TWI584341B - Gas delivery device and plasma processing device - Google Patents

Gas delivery device and plasma processing device Download PDF

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TWI584341B
TWI584341B TW103145591A TW103145591A TWI584341B TW I584341 B TWI584341 B TW I584341B TW 103145591 A TW103145591 A TW 103145591A TW 103145591 A TW103145591 A TW 103145591A TW I584341 B TWI584341 B TW I584341B
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gas
flow
delivery device
current limiting
switching element
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TW201618154A (en
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Qiang Wei
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氣體輸送裝置及電漿處理裝置 Gas delivery device and plasma processing device

本發明涉及半導體加工設備,特別涉及一種氣體輸送裝置和電漿處理裝置。 The present invention relates to a semiconductor processing apparatus, and more particularly to a gas delivery apparatus and a plasma processing apparatus.

目前在電漿工藝中,通常是將反應氣體由電漿處理裝置的反應腔內上部設置的氣體噴淋頭導入反應腔室內,反應氣體經過射頻激發形成電漿,然後通過反應腔室內下部的靜電夾盤的偏壓使電漿轟擊位於夾盤上的晶片,從而實現對晶片的蝕刻、沉積等電漿工藝。 At present, in the plasma process, the reaction gas is usually introduced into the reaction chamber from a gas shower head provided in the upper portion of the reaction chamber of the plasma processing device, and the reaction gas is excited by radio frequency to form a plasma, and then the static electricity is passed through the lower portion of the reaction chamber. The bias of the chuck causes the plasma to bombard the wafer on the chuck, thereby implementing a plasma process such as etching, deposition, etc. of the wafer.

然而,由於氣體輸送、電場作用或抽氣不均勻等多種原因,容易使產生的電漿在半導體晶片表面上的不同區域具有不同的分佈密度,從而在晶片表面的不同區域產生不同的處理速度,對於沿晶片徑向分佈的不同區域,如中心區域和邊緣區域,這種不均勻處理尤其明顯,進而導致晶片上不同區域形成的半導體元件的性能不同,對半導體元件製造的工藝控制及產品良率都有很大影響。 However, due to various reasons such as gas transport, electric field action or pumping unevenness, it is easy to cause the generated plasma to have different distribution densities in different regions on the surface of the semiconductor wafer, thereby generating different processing speeds in different regions of the wafer surface. This unevenness is particularly noticeable for different regions distributed along the radial direction of the wafer, such as the central region and the edge region, which in turn leads to different performance of semiconductor components formed in different regions on the wafer, process control for semiconductor component fabrication, and product yield. It has a big impact.

為了解決該問題,習知技術提出了一種氣體分流器,其可將反應氣體分流為不同流量的多路,從而將不同流量的多路反應氣體輸送至氣體噴淋頭的不同區域,使得反應腔室內不同區域能夠獲得不同密度的的電漿,以改善對整個晶片表面處理的均勻性。然而,這種氣體分流器所分流的每一路反應氣體的流量範圍是相同的,如10%到90%,如果對於某一區域希望得到特別小 的流量比例,如0.5%,則現有的氣體分流器無法實現。 In order to solve this problem, the prior art proposes a gas splitter which can split the reaction gas into multiple channels of different flow rates, thereby conveying different flow rates of multiple reactive gases to different regions of the gas shower head, so that the reaction chamber Different areas of plasma can be obtained in different areas of the room to improve the uniformity of the entire wafer surface treatment. However, the flow rate of each reaction gas shunted by this gas splitter is the same, such as 10% to 90%, if it is desired to be particularly small for a certain area. The flow ratio, such as 0.5%, is not possible with existing gas splitters.

因此,需要提供一種氣體輸送裝置以改善上述缺陷。 Therefore, it is desirable to provide a gas delivery device to improve the above drawbacks.

本發明的主要目的在於克服習知技術的缺陷,提供一種氣體輸送裝置,能夠向電漿處理裝置的反應腔室內的不同區域輸送不同流量,特別是小流量的反應氣體,提高氣體流量的控制精度。 The main object of the present invention is to overcome the deficiencies of the prior art and to provide a gas delivery device capable of delivering different flow rates, particularly small flow rates of reaction gases, to different regions of the reaction chamber of the plasma processing device to improve the control accuracy of the gas flow rate. .

