TWI596316B - Plate work center test method - Google Patents

Plate work center test method Download PDF

Info

Publication number
TWI596316B
TWI596316B TW102124163A TW102124163A TWI596316B TW I596316 B TWI596316 B TW I596316B TW 102124163 A TW102124163 A TW 102124163A TW 102124163 A TW102124163 A TW 102124163A TW I596316 B TWI596316 B TW I596316B
Authority
TW
Taiwan
Prior art keywords
plate
workpiece
light
photographing
wafer
Prior art date
Application number
TW102124163A
Other languages
English (en)
Chinese (zh)
Other versions
TW201411088A (zh
Inventor
Nobuyuki Fukushi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201411088A publication Critical patent/TW201411088A/zh
Application granted granted Critical
Publication of TWI596316B publication Critical patent/TWI596316B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW102124163A 2012-08-02 2013-07-05 Plate work center test method TWI596316B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012172135A JP6075993B2 (ja) 2012-08-02 2012-08-02 板状ワーク中心検出方法

Publications (2)

Publication Number Publication Date
TW201411088A TW201411088A (zh) 2014-03-16
TWI596316B true TWI596316B (zh) 2017-08-21

Family

ID=50050554

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102124163A TWI596316B (zh) 2012-08-02 2013-07-05 Plate work center test method

Country Status (4)

Country Link
JP (1) JP6075993B2 (ko)
KR (1) KR101952971B1 (ko)
CN (1) CN103579064B (ko)
TW (1) TWI596316B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6210902B2 (ja) * 2014-02-18 2017-10-11 株式会社ディスコ レーザー加工溝の検出方法
CN109000570A (zh) * 2018-07-28 2018-12-14 大连云腾机械制造有限公司 高精度工件高度检测仪
JP2022078570A (ja) 2020-11-13 2022-05-25 株式会社ディスコ 中心検出装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63161637A (ja) * 1986-12-25 1988-07-05 Toshiba Corp 半導体ウエ−ハの位置認識装置
JP2003017545A (ja) * 2001-07-04 2003-01-17 Matsushita Electric Ind Co Ltd 基板の位置決め方法と装置
TWI327639B (ko) * 2006-06-06 2010-07-21 Fujinon Corp
TWM387242U (en) * 2010-04-09 2010-08-21 Nat Applied Res Laboratories Eccentric inspection device of optical lens
JP2011253936A (ja) * 2010-06-02 2011-12-15 Disco Abrasive Syst Ltd 研削装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211766A (ja) 1994-01-14 1995-08-11 Disco Abrasive Syst Ltd 中心合わせ装置
JP4385699B2 (ja) * 2003-09-25 2009-12-16 オムロン株式会社 半導体ウェーハの方向調整方法および半導体ウェーハの方向調整装置
KR100978487B1 (ko) * 2008-12-29 2010-08-30 에이티아이 주식회사 기판검사용 조명장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63161637A (ja) * 1986-12-25 1988-07-05 Toshiba Corp 半導体ウエ−ハの位置認識装置
JP2003017545A (ja) * 2001-07-04 2003-01-17 Matsushita Electric Ind Co Ltd 基板の位置決め方法と装置
TWI327639B (ko) * 2006-06-06 2010-07-21 Fujinon Corp
TWM387242U (en) * 2010-04-09 2010-08-21 Nat Applied Res Laboratories Eccentric inspection device of optical lens
JP2011253936A (ja) * 2010-06-02 2011-12-15 Disco Abrasive Syst Ltd 研削装置

Also Published As

Publication number Publication date
TW201411088A (zh) 2014-03-16
KR101952971B1 (ko) 2019-02-27
JP6075993B2 (ja) 2017-02-08
KR20140018116A (ko) 2014-02-12
JP2014033049A (ja) 2014-02-20
CN103579064A (zh) 2014-02-12
CN103579064B (zh) 2017-08-04

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