 41 is originally a non-conducting and perforated plate body similar to the upper guiding plate 30, and then the perforated hole wall is plated with a metal layer to form the signal perforations 42 and ground. The perforations 43 are such that each of the signal vias 42 and the ground vias 43 have a conductive inner wall 421, 431. In addition, the upper surface (or the lower surface) of the lower guiding plate 41 may be completely plated with a metal layer, and then a specific portion of the metal layer is removed (for example, by etching) to generate two voids 46 having a specific shape. The metal layer inside each of the gaps 46 is made into a signal conductor 44, and the remaining metal layers on the outside of the two gaps 46 belong to the ground conductor 45.

In this embodiment, each of the signal conductors 44 has an annular portion 441, an extending portion 443 extending from the annular portion 441, and a connecting portion 445 connecting the extending portion 443. The two signal conductors 44 The annular portion 441 covers and connects the conductive inner walls 421 of the two signal through holes 42 respectively. Therefore, the conductive inner walls 421 of the two signal through holes 42 can be connected to other devices by connecting the external connecting portions 445 to the external lines. Electrical connection (this section will be detailed below). The shape of each of the signal conductors 44 is not limited as long as the function of electrically connecting the signal vias 42 to the external lines as described above can be provided. The grounding conductor 45 covers and connects the conductive inner wall 431 of the two grounding through holes 43. Therefore, the two The conductive inner wall 431 of the grounding through hole 43 can be electrically connected to each other by the grounding conductor 45, and can be electrically connected to a ground potential by being connected to the grounding conductor 45. (This section will also be described in detail below. ).

Referring to FIG. 4, the outline shape of each of the vertical probes 50, 50' is similar to that of a conventional buckling probe manufactured by a microelectromechanical process, and has a sequential shape. A needle tail 51, a needle body 52, a stopping portion 53 and a needle head 54 are connected. The needle body 52 is in a buckling shape and can be elastically deformed when the probe 50, 50' is stressed. The needle head 54 can When the lower end point touches a test object (not shown), and the needle 54 touches the object to be tested, it can move a small amount along a longitudinal axis L1. The vertical probe of the present invention is preferably designed such that the length of the vertical probe is 3-6 times the length of the needle, and the length defined by the present invention refers to the length parallel to the longitudinal axis L1, for example. The length Lt shown in FIG. 4 is the length of each of the vertical probes 50, 50' (ie, the end of the needle 51 is not connected to the end of the needle body 52, the horizontal extension to the needle 54 is not connected to the stop portion 53. Or the vertical distance of the horizontal extension of one end of the needle body 52), and the length Lh is the length of the needle 54. Moreover, the needle body 52 is in a buckling shape such that the needle tail 51 and the needle 54 are not on the same vertical extension axis, i.e., the needle tail 51 does not extend in the extended path of the needle 54 along the longitudinal axis L1. The needle body 52 is bent without curling and has a good resilience, and also allows a plurality of probes to be placed together to achieve a small size. The needle tail 51 and the needle 54 may be substantially linear in configuration and may not be on the same vertical extension axis but substantially parallel to each other.

The probes of the present invention are integrally formed of a single material, and the vertical probes 50, 50' of the present invention comprise a structural member 55, an insulating layer 56 and a conductive member 57, optionally of different materials. . In this embodiment, the structural member 55 includes the needle tail 51 and a majority of the needle body 52. The conductive member 57 includes the needle head 54, the stopping portion 53 and a small portion of the needle body 52. In detail, the manufacturing method of the vertical probe 50, 50' includes the following steps:

a) Referring to FIG. 5, a substrate 61 (material such as stainless steel) and a sacrificial layer 62 (material such as copper) disposed on the substrate 61 (see FIG. 6) are provided, and lithography is utilized. A photolithography and an electroplating process form a photoresist layer 63 on the sacrificial layer 62, and the structural member 55 and the conductive member 57 embedded in the photoresist layer 63.

In detail, the photoresist layer 63 is formed into a shape corresponding to the shape of the structural member 55 and the conductive member 57 by a lithography process, and the structural member can be produced by electroplating in the two through grooves. 55 and the conductive member 57. The structural member 55 may be made of a high hardness material such as palladium (Pd), nickel (Ni), rhodium (Rh) or an alloy thereof, and the conductive member 57 may be made of a high hardness material as described above or a highly conductive material such as gold. (Au), silver (Ag), copper (Cu) or an alloy thereof. In other words, the structural member 55 and the conductive member 57 may be of the same material or different materials. If the structural member 55 and the conductive member 57 are made of different materials, the step a) is divided into two to form the structure. The steps of the member 55 and the conductive member 57 (the order is not limited). After this step a) is completed, the structural member 55 and the conductive member 57 may be planarized by grinding (but not necessarily), and the following steps are performed.

b) removing the photoresist layer 63 (e.g., by etching) such that there is a gap 64 between the structure member 55 and the conductive member 57, as shown in FIG.

