TWI575092B - A vapor deposition device with temperature control collimating unit - Google Patents

Description

Vapor deposition device with temperature control collimation unit

The present invention relates to an evaporation apparatus for depositing an organic electro-luminescence (EL) flat panel display, and more particularly to an evaporation apparatus having a temperature-controlled collimation unit.

Due to the evolution of technology, various flat panel displays have been developed in recent years, and the low power consumption and high-speed response of organic ELs have been highly noticed. The organic EL is a laminated structure using an organic film, and forms three kinds of pixels of red, green, and blue, and finally forms a pattern from the three kinds of pixels, and can be technically achieved by using a mask having a predetermined pattern in combination with vapor deposition.

However, since most of the gas particles are incident through the mask in direct and oblique directions during the evaporation process, the obliquely incident gas particles are likely to cause uneven film thickness due to the shadowing effect of the thickness of the mask (eg, part). The phenomenon that the film thickness of the pixel is thick in the middle but the periphery is thin. Therefore, when the pixels of the peripheral portion having a small peripheral thickness allow the EL flat panel display to be actually operated for mixing, it is not only easy to affect the resolution of the screen but also deteriorate the pattern display quality.

Referring to FIG. 1, in order to overcome the shadowing effect of the mask, the vapor deposition device 9 having the limiting plate disclosed in the Chinese Patent Publication No. CN 103430625 A is used for vaporizing a raw material (not shown) into a majority. Gas fraction Sub 95 is used to form the gas molecules 95 on a substrate 96. As shown in FIG. 1 , the vapor deposition device 9 having a limiting plate comprises: a vacuum chamber (not shown), and further includes an evaporation source 91 and a gas located in the vacuum chamber from bottom to top. The grouping plates 92 are parallel to each other and spaced apart and perpendicular to the evaporation source 91, and a mask 94 having a plurality of openings 941. The substrate 96 is disposed within the vacuum chamber to be positioned above the mask 94. The directivity of the gas particles 95 during traveling is improved by the restriction plates 92 arranged in parallel between the vapor deposition source 91 and the mask 94. That is, the limiting plates 92 block the obliquely incident gas particles 95 and allow only the direct gas particles 95 to travel in the one-dimensional space defined by the adjacent limiting plates 92, thereby allowing travel in each one-dimensional space. The gas molecules 95 are introduced into the respective openings 941 of the mask 94.

It should be additionally noted here that in order to prevent the gas particles 95 deposited on one surface of each of the limiting plates 92 from being vaporized by secondary gasification, the temperature of the limiting plates 92 must be kept below the vapor deposition. The temperature of the source 91 is even further connected to the limiting plate 92 to a cooling device (not shown) for further cooling. Although the temperature limiting plate 92 can improve the directivity of the gas particles 95 and prevent secondary vapor deposition. However, a portion of the obliquely incident gas particles 95 are still deposited on the surface of each of the restricting plates 92, causing the spacing of the restricting plates 92 to be reduced, and even blocking the one-dimensional space between the adjacent restricting plates 92, thereby reducing the evaporation efficiency.

Therefore, how to design a vapor deposition device, using the limiting plate 92 to overcome the shielding effect caused by the mask 94, and also improving the evaporation efficiency, is a problem to be solved by those skilled in the art.

Accordingly, it is an object of the present invention to provide an evaporation apparatus having a temperature-controlled collimating unit.

Thus, the vapor deposition apparatus of the present invention having a temperature-controlled collimation unit is for vaporizing a raw material into a plurality of gas molecules and depositing the gas molecules on a material to be plated. The vapor deposition device with a temperature-controlled collimating unit comprises: a vacuum chamber unit, a gasification unit, a collimating unit, and a heating unit.

The vacuum chamber unit includes a bottom portion and a top portion opposite to the bottom portion, and defines a closed reaction chamber, the object to be plated being disposed at the top of the vacuum chamber unit to be positioned in the closed reaction chamber. The gasification unit is disposed at the bottom of the vacuum chamber unit and is capable of vaporizing the raw material into the gas molecules. The gasification unit includes a housing in the closed reaction chamber, the housing defines an accommodating space for accommodating the raw material, and a top portion of the housing is formed with at least one and the accommodating space Connected shots. The collimating unit is detachably disposed between the housing and the object to be plated and formed with at least one passage. The passage has an inlet end facing the injection opening of the casing and an outlet end facing the object to be plated, and extends from the inlet end toward the object to be plated, so that the gas molecules are from the injection port When exiting the accommodating space, the passage can be made to travel toward the object to be plated. The heating unit is coupled to the collimating unit and is used to vaporize a deposit deposited inside one of the collimating units. The deposit is formed by a portion of the gas molecules as they travel through the channel.