為達成上述目的,本發明提供一種氣體輸送裝置,應用於電漿處理裝置,所述電漿處理裝置包括反應腔體,所述氣體輸送裝置包括氣體分流器以及至少一個氣體調節器。所述氣體分流器用於將反應氣體分流為流量可控的多路以輸出至位於所述反應腔體內的氣體導流件的不同氣體分佈區域;所述氣體調節器連接於所述氣體分流器及所述氣體導流件之間,用於接收經所述氣體分流器輸出的其中一路反應氣體並將其分流為多條支路以輸出至所述氣體導流件上對應于該路反應氣體的氣體分佈區域內的不同子區域。所述氣體調節器包括與該對應的氣體分佈區域的不同子區域相連通的多條氣體傳輸管線,其中至少一條氣體傳輸管線包括並聯的至少三條分支管線及流量切換元件,該流量切換元件用於控制每一所述分支管線的傳輸流量及導通和截止狀態以調節該條氣體傳輸管線所輸送的氣體流量。 To achieve the above object, the present invention provides a gas delivery device for use in a plasma processing apparatus, the plasma processing apparatus including a reaction chamber including a gas flow splitter and at least one gas regulator. The gas splitter is configured to split the reaction gas into a flow controllable multiplex to output to different gas distribution regions of the gas guiding member located in the reaction chamber; the gas regulator is coupled to the gas splitter and Between the gas guiding members, for receiving one of the reaction gases output through the gas splitter and diverting them into a plurality of branches for output to the gas guiding member corresponding to the reactive gas of the path Different sub-areas within the gas distribution area. The gas regulator includes a plurality of gas transfer lines in communication with different sub-regions of the corresponding gas distribution region, wherein at least one gas transfer line includes at least three branch lines and flow switching elements in parallel, the flow switching element being used The transmission flow and the on and off states of each of the branch lines are controlled to regulate the flow of gas delivered by the gas transmission line.

優選的,所述流量切換元件包括設置於所述至少三條分支管線上的多個限流元件和至少兩個開關元件。 Preferably, the flow switching element comprises a plurality of current limiting elements and at least two switching elements disposed on the at least three branch lines.

優選的,所述多條氣體傳輸管線包括第一氣體傳輸管線和第二氣體傳輸管線,所述第二氣體傳輸管線包括並聯的第一、第二和第三分支管線及所述流量切換元件,所述流量切換元件包括設置於所述第一分支管線上的第 一限流元件、設置於所述第二分支管線上的串聯的第二限流元件和第一開關元件、以及設置於所述第三分支管線上的串聯的第三限流元件和第二開關元件。 Preferably, the plurality of gas transmission lines include a first gas transmission line and a second gas transmission line, and the second gas transmission line includes first, second and third branch lines connected in parallel and the flow switching element, The flow switching element includes a first portion disposed on the first branch line a current limiting element, a second current limiting element and a first switching element disposed in series on the second branch line, and a third current limiting element and a second switch connected in series on the third branch line element.

優選的,所述第一氣體傳輸管線上設置第四限流元件。 Preferably, a fourth current limiting element is disposed on the first gas transmission line.

優選的,所述流量切換元件還包括設置於所述第一分支管線上的與所述第一限流元件串聯的第三開關元件。 Preferably, the flow switching element further includes a third switching element disposed in series with the first current limiting element on the first branch line.

優選的,所述氣體分流器將反應氣體分流為第一流量和第二流量的兩路反應氣體以輸出至所述氣體導流件的第一氣體分佈區域和第二氣體分佈區域,所述氣體調節器將所述第二流量的反應氣體分流為第三流量和第四流量的兩路反應氣體以分別傳輸至所述第二氣體分佈區域的第一子區域和第二子區域。 Preferably, the gas splitter splits the reaction gas into two reaction gases of a first flow rate and a second flow rate to be output to the first gas distribution region and the second gas distribution region of the gas flow guide, the gas The regulator splits the reaction gas of the second flow into two reaction gases of the third flow rate and the fourth flow rate to be respectively transmitted to the first sub-region and the second sub-region of the second gas distribution region.

優選的,各所述限流元件均為限流孔,各所述開關元件均為開關閥。 Preferably, each of the current limiting elements is a current limiting hole, and each of the switching elements is an on-off valve.

優選的,各所述限流孔的尺寸不同。 Preferably, each of the restrictor holes has a different size.

