TWI572739B - Heating device - Google Patents

Description

heating equipment

The present invention relates to a heating device, and more particularly to a substrate heating device.

In a conventional coating process, a substrate (eg, a wafer) can be coated by heating in a vacuum system. For example, the heating device can be applied to a metal organic chemical vapor deposition (MOCVD) process to heat the substrate to chemically react the reactants on the heated substrate to form a thin film. Common heating devices can be divided into hot plate type and lamp type. Among them, the hot plate type heating device is contact heating, which can directly contact and heat the substrate, so that the heated substrate achieves good temperature uniformity, but the required heating time is long. In contrast, the tube-type heating device is non-contact heating, which requires a shorter heating time, but its temperature uniformity is not good.

Furthermore, the tube type heating device usually heats the substrate by using a plurality of lamps as a heat source. When the size of the tube heating device becomes large (for example, for heating a substrate having a length of 1650 mm (millimeter, mm) and a width of 1300 mm), in order to achieve a predetermined temperature uniformity of the substrate, it needs to be adjusted according to the surrounding environment. The position of the lamp and the size of the lamp. For example, because the outside of the heating device contacts the surrounding ring The environment, or the cooling system is usually additionally cooled, so that the surrounding area of the heating device is lower than the temperature of the intermediate portion. Thereby, when the heating effect of the heating device is adjusted so that the surrounding area meets the demand, the middle area may be overheated. Therefore, the current practice is to adjust the arrangement position or arrangement of the lamps, or to configure the lamps with smaller sizes in areas that are prone to overheating. This increases the complexity of lamp configuration and temperature control, as well as manufacturing and maintenance costs.

The present invention provides a heating device that allows a heated substrate to have a good overall temperature uniformity.

The heating device of the present invention is adapted to uniformly heat a substrate. The heating device comprises a casing, a plurality of lamps, a support member, a spacer and at least one blocking member. The tube is disposed within the housing and provides a thermal energy. The support member is disposed on the outer casing and is located on the lamp tube, and the substrate is adapted to be placed on the support member. The spacer is disposed on the lamp tube to isolate the lamp tube from the substrate, and thermal energy is transmitted from the lamp tube through the spacer to the substrate. The blocking member is disposed on the spacer to block a portion of the thermal energy transfer to a portion of the substrate.

In an embodiment of the invention, the spacer comprises a spacer mesh, and thermal energy is transmitted to the substrate through the spacer.

In an embodiment of the invention, the material of the isolation net comprises metal.

In an embodiment of the invention, the spacer comprises a spacer, and thermal energy is transmitted to the substrate through the spacer.

In an embodiment of the invention, the material of the spacer is made of quartz.

In an embodiment of the invention, the material of the blocking member comprises a metal.

In an embodiment of the invention, the lamps have the same size specifications.

In an embodiment of the invention, the amount of heat energy provided by the lamp tube after passing through the spacer is less than the amount of heat lost by the lamp after passing through the blocking member.

In an embodiment of the invention, each of the lamps includes an infrared light tube that provides thermal energy by emitting infrared light.

In an embodiment of the invention, the lamp tube correspondingly constitutes at least two heating modules, and the heating module is adapted to be independently assembled to or detached from the outer casing.

Based on the above, in the heating device of the present invention, the lamp tube is disposed in the outer casing, the support member and the spacer are disposed on the lamp tube, and the blocking member is disposed on the spacer. Thereby, the substrate can be placed on the support and heated by the thermal energy provided by the lamp, and the spacer can prevent the substrate from contacting the lamp tube, and the portion on the substrate that is easily overheated can block part of the thermal energy by the blocking member. Thereby, the heating device of the present invention is suitable for uniformly heating the substrate so that the heated substrate has a good overall temperature uniformity.

The above described features and advantages of the invention will be apparent from the following description.

100, 200‧‧‧ heating device

100a to 100c‧‧‧ heating module

102‧‧‧Substrate

110‧‧‧Shell

120‧‧‧Light tube

130, 230‧‧‧Isolated parts

140a, 140b‧‧‧blocking parts

150‧‧‧Support

H1, H2, H3, H4‧‧‧ arrows

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a heating apparatus according to an embodiment of the present invention.

Figure 2 is a top plan view of the heating device of Figure 1.

Figure 3 is a side elevational view of the heating device of Figure 1.