The effect of the present invention is that the portion of the gas molecules can effectively travel upward in the channel defined by the collimating unit, and at the same time The heating unit vaporizes the deposit deposited inside the collimating unit to prevent the passage from being blocked by the deposit and thereby increasing the evaporation efficiency.

1‧‧‧vacuum chamber unit

11‧‧‧ bottom

12‧‧‧ top

13‧‧‧Closed reaction chamber

2‧‧‧ gasification unit

21‧‧‧ housing

211‧‧‧ top

22‧‧‧ accommodating space

23‧‧‧ shots

3‧‧‧Box board

30‧‧‧ channel

301‧‧‧ Inner torus

31‧‧‧ entrance end

32‧‧‧export end

4‧‧‧ mask

40‧‧‧ openings

6‧‧‧heating unit

7‧‧‧Cooling unit

71‧‧‧Metal plates

711‧‧‧through holes

72‧‧‧Cooling line

81‧‧‧Original materials

82‧‧‧ gas molecules

83‧‧‧The object to be plated

Z‧‧‧ axis direction

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a perspective view showing the steaming of the limiting plate disclosed in the Chinese Patent Publication No. WO 103430625 A. FIG. 2 is a perspective view showing an embodiment of the vapor deposition apparatus having a temperature-controlled collimating unit of the present invention; and FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2, illustrating the implementation. For example, a vacuum chamber unit, a gasification unit, a collimation unit, a heating unit, a mask, and a cooling unit.

Referring to FIG. 2 and FIG. 3, an embodiment of an evaporation device having a temperature-controlled collimating unit is used to vaporize a raw material 81 into a plurality of gas molecules 82 and deposit the gas molecules 82 in a gas to be plated. On object 83. This embodiment comprises: a vacuum chamber unit 1, a gasification unit 2, a collimation unit, a mask 4, a heating unit 6, and a cooling unit 7.

The vacuum chamber unit 1 includes a bottom portion 11 and a top portion 12 opposite the bottom portion 11, and defines a closed reaction chamber 13. The object to be plated 83 is disposed at the top portion 12 of the vacuum chamber unit 1 to be positioned in the sealed reaction chamber 13. Those skilled in the art will appreciate that the vacuum chamber unit unit 1 has substantially one including the bottom portion 11 and the top portion 12. And defining a stainless steel cavity of the closed reaction chamber 13 and an evacuation pump (not shown) for causing the sealed reaction chamber 13 to assume a vacuum state. However, the stainless steel cavity and the pumping pump are not technical features of the present invention, and will not be further described herein.

The gasification unit 2 is disposed at the bottom 11 of the vacuum chamber unit 1 and is capable of vaporizing the raw material 81 into the gas molecules 82. The gasification unit 2 includes a housing 21 in the closed reaction chamber 13. The housing 21 defines an accommodating space 22 for receiving the raw material 81. A top portion 211 of the housing 21 is formed with at least one injection opening 23 communicating with the accommodating space 22. Those skilled in the art will appreciate that the gasification unit 2 can vaporize the raw material 81 into the gas molecules 82, including, in addition to the housing (e.g., helium) 21, a surrounding a resistive heating coil (not shown) of the housing 21 for heating and gasifying the raw material 81 in the accommodating space 22, or an electron gun with a focusing lens group and an electron beam generating member ( Electron gun). The components such as the aforementioned resistive heating coil or electron gun are not technical features of the present invention, and will not be further described herein.

The collimating unit is detachably disposed between the housing 21 and the object to be plated 83, and is formed with at least one passage 30. The passage 30 has an inlet end 31 facing the injection opening 23 of the housing 21, and an outlet end 32 facing the object to be plated 83 extending from the inlet end 31 toward the object to be plated 83. The collimating unit can pass the gas molecules 82 through the channel 30 to travel toward the object to be plated 83 when the gas molecules 82 exit the accommodating space 22. In this embodiment of the invention, the ejection opening 23 formed by the top 211 of the housing 21 The number of the channels is plural, and the number of the channels 30 of the collimating unit is plural.

The mask 4 is disposed between a surface of the object to be plated 83 and each of the outlet ends 32 of the collimating unit. The mask 4 has a plurality of openings 40 through which the gas molecules 82 pass.

The heating unit 6 is connected to the collimating unit and is used to vaporize a deposit (not shown) deposited inside one of the collimating units. The deposit is formed by a portion of the gas molecules 82 as they travel through each of the channels 30.

