TWI601203B - Single-wafer rotary etching cleaning machine fluid collection device - Google Patents

Description

Fluid collection device for single wafer rotary etching cleaning machine

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a fluid collection device for a single wafer rotary etch cleaning machine, and more particularly to a fluid collection device for separately collecting different fluids in a corresponding recovery tray by using a cover disk for actuating the fluid up and down.

Wet etching is one of the indispensable procedures in the current semiconductor manufacturing process. Generally, a semiconductor single wafer undergoes multiple etching and cleaning processes during wet etching, for example, first with A acid. Etching, followed by a second etching with B acid, and finally rinsed with deionized water, and based on cost considerations, the used etching liquid needs to be recycled and reused. Therefore, the conventional rotary etching apparatus is provided. The plurality of etching liquid collecting tanks are respectively collected by moving the entire etching liquid collecting tank up and down with respect to the turntable on which the single wafer is placed, or by moving the single wafer rotating disc up and down with respect to the etching liquid collecting tank. Different etching solutions to avoid contamination or chemical changes caused by mixing between etching solutions.

If the rotary etching apparatus is operated to collect the entire etching liquid collection tank in a manner of moving up and down with respect to the single-wafer rotating disk (that is, the single-wafer is not moved and the etching liquid recovery tank moves up and down), different etching liquids are collected. , the liquid pipe connected to each of the etching liquid collecting tanks can only adopt a soft tube, and a pump is needed to transport the collected etching liquid to the recycling barrel, and at the same time, it is difficult to clean the inside of the etching liquid collecting tank, thereby This causes the etchant to remain in the flexible tube and causes contamination due to dirty cleaning.

If the rotary etching apparatus is operated in such a manner that the single-wafer turntable and the single wafer are moved up and down with respect to the etching liquid collecting tank (that is, the single wafer moves up and down and the etching liquid collecting tank does not move), different collections are collected. The etching liquid has a risk of easily causing vibration of a single wafer to be broken, and it is also difficult to clean the inside of the etching liquid collecting tank.

Based on the absence of the etchant collection tank of the conventional rotary etching apparatus, a fluid collection device for a single wafer rotary etching cleaning machine is provided, which has a plurality of selective discharge pipes and no need to increase the pump. The advantages of transporting the collected etchant to the recovery tank and easily cleaning the interior of the fluid collection device are those that are actively disclosed in the present invention.

SUMMARY OF THE INVENTION The main object of the present invention is to improve the conventional rotary etching apparatus which has a problem that the etching liquid recovery tube is less selective and difficult to clean the inside of the etching liquid recovery tank.

To achieve the above and other objects, the present invention provides a fluid collection device for a single wafer rotary etch cleaning machine for collecting and etching a fluid of a single wafer, comprising: a turntable for fixing and rotating a single wafer; At least one recovery tray is fixed on the outer edge of the turntable for collecting the fluid that is ejected when the single wafer is rotated; at least one cover tray is correspondingly disposed on the recovery tray for guiding The fluid flows into the recovery tray; at least one lift group, the lift group includes a symmetrical second lift unit, the lift group is connected to the cover tray for actuating the cover up and down with respect to the turntable and the recovery tray plate.

In an embodiment of the invention, the cover disk has an annular shape and a central portion has a radial opening.

In an embodiment of the invention, the radial opening is spaced from the outer circumference of the turntable by a distance of 1 to 10 mm.

In an embodiment of the invention, the radial opening and the outer circumference of the turntable are preferably 3 to 5 mm.

In an embodiment of the invention, the recovery tray is annular.

In an embodiment of the present invention, the cover disk further has a guiding top wall and a guiding side wall, wherein the guiding top wall is an annular top surface inclined toward the outside, and the guiding side wall is the cover disk On one side, a portion of the guiding side wall overlaps with a portion of the side wall of the recovery tray.

In an embodiment of the invention, the recovery tray is equal in number to the cover tray.

In an embodiment of the invention, the recovery tray is connected to a recovery tube for discharging the fluid.

Thereby, the fluid collecting device of the present invention completes guiding different fluids to the corresponding recovery tray by the stationary fixed recovery tray and the turntable and the cover tray which can be moved up and down with respect to the recovery tray and the turntable, and is recovered due to recycling. Since the tray is fixed, the recovery tube connected to the recovery tray can be selected to use a hard tube or a flexible tube, and since the recovery tray is separable from the cover tray, the inside of the recovery tray can be easily cleaned.