In FIG. 5, the sacrificial layer 62 is not covered by the photoresist layer 63. After the step b) removing the photoresist layer 63, the sacrificial layer 62 is left on the substrate 61, and The structural member 55 and the conductive member 57 fixed on the sacrificial layer 62 have a small portion of the photoresist layer 63 between the structural member 55 and the conductive member 57. The portion 64 is removed after the portion is removed.

c) Referring to Fig. 7, an insulating material 65 is filled in the gap 64 to form the insulating layer 56, thereby producing the vertical probes 50, 50' fixed to the sacrificial layer 62 and the substrate 61.

The insulating material 65 (that is, the material of the insulating layer 56) may be made of an elastic polymer material such as, but not limited to, Polyimide (PI), or an inelastic ceramic material. For example, aluminum oxide (Al ₂ O ₃ ), hafnium oxide (HfO ₂ ), and the like. As shown in FIG. 7, the insulating material 65 may cover the sacrificial layer 62. After the insulating material 65 is cured, the portion of the insulating material 65 outside the gap 64 is etched (for example, reactive ion etching). Remove. After this step c) is completed, the insulating layer 56 may be planarized by (but not necessarily) grinding, and the following steps are performed.

d) removing the sacrificial layer 62 (e.g., by etching) such that the vertical probes 50, 50' are separated from the substrate 61, as shown in Fig. 8.

In this way, the structural member 55, the insulating layer 56 and the conductive member 57 are fixed to each other, and the insulating layer 56 completely separates the conductive member 57 from the structural member 55 to make the conductive member 57 and the conductive member 57 The structural members 55 are insulated from each other. In other words, when the needle 54 of the vertical probe 50, 50' touches the object to be tested, only the conductive member 57 is electrically connected to the object to be tested, and the insulating layer 56 and the structure member 55 are not connected with the object to be tested. Electrical connection.

As shown in FIG. 2 and FIG. 3, the needle tails 51 of the vertical probes 50 and 50' are respectively inserted through the through holes 31 of the upper guide plate 30, and the needles 54 of the two signal pins 50 are respectively disposed. The second signal hole 42 is electrically connected to the second signal conductor 44 through the conductive inner wall 421 of the second signal hole 42. The needles 54 of the two ground pins 50' are respectively worn. The two grounding through holes 43 are disposed in contact with the conductive inner wall 431 , and are electrically connected to the grounding conductor 45 through the conductive inner wall 431 of the two grounding through holes 43 . When the vertical probes 50, 50' are not touched by the object to be tested, the blocking portion 53 abuts against the signal conductor 44 or the ground conductor 45 of the lower guide unit 40 (if the signal conductor 44 and the ground conductor) 45 is provided on the lower surface of the lower guide 41, and the stopper portion 53 abuts against the upper surface of the lower guide 41) to prevent the vertical probes 50, 50' from coming off the lower guide 41.

In this embodiment, since each of the probes 50, 50' is manufactured by a microelectromechanical process, the needles 54 are generally rectangular in shape, and each of the signal through holes 42 and the grounding through holes 43 are in the shape of a circular hole. However, please refer to the Chinese Patent No. I528037 previously filed by the applicant of the present invention. Each of the needles 54 can also be formed into a circular arc chamfer or a cylindrical shape by a microelectromechanical process and an electrolysis process, and each of the signal perforations 42 The grounding through hole 43 is also not limited to a circular hole shape, and may be, for example, a square hole or a rectangular hole. In addition, please refer to the Chinese patent number I453420 previously filed by the applicant of the present invention, each of the signal perforations 42 The conductive inner walls 421, 431 of the ground vias 43 may include a primer layer and a composite metal layer containing lubricating particles to reduce the friction between the probe and the conductive inner wall.

Referring to FIG. 9, the probe head 20 is applied to a probe card 70. The probe card 70 includes a probe board 20, and further includes a circuit board 71 disposed on the circuit board. A space transformer 72 between the 71 and the probe head 20, and two conductive connectors 73 connecting the circuit board 71 and the lower guide unit 40. The circuit board 71 and the space transformer 72 can be electrically connected by solder ball soldering or by using an elastic conductive member as an intermediate interposer. In addition, the probe head 20 in FIG. 9 has two conventional vertical probes 50, 50', and has two conventional vertical probes (referred to as a vertical needle 74 in the present invention), that is, The needle tail 741, the needle body 743, and the needle 745 of each of the vertical needle bodies 74 are electrically conductive to each other.

