TW201610440A - Probe head manufacturing method and structure of high frequency vertical probe card - Google Patents

Abstract

A probe head manufacturing method and structure of high frequency vertical probe card are provided. Mainly, components are fastened without screw and by using high temperature epoxy resin on the surface of the probe card facing the chip under test, and its structure comprises a lower guide plate, an intermediate guide plate, an upper guide plate, a positioning sheet and several probes. The bottom end of each probe is extended to the outside through the pinhole of the lower guide plate. The top end thereto is extended to the outside through the pinholes of the positioning sheet and the upper guide plate and is merely restricted to move among pinholes of three mechanisms. The lower guide plate is embedded and fastened in the intermediate guide plate. The lower guide plate partially protrudes the bottom surface of the intermediate guide plate. Accordingly, there is no need to use screw for fastening between the lower guide plate and the intermediate guide plate to eliminate inappropriate error of scratching chips due to loosening of screws or fastening components during test process. In addition, since the lower guide plate is embedded into the intermediate guide plate, the thicknesses of the lower guide plate and the intermediate guide plate can be increased to further increase the mechanism strengths of the lower and intermediate guide plate mechanisms.

Description

Probe head manufacturing method and structure of high frequency vertical probe card

The invention relates to the technical field of a high-frequency vertical probe card, in particular to a test risk of avoiding the probe being stuck in the test and causing the wafer to be scratched due to loosening of the fixing component or the screw.

As shown in the first figure, it is a schematic structural view of a conventional vertical probe card. The probe card mainly includes a circuit board 11, an upper guide 12, a middle guide 13, a lower guide 14, a positioning piece 15, and a plurality of probes 16. The circuit board 11 is electrically transmitted and tested by the probe 16 in contact therewith. When the probe 16 is tested, the tip of the probe is pressed against the wafer, and each of the probes 16 is in contact with and electrically transmitted by the elastic deformation of the probe. The probe 16 is fixed by the upper guide 12 and the lower guide 14. The structure has a needle space 131 in the middle of the middle guide plate 13, and the positioning piece 15 is located in the needle space 131 for assembling the initial positioning. The upper guide plate 12 and the lower guide plate 14 are fixed on the upper and lower sides of the middle guide plate 13. The upper guide plate 12, the positioning piece 15 and the lower guide plate 14 are distributed with a corresponding number of pinholes. During assembly, each probe 15 is inserted into the pinhole of the lower guide plate 14 through the pinhole of the positioning piece 15 to stand upright; finally, the pinhole of the upper guide plate 12 extends to the outside. The probe card has the following disadvantages in use: 1. The middle guide plate 13 and the lower guide plate 14 are generally fixed by a picking screw 17, and in such a high frequency vertical probe card, the middle guide The thickness of the plate 13 is about 2.5 mm, and the thickness of the lower guide plate 14 is about 1 mm. It can be seen that the screw 17 is a very small member, and although the fixing force is assisted by the screw rubber, But in fact, after the probe card is used for a period of time, the screw is easy to loosen. If the time for dropping the screw is before the wafer test, then luck can be found early, but if the drop time occurs during the wafer test, It is easy to scratch the entire wafer surface, causing serious damage to the wafer; 2. With the advancement of technology, the number of probes that the probe card must have is increasing, the size is getting shorter and shorter, and the overall thickness of the probe card is relatively It must also be thinned. Such a structure in which the upper guide plate, the middle guide plate and the lower guide plate are stacked, if the thickness is thinned, the strength of the upper guide plate and the lower guide plate is likely to be low, which affects the fixing effect. The difficulty in processing and production will also increase.

The main object of the present invention is to provide a probe head manufacturing method and structure for a high-frequency vertical probe card. The probe card manufactured by the method of the present invention has no screws or other fixing components on the surface facing the wafer to be tested. This eliminates the possibility of scratching the wafer due to the falling of the component during the test, and avoids unnecessary defective products.

The secondary object of the present invention is to provide a high-frequency vertical probe card manufacturing method and structure with good structural strength. When the overall thickness of the probe card is reduced and thinned, the structure of the present invention can still maintain better strength and is advantageous for production. Manufacturing.

In order to achieve the above object, the manufacturing method of the present invention comprises: providing a middle guide plate having a mounting portion which is a profile formed by a needle insertion space formed through the middle guide plate; and fitting the lower guide plate to The mounting portion of the middle guide plate is fixed by a high temperature annular resin, the lower guide plate partially protrudes from the bottom surface of the middle guide plate; a plurality of pinholes are mechanically added at the lower guide plate; and a positioning piece is fixed to the The middle guiding plate has a number of pinholes corresponding to the number of pinholes of the lower guiding plate; the number of probes are installed, and each probe is inserted into the needle of the lower guiding plate through the pinhole of the positioning piece Hole upright; and An upper guide plate is fixed to the middle guide plate, and the upper guide plate has a relative number of pinholes for the top end of the plurality of probes to protrude from the top surface of the upper guide plate via the corresponding pinhole. The probe located on the upper guide will eventually come into contact with a circuit board to form a probe card structure.