優選的,所述氣體導流件為氣體噴淋頭。 Preferably, the gas guiding member is a gas shower head.

根據本發明的另一方面,本發明還提供了一種電漿處理裝置,包括反應腔體和上述的氣體輸送裝置。 According to another aspect of the present invention, there is also provided a plasma processing apparatus comprising a reaction chamber and the gas delivery device described above.

本發明的有益效果在於通過氣體調節器將氣體分流器分流的其中一路反應氣體切換為多條支路,並通過流量切換元件及並聯的至少三條分支管線的設計控制各條支路的流量比例,而使得反應腔室內的特定區域能夠得到所需流量的反應氣體供給,進而根據需求調節電漿處理裝置反應腔體內不同區域的電漿分佈密度,提高晶片上不同區域所形成的半導體元件的均一性。 The invention has the beneficial effects that one of the reaction gases shunted by the gas splitter is switched into a plurality of branches by a gas regulator, and the flow ratio of each branch is controlled by the flow switching element and the design of at least three branch lines connected in parallel, The specific region in the reaction chamber can be supplied with the reaction gas of the required flow rate, and then the plasma distribution density in different regions of the reaction chamber of the plasma processing device can be adjusted according to the demand, and the uniformity of the semiconductor components formed in different regions on the wafer can be improved. .

1‧‧‧反應腔室 1‧‧‧reaction chamber

2‧‧‧氣體分流器 2‧‧‧ gas splitter

21‧‧‧管線 21‧‧‧ pipeline

22‧‧‧流量 22‧‧‧ flow

3‧‧‧氣體調節器 3‧‧‧ gas regulator

31‧‧‧氣體傳輸管線 31‧‧‧ gas transmission pipeline

311‧‧‧限流孔 311‧‧‧Limited orifice

32‧‧‧氣體傳輸管線 32‧‧‧ gas transmission pipeline

321‧‧‧限流孔 321‧‧‧Limited orifice

322‧‧‧限流孔 322‧‧‧Limited orifice

323‧‧‧開關元件 323‧‧‧Switching elements

324‧‧‧限流孔 324‧‧‧Limited orifice

325‧‧‧開關閥 325‧‧‧ switch valve

32a‧‧‧分支管線 32a‧‧‧ branch pipeline

32b‧‧‧分支管線 32b‧‧‧ branch pipeline

32c‧‧‧分支管線 32c‧‧‧ branch pipeline

4‧‧‧氣體導流件 4‧‧‧Gas guides

41‧‧‧氣體分佈區 41‧‧‧ gas distribution area

42‧‧‧氣體分佈區 42‧‧‧ gas distribution area

42A‧‧‧子區域 42A‧‧‧Sub-area

42B‧‧‧子區域 42B‧‧‧Sub-area

圖1為本發明一實施例的氣體輸送裝置的結構示意圖。 1 is a schematic structural view of a gas delivery device according to an embodiment of the present invention.

為使本發明的內容更加清楚易懂,以下結合說明書附圖,對本發明的內容作進一步說明。當然本發明並不局限於該具體實施例,本領域內的技術人員所熟知的一般替換也涵蓋在本發明的保護範圍內。 In order to make the content of the present invention clearer and easier to understand, the contents of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the invention is not limited to the specific embodiment, and general replacements well known to those skilled in the art are also encompassed within the scope of the invention.