In Fig. 9, the components are illustrated in a simple diagram for illustration. In order to simplify the drawing, the structure of each of the vertical probes 50, 50' is not shown in detail in FIG. 9, but only in the same figure as the vertical needle 74, and the lower guide is not drawn in detail in FIG. The structure of the board unit 40 is shown only in the same figure as the upper guide 30. In addition, the ratio of the probe head 20 in Fig. 9 does not correspond to the second figure, and the components in Fig. 9 are not drawn in accordance with the actual scale, thereby simplifying the drawing.

It should be noted that the upper and lower guide plates 30 and 41 of the probe head 20 are actually connected to each other by a connection structure (not shown), and are fixed to the circuit board 71. However, the connection structure is not related to the technical features of the present invention, and thus the connection structure is not shown in the drawings and will not be described in detail herein. In addition, the space transformer 72 is used to electrically connect the two vertical pins 74 to the circuit board 71. However, the probe head 20 and the probe card 70 of the present invention are not limited to being provided with the vertical needle body. 74, that is, the probes in the probe head 20 and the probe card 70 of the present invention may all adopt the vertical probe provided by the present invention, or may be partially the vertical probe provided by the present invention and partially Conventional probes; in the case where the vertical needle body 74 is not provided, or in the case where each of the vertical needle bodies 74 can be directly electrically connected to the circuit board 71, the space transformer 72 may not be provided.

The circuit board 71 is configured to receive a test signal and a ground potential provided by a test machine (not shown), and provide the test signal and ground potential to the lower guide unit 40, and then to the vertical Probes 50, 50'. In detail, each of the conductive connecting members 73 can be a coaxial line, and one end of the conductive connecting member 73 can be electrically connected to the circuit board 71 via a socket 75 (or the circuit board 71 can be directly connected without the socket 75). The coaxial core and the peripheral conductors that insulatively cover the periphery of the core respectively transmit a test signal and a ground potential, and the other end of each of the conductive connectors 73 can be connected to the lower guide unit 40 by another socket 76 ( The lower guide unit 40 can be directly connected to the lower conductor unit 40 without the socket 76, so that the core and the peripheral conductor of the coaxial line (the conductive connection member 73) are electrically connected to the signal conductor 44 and the ground conductor 45, respectively, so as to be on the circuit board 71 and the signal. A test signal is transmitted between the conductors 44, and a ground potential is transmitted between the circuit board 71 and the ground conductor 45, and the test signal and the ground potential are respectively transmitted to the signal pin 50 and the ground pin 50'. In addition, the test signal and the ground potential provided by the testing machine may not be disposed through the internal wiring circuit of the circuit board 71. The socket 75 may be disposed on the upper surface of the circuit board 71. Further, the socket 75 may be disposed on the circuit board. 71 is used to receive the test signal and the ground potential provided by the test machine, but the socket 75 is electrically insulated from the contacts, and the test signal and the ground potential provided by the test machine directly pass through the socket 75 and the conductive connectors. 73. The signal conductor 44 and the ground conductor 45 are transmitted to the vertical probes 50, 50'.

When the two conductive connectors 73 are coaxial, the cores of the coaxial wires are indirectly electrically connected to the two signal pins 50, and the peripheral conductors of the coaxial wires are indirectly electrically connected to the two ground pins. 50'. That is, the cores of the two coaxial wires (the conductive connectors 73) are respectively electrically connected to the two signal conductors 44 through the two sockets 76, and are electrically connected to the conductive members 57 of the two signal pins 50, respectively. The outer conductors of the two coaxial pins (electrically conductive connectors 73) are respectively electrically connected to the grounding conductors 45 through the two sockets 76, and are electrically connected to the conductive members 57 of the two grounding pins 50', respectively. In this way, not only the conductive members 57 of the signal pins 50 are impedance matching effects due to the conductive members 57 associated with the ground pins 50', but each of the signal conductors 44 is provided with a ground conductor 45. The impedance matching effect is generated, and each of the coaxial lines itself can also generate an impedance matching effect, so that the entire signal transmission path has almost impedance matching and is more suitable for high frequency testing.

However, each of the conductive connectors 73 is not limited to a coaxial line, and not necessarily each of the signal pins 50 corresponds to the conductive connector 73. For example, the conductive connecting member 73 can be a cable (such as a flexible flat cable) or a flexible printed circuit board (FPCB) to electrically connect the signals through the plurality of lines included therein. The needle 50 can also be electrically connected to the grounding pin 50'. In other words, the probe card 70 can include only one conductive connector 73. In addition, the grounding pin 50' can receive the ground potential without passing through the conductive connecting member 73. In detail, the vertical pin body 74 can include a grounding pin body for transmitting a ground potential, and the needle 745 of the grounding pin body. The grounding hole 43 can be electrically connected to the grounding conductor 45 through the conductive inner wall 431 of the grounding through hole 43. Thus, the grounding pin body (that is, one of the vertical pins) The needle tail 741 of the body 74) can receive the ground potential provided by the circuit board 71 through the space converter 72 (or directly without the space converter 72), and sequentially conducts the conductive body through the needle body 743, the needle 745 and the grounding through hole 43. The inner wall 431 transmits a ground potential to the ground conductor 45, which transmits a ground potential to each ground via 43 and to each ground pin 50'.

