TWI585998B - 紫外光發光裝置 - Google Patents

紫外光發光裝置 Download PDF

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Publication number
TWI585998B
TWI585998B TW101147243A TW101147243A TWI585998B TW I585998 B TWI585998 B TW I585998B TW 101147243 A TW101147243 A TW 101147243A TW 101147243 A TW101147243 A TW 101147243A TW I585998 B TWI585998 B TW I585998B
Authority
TW
Taiwan
Prior art keywords
layer
conductive semiconductor
light emitting
semiconductor layer
ultraviolet light
Prior art date
Application number
TW101147243A
Other languages
English (en)
Chinese (zh)
Other versions
TW201336110A (zh
Inventor
洪理朗
崔雲慶
Original Assignee
Ｌｇ伊諾特股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｌｇ伊諾特股份有限公司 filed Critical Ｌｇ伊諾特股份有限公司
Publication of TW201336110A publication Critical patent/TW201336110A/zh
Application granted granted Critical
Publication of TWI585998B publication Critical patent/TWI585998B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Led Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
TW101147243A 2011-12-13 2012-12-13 紫外光發光裝置 TWI585998B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20110134019 2011-12-13
KR1020120124003A KR101961825B1 (ko) 2011-12-13 2012-11-05 자외선 발광 소자

Publications (2)

Publication Number Publication Date
TW201336110A TW201336110A (zh) 2013-09-01
TWI585998B true TWI585998B (zh) 2017-06-01

Family

ID=48863165

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101147243A TWI585998B (zh) 2011-12-13 2012-12-13 紫外光發光裝置

Country Status (2)

Country Link
KR (1) KR101961825B1 (ko)
TW (1) TWI585998B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9812611B2 (en) * 2015-04-03 2017-11-07 Soko Kagaku Co., Ltd. Nitride semiconductor ultraviolet light-emitting element and nitride semiconductor ultraviolet light-emitting device
KR102601417B1 (ko) * 2017-09-28 2023-11-14 서울바이오시스 주식회사 발광 다이오드 칩
US10937928B2 (en) * 2017-11-09 2021-03-02 Asahi Kasei Kabushiki Kaisha Nitride semiconductor element, nitride semiconductor light emitting element, ultraviolet light emitting element

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557115A (en) * 1994-08-11 1996-09-17 Rohm Co. Ltd. Light emitting semiconductor device with sub-mount
US20050087755A1 (en) * 2003-10-27 2005-04-28 Samsung Electronics Co., Ltd. Electrode structure, and semiconductor light-emitting device having the same
US20100051994A1 (en) * 2008-08-28 2010-03-04 Kabushiki Kaisha Toshiba Semiconductor light emitting device and semiconductor light emitting apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632697B2 (ja) * 2004-06-18 2011-02-16 スタンレー電気株式会社 半導体発光素子及びその製造方法
JP2007103689A (ja) 2005-10-05 2007-04-19 Matsushita Electric Ind Co Ltd 半導体発光装置
US7626210B2 (en) 2006-06-09 2009-12-01 Philips Lumileds Lighting Company, Llc Low profile side emitting LED

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557115A (en) * 1994-08-11 1996-09-17 Rohm Co. Ltd. Light emitting semiconductor device with sub-mount
US20050087755A1 (en) * 2003-10-27 2005-04-28 Samsung Electronics Co., Ltd. Electrode structure, and semiconductor light-emitting device having the same
US20100051994A1 (en) * 2008-08-28 2010-03-04 Kabushiki Kaisha Toshiba Semiconductor light emitting device and semiconductor light emitting apparatus

Also Published As

Publication number Publication date
TW201336110A (zh) 2013-09-01
KR20130067216A (ko) 2013-06-21
KR101961825B1 (ko) 2019-03-25

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