Furthermore, the probe head structure of the high-frequency vertical probe card of the present invention comprises: an upper guide plate, a middle guide plate, an upper guide plate, a positioning piece and a plurality of probes, wherein the middle guide plate has a mounting portion penetrating through the body The lower guide plate is fixedly mounted on the mounting portion of the middle guide plate, partially protrudes from the bottom surface of the middle guide plate, and the lower guide plate has a plurality of pinholes; the upper guide plate is fixed on the middle guide plate. Having a plurality of pinholes positioned opposite to the number of pinholes of the lower guide plate; the bottom end and the top end of each of the probes respectively extend to the outside through the pinholes of the corresponding lower guide plate and the pinholes of the upper guide plate, and are limited only The positioning piece has a plurality of pin holes, and is located in a space formed by the mounting portion, and each probe is located in the opposite pin hole for initial positioning work in the assembly.

The structural feature of the present invention is that the lower guide plate is fitted into the middle guide plate, and the disadvantage of conventional screw fixing is removed. In addition, the thickness of the middle guide plate and the lower guide plate can be maintained at the same or close. When the probe size is shorter and shorter, the thickness of the lower guide plate does not need to be simultaneously thinned, and the proper thickness can be maintained to maintain the structure. The strength, reduce the difficulty of production and assembly, in line with the needs of the industry.

The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

11‧‧‧ boards

12‧‧‧Upper guide

13‧‧‧中导板

131‧‧‧cloth space

14‧‧‧Lower guide

15‧‧‧ Positioning film

16‧‧‧ probe

17‧‧‧ screws

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2‧‧‧中导板

21‧‧‧Installation Department

3‧‧‧ lower guide

31‧‧‧ pinhole

4‧‧‧ Positioning film

41‧‧‧ pinhole

5‧‧‧ probe

6‧‧‧Upper guide

61‧‧‧ pinhole

7‧‧‧ boards

The first figure is a schematic diagram of a conventional probe card structure; the second figure is a flow chart of the manufacturing method of the present invention; the third A to the third F figure are schematic diagrams of the structures in the steps of the second drawing; The fourth figure is a schematic cross-sectional view of the structure of the present invention.

As shown in the second figure, it is a flowchart of the present invention, and refers to the third A to third F diagrams. The steps of the method for manufacturing the probe head of the high frequency vertical probe card of the present invention include:

Step 101, providing a middle guide plate 2 having a mounting portion 21, wherein the mounting portion 21 is a type of a needle space formed through the middle guide plate 2, as shown in FIG. 3A; wherein the seating portion 21 is used for For the lower guide plate 3 to be embedded therein, the mounting portion 21 is a narrow upper receiving groove body, for example, a tapered receiving groove body which is tapered from top to bottom, or As shown in the present embodiment, it is a narrow stepped receiving tank body in the upper jaw. In addition, the middle guide plate 2 is a high-hard, high-strength metal material.

Step 102: The lower guide plate 3 is fitted to the mounting portion 21 of the middle guide plate 2, and the two are fixed by a high temperature epoxy resin. The lower guide plate 3 partially protrudes from the bottom surface of the middle guide plate 2, such as the third B. In the embodiment, the lower guide 3 is an insulating ceramic material.

Step 103: Forming a plurality of pinholes 31 at the lower guide plate 3 by mechanical addition, as shown in FIG. 3C. The number and aperture of the pinholes 31 are the size of the probe to be mounted. In addition, since the probe card has a large number of probes, a small pitch, and a high density, it is necessary to perform the drilling operation after the position of the lower guide plate 3 is fixed, so that the required precision can be met.

Step 104: Fix a positioning piece 4 to the middle guiding plate 2, and the positioning piece 4 has a plurality of pinholes 41 corresponding to the number of the pinholes 31 of the lower guiding plate 3, as shown in the third D.

Step 105: Install the number of probes 5, and each probe 5 is first inserted into the pinhole 31 of the lower guide plate 3 through the pinhole 41 of the positioning piece 4 to stand upright, as shown in FIG. After the number of probes 5 are all installed, the connection structure between the positioning piece 4 and the middle guide plate 2 can be cut. In addition, the probe 5 is a vertical probe. Elastic with longitudinal cushioning deformation.

Step 106, fixing an upper guide plate 6 to the middle guide plate 2, the upper guide plate 6 has a relative number of pinholes 61, and the top end of the plurality of probes 5 protrudes from the upper guide plate through the corresponding pinholes 61. 6 top surface, such as the third F picture. The lower guide plate 6 is an insulating ceramic material, and the pinholes 61 penetrating the surface are processed in advance, and the number and the apertures also correspond to the matched probes 5.