圖1顯示了本發明一種實施方式提供的本發明氣體輸送裝置。該氣體輸送裝置應用於電漿處理裝置,電漿處理裝置包括反應腔室1,反應腔室1內的上部設置有氣體導流件4,氣體導流件4可包括多個氣體分佈區。本實施例中氣體導流件4為氣體噴淋頭,在其他實施例中也可以是氣體導流環或導流板等其他類似裝置。氣體輸送裝置用於將反應氣體分流為不同流量的多路輸送至氣體導流件4的不同氣體分佈區,以引入反應腔室內的不同區域。氣體輸送裝置包括氣體分流器2和氣體調節器3,氣體分流器2將反應氣體分為多路流量不同的反應氣體,例如本實施例中,氣體噴淋頭4上設置氣體分佈區41和42,則氣體分流器2對應將反應氣體分流形成具有不同的第一流量a和第二流量b的兩路反應氣體,分別通過管線21和22輸出。氣體分流器2可包括氣體分離器和流量控制器來執行其分流及流量調節功能,並且經其分流的多路反應氣體可以是成分相同或不同的氣體。 1 shows a gas delivery device of the present invention provided by an embodiment of the present invention. The gas delivery device is applied to a plasma processing device including a reaction chamber 1 in which an upper portion of the reaction chamber 1 is provided with a gas guiding member 4, and the gas guiding member 4 may include a plurality of gas distribution regions. In this embodiment, the gas guiding member 4 is a gas shower head, and in other embodiments, it may be a gas guiding ring or a baffle or the like. The gas delivery device is used to split the reaction gases into different flow rates for different flow distributions to different gas distribution zones of the gas flow guide 4 for introduction into different regions within the reaction chamber. The gas delivery device includes a gas flow divider 2 and a gas regulator 3, and the gas flow divider 2 divides the reaction gas into reaction gases having different flow rates. For example, in the present embodiment, gas distribution zones 41 and 42 are disposed on the gas shower head 4. Then, the gas splitter 2 splits the reaction gas to form two reaction gases having different first flow rates a and second flow rates b, which are respectively output through the lines 21 and 22. The gas splitter 2 may include a gas separator and a flow controller to perform its split and flow regulating functions, and the multiple reactive gases split therethrough may be gases of the same or different composition.

需要注意的是,本發明中經氣體分流器2分流的多路反應氣體並不都直接輸出至氣體噴淋頭4,至少其中一路反應氣體由氣體調節器3進一步分流及調節流量。如圖1所示,氣體調節器3設置於氣體分流器2和氣體噴淋頭4之間,具體地是設置在氣體分流器2的至少一個管線上,用於接收經氣體分流器2輸出的其中一路反應氣體並將其分流為多條支路以輸出至氣體噴淋 頭4上對應于該路反應氣體的氣體分佈區域內的不同子區域。氣體調節器3也可以是多個,分別對多路反應氣體進一步分流及調節流量。本實施例中以氣體調節器3設置在管線22上、氣體分佈區42具有兩個子區域42A和42B加以說明,其中氣體分佈區域41、42分別對應於氣體噴淋頭4的邊緣位置和中心位置,並且氣體分佈區域的子區域42B比42A更靠近氣體噴淋頭的中心,當然在其他實施例中也可以將處於氣體噴淋頭邊緣位置的氣體分佈區域劃分成多個子區域以分別提供進一步細分的氣體流量。氣體調節器3將流量b的一路反應氣體分成流量為b1和b2的兩條支路而輸送至子區域42A和42B,其包括與各子區域相連通的氣體傳輸管線31,32。其中,氣體傳輸管線32包括三條並聯的分支管線32a、32b、32c,以及流量切換元件。流量切換元件用於控制氣體傳輸管線32中各條分支管線32a、32b、32c的傳輸流量及導通和截止狀態,從而使得氣體傳輸管線32所輸送的氣體流量得以調節。流量切換元件可包括限流元件和開關元件,其中限流元件負責控制分支管線的最大氣體流量,開關元件負責控制分支管線的導通或截止,通過限流元件和開關元件的配合就可使氣體傳輸管線32輸出不同流量或流量比例的反應氣體。本實施例及下文所述的各限流元件均為限流孔,可根據限流孔自身規格尺寸決定限流孔輸出的最大氣體流量,例如限流孔的口徑越大輸出的氣體流量也越大;各開關元件均為開關閥,僅具有開啟和關閉兩種狀態。此外,分支管線的數量也可大於三條,以實現更大的流量調節範圍。 It should be noted that in the present invention, the multiple reactive gases split by the gas splitter 2 are not directly output to the gas shower head 4, and at least one of the reactant gases is further shunted by the gas regulator 3 and the flow rate is adjusted. As shown in FIG. 1, the gas regulator 3 is disposed between the gas splitter 2 and the gas shower head 4, specifically at least one line of the gas splitter 2 for receiving the output through the gas splitter 2. One of the reactive gases is split and split into multiple branches for output to the gas spray The head 4 corresponds to a different sub-region within the gas distribution region of the reactive gas of the path. There may be a plurality of gas regulators 3, which further separate the multiple reactive gases and adjust the flow rate. In the present embodiment, the gas regulator 3 is disposed on the line 22, and the gas distribution region 42 has two sub-regions 42A and 42B, wherein the gas distribution regions 41, 42 correspond to the edge position and center of the gas shower head 4, respectively. Position, and the sub-area 42B of the gas distribution area is closer to the center of the gas shower head than 42A. Of course, in other embodiments, the gas distribution area at the edge of the gas shower head may be divided into a plurality of sub-areas to provide further respectively. Subdivided gas flow. The gas regulator 3 divides one of the reactant gases of the flow rate b into two branches of flow rates b1 and b2 and delivers them to the sub-regions 42A and 42B, which include gas transfer lines 31, 32 in communication with the respective sub-regions. Among them, the gas transfer line 32 includes three parallel branch lines 32a, 32b, 32c, and a flow switching element. The flow switching element is used to control the flow rate and the on and off states of the respective branch lines 32a, 32b, 32c in the gas transfer line 32, thereby allowing the gas flow rate delivered by the gas transfer line 32 to be adjusted. The flow switching element may include a current limiting element and a switching element, wherein the current limiting element is responsible for controlling the maximum gas flow rate of the branch line, the switching element is responsible for controlling the conduction or the cut-off of the branch line, and the gas transmission is performed by the cooperation of the current limiting element and the switching element. Line 32 outputs reactant gases at different flow or flow ratios. The current limiting components in this embodiment and the following are current limiting holes, and the maximum gas flow rate of the limiting orifice output can be determined according to the size of the current limiting hole itself. For example, the larger the diameter of the limiting orifice, the more the gas flow rate is output. Large; each switching element is an on-off valve, which has only two states of opening and closing. In addition, the number of branch lines can be greater than three to achieve a larger flow adjustment range.