Since each of the signal conductors 44 is separated from the ground conductor 45 by the gap 46 to achieve mutual insulation, each of the signal conductors 44 and the peripheral space 46 thereof occupy a certain area. In this case, further By reducing the distance between the signal pins 50, the signal conductors 44 can be set by the plurality of lower guides 41. For example, FIG. 10 and FIG. 11 disclose a probe head according to a second preferred embodiment of the present invention, the basic structure of which is similar to that of the probe head 20 described above, but the guide plate of the present embodiment The unit 40 includes two lower guide plates 41. The two signal conductors 44 are respectively fixedly disposed on the two lower guide plates 41. The two signal through holes 42 are respectively disposed on the two lower guide plates 41, although the needles of the two signal pins 50 are provided. 54 is disposed on the two lower guide plates 41. However, only the perforations connected to the signal conductors 44 are provided as the signal perforations 42 and the conductive inner walls 421 connected to the needles 54 are provided in the perforations of the lower guide plates 41. In this embodiment, the second The grounding conductor 45 is disposed on the guiding plate 41. However, at least one of the lower guiding plates 41 is provided with the grounding conductor 45.

In the probe head provided by the present invention, the conductive inner walls 431 of the different ground vias 43 do not have to be connected to the same ground conductor 45. For example, FIG. 12 and FIG. 13 disclose a probe head according to a third preferred embodiment of the present invention, the basic structure of which is similar to that of the probe head 20 described above, but the guide plate of the present embodiment The unit 40 includes two grounding conductors 45 connected to the conductive inner walls 431 of the two grounding through holes 43 respectively. Furthermore, each of the ground conductors 45 has an annular portion 451 covering the conductive inner wall 431 of the corresponding ground via 43 , an extension 453 extending from the annular portion 451 toward the signal via 42 , and An external connection portion 455 is connected to the extension portion 453 and is located at the periphery of the signal conductor 44. The external connection portion 455 can not only connect the conductive connection member 73 as described above, but also receives the ground potential, and is better formed on the periphery of the signal conductor 44. Impedance matching effect. In a fourth preferred embodiment of the present invention as shown in FIGS. 14 and 15, in the case where the lower guide unit 40 includes two lower guides 41, the two ground conductors 45 are corresponding thereto. The signal conductors 44 are respectively disposed on the two lower guide plates 41.

In the foregoing embodiments, the insulating layer 56 of each of the vertical probes 50, 50' is located adjacent to the body 52, as shown in Fig. 4. Moreover, the structural member 55 is a female member having a connecting recess, that is, has a recess 551 at the lower end of the needle body 52, and the conductive member 57 is a male member having a connecting convex portion, that is, having an inclusion The needle 54 and the body 571 of the stopping portion 53 and a protrusion 573 protruding from the body 571, the groove 551, the insulating layer 56 and the protrusion 573 are shaped to correspond to each other, the protrusion 573 The insulating layer 56 is embedded in the recess 551. The design is such that the structural member 55, the insulating layer 56 and the conductive member 57 are more stably combined.

More specifically, the bump 573 has a connecting portion 574 connected to the body 571, and a card engaging portion 575 connected to the connecting portion 574. At least a portion of the embedded portion 575 has a width greater than the connecting portion. 574 width. The width defined by the present invention means parallel to a vertical axis The width of the horizontal axis L2 of L1, for example, the width D indicated in Fig. 4 is the maximum width of the embedded card segment 575. The design can make the structural member 55, the insulating layer 56 and the conductive member 57 have the effect of embedding each other, so that the bonding can be more stable.

In addition, the card segment 575 can extend from the connecting segment 574 in a manner that its width is first increased and then decreased, thereby producing a better card embedding effect. For example, the card segment 575 in FIG. 4 has a circular arc surface 576 connected to the insulating layer 56, and the central angle of the circular arc surface 576 is greater than 180 degrees, so that the embedded card segment 575 is from the connecting portion 574. The width is gradually increased and then the width is gradually decreased. Alternatively, as shown in FIG. 16, the card-in section 575 may have a large rectangular portion 577 connected to the connecting portion 574, and a small rectangular portion 578 connected to the large rectangular portion 577, the large rectangular portion 577 The width is greater than the width of the connecting portion 574, and the width of the small rectangular portion 578 is smaller than the width of the large rectangular portion 577. The embedded card segment 575 is also designed to increase the width first and then reduce the card to produce a good embedding effect. .