As shown in the fourth figure, a schematic cross-sectional view of the structure is performed by using the manufacturing method of the present invention, wherein the probe head is also electrically connected to the probes 5 of the circuit board 7 . The structure includes a lower guiding plate 3, a middle guiding plate 2, an upper guiding plate 6, a positioning piece 4 and a plurality of probes 5, wherein the middle guiding plate 2 has a mounting portion 21 penetrating through the body; the lower guiding plate 3 is fitted The mounting portion 21 fixed to the middle guide plate 2 is partially protruded from the bottom surface of the middle guide plate 2, and the lower guide plate 3 has a plurality of pinholes 31; the upper guide plate 6 is fixed to the middle guide plate 2, a plurality of pinholes 61 having a position opposite to the number of the pinholes 31 of the lower guide plate 3; the bottom end and the top end of each of the probes 5 respectively correspond to the pinholes 31 of the lower guide plate 3 and the pinholes of the upper guide plate 6 The 61 extends to the outside and is restricted to operate only between the two pinholes 31, 61. The positioning piece 4 has a plurality of pinholes 41 located in the space formed by the mounting portion 21, and each of the probes 5 is located in the corresponding pinhole 41 to facilitate the initial positioning operation of the assembly.

The manufacturing method adopted by the present invention focuses on embedding the lower guide plate 3 at the middle guide plate 2, thereby fixing the positions of the two, so that there is no screw between the lower guide plate 3 and the middle guide plate 2 Or other fixed components, under long-term testing, there will be no scratches caused by the screw falling. Furthermore, as technology advances, the size of the probe card must be shortened and the thickness of the probe card shortened. The design of the present invention is such that the lower guide 3 is embedded in the middle guide 2, and the probe is short in size. Thinning does not weaken the structural strength. On the contrary, the size of the lower guide 3 is similar to that of the middle guide 2, which makes the structural strength stronger, and is more advantageous in production or test use.

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and thus equivalent changes made by the scope of the present invention remain within the scope of the present invention.

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Claims (9)

A method for manufacturing a probe head of a high-frequency vertical probe card, the method comprising: providing a middle guide plate having a mounting portion, wherein the mounting portion is a shape forming a cloth needle space through the middle guide plate; The plate is fitted to the mounting portion of the middle guide plate, and is fixed by a high temperature epoxy resin. The lower guide plate partially protrudes from the bottom surface of the middle guide plate; a plurality of pinholes are formed by mechanical addition at the lower guide plate; The piece is fixed to the middle guide plate, the positioning piece has a number of pinholes corresponding to the number of pinholes of the lower guide plate; the number of probes are installed, and each probe is inserted into the lower guide through the pinhole of the positioning piece a pinhole of the plate is erected; and an upper guide plate is fixed to the middle guide plate, the upper guide plate has a relative number of pinholes, and the top end of the plurality of probes protrudes from the top of the upper guide plate through the corresponding pinhole surface. The method of manufacturing a probe head for a high frequency vertical probe card according to claim 1, wherein the mounting portion is a narrow upper receiving groove body. The method of manufacturing a probe head for a high-frequency vertical probe card according to claim 2, wherein the mounting portion is a narrow stepped receiving groove body. The method of manufacturing a probe head for a high-frequency vertical probe card according to claim 2, wherein the mounting portion is a tapered receiving groove that tapers from top to bottom. The probe head manufacturing method of the high frequency vertical probe card according to claim 1, wherein the upper guide plate and the lower guide plate are insulating ceramic materials. A probe head structure of a high frequency vertical probe card, comprising a lower guide plate, a middle guide plate, an upper guide plate, a positioning piece and a plurality of probes, wherein: the middle guide plate has a mounting portion penetrating through the body; the lower guide plate is fitted and fixed to the mounting portion of the middle guide plate, partially protruding from the bottom surface of the middle guide plate, the lower guide The plate has a plurality of pinholes; the upper guide plate is fixed on the middle guide plate, and has a plurality of pinholes positioned opposite to the number of pinholes of the lower guide plate; the bottom end and the top end of each probe respectively correspond to the lower guide The pinhole of the plate and the pinhole of the upper guide extend to the outside, and are restricted to be movable only between the two pinholes, and the positioning piece has a plurality of pinholes located in the space formed by the mounting portion, each probe Located in the corresponding pinhole; in this assembled structure, there are no exposed fixing elements or screws between the lower and middle guides. The probe head structure of the high frequency vertical probe card according to claim 6, wherein the mounting portion is a narrow stepped receiving groove body. The probe head structure of the high frequency vertical probe card of claim 6, wherein the mounting portion is a tapered receiving groove that tapers from top to bottom. The probe head structure of the high frequency vertical probe card of claim 6, wherein the upper guide plate and the lower guide plate are insulating ceramic materials.