TWI581678B - Copper foil for printed circuit - Google Patents

Copper foil for printed circuit Download PDF

Info

Publication number
TWI581678B
TWI581678B TW101140735A TW101140735A TWI581678B TW I581678 B TWI581678 B TW I581678B TW 101140735 A TW101140735 A TW 101140735A TW 101140735 A TW101140735 A TW 101140735A TW I581678 B TWI581678 B TW I581678B
Authority
TW
Taiwan
Prior art keywords
copper foil
particles
copper
printed circuit
layer
Prior art date
Application number
TW101140735A
Other languages
English (en)
Chinese (zh)
Other versions
TW201330721A (zh
Inventor
Hideta Arai
Atsushi Miki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201330721A publication Critical patent/TW201330721A/zh
Application granted granted Critical
Publication of TWI581678B publication Critical patent/TWI581678B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW101140735A 2011-11-04 2012-11-02 Copper foil for printed circuit TWI581678B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011242181 2011-11-04

Publications (2)

Publication Number Publication Date
TW201330721A TW201330721A (zh) 2013-07-16
TWI581678B true TWI581678B (zh) 2017-05-01

Family

ID=48192952

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101140735A TWI581678B (zh) 2011-11-04 2012-11-02 Copper foil for printed circuit

Country Status (5)

Country Link
JP (2) JP6205269B2 (ja)
KR (1) KR101623667B1 (ja)
CN (1) CN103958743B (ja)
TW (1) TWI581678B (ja)
WO (1) WO2013065730A2 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104120471B (zh) * 2013-04-26 2018-06-08 Jx日矿日石金属株式会社 高频电路用铜箔、覆铜板、印刷配线板、带载体的铜箔、电子设备及印刷配线板的制造方法
JP6166614B2 (ja) * 2013-07-23 2017-07-19 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
JP7166335B2 (ja) * 2018-03-27 2022-11-07 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN109056009B (zh) * 2018-08-19 2019-11-12 江西伟创丰电路有限公司 一种印刷电路板用铜箔及其制备方法
TWI719698B (zh) * 2019-06-12 2021-02-21 金居開發股份有限公司 進階反轉電解銅箔及其銅箔基板
KR102553808B1 (ko) 2022-06-03 2023-07-10 주식회사 수정해양개발 인공어초

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201021639A (en) * 2008-11-25 2010-06-01 Nippon Mining Co Copper foil for printed circuit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10341066A (ja) * 1997-06-10 1998-12-22 Furukawa Electric Co Ltd:The 印刷回路用銅箔、前記銅箔を用いた印刷回路用樹脂接着剤付銅箔、および前記銅箔を用いた印刷回路用銅張り積層板
JPH11135952A (ja) * 1997-10-27 1999-05-21 Furukawa Electric Co Ltd:The 印刷回路基板用樹脂付き銅箔、およびそれを用いた印刷回路基板
JP5129642B2 (ja) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
TWI434965B (zh) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
EP2557204A1 (en) * 2010-05-07 2013-02-13 JX Nippon Mining & Metals Corp. Copper foil for printed circuit
JP5654416B2 (ja) * 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
JP5497808B2 (ja) * 2012-01-18 2014-05-21 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた銅張積層板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201021639A (en) * 2008-11-25 2010-06-01 Nippon Mining Co Copper foil for printed circuit

Also Published As

Publication number Publication date
CN103958743B (zh) 2016-12-28
JP2016188436A (ja) 2016-11-04
KR20140085586A (ko) 2014-07-07
JPWO2013065730A1 (ja) 2015-04-02
JP6205269B2 (ja) 2017-09-27
TW201330721A (zh) 2013-07-16
WO2013065730A2 (ja) 2013-05-10
KR101623667B1 (ko) 2016-05-23
CN103958743A (zh) 2014-07-30

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