TWI597794B - Data processing method, data processing device and processing device - Google Patents

Data processing method, data processing device and processing device Download PDF

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Publication number
TWI597794B
TWI597794B TW103122645A TW103122645A TWI597794B TW I597794 B TWI597794 B TW I597794B TW 103122645 A TW103122645 A TW 103122645A TW 103122645 A TW103122645 A TW 103122645A TW I597794 B TWI597794 B TW I597794B
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TW
Taiwan
Prior art keywords
data
processing
predicted value
smoothing
smoothed
Prior art date
Application number
TW103122645A
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English (en)
Chinese (zh)
Other versions
TW201523759A (zh
Inventor
渡辺成一
井上智己
中元茂
福地功祐
Original Assignee
日立全球先端科技股份有限公司
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Application filed by 日立全球先端科技股份有限公司 filed Critical 日立全球先端科技股份有限公司
Publication of TW201523759A publication Critical patent/TW201523759A/zh
Application granted granted Critical
Publication of TWI597794B publication Critical patent/TWI597794B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/11—Complex mathematical operations for solving equations, e.g. nonlinear equations, general mathematical optimization problems
    • G06F17/13—Differential equations
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/18—Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Analysis (AREA)
  • Pure & Applied Mathematics (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Optimization (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Databases & Information Systems (AREA)
  • Algebra (AREA)
  • Operations Research (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Probability & Statistics with Applications (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
TW103122645A 2013-11-29 2014-07-01 Data processing method, data processing device and processing device TWI597794B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013246891 2013-11-29
JP2014111875A JP6318007B2 (ja) 2013-11-29 2014-05-30 データ処理方法、データ処理装置および処理装置

Publications (2)

Publication Number Publication Date
TW201523759A TW201523759A (zh) 2015-06-16
TWI597794B true TWI597794B (zh) 2017-09-01

Family

ID=53265456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103122645A TWI597794B (zh) 2013-11-29 2014-07-01 Data processing method, data processing device and processing device

Country Status (4)

Country Link
US (3) US10073818B2 (enExample)
JP (1) JP6318007B2 (enExample)
KR (2) KR101646613B1 (enExample)
TW (1) TWI597794B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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US10386828B2 (en) 2015-12-17 2019-08-20 Lam Research Corporation Methods and apparatuses for etch profile matching by surface kinetic model optimization
US9792393B2 (en) 2016-02-08 2017-10-17 Lam Research Corporation Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
US10032681B2 (en) 2016-03-02 2018-07-24 Lam Research Corporation Etch metric sensitivity for endpoint detection
US10197908B2 (en) 2016-06-21 2019-02-05 Lam Research Corporation Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework
US10254641B2 (en) 2016-12-01 2019-04-09 Lam Research Corporation Layout pattern proximity correction through fast edge placement error prediction
US10534257B2 (en) 2017-05-01 2020-01-14 Lam Research Corporation Layout pattern proximity correction through edge placement error prediction
KR102092855B1 (ko) * 2018-02-14 2020-03-24 숭실대학교 산학협력단 수중 센서 네트워크를 이용한 자기장 기반의 물체 위치 추정 시스템 및 그 방법
US10572697B2 (en) 2018-04-06 2020-02-25 Lam Research Corporation Method of etch model calibration using optical scatterometry
KR20250078603A (ko) 2018-04-10 2025-06-02 램 리써치 코포레이션 레지스트 및 에칭 모델링
US11921433B2 (en) 2018-04-10 2024-03-05 Lam Research Corporation Optical metrology in machine learning to characterize features
US10794940B2 (en) 2018-07-02 2020-10-06 Lg Chem, Ltd. System for accurately determining an amount of electrical current flowing through a hall effect current sensor
US10977405B2 (en) 2019-01-29 2021-04-13 Lam Research Corporation Fill process optimization using feature scale modeling
CN111814106A (zh) * 2020-07-09 2020-10-23 平安科技（深圳）有限公司 时序数据滞后性处理方法、装置、电子设备及存储介质
KR102783719B1 (ko) * 2024-07-03 2025-03-18 한국해양과학기술원 빅데이터 기반의 조업어장 해양 쓰레기 발생량 예측 시스템 및 방법

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JPS6153728A (ja) 1984-08-24 1986-03-17 Hitachi Ltd エツチング終点判定方法
US6197116B1 (en) * 1996-08-29 2001-03-06 Fujitsu Limited Plasma processing system
JPH10283335A (ja) * 1997-04-10 1998-10-23 Fuji Electric Co Ltd リカレントネットワークによる予測方法
JP3383236B2 (ja) * 1998-12-01 2003-03-04 株式会社日立製作所 エッチング終点判定方法及びエッチング終点判定装置
JP3884894B2 (ja) * 2000-03-01 2007-02-21 株式会社日立製作所 プラズマエッチング処理装置
TW492106B (en) * 2000-06-20 2002-06-21 Hitachi Ltd Inspection method for thickness of film to be processed using luminous beam-splitter and method of film processing
US6782297B2 (en) * 2001-05-24 2004-08-24 Eric Paul Tabor Methods and apparatus for data smoothing
US6903826B2 (en) * 2001-09-06 2005-06-07 Hitachi, Ltd. Method and apparatus for determining endpoint of semiconductor element fabricating process
JP2004110300A (ja) 2002-09-17 2004-04-08 Japan Research Institute Ltd データ予測方法、データ予測装置、コンピュータプログラム、及び記録媒体
US7020791B1 (en) * 2002-09-19 2006-03-28 Nortel Networks Limited Clock recovery using a double-exponential smoothing process
TWI246725B (en) 2002-10-31 2006-01-01 Tokyo Electron Ltd Method and apparatus for detecting endpoint
WO2007034482A2 (en) * 2005-09-20 2007-03-29 Sterna Technologies (2005) Ltd. A method and system for managing data and organizational constraints
JP4833687B2 (ja) * 2006-02-27 2011-12-07 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP4943716B2 (ja) 2006-03-01 2012-05-30 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6553398B2 (ja) * 2015-05-12 2019-07-31 株式会社日立ハイテクノロジーズ プラズマ処理装置、データ処理装置およびデータ処理方法

Also Published As

Publication number Publication date
US10073818B2 (en) 2018-09-11
KR20160067074A (ko) 2016-06-13
US20180341625A1 (en) 2018-11-29
US20150154145A1 (en) 2015-06-04
US10783220B2 (en) 2020-09-22
KR20150062920A (ko) 2015-06-08
JP2015128129A (ja) 2015-07-09
KR101795523B1 (ko) 2017-11-08
TW201523759A (zh) 2015-06-16
US11308182B2 (en) 2022-04-19
KR101646613B1 (ko) 2016-08-08
JP6318007B2 (ja) 2018-04-25
US20200380066A1 (en) 2020-12-03

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