1‧‧‧Fluid collecting device

10‧‧‧ Turntable

101‧‧‧ shaft

11‧‧‧Recycling tray

111‧‧‧First recovery tray

112‧‧‧Second recovery tray

113‧‧‧ Third recovery tray

114‧‧‧First recovery tray side wall

115‧‧‧Second recovery tray side wall

116‧‧‧ Third recovery tray side wall

12‧‧‧Recycling tube

121‧‧‧First recovery pipe

122‧‧‧Second recovery pipe

123‧‧‧ Third recovery pipe

13‧‧‧through hole

131‧‧‧First through hole

131’‧‧‧ first through hole

132‧‧‧Second through hole

132’‧‧‧second through hole

133‧‧‧ third through hole

133’‧‧‧ third through hole

14‧‧‧ Cover

141‧‧‧First cover

141a‧‧‧First guiding top wall

141b‧‧‧First guiding side wall

142‧‧‧Second cover

142a‧‧‧Second guiding top wall

142b‧‧‧Second guiding side wall

143‧‧‧The third cover

143a‧‧‧3rd guiding top wall

143b‧‧‧ third guiding sidewall

15‧‧‧ Lifting group

151‧‧‧First lifting unit

151’‧‧‧First Lifting Unit

152‧‧‧Second lifting unit

152’‧‧‧Second lifting unit

153‧‧‧ third lifting unit

153’‧‧‧ Third Lifting Unit

20‧‧‧ nozzle

D‧‧‧distance

W‧‧‧Single wafer

FIG. 1 is a schematic view showing the opening of a fluid collecting device according to an embodiment of the present invention.

Fig. 2 is a bottom view of the fluid collecting device in an embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view showing a fluid collecting device in an embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view showing the first use state of the fluid collecting device in an embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view showing a second use state of the fluid collecting device in an embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view showing a third use state of the fluid collecting device in an embodiment of the present invention.

Fig. 7 is a schematic cross-sectional view showing a fourth use state of the fluid collecting device in an embodiment of the present invention.

In order to fully understand the object, features and effects of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings, which are illustrated as follows: Please refer to FIG. 1 to FIG. The fluid collecting device 1 of the present invention is for collecting a fluid that is ejected during a single wafer W-rotation etching. The fluid collecting device 1 includes a turntable 10, at least one recovery tray 11, at least one cover tray 14, and at least one lifting group. 15.

The turntable 10 is connected with a rotating shaft 101 for fixing and rotating a single wafer W.

The recovery tray 11 is annular and fixed on the outer edge of the turntable for collecting the fluid that is ejected when the single wafer W is rotated. The recovery tray 11 is connected to a recovery tube 12 for discharging the fluid. The recovery pipe 12 is further connected to a recovery tank (not shown) to receive the fluid discharged through the recovery pipe 12.

The recovery tray 11 includes a first recovery tray 111, a second recovery tray 112, and a third recovery tray 113. The first recovery tray 111 is fixed to the closest to the rotary tray 10. The third recovery tray 113 The second recovery tray 112 is fixed between the first recovery tray 111 and the third recovery tray 113. The first recovery tray 111 has a first recovery tray sidewall 114, the second recovery tray 112 has a second recovery tray sidewall 115, and the third recovery tray 113 has a third recovery tray sidewall 116. The bottoms of the first recovery tray 111, the second recovery tray 112, and the third recovery tray 113 are in a groove shape. The first recovery tray 111, the second recovery tray 112, and the third recovery tray 113 A first recovery pipe 121, a second recovery pipe 122 and a third recovery pipe 123 are respectively connected to discharge different fluids.

The cover tray 14 is annular and has a radial opening for covering the recovery tray 11 for guiding the fluid to the recovery tray 11. The cover tray 14 includes a first cover tray 141, a second cover tray 142, and a third cover tray 143. The first cover tray 141 is correspondingly disposed to cover the first recovery tray 111. The second cover tray 142 The second recovery tray 112 is correspondingly disposed, and the third cover tray 143 is corresponding to the third recovery tray 113. The distance d between the radial opening of the first cover disk 141, the second cover disk 142 and the third cover disk 143 and the outer circumference of the turntable 10 may be 1 to 10 mm, and the preferred distance d is 3 to 5 mm. The fluid that is scattered outward due to the centrifugal force of the single wafer W that is rotated during use is prevented from being sprayed onto the recovery tray that does not correspond to the collection of the fluid.