如圖1所示,分支管線32a上設置限流孔321,分支管線32b上設置串聯的限流孔322和開關元件323,分支管線32c上設置串聯的限流孔324和開關元件325。如此,通過兩個開關元件323、325的開閉狀態的控制,能夠實現4種排列組合形式,即:兩個開關閥均關閉,分支管線32b、32c截止,氣 體傳輸管線32所輸出的氣體流量b2為分支管線32a輸出的氣體流量;僅開關元件323打開,分支管線32b導通,氣體傳輸管線32所輸出的氣體流量b2為分支管線32a和32b輸出的氣體流量之和;僅開關元件325打開,分支管線32c導通,氣體傳輸管線32所輸出的氣體流量b2為分支管線32a和32c輸出的氣體流量之和;以及,兩個開關元件均打開,分支管線32b、32c導通,氣體傳輸管線32所輸出的氣體流量b2為三條分支管線輸出的氣體流量之和。因此,通過開關閥的開閉動作配合限流孔所限定的最大輸出氣體流量,氣體流量b2占氣體流量b的比例可以切換為四種,再配合氣體分流器2的分流比例,就能夠調節輸出至子區域42B的反應氣體流量。限流孔321、322和324的規格尺寸可以相同也可以不相同。假設配合各限流孔的口徑的選擇,能夠在上述四種情況下分別實現氣體輸送管線32輸送的氣體流量b2為4%b,13%b,19%b以及25%b。若反應氣體初始總流量為Q=a+b,且經氣體分流器2的分流,管線22輸出的氣體流量比例為b/(a+b)=10%~90%,那麼傳輸至氣體噴淋頭區域42B的氣體流量的最大值為90%×25%Q23%Q,最小值為10%×4%Q=0.4%Q,由以上可知供應至區域42B的反應氣體的流量的調節範圍得以擴展,而不僅限於市售氣體分流器10%~90%的調節範圍,特別適用於小流量反應氣體的供應。當然,在其他實施例中,也可以在分支管線32a上串聯另一開關閥,則通過三個開關閥的開閉動作可以實現氣體傳輸管線32輸出氣體流量b2占氣體流量b的氣體流量比例在七個設定值間切換,實現供應至區域42B的氣體流量的更大範圍的調節。在此種實施例中,較佳的,限流孔321、322和324的規格尺寸可以設置為不相同,如此氣體傳輸管線32輸出的氣體流量的控制範圍更大。此外,如圖所示,氣體調節器3的氣體傳輸管線31上也可設置一限流孔311,限流孔311的規格尺寸根據子區域42A的氣體需求量進行設置,其與限流孔321和322的規格尺寸可 以相同,也可以設置為不相同。 As shown in FIG. 1, a flow restricting hole 321 is provided in the branch line 32a, a current limiting hole 322 and a switching element 323 are provided in the branch line 32b, and a current limiting hole 324 and a switching element 325 are connected in the branch line 32c. Thus, by the control of the opening and closing states of the two switching elements 323, 325, four types of arrangement can be realized, that is, both switching valves are closed, the branch lines 32b, 32c are cut off, and the gas flow rate b2 outputted by the gas transfer line 32 is obtained. The flow rate of the gas outputted to the branch line 32a; only the switching element 323 is opened, the branch line 32b is turned on, and the gas flow rate b2 outputted by the gas transfer line 32 is the sum of the gas flows output from the branch lines 32a and 32b; only the switching element 325 is opened, the branch The line 32c is turned on, and the gas flow rate b2 outputted by the gas transfer line 32 is the sum of the gas flows output from the branch lines 32a and 32c; and both switch elements are open, the branch lines 32b, 32c are turned on, and the gas transfer line 32 outputs The gas flow rate b2 is the sum of the gas flows output by the three branch lines. Therefore, by the opening and closing operation of the on-off valve and the maximum output gas flow rate defined by the restriction orifice, the ratio of the gas flow rate b2 to the gas flow rate b can be switched to four, and the split ratio of the gas splitter 2 can be adjusted to adjust the output to The flow rate of the reaction gas in the sub-area 42B. The size of the restriction holes 321, 322, and 324 may be the same or different. It is assumed that the gas flow rate b2 delivered by the gas delivery line 32 can be 4% b, 13% b, 19% b, and 25% b, respectively, in accordance with the selection of the diameter of each of the restriction holes. If the initial total flow rate of the reaction gas is Q=a+b, and the flow through the gas splitter 2, the ratio of the gas flow output from the line 22 is b/(a+b)=10%~90%, then the gas is sprayed to the gas spray. The maximum gas flow rate of the head region 42B is 90% × 25% Q 23% Q, the minimum value is 10% × 4% Q = 0.4% Q, from which it can be seen that the adjustment range of the flow rate of the reaction gas supplied to the region 42B is expanded, and is not limited to 10% to 90% of the commercially available gas splitter. The adjustment range is especially suitable for the supply of small flow reaction gases. Of course, in other embodiments, another on-off valve may be connected in series on the branch line 32a, and the ratio of the gas flow rate of the gas delivery line 32 to the gas flow rate b of the gas transmission line 32 can be realized by the opening and closing operation of the three switching valves. Switching between setpoints enables a wider range of adjustments to the gas flow rate supplied to zone 42B. In such an embodiment, preferably, the size of the restriction orifices 321, 322, and 324 may be set to be different, such that the gas flow rate output by the gas transfer line 32 is controlled to be larger. In addition, as shown in the figure, a gas restricting hole 311 may be disposed on the gas transmission line 31 of the gas regulator 3, and the size of the restricting hole 311 is set according to the gas demand of the sub-area 42A, and the restricting hole 321 The size of the 322 and the size of the 322 can be the same or can be set to be different.