The cooling unit 7 is disposed between the mask 4 and the collimating unit, and includes a metal plate 71 and a cooling pipe 72. The metal plate 71 has a plurality of through holes 711 through which the gas molecules 82 pass. The cooling line 72 is connected to the metal plate 71 and can be circulated through a cooling water (not shown). The outlet end 32 of each channel 30 is a respective through hole 711 facing the metal plate 71. More specifically, the collimating unit is constituted by a frame plate 3 which is disposed substantially parallel to the mask 4 and is provided with a plurality of inner ring faces 301 as shown in FIG. In this embodiment of the present invention, each inner ring surface 301 of the frame plate 3 defines each channel 30, and the heating unit 6 is a heating coil that is in contact with the collimating unit (ie, the frame plate 5).

Preferably, a cross-sectional shape of each channel 30 parallel to a top surface of the frame plate 3 is a circle, a hexagon, a quadrangle, or a triangle. In this embodiment of the present invention, the cross-sectional shape of each of the channels 30 is a circular shape as shown in FIG. 2 and has a diameter, and each of the diameters is 0.5 to 10 cm, for example, but not limited thereto. More preferably, a shortest distance from the inlet end 31 of each channel 30 to each of the ejection openings 23 of the housing 21 is 1 to 150 cm, and a shortest distance from the outlet end 32 of each channel 30 to the mask 4 is 1 to 150 Centimeters. In other words, the inner annular faces 301 of the frame plate 3 enable each of the channels 30 to assume a two-dimensional space. The shortest distance between the cooling unit 7 and the heating unit 6 is from 0.01 cm to 10 cm.

As can be seen from the above two paragraphs, the gas molecules 82 exiting the accommodating space 22 from the respective outlets 23 of the casing 21 can be defined by the inner ring faces 301 after entering the inlet end 31 of each channel 30. The two-dimensional space travels straight toward the exit end 32 of each channel 30.

It should be noted that in the embodiment of the present invention, the housing 21 and the frame plate 3 can be horizontally moved relative to the mask 4 to make the housing 21 and the frame plate 3 horizontal. During the moving process, a large-area evaporation process is performed. However, the housing 21 can also be horizontally moved relative to the frame plate 3. The frame plate 3 is fixed to the vacuum chamber unit 1, and is not limited to this embodiment.

Specifically, when the gas molecules 82 travel from the accommodation space 22 of the casing 21 to the respective injection ports 23, they are first emitted from the respective injection ports 23 along the axial direction Z of each of the injection ports 23. After the gas molecules 82 are emitted, the gas molecules 82 having high directivity emitted through the respective ejection openings 23 of the casing 21 (that is, the angle between the molecular traveling direction and the axial direction Z is small) are able to pass through the respective channels 30. The inlet end 31, and the gas molecules 82 having low directivity emitted through the respective ejection openings 23 of the housing 21 are corrected by the inner annular surface 301 of the frame plate 3 (i.e., the collimating unit) to lower the ejection angle thereof ( That is, the angle between the direction of travel of the molecules and the direction Z of the axis). Therefore, the portion of the gas molecules 82 passing through the inlet end 31 of each channel 30 can effectively travel upward in the two-dimensional space defined by each inner annulus 301, and from the outlet of each channel 30. The end 32 exits to continue along the axis direction Z toward the respective openings 40 of the mask 4 and thereby deposit on the surface of the object to be plated 83.

It should be further noted that in the portion of the gas molecules 82 traveling in each channel 30, the gas molecules 82 whose ejection angle is slightly larger than the direct traveling are formed by being easily deposited on the inner ring faces 301, so that the channels are formed. 30 blocking causes the evaporation efficiency to decrease. Therefore, the present invention heats the frame plate 3 (i.e., the collimating unit) by the heating unit (heating coil) 6, and re-vaporizes the deposit deposited on each inner ring surface 301 to prevent the respective channels 30 from being blocked. . Moreover, in order to prevent a thermal energy generated by the heating unit 6 from damaging the mask 4, the thermal energy can be firstly conducted through the metal plate 71 of the cooling unit 7, and further transmitted through the cooling water flowing through the inside of the cooling pipe 72. (not shown) the heat energy guided to the metal plate 71 is led out.