In FIG. 4, since the connecting section 574 is located at the widest point of the needle body 52, the insulating layer 56 has a pair of main sections 561 which should be in the shape of the bumps 573, and has a corresponding main section 561 from the main section 561. The two upper edges of the two indented sections 563 are located between the protrusions 573 and the structural member 55, and the inverted sections 563 are located between the body 571 and the structural member 55, such that The insulating layer 56 is designed to completely separate the structural member 55 from the conductive member 57. However, the position of the insulating layer 56 is not limited. The design of the insulating layer 56 may be adjusted according to different positions or may not have the barbed section 563. For example, in the vertical probe shown in FIG. 17, the embedded card segment 575 of the bump 573 is in the shape of a circular arc similar to the embedded card segment 575 of FIG. 4, but the bump 573 and the insulating layer. The 56 is located at the stop portion 53, and the insulating layer 56 does not need to have the barbed portion 563.

The position of the insulating layer 56 is not limited. However, since the insulating layer 56 is the conductive member 57 for transmitting the test signal and the ground potential, the insulating layer 56 is located at the stopping portion 53, and the needle body 52 is adjacent to the The stop portion 53 or the needle 54 is preferably designed such that the conductive member 57 has an appropriate length to prevent the signal transmission path from being too long. As shown in Figure 18, the insulation layer 56 may be located in the needle 54 and substantially conform to the contour of the needle 54 to extend in a U-shape. It can be seen from FIG. 18 that the structural member 55 can be a male member having a connecting protrusion and the conductive member 57 can be a female member having a connecting recess, that is, the conductive member 57 (the female member) has a a recess, the structural member 55 (male member) has a body, and a protrusion protruding from the body, the bump and the insulating layer are embedded in the recess, and the variation is also applicable to the present invention. Other probe designs. The insulating layer 56 is disposed such that the ratio of the volume of the conductive member 57 to the volume of the needle 54 is less than 2/3. The vertical probe of the present invention closely bonds the structural member 55 and the conductive member 57 together by the insulating layer 56. When the vertical probe is assembled into a probe head for testing, the vertical probe can maintain a The number of times of contact with the object to be tested (for example, tens of thousands of times) in the target range does not cause separation of the joint faces between the structural member 55, the insulating layer 56, and the conductive member 57. Preferably, the length of the conductive member 57 (or the needle 54) is less than 1/3 of the length of the vertical probe. In summary, the insulating layer 56 is at least partially located inside the needle body 52, the stop portion 53 or the needle 54 or substantially inside the needle body 52, the stop portion 53 or the needle 54, and increases each other in different shapes. The joint area is to enhance the strength and stability of its engagement with the needle body 52, the stop portion 53, or the needle 54.

The vertical probe of the present invention is not limited to the above-described buckling probe, and may also be a linear probe as shown in FIGS. 19 to 21, and the linear probe may have a single width (eg, Figure 19), or design the width of the change according to the needs. For example, in Fig. 20, the needle 54 and the needle tail 51 have a single width, and the needle body 52 is gradually narrowed from the top to the bottom and then widened. For another example, in Fig. 21, the vertical probe is gradually narrowed from top to bottom. Although the linear probe is difficult to clearly distinguish the needle tail 51, the needle body 52, and the needle 54 by the shape, after being disposed on the upper and lower guide plates 30 and 41, the upper and lower guide plates 30 can be used. The positional relationship of 41 defines a needle tail 51 that is disposed through the upper guide plate 30, a needle 54 that is disposed through the lower guide plate 41, and a needle body 52 that is located between the upper and lower guide plates 30, 41. After the needle is inserted through the upper and lower guide plates 30 and 41, the upper and lower guide plates 30 and 41 can be displaced from each other (for example, the upper guide plate 30 is moved to the left and the lower guide plate 41 is moved to the right), so that the needle body is formed. The 52 is in a buckling shape, so that the probe can be prevented from coming off the lower guide 41 even without the stopper 53. In other words, the invention The vertical probe is not limited to having a stopper. In the linear probe embodiment of the present invention, the conductive member 57 includes a portion of the needle 54 in length, the length of the conductive member 57 being equal to the length of the needle 54. Preferably, the length of the conductive member 57 (or the needle 54) is less than 1/4 of the length of the vertical probe.

In the 19th to 21st drawings, the shape of the insulating layer 56 is similar to that of the insulating layer 56 of FIG. 4, but the barbed section 563 of the insulating layer 56 of FIG. 4 is parallel to the horizontal axis L2. The autonomous section 561 extends out, and the barbed section 563 of the insulating layer 56 in FIGS. 19 to 21 extends obliquely to the horizontal axis L2 in the direction of the body 571 of the conductive member 57. The design can make the structural member 55, the insulating layer 56 and the conductive member 57 more stable.