由以上可知,本發明通過氣體調節器的設計,將已分流的一路反應氣體再次分流為多條支路,並在其中一條支路上設置至少三條並聯的分支管線以及流量切換元件控制該支路的氣體流量,而將流量滿足需求的反應氣體對應分配至氣體噴淋頭的相應區域,此種設計能夠實現流量比不同的多路反應氣體在電漿處理裝置反應腔室內氣體導流件上多個區域的分佈控制,相比只有兩根分支管線的設計,提高了氣體流量b2處的組合數量,改變了兩根分支管線只有兩種組合對工藝的限制,採用多路並聯的分支管線可以有效的實現多種不同氣體流量的組合,特別地,可以精確地提供小流量氣體至氣體需求量較小的氣體分佈區,從而獲得所需的電漿密度分佈,以滿足不同工藝的需求。此外,開關元件和限流元件的設置也具有操作簡單,成本低廉的優點。 It can be seen from the above that the present invention divides the diverted one-way reaction gas into a plurality of branches by the design of the gas regulator, and installs at least three parallel branch lines on one of the branches and the flow switching element controls the branch. The gas flow rate is correspondingly distributed to the corresponding region of the gas shower head, and the design can realize multiple flow reactants with different flow ratios in the gas guiding device in the reaction chamber of the plasma processing device. The distribution control of the area, compared with the design of only two branch pipelines, increases the number of combinations at the gas flow rate b2, and changes the combination of only two combinations of the two branch pipelines. The use of multiple parallel branch lines can be effective. Achieving a combination of a plurality of different gas flows, in particular, can accurately provide a small flow of gas to a gas distribution area where gas demand is small, thereby obtaining a desired plasma density distribution to meet the needs of different processes. In addition, the arrangement of the switching element and the current limiting element also has the advantages of simple operation and low cost.