Figure 4 is a side elevational view of a heating apparatus in accordance with another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a heating apparatus according to an embodiment of the present invention. Figure 2 is a top plan view of the heating device of Figure 1. Figure 3 is a side elevational view of the heating device of Figure 1. Referring to FIG. 1 to FIG. 3 , in the embodiment, the heating device 100 includes a housing 110 , a plurality of lamps 120 , a spacer 130 , and a plurality of blocking members 140 a and 140 b ( FIGS. 1 and 2 depict two different sizes The blocking members 140a and 140b are shown as a schematic) and the support member 150. Thereby, the heating device 100 is adapted to uniformly heat the substrate 102 (shown in FIG. 3 ), for example, to heat the substrate 102 in a vacuum system, but the invention does not limit the application of the heating device 100 and the type of the substrate, which may be based on Demand adjustment.

Specifically, in the embodiment, the lamps 120 are arranged in the outer casing 110 in sequence, wherein each of the lamps 120 is, for example, an infrared light lamp, so that the lamp 120 is provided by emitting infrared light. Thermal energy. Thereby, the lamp tube 120 can serve as a heat source of the heating device 100, and the infrared light emitted by the lamp tube 120 as a heat source can be adjusted to a short wave (wavelength of about 1 micrometer (um)) or medium wave according to demand. The wavelength is about 2 to 4 microns). However, the type, number, and wavelength of the light tube 120 can be adjusted according to requirements, and the invention is not limited.

In addition, in the embodiment, the plurality of lamps 120 can be configured to form at least two sets of heating modules, for example, three sets of heating modules 100a to 100c illustrated in FIGS. 1 to 2, and the size of the tube 120. The specifications are the same. In other words, the embodiment adopts the size The lamp 120 of the same specification serves as a heat source, thereby simplifying the manufacturing process and reducing the manufacturing cost. In addition, the lamp tube 120 of the present embodiment can be modularized, so that the heating modules 100a to 100c are adapted to be independently assembled to or detached from the outer casing 110, thereby reducing the difficulty in manufacturing the heating device 100 and simplifying the lamp 120. The maintenance method, but the present invention is not limited to the above embodiment, and can be adjusted according to requirements.

Therefore, in the embodiment, the substrate 102 can be supported by the support member 150 and located above the lamp tube 120, and then heated by the thermal energy provided by the lamp tube 120. In detail, the support member 150 is disposed on the inner side of the outer casing 110 and located on the bulb 120, and the substrate 102 is adapted to be placed on the support member 150. In other words, in this embodiment, the protrusions protruding from the inner side of the outer casing 110 are used as the support members 150. However, in other embodiments, the support members 150 may also be convex ribs or other suitable protruding structures, and the present invention does not limit the support members 150. Structure, quantity and location. Preferably, the structure of the support member 150 does not affect the transfer of thermal energy from the lamp tube 120 to the substrate 102. Therefore, when the substrate 102 is placed on the support member 150, the substrate 102 is located above the lamp tube 120, and the substrate 102 supported by the support member 150 does not contact the lamp tube 120, and is heated by the heat energy provided by the lamp tube 120. (As shown in Figure 3).

On the other hand, in the embodiment, the spacer 130 is disposed on the bulb 120 to isolate the bulb 120 from the substrate 102. More specifically, the spacer 130 isolates the lamp tube 120 from the substrate 102 supported by the support member 150 on opposite sides to prevent the substrate 102 from being displaced or the debris formed after the crack is contacted to the lamp tube 120. Thereby, the spacer 130 preferably covers all the lamps 120 to effectively isolate the substrate 102 from all the lamps 120, but the thermal energy can still be transferred from the tube 120 through the spacer 130 to the base. Board 102. In other words, the spacer 130 located between the lamp 120 and the substrate 102 does not affect the heating effect of the lamp 120 on the substrate 102, so that most of the thermal energy provided by the lamp 120 can pass through the spacer 130 from the tube 120. It is transferred to the substrate 102 to thereby heat the substrate 102. The implementation of the spacer 130 is detailed below.

