TWI591133B - 研磨劑及包括研磨劑之拋光漿液組合物 - Google Patents

研磨劑及包括研磨劑之拋光漿液組合物 Download PDF

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Publication number
TWI591133B
TWI591133B TW105107661A TW105107661A TWI591133B TW I591133 B TWI591133 B TW I591133B TW 105107661 A TW105107661 A TW 105107661A TW 105107661 A TW105107661 A TW 105107661A TW I591133 B TWI591133 B TW I591133B
Authority
TW
Taiwan
Prior art keywords
weight
abrasive particles
amount
slurry composition
polishing slurry
Prior art date
Application number
TW105107661A
Other languages
English (en)
Chinese (zh)
Other versions
TW201638240A (zh
Inventor
黃晙夏
鄭記和
黃珍明
權昌吉
李在祐
Original Assignee
Ｋ Ｃ 科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｋ Ｃ 科技股份有限公司 filed Critical Ｋ Ｃ 科技股份有限公司
Publication of TW201638240A publication Critical patent/TW201638240A/zh
Application granted granted Critical
Publication of TWI591133B publication Critical patent/TWI591133B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
TW105107661A 2015-03-13 2016-03-11 研磨劑及包括研磨劑之拋光漿液組合物 TWI591133B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150034907A KR101732421B1 (ko) 2015-03-13 2015-03-13 연마입자 및 그를 포함하는 연마 슬러리 조성물

Publications (2)

Publication Number Publication Date
TW201638240A TW201638240A (zh) 2016-11-01
TWI591133B true TWI591133B (zh) 2017-07-11

Family

ID=56920331

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105107661A TWI591133B (zh) 2015-03-13 2016-03-11 研磨劑及包括研磨劑之拋光漿液組合物

Country Status (3)

Country Link
KR (1) KR101732421B1 (ko)
TW (1) TWI591133B (ko)
WO (1) WO2016148409A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102275429B1 (ko) * 2017-12-11 2021-07-12 주식회사 케이씨텍 Cmp용 슬러리 조성물 및 이에 포함된 연마입자
KR20200057374A (ko) * 2018-11-16 2020-05-26 주식회사 케이씨텍 연마 슬러리 조성물 및 그의 제조방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4278773B2 (ja) * 1999-04-30 2009-06-17 花王株式会社 研磨液組成物
KR100584007B1 (ko) * 2004-12-31 2006-06-02 주식회사 케이씨텍 연마용 슬러리 및 이의 제조 방법
US7709053B2 (en) * 2004-07-29 2010-05-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing of polymer-coated particles for chemical mechanical polishing
TW201038690A (en) * 2008-09-26 2010-11-01 Rhodia Operations Abrasive compositions for chemical mechanical polishing and methods for using same
KR101472856B1 (ko) * 2012-11-07 2014-12-17 한양대학교 산학협력단 친환경 sti 공정용 연마 슬러리 및 이를 이용한 연마 방법

Also Published As

Publication number Publication date
WO2016148409A1 (ko) 2016-09-22
TW201638240A (zh) 2016-11-01
KR20160109813A (ko) 2016-09-21
KR101732421B1 (ko) 2017-05-08

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