The first cover disk 141 has a first guiding top wall 141a and a first guiding side wall 141b. The second cover disk 142 has a second guiding top wall 142a and a second guiding side wall 142b. The three cover disk 143 has a third guiding top wall 143a and a third guiding side wall 143b. The first guiding top wall 141a, the second guiding top wall 142a and the third guiding top wall 143a are outwardly inclined annular top surfaces for providing a single wafer W impacting fluid impact And directing the fluid to the first recovery tray 111, the second recovery tray 112, and the third recovery tray 113, respectively. The first guiding sidewall 141b, the second guiding sidewall 142b and a portion of the third guiding sidewall 143b are respectively associated with the first recovery tray sidewall 114, the second recovery tray sidewall 115 and the third recovery tray sidewall A portion of 116 overlaps each other to ensure that the fluid that is ejected from the single wafer W does not seep out of the first recovery tray 111, the second recovery tray 112, and the third recovery tray 113, causing contamination between the fluids.

The hoisting group 15 includes a first hoisting group, a second hoisting group, and a third hoisting group, wherein the first hoisting group includes a symmetrical first lifting unit 151, 151', and the second hoisting group includes a symmetrical second lifting unit 152, 152' The third lifting group includes a symmetrical third lifting unit 153, 153'.

The first recovery tray side wall 114, the second recovery tray side wall 115 and the third recovery tray side wall 116 are respectively provided with a pair of first through holes 131, 131', second through holes 132, 132' and third through holes 133, 133 in the same radial direction. ', to respectively pass the first lifting unit 151, 151', the second lifting unit 152, 152' and the third lifting unit 153, 153'.

The first lifting unit 151, 151', the second lifting unit 152, 152' and the third lifting unit 153, 153' respectively pass through the first through holes 131, 131', the second through holes 132, 132' and the third through holes 133, 133', and the first The guiding sidewall 141b, the second guiding sidewall 142b and the third guiding sidewall 143b are connected to the first cover disk 141, the second cover disk 142 and the third cover disk 143 relative to the first The recovery tray 111, the second recovery tray 112, the third recovery tray 113, and the turntable 10 are operated up and down.

The mode of operation of the fluid collection device 1 of the present invention in different operating states will be described in detail below. Hereinafter, it will be assumed that the first recovery tray 111 collects the first fluid added to the single wafer W; the second recovery tray 112 collects and implants the second fluid added to the single wafer W; and the third recovery tray 113 collects the injection. A third fluid is added to the single wafer W, wherein the first stream system mixes the acid, the second stream system dilute hydrofluoric acid, and the third stream system deionized water. It is also assumed that the entire etching process sequentially injects mixed acid, dilute hydrofluoric acid, and deionized water into a single wafer W in one cycle.

However, it should be noted that the order of injecting the fluid added to the single wafer W is not limited to the above, but the respective recovery trays may be set to collect different fluids according to the needs of the user; and, the fluid of the present invention The number of collection trays of the collection device 1 is not limited to three, but may be one. Or more; the first fluid and the second fluid and the third fluid are not limited to use mixed acid, dilute hydrofluoric acid and deionized water, and different fluids can be used according to the process requirements of the user.

Please refer to FIG. 4 , which is a schematic cross-sectional view of the fluid collection device 1 in a first use state, showing the state of the single wafer W when it is placed or removed. The top surfaces of the first cover disk 141, the second cover disk 142 and the third cover disk 143 are located slightly lower than the turntable 10 to facilitate placement or removal of the single wafer W.

Please refer to FIG. 5 , which is a schematic cross-sectional view of the fluid collection device 1 in a second use state. First, a single wafer W is placed on the turntable 10; then, the first lifting unit 151, 151', the second lifting unit 152, 152', and the third lifting unit 153, 153', the first cover disk 141, the second cover disk 142 And the top surface of the third cover disk 143 rises above the turntable 10; then, the turntable 20 drives the single wafer W to rotate; then, a nozzle 20 injects mixed acid onto the single wafer W for the first etching At this time, the mixed acid is scattered outward due to the centrifugal force of the single wafer W being rotated, and impinges on the first guiding top wall 141a or the first guiding sidewall 141b and then flows to the first The tray 111 is recovered for discharge.