The insulating layer design of the linear probe as described above may also be as shown in Figs. 22 to 24, and the insulating layer 56 in Fig. 22 is similar to the insulating layer 56 in Fig. 18, but in Fig. 22 The insulating layer 56 is wavy, and the design is such that the structural member 55, the insulating layer 56 and the conductive member 57 are more stably combined. The insulating layer 56 in Fig. 23 is of the same design as that of Fig. 18. The insulating layer 56 in Fig. 24 is similar to the insulating layer 56 in Fig. 16, but the insulating layer 56 in Fig. 24 has a second inclined barb segment 563. The insulating layer design of Figures 22 and 24 can also be applied to the aforementioned buckling probe, and the insulating layer design of the aforementioned buckling probe can also be applied to the linear probe. Regardless of the aforementioned buckling probe or linear probe, the bonding force between the conductive member 57 and the structural member 55 is increased by the bonding force of the material of the insulating layer 56 itself. The bonding area between the structural member 55 and the insulating layer 56, such as the geometry of the insulating layer 56 shown in Fig. 22, can also increase the bonding force. The insulating layer 56 is disposed such that the ratio of the conductive member 57 to the needle 54 is less than 3/5.

The vertical probe of the present invention is not limited to the microelectromechanical probe as described above, and can also be made by a conventional mechanical probe (also referred to as a forming needle) plus an insulating layer and a conductive layer, as shown in FIG. 25 and The vertical probe 80 shown in FIG. 26 has a needle tail 81 for passing through the upper guide plate 30 as described above, and a guide pin 41 for threading through the lower guide plate 41 as described above. To touch the needle of the object to be tested 82, and a needle body 83 between the needle tail 81 and the needle 82. The manufacturing method of the vertical probe 80 includes the following steps:

a) A structural member 84 is provided having a shape substantially corresponding to the needle tail 81, the needle body 83 and one of the needle tail segments of the needle 82, a needle body segment and a needle segment.

In fact, the structural member 84 can be a conventional mechanical probe, and the material thereof can be PdCuAg (palladium copper silver), ReW (tantalum tungsten), rhenium (Rh), or the like.

b) insulating the structural member 84 to form an insulating layer 85 covering at least the needle segment of the structural member 84.

The material of the insulating layer 85 may be an elastic polymer material, such as Polyimide (PI), or an inelastic ceramic material such as alumina (Al ₂ O ₃ ) or cerium oxide ( HfO ₂ ) and so on.

The conductive layer 85 is formed on the insulating layer 85 to form a conductive member 86 covering at least a portion of the insulating layer 85. The conductive member 86 is located on the needle 82 and can be used to contact the object to be tested. The insulating layer 85 completely separates the conductive member 86 from the structural member 84 to insulate the conductive member 86 from the structural member 84.

The conductive member 86 may be made of a high hardness material such as palladium (Pd), nickel (Ni), rhodium (Rh) or an alloy thereof, or a highly conductive material such as gold (Au), silver (Ag), copper (Cu). Or its alloy.

In the present embodiment, the surface of the structural member 84 is completely covered by the insulating layer 85. However, the insulating layer 85 does not have to completely cover the structural member 84 as long as the insulating layer 85 completely separates the conductive member 86. The structural members 84 can be separated. According to the manufacturing method described above, the structural member 84, the insulating layer 85 and the conductive member 86 are fixed to each other, and when the needle 82 of the vertical probe 80 touches the object to be tested, only the conductive member 86 is The insulating layer 85 and the structural member 84 are not electrically connected to the object to be tested. Further, in the manufacturing method of the vertical probe 80, the conductive member 86 The insulating layer 85 can also be completely covered, but the conductive member 86 is broken at the interface between the needle segment of the structural member 84 and the needle body segment, i.e., the portion of the conductive member 86 at the needle segment of the structural member 84 and the structural member 84. There is a gap between the portions of the needle body section to insulate the foregoing.

In summary, the vertical probe provided by the present invention can be electrically connected to the circuit board only by the conductive member passing through the lower guide unit and the conductive connecting member, thereby allowing the object to be tested and the testing machine to transmit signals to each other. The structural member is used to provide mechanical resilience so that the probe is in elastic contact with the object to be tested. In other words, the vertical probe provided by the present invention only transmits signals by its conductive members, so that the signal transmission path can be made short to meet the requirements of high frequency testing. For the problem of insufficient bandwidth (about 2 GHz) in the current situation, the present invention can increase the bandwidth to above 5 GHz.

Moreover, the structural member of the vertical probe provided by the present invention is separated from the conductive member, and can be matched with different materials according to requirements. For example, the unit resistance value of the conductive member can be less than or equal to the unit resistance value of the structural member. Or, the structural member may have a modulus of elasticity greater than or equal to a modulus of elasticity of the conductive member. In addition, the structural member, the insulating layer and the conductive member of the vertical probe provided by the present invention are fixed to each other, so that the vertical probe is easy to mount. Furthermore, in the probe head and the probe card provided by the present invention, the lower guiding plate can be provided with a matching circuit, and when a flexible circuit board is used as the conductive connecting member, the conductive connecting member can also be provided with a matching circuit. Even if the matching circuit does not need to be composed of electronic components such as resistors, inductors, and capacitors, but can be achieved by wiring, the probe head and the probe card of the present invention are easier to set the matching circuit and can be finer than the conventional one. Fine pitch.