可以理解的是,本發明中的氣體輸送裝置,可應用於各種電漿處理裝置中,如電漿蝕刻、電漿物理汽相沉積、電漿化學汽相沉積、電漿表面清洗等裝置。 It can be understood that the gas delivery device of the present invention can be applied to various plasma processing devices, such as plasma etching, plasma physical vapor deposition, plasma chemical vapor deposition, plasma surface cleaning and the like.

雖然本發明已以較佳實施例揭示如上,然所述諸多實施例僅為了便於說明而舉例而已,並非用以限定本發明,本領域中具有通常知識者在不脫離本發明精神和範圍的前提下可作若干的更動與潤飾,本發明所主張的保護範圍應以申請專利範圍所述為准。 The present invention has been described in the above preferred embodiments, and the present invention is not intended to limit the scope of the present invention, and is not intended to limit the scope of the invention. A number of changes and refinements may be made, and the scope of protection claimed by the present invention shall be as described in the scope of the patent application.

1‧‧‧反應腔室 1‧‧‧reaction chamber

2‧‧‧氣體分流器 2‧‧‧ gas splitter

21‧‧‧管線 21‧‧‧ pipeline

22‧‧‧流量 22‧‧‧ flow

3‧‧‧氣體調節器 3‧‧‧ gas regulator

31‧‧‧氣體傳輸管線 31‧‧‧ gas transmission pipeline

311‧‧‧限流孔 311‧‧‧Limited orifice

32‧‧‧氣體傳輸管線 32‧‧‧ gas transmission pipeline

321‧‧‧限流孔 321‧‧‧Limited orifice

322‧‧‧限流孔 322‧‧‧Limited orifice

323‧‧‧開關元件 323‧‧‧Switching elements

324‧‧‧限流孔 324‧‧‧Limited orifice

325‧‧‧開關元件 325‧‧‧Switching elements

32a‧‧‧分支管線 32a‧‧‧ branch pipeline

32b‧‧‧分支管線 32b‧‧‧ branch pipeline

32c‧‧‧分支管線 32c‧‧‧ branch pipeline

4‧‧‧氣體導流件 4‧‧‧Gas guides

41‧‧‧氣體分佈區 41‧‧‧ gas distribution area

42‧‧‧氣體分佈區 42‧‧‧ gas distribution area

42A‧‧‧子區域 42A‧‧‧Sub-area

42B‧‧‧子區域 42B‧‧‧Sub-area

Claims (10)