Please refer to FIG. 6 , which is a schematic cross-sectional view of the fluid collection device 1 in a third use state. After the single wafer W is first etched using the mixed acid, the single wafer W is etched a second time using dilute hydrofluoric acid. First, the first lifting unit 151, 151' lowers the top surface of the first cover disk 141 to a position lower than the position of the turntable 10, that is, the position of the first use state; then, the turntable 20 drives the single wafer W to rotate; Next, a nozzle 20 injects dilute hydrofluoric acid into the single wafer W for the second etching. At this time, the dilute hydrofluoric acid is scattered outward due to the centrifugal force of the single wafer W being rotated, and The second guiding top wall 142a or the second guiding side wall 142b is struck and then flows to the second recovery tray 112 for discharge.

Next, please refer to FIG. 7, which is a schematic cross-sectional view of the fluid collection device 1 in a fourth use state. After the second etching of the single wafer W by using the dilute hydrofluoric acid, the single crystal is finally used using deionized water. Round W is the action of washing. First, the second lifting unit 152, 152' lowers the top surface of the second cover disk 142 to a position lower than the position of the turntable 10, that is, the position of the first use state; then, the turntable 10 drives the single wafer W to rotate; Then, a nozzle 20 injects deionized water onto the single wafer W to be washed. At this time, the deionized water is scattered outward due to the centrifugal force of the single wafer W being rotated, and impinges on the third The guiding top wall 143a or the third guiding side wall 143b then flows to the third recovery tray 113 for discharge. At this point, the entire etching process is completed. Then, the third lifting unit 153, 153' lowers the top surface of the third cover disk 143 to a position lower than the position of the turntable 10, that is, the position of the first use state, and then takes out the single wafer W on the turntable 10.

In summary, the fluid collection device of the single-wafer rotary etching and cleaning machine of the present invention is used for separately collecting different fluids for etching a single wafer, by fixing the fixed recovery tray and the turntable and relative to the recovery tray and the turntable. A cover plate that can be actuated up and down to guide the flow of different fluids to the corresponding recovery tray, and since the recovery tray is fixed, the recovery tube connecting the recovery tray can be selected to use a hard tube or a soft tube and does not need to be added. The collected fluid is transported to the recovery tank through the recovery pipe, and since the recovery tray is separable from the cover tray, the inside of the recovery tray can be easily cleaned.

The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

10‧‧‧ Turntable

111‧‧‧First recovery tray

112‧‧‧Second recovery tray

113‧‧‧ Third recovery tray

14‧‧‧ Cover

141‧‧‧First cover

141a‧‧‧First guiding top wall

141b‧‧‧First guiding side wall

142‧‧‧Second cover

142a‧‧‧Second guiding top wall

142b‧‧‧Second guiding side wall

143‧‧‧The third cover

143a‧‧‧3rd guiding top wall

143b‧‧‧ third guiding sidewall

15‧‧‧ Lifting group

151‧‧‧First lifting unit

151’‧‧‧First Lifting Unit

152‧‧‧Second lifting unit

152’‧‧‧Second lifting unit

153‧‧‧ third lifting unit

153’‧‧‧ Third Lifting Unit

D‧‧‧distance

W‧‧‧Single wafer

Claims (6)

A fluid collection device for a single wafer rotary etch cleaning machine for collecting and etching a fluid of a single wafer, comprising: a turntable for fixing and rotating a single wafer; at least one recovery tray fixed to the turntable The outer edge is configured to collect the fluid that is ejected when the single wafer is rotated; at least one cover disk is correspondingly disposed on the recovery tray for guiding the fluid to the recovery tray; at least one a lifting unit comprising a symmetrical second lifting unit, the lifting unit being connected to the cover plate for actuating the cover plate up and down with respect to the turntable and the recovery tray; wherein the cover plate is annular and The central portion has a radial opening; wherein the radial opening is spaced from the outer circumference of the turntable by a distance of 1 to 10 mm; and the recovery tray and the cover tray are separable. The fluid collection device of claim 1, wherein the radial opening and the outer circumference of the turntable are preferably 3 to 5 mm. The fluid collection device of claim 1, wherein the recovery tray is annular. The fluid collection device of claim 1, wherein the cover disk further has a guiding top wall and a guiding side wall, wherein the guiding top wall is an annular top surface inclined toward the outside, the guiding side wall is One side of the guiding side wall of the cover plate is partially overlapped with a portion of the side wall of the recovery tray. The fluid collection device of claim 1, wherein the recovery tray is equal in number to the cover tray. The fluid collection device of claim 1, wherein the recovery tray is connected to a recovery tube for discharging the fluid.