Finally, it is to be noted that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention, and alternative or variations of other equivalent elements should also be the scope of the patent application of the present application. In addition, in the method embodiment, if the implementation is possible, the steps may not be in a sequential relationship, and may be performed in whole or in part simultaneously.

20‧‧‧Probe head

30‧‧‧Upper guide

31‧‧‧Perforation

40‧‧‧ lower guide unit

41‧‧‧ lower guide

44‧‧‧ Signal conductor

441‧‧‧Round Department

443‧‧‧Extension

445‧‧‧External Department

45‧‧‧ Grounding conductor

46‧‧‧ gap

50‧‧‧Vertical probe (signal pin)

50'‧‧‧Vertical probe (grounding pin)

51‧‧‧needle tail

52‧‧‧ needle body

53‧‧‧stops

54‧‧‧ needle

55‧‧‧Structural parts

56‧‧‧Insulation

57‧‧‧Electrical parts

Claims (30)

A vertical probe having a needle tail for threading on an upper guide, a needle for threading a lower guide and for touching a test object, and a needle at the end of the needle and the needle The vertical probe is characterized in that: the vertical probe comprises a structural member fixed to each other, an insulating layer and a conductive member, the structural member including the needle tail and at least part of the needle body The conductive member includes at least a portion of the needle, the insulating layer completely separating the conductive member from the structural member to insulate the conductive member from the structural member. The vertical probe of claim 1, wherein one of the structural member and the conductive member is a female member, the female member has a groove, and the structural member and the conductive member are the other one In the case of a male member, the male member has a body and a protrusion protruding from the body, the bump and the insulating layer being embedded in the groove. The vertical probe according to claim 2, wherein one vertical axis and one horizontal axis are defined, and the needle moves substantially along the longitudinal axis when the object touches the object; The block has a connecting portion connected to the body, and a card engaging portion connected to the connecting portion, at least part of the width of the engaging portion parallel to the horizontal axis is greater than the parallel portion of the connecting portion parallel to the horizontal axis width. The vertical probe of claim 2, wherein the insulating layer has a main section between the bump and the female component, and a body extending from the main section and located on the body A barb segment between the parent member. The vertical probe according to claim 1, further comprising a stopping portion between the needle body and the needle, the insulating layer is located at the stopping portion, and the needle body is adjacent to the stopping portion. One of the three parts of the needle and the needle. The vertical probe of claim 1, wherein the insulating layer is located at the needle and extends substantially in a U-shape corresponding to the outline of the needle. The vertical probe of claim 6, wherein the ratio of the volume of the conductive member to the volume of the needle is less than 2/3. The vertical probe of claim 1, wherein the insulating layer is wavy. The vertical probe of claim 1, wherein the length of the conductive member is less than 1/3 of the length of the vertical probe. A method of manufacturing a vertical probe according to any one of claims 1 to 9, comprising the steps of: providing a substrate and a sacrificial layer disposed on the substrate, and utilizing lithography and electroplating The process comprises forming a photoresist layer on the sacrificial layer, and the structural member and the conductive member interstitially interposed on the photoresist layer; removing the photoresist layer such that there is a gap between the structural member and the conductive member Filling the gap with an insulating material to form the insulating layer, thereby generating the vertical probe fixed to the sacrificial layer and the substrate; and removing the sacrificial layer to separate the vertical probe from the substrate . A vertical probe having a needle tail for threading on an upper guide, a needle for threading a lower guide and for touching a test object, and a needle at the end of the needle and the needle The vertical probe is characterized in that: the vertical probe comprises a structural member fixed to each other, an insulating layer and a conductive member, the structural member has a needle tail segment, a needle segment and a connection The needle tail segment and the needle body segment of the needle segment, the insulating layer covering at least the needle segment of the structural member, the conductive member is a conductive layer covering at least part of the insulating layer and contacting the object to be tested, the insulation The layer separates the conductive member completely from the structural member to insulate the conductive member from the structural member. The vertical probe according to claim 1 or 11, wherein a vertical axis is defined, and the needle moves substantially along the longitudinal axis when the object is touched, and the vertical probe is parallel. The length of the longitudinal axis is substantially 3 to 6 times the length of the needle parallel to the longitudinal axis. The vertical probe of claim 1 or 11, wherein the conductive member has a unit resistance value less than or equal to a unit resistance value of the structural member. The vertical probe of claim 1 or 11, wherein the structural member has a modulus of elasticity greater than or equal to a modulus of elasticity of the conductive member. A method for manufacturing a vertical probe, the vertical probe having a needle tail for threading on an upper guide, a needle for threading the lower guide and for touching a test object, and a needle body between the needle tail and the needle; the method of manufacturing the vertical probe includes the steps of: providing a