一種氣體輸送裝置,應用於電漿處理裝置,所述電漿處理裝置包括反應腔體,其中所述氣體輸送裝置包括:氣體分流器,用於將反應氣體分流為流量可控的多路以各自單獨輸出至位於所述反應腔體內的氣體導流件的不同氣體分佈區域;至少一個氣體調節器,連接於所述氣體分流器及所述氣體導流件之間,每一所述氣體調節器用於接收經所述氣體分流器輸出的其中一路反應氣體並將其分流為多條支路以輸出至所述氣體導流件上對應於該路反應氣體的氣體分佈區域內的不同子區域,其包括與該對應的氣體分佈區域的不同子區域相連通的多條氣體傳輸管線,其中至少一條氣體傳輸管線包括並聯的至少三條分支管線及流量切換元件,該流量切換元件用於控制各所述分支管線的傳輸流量及導通和截止狀態以調節該條氣體傳輸管線所輸送的氣體流量,該條氣體傳輸管線的所有並聯的分支管線的輸出端會合為一條管線以只對應單一且同一個該子區域。 A gas delivery device is applied to a plasma processing device, the plasma processing device comprising a reaction chamber, wherein the gas delivery device comprises: a gas splitter for splitting the reaction gas into a flow-controllable multi-path to each Separately outputted to different gas distribution regions of the gas guiding member located in the reaction chamber; at least one gas regulator connected between the gas splitter and the gas guiding member, each of the gas regulators Receiving one of the reactive gases output through the gas splitter and splitting it into a plurality of branches for output to different sub-regions in the gas distribution region of the gas guiding member corresponding to the reactive gas of the path, Included in the plurality of gas transmission lines in communication with different sub-regions of the corresponding gas distribution region, wherein at least one of the gas transmission lines includes at least three branch lines and flow switching elements connected in parallel, the flow switching element is configured to control each of the branches The transmission flow rate and the on and off states of the pipeline to regulate the flow of gas delivered by the gas transmission line, the gas The output end of the branch line transmission lines all parallel lines converge to a single, and only correspond to the same sub-region. 如請求項1所述的氣體輸送裝置,其中所述流量切換元件包括設置於所述至少三條分支管線上的多個限流元件和至少兩個開關元件。 The gas delivery device of claim 1, wherein the flow switching element comprises a plurality of current limiting elements and at least two switching elements disposed on the at least three branch lines. 如請求項2所述的氣體輸送裝置,其中所述多條氣體傳輸管線包括第一氣體傳輸管線和第二氣體傳輸管線,所述第二氣體傳輸管線包括並聯的第一、第二和第三分支管線及所述流量切換元件,所述流量切換元件包括設置於所述第一分支管線上的第一限流元件、設置於所述第二分支管線上的串聯的第二限流元件和第一開關元件、以及設置於所述第三分支管線上的串聯的第三限流元件和第二開關元件。 The gas delivery device of claim 2, wherein the plurality of gas transfer lines comprise a first gas transfer line and a second gas transfer line, the second gas transfer line comprising first, second and third in parallel a branch line and the flow switching element, the flow switching element comprising a first current limiting element disposed on the first branch line, a second current limiting element disposed in series on the second branch line, and a a switching element, and a series of third current limiting element and second switching element disposed on the third branch line. 如請求項3所述的氣體輸送裝置,其中所述第一氣體傳輸管線上設置第四限流元件。 The gas delivery device of claim 3, wherein the fourth gas restriction line is provided with a fourth current limiting element. 如請求項3所述的氣體輸送裝置,其中所述流量切換元件還包括設置於所述第一分支管線上的與所述第一限流元件串聯的第三開關元件。 The gas delivery device of claim 3, wherein the flow switching element further comprises a third switching element disposed in series with the first current limiting element on the first branch line. 如請求項3所述的氣體輸送裝置,其中所述氣體分流器將反應氣體分流為第一流量和第二流量的兩路反應氣體以輸出至所述氣體導流件的第一氣體分佈區域和第二氣體分佈區域,所述氣體調節器將所述第二流量的反應氣體分流為第三流量和第四流量的兩路反應氣體以分別傳輸至所述第二氣體分佈區域的第一子區域和第二子區域。 The gas delivery device of claim 3, wherein the gas splitter splits the reaction gas into two reaction gases of a first flow rate and a second flow rate to output to the first gas distribution region of the gas flow guide member and a second gas distribution region, the gas regulator splits the reaction gas of the second flow into two reaction gases of a third flow rate and a fourth flow rate to be respectively transmitted to the first sub-region of the second gas distribution region And the second sub-area. 如請求項5所述的氣體輸送裝置,其中各所述限流元件均為限流孔,各所述開關元件均為開關閥。 The gas delivery device of claim 5, wherein each of the current limiting elements is a current limiting hole, and each of the switching elements is an on-off valve. 如請求項7所述的氣體輸送裝置,其中各所述限流孔的尺寸不同。 The gas delivery device of claim 7, wherein each of the restriction orifices has a different size. 如請求項1所述的氣體輸送裝置,其中所述氣體導流件為氣體噴淋頭。 The gas delivery device of claim 1, wherein the gas flow guide is a gas showerhead. 一種電漿處理裝置,包括反應腔體和如請求項1~9任一項所述的氣體輸送裝置。 A plasma processing apparatus comprising a reaction chamber and the gas delivery device according to any one of claims 1-9.
TW103145591A 2014-11-03 2014-12-25 Gas delivery device and plasma processing device TWI584341B (en)

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