In summary, the present invention has an evaporation device of a temperature-controlled collimating unit, and the portion of the gas molecules 82 can effectively travel upward in a two-dimensional space defined by each inner ring surface 301 (ie, each channel 30). The shielding effect caused by the mask 4 is avoided, and at the same time, the deposit deposited on each inner ring surface 301 by the heating unit 6 avoids the blockage of the respective channels 30, thereby improving the evaporation efficiency, so The object of the invention is achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

1‧‧‧vacuum chamber unit

11‧‧‧ bottom

12‧‧‧ top

13‧‧‧Closed reaction chamber

21‧‧‧ housing

3‧‧‧Box board

30‧‧‧ channel

4‧‧‧ mask

6‧‧‧heating unit

7‧‧‧Cooling unit

71‧‧‧Metal plates

711‧‧‧through holes

72‧‧‧Cooling line

83‧‧‧The object to be plated

Claims (8)

An evaporation device having a temperature-controlled collimating unit for vaporizing a raw material into a plurality of gas molecules and depositing the gas molecules on a material to be plated, the vapor deposition device having a temperature-controlled collimating unit comprises a vacuum chamber unit comprising a bottom portion and a top portion opposite to the bottom portion, and defining a closed reaction chamber, the object to be plated being disposed at the top of the vacuum chamber unit to be positioned in the closed reaction chamber; a chemical unit, disposed at the bottom of the vacuum chamber unit and capable of vaporizing the raw material into the gas molecules, the gasification unit comprising a housing in the sealed reaction chamber, the housing defining a capacity An accommodating space of the raw material is disposed, and a top portion of the housing is formed with at least one ejection opening communicating with the accommodating space; a collimating unit detachably disposed between the housing and the object to be plated Forming at least one passage having an inlet end facing the injection opening of the housing and an outlet end facing the object to be plated, and extending from the inlet end toward the object to be plated, so that Gas molecules exit from the exit Passing through the channel to travel toward the object to be plated; and a heating unit coupled to the collimating unit and for vaporizing a deposit deposited inside one of the collimating units, the deposit being part of The gas molecules are stacked as they pass through the channel; wherein the heating unit is a heating coil in contact with the collimating unit. An evaporation device having a temperature-controlled collimating unit for vaporizing a raw material into a plurality of gas molecules and depositing the gas molecules in a gas to be plated The vapor deposition device having a temperature-controlled collimating unit comprises: a vacuum chamber unit including a bottom portion and a top portion opposite to the bottom portion, and defining a closed reaction chamber, wherein the object to be plated is disposed The top of the vacuum chamber unit is located in the closed reaction chamber; a gasification unit is disposed at the bottom of the vacuum chamber unit and can vaporize the raw material into the gas molecules, and the gasification unit includes one of the gas seals a housing in the reaction chamber, the housing defines an accommodating space for accommodating the raw material, and a top portion of the housing is formed with at least one ejection opening communicating with the accommodating space; a collimating unit, Removably disposed between the housing and the object to be plated and formed with at least one passage, the passage having an inlet end facing the injection opening of the housing and an outlet end facing the object to be plated, and The inlet end is collimated toward the object to be plated, so that the gas molecules can pass through the channel to travel toward the object to be plated from the exit port; a heating unit is connected to the collimating unit and used Gasified in the collimation list An internal deposit formed by a portion of the gas molecules as they travel through the passage; and a mask and a cooling unit disposed on a surface of the object to be plated and the collimating The cooling unit is disposed between the unit and the collimating unit. The vapor deposition device of claim 2, wherein the mask has a plurality of openings through which the gas molecules pass; the cooling unit includes a metal plate and a cooling pipe, the metal plate Having a plurality of through holes for the passage of the gas molecules, the cooling pipe connecting the metal plates And can supply a cooling water circulation. The vapor deposition device with a temperature-controlled collimating unit according to claim 3, wherein the number of the ejection openings formed at the top of the housing is plural, and the number of the channels of the collimating unit is plural, and each The outlet ends of the channels are respectively facing the through holes of the metal plate. The vapor deposition device with a temperature-controlled collimation unit according to claim 4, wherein the collimation unit is constituted by a frame plate substantially parallel to the mask and having a plurality of inner annular surfaces therein, the frame Each inner ring surface of the board defines each channel. The vapor deposition device with a temperature-controlled collimating unit according to claim 5, wherein a shortest distance from the inlet end of each channel to each of the ejection openings of the housing is 1 to 150 cm, and the outlet end of each channel is The shortest distance of the mask is 1 to 150 cm. An evaporation device having a collimating tube according to claim 5, wherein each of the channels has a circular shape, a hexagonal shape, a square shape, or a triangular shape in a cross-sectional shape parallel to a top surface of the frame plate. An evaporation apparatus having a temperature-controlled collimating unit according to claim 7, wherein each of the cross-sectional shapes is a circle and has a diameter, and each diameter is 0.5 to 10 cm.