KR101646613B1 - 데이터 처리 방법, 데이터 처리 장치 및 처리 장치 - Google Patents

데이터 처리 방법, 데이터 처리 장치 및 처리 장치 Download PDF

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KR101646613B1
KR101646613B1 KR1020140097409A KR20140097409A KR101646613B1 KR 101646613 B1 KR101646613 B1 KR 101646613B1 KR 1020140097409 A KR1020140097409 A KR 1020140097409A KR 20140097409 A KR20140097409 A KR 20140097409A KR 101646613 B1 KR101646613 B1 KR 101646613B1
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KR20150062920A (ko
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세이이치 와타나베
사토미 이노우에
시게루 나카모토
고스케 후쿠치
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가부시키가이샤 히다치 하이테크놀로지즈
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/18—Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/11—Complex mathematical operations for solving equations, e.g. nonlinear equations, general mathematical optimization problems
    • G06F17/13—Differential equations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Optimization (AREA)
  • Computational Mathematics (AREA)
  • Pure & Applied Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Databases & Information Systems (AREA)
  • Algebra (AREA)
  • Operations Research (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Probability & Statistics with Applications (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
KR1020140097409A 2013-11-29 2014-07-30 데이터 처리 방법, 데이터 처리 장치 및 처리 장치 Active KR101646613B1 (ko)

Applications Claiming Priority (4)

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JP2013246891 2013-11-29
JPJP-P-2013-246891 2013-11-29
JPJP-P-2014-111875 2014-05-30
JP2014111875A JP6318007B2 (ja) 2013-11-29 2014-05-30 データ処理方法、データ処理装置および処理装置

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KR1020160066776A Division KR101795523B1 (ko) 2013-11-29 2016-05-30 데이터 처리 방법

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KR20150062920A KR20150062920A (ko) 2015-06-08
KR101646613B1 true KR101646613B1 (ko) 2016-08-08

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KR1020160066776A Active KR101795523B1 (ko) 2013-11-29 2016-05-30 데이터 처리 방법

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US (3) US10073818B2 (enExample)
JP (1) JP6318007B2 (enExample)
KR (2) KR101646613B1 (enExample)
TW (1) TWI597794B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098668A (ko) * 2018-02-14 2019-08-22 숭실대학교산학협력단 수중 센서 네트워크를 이용한 자기장 기반의 물체 위치 추정 시스템 및 그 방법

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US10386828B2 (en) 2015-12-17 2019-08-20 Lam Research Corporation Methods and apparatuses for etch profile matching by surface kinetic model optimization
US9792393B2 (en) 2016-02-08 2017-10-17 Lam Research Corporation Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
US10032681B2 (en) 2016-03-02 2018-07-24 Lam Research Corporation Etch metric sensitivity for endpoint detection
US10197908B2 (en) 2016-06-21 2019-02-05 Lam Research Corporation Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework
US10254641B2 (en) 2016-12-01 2019-04-09 Lam Research Corporation Layout pattern proximity correction through fast edge placement error prediction
US10534257B2 (en) 2017-05-01 2020-01-14 Lam Research Corporation Layout pattern proximity correction through edge placement error prediction
US10572697B2 (en) 2018-04-06 2020-02-25 Lam Research Corporation Method of etch model calibration using optical scatterometry
KR20250078603A (ko) 2018-04-10 2025-06-02 램 리써치 코포레이션 레지스트 및 에칭 모델링
US11921433B2 (en) 2018-04-10 2024-03-05 Lam Research Corporation Optical metrology in machine learning to characterize features
US10794940B2 (en) 2018-07-02 2020-10-06 Lg Chem, Ltd. System for accurately determining an amount of electrical current flowing through a hall effect current sensor
US10977405B2 (en) 2019-01-29 2021-04-13 Lam Research Corporation Fill process optimization using feature scale modeling
CN111814106A (zh) * 2020-07-09 2020-10-23 平安科技（深圳）有限公司 时序数据滞后性处理方法、装置、电子设备及存储介质
KR102783719B1 (ko) * 2024-07-03 2025-03-18 한국해양과학기술원 빅데이터 기반의 조업어장 해양 쓰레기 발생량 예측 시스템 및 방법

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US6197116B1 (en) * 1996-08-29 2001-03-06 Fujitsu Limited Plasma processing system
JPH10283335A (ja) * 1997-04-10 1998-10-23 Fuji Electric Co Ltd リカレントネットワークによる予測方法
JP3383236B2 (ja) * 1998-12-01 2003-03-04 株式会社日立製作所 エッチング終点判定方法及びエッチング終点判定装置
JP3884894B2 (ja) * 2000-03-01 2007-02-21 株式会社日立製作所 プラズマエッチング処理装置
TW492106B (en) * 2000-06-20 2002-06-21 Hitachi Ltd Inspection method for thickness of film to be processed using luminous beam-splitter and method of film processing
US6782297B2 (en) * 2001-05-24 2004-08-24 Eric Paul Tabor Methods and apparatus for data smoothing
US6903826B2 (en) * 2001-09-06 2005-06-07 Hitachi, Ltd. Method and apparatus for determining endpoint of semiconductor element fabricating process
JP2004110300A (ja) 2002-09-17 2004-04-08 Japan Research Institute Ltd データ予測方法、データ予測装置、コンピュータプログラム、及び記録媒体
US7020791B1 (en) * 2002-09-19 2006-03-28 Nortel Networks Limited Clock recovery using a double-exponential smoothing process
TWI246725B (en) 2002-10-31 2006-01-01 Tokyo Electron Ltd Method and apparatus for detecting endpoint
WO2007034482A2 (en) * 2005-09-20 2007-03-29 Sterna Technologies (2005) Ltd. A method and system for managing data and organizational constraints
JP4833687B2 (ja) * 2006-02-27 2011-12-07 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP4943716B2 (ja) 2006-03-01 2012-05-30 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6553398B2 (ja) * 2015-05-12 2019-07-31 株式会社日立ハイテクノロジーズ プラズマ処理装置、データ処理装置およびデータ処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098668A (ko) * 2018-02-14 2019-08-22 숭실대학교산학협력단 수중 센서 네트워크를 이용한 자기장 기반의 물체 위치 추정 시스템 및 그 방법

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Publication number Publication date
US10073818B2 (en) 2018-09-11
KR20160067074A (ko) 2016-06-13
US20180341625A1 (en) 2018-11-29
US20150154145A1 (en) 2015-06-04
US10783220B2 (en) 2020-09-22
KR20150062920A (ko) 2015-06-08
JP2015128129A (ja) 2015-07-09
KR101795523B1 (ko) 2017-11-08
TW201523759A (zh) 2015-06-16
US11308182B2 (en) 2022-04-19
TWI597794B (zh) 2017-09-01
JP6318007B2 (ja) 2018-04-25
US20200380066A1 (en) 2020-12-03

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