structural member having a needle tail section, a needle section, and connecting the needle tail section and the needle a pin segment of the segment; forming an insulating layer covering at least the needle segment of the structural member; and forming a metal plating film on the insulating layer to form an insulating layer covering at least a portion of the insulating layer for contacting the object to be tested a conductive member, and the insulating layer completely separates the conductive member from the structural member to insulate the conductive member from the structural member. A probe head includes: an upper guide plate; a lower guide plate unit, comprising at least a lower guide plate, at least one signal conductor fixedly disposed on the at least one lower guide plate for transmitting a test signal, and at least one a grounding conductor electrically connected to a ground potential, and at least one signal perforation and at least one grounding through hole disposed on the at least one lower guiding plate, the signal perforation having a conductive inner wall connected to the signal conductor, the grounding through hole having a a conductive inner wall connected to the ground conductor; The vertical probe according to claim 1 or 11, wherein the vertical probe has a needle tail threaded through the upper guide, and the needle of the vertical probe is threaded through the at least one The vertical probe includes at least one signal pin and at least one grounding pin. The needle of the signal pin is inserted through the conductive inner wall of the signal through hole and electrically connected to the signal conductor. The needle of the grounding pin is connected to the grounding through hole and electrically connected to the grounding conductor through the conductive inner wall of the grounding through hole. The probe head of claim 16, wherein the lower guide unit comprises two lower guide plates, two signal conductors respectively fixedly disposed on the two lower guide plates, and respectively disposed on the two The second guide plate is pierced by the signal, and the conductive inner wall of the two signal holes is respectively connected to the two signal conductors. The vertical probes include two signal pins, and the needles of the two signal pins are respectively disposed on the second signal pin. The two signals are perforated and electrically connected to the two signal conductors through the conductive inner walls of the two signal holes. The probe head according to claim 17, wherein the lower guide unit comprises two grounding conductors respectively fixedly laid on the two lower guide plates. The probe head of claim 16, wherein the lower guide unit comprises a plurality of ground vias, and the conductive inner walls of the ground vias are connected to the same ground conductor. The probe head of claim 16, wherein the lower guide unit comprises a plurality of the ground conductors, and the plurality of ground vias respectively connected to the ground conductors. The probe head of claim 16, wherein the grounding conductor system is disposed on a periphery of the signal conductor. A probe card comprising: the probe head according to claim 16; a circuit board fixed to the upper and lower guide plates of the probe head, and providing the signal conductor a test signal transmitted and a ground potential electrically connected to the ground conductor; A conductive connector is electrically connected to the signal conductor and the circuit board at two ends thereof for transmitting a test signal between the circuit board and the signal conductor. The probe card of claim 22, wherein the conductive connector is also electrically connected to the ground conductor, thereby transmitting a ground potential between the circuit board and the ground conductor. The probe card of claim 22, wherein the probe head further comprises a vertical needle body, the vertical needle body having a needle tail disposed on the upper guide plate and being disposed under the needle a needle that is electrically connected to the ground conductor through a conductive inner wall of the grounding through hole, and a needle body between the needle tail and the needle, the needle tail, the needle body and the needle body of the vertical needle body The electrodes of the vertical needle can receive the ground potential provided by the circuit board and sequentially transmit the ground potential to the ground conductor through the conductive inner wall of the needle body, the needle and the grounding through hole. The probe card of claim 22, wherein the conductive connector is one of a coaxial line, a row of wires, and a flexible circuit board. A vertical probe is connected to an upper guide plate and is disposed on the lower guide plate to measure a test object by a needle. The vertical probe comprises: a needle tail for connecting to the upper guide plate; a needle body is connected to the needle tail, the needle body is disposed between the upper guide plate and the lower guide plate; a needle is coupled to the needle body, and the needle is configured to be movably disposed on the lower guide plate And electrically connected to the lower guide; and an insulating portion for electrically insulating the tail from the needle. The vertical probe of claim 26, wherein the vertical probe is configured to electrically conduct a test signal to the needle through the lower guide when the needle is subjected to the force measurement of the object to be tested. The object to be tested is provided with cushioning and resilience by the needle body. The vertical probe of claim 27, wherein the length of the vertical probe is 3 to 6 times the length of the needle. The vertical probe of claim 27, wherein the needle and the needle tail are not on the same vertical extension axis. The vertical probe of claim 26, further comprising a stop portion between the needle body and the needle, the insulating layer being at least partially located at the needle body, the stop portion or the needle Internal.