Moreover, in the present embodiment, the blocking members 140a and 140b are disposed on the spacer 130 to block part of the transfer of thermal energy to the portion of the substrate 102. Thereby, during the transfer of thermal energy provided by the lamp 120 through the spacer 130 to the substrate 102, part of the thermal energy is absorbed or blocked by the blocking members 140a and 140b to reduce the area of the substrate 102 corresponding to the blocking members 140a and 140b. The absorbed heat energy. For example, the materials of the blocking members 140a and 140b of the present embodiment are preferably metal, so that the blocking members 140a and 140b can reduce the absorption of the regions of the substrate 102 corresponding to the blocking members 140a and 140b by absorbing part of the thermal energy. Thermal energy. However, the blocking members 140a and 140b may also be made of a material having poor thermal conductivity, so that part of the thermal energy cannot be transmitted through the blocking member to the region of the substrate 102 corresponding to the blocking members 140a and 140b, thereby reducing the corresponding resistance in the substrate 102 corresponding to the blocking member 140a. The heat absorbed by the area with 140b. Accordingly, the present invention does not limit the size, number, position and material of the blocking members 140a and 140b.

Furthermore, although the lamp tubes 120 of the present embodiment are arranged in the outer casing 110 in sequence, the heat energy generated by the lamps 120 is not uniformly transmitted outward, and the temperature (for example, the intermediate portion) of the heating device 100 may have a temperature. Too high a situation. Alternatively, the surrounding environment of the heating device 100 may be additionally provided with a cooling system, for example, cooling water is used to lower the ambient temperature of the heating device 100, so that the temperature of the surrounding area of the heating device 100 is lower than the temperature of the intermediate portion. Thereby, in order to make the heating device 100 has a uniform heating effect, and the blocking members 140a and 140b can be disposed in an area where the temperature is too high in the heating device 100 according to requirements, for example, corresponding to an intermediate portion of the substrate 102 (as shown in FIG. 3), in order to be overheated. A portion of the thermal energy is absorbed or blocked in the region, thereby reducing the thermal energy absorbed by the regions of the substrate 102 corresponding to the barriers 140a and 140b such that the regions of the substrate 102 corresponding to the barriers 140a and 140b coincide with the temperatures of the other regions. From this, it can be seen that by adjusting the size, the number, the position, and the material of the stoppers 140a and 140b, the heating device 100 can be effectively heated to uniformly heat the respective portions of the substrate 102, so that the entire substrate 102 has a good temperature uniformity.

Moreover, in the present embodiment, since the spacer 130 preferably covers all the lamps 120 to effectively isolate the substrate 102 from all the lamps 120, thermal energy can still be transferred from the tube 120 through the spacer 130 to the substrate. 102, the material or shape of the spacer 130 preferably needs to have a small absorption rate of thermal energy, so that most of the thermal energy can be transmitted to the substrate 102 through the spacer 130. Further, in the present embodiment, the amount of heat energy provided by the lamp tube 120 after passing through the spacer 130 is smaller than the amount of heat energy provided by the lamp tube 120 after passing through the blocking member 140a. That is, most of the thermal energy provided by the lamp 120 can pass through the spacer 130, so that the heating device 100 does not dissipate excessive thermal energy due to the configuration of the spacer 130. In contrast, the thermal energy corresponding to the stops 140a and 140b is absorbed or blocked by the blocking members 140a and 140b to reduce the thermal energy passing through the blocking members 140a and 140b, thereby reducing the corresponding correspondence of the blocking members 140a and 140b on the substrate 102. The heat absorbed by the area.

For example, referring to FIG. 3, in the embodiment, the spacer 130 used in the heating device 100 is a spacer mesh, and the material of the spacer mesh is, for example, metal, that is, This embodiment uses a metal mesh as the spacer 130, but the invention is not limited thereto. With the metal mesh as the spacer 130, most of the thermal energy provided by the lamp 120 can be transmitted to the substrate 102 through the mesh of the metal mesh as the spacer 130, thereby heating the substrate 102, as indicated by the arrow H1 of FIG. In addition, in the process of transferring the thermal energy provided by the lamp 120 through the isolation mesh as the spacer 130 to the substrate 102, part of the thermal energy is absorbed or blocked by the metal plates as the blocking members 140a and 140b, thereby reducing the correspondence on the substrate 102. The heat energy absorbed by the portions of the blocking members 140a and 140b is as shown by the arrow H2 of FIG.

It can be seen that the heating device 100 of the present embodiment can use the lamp 120 having the same size and size as the heating source, thereby simplifying the manufacturing process of the heating device 100 and reducing the manufacturing cost. Moreover, by using the metal mesh as the design of the spacer 130, the spacer 130 can be prevented from affecting the heating effect of the substrate 102 while supporting the carrier substrate 102. In other words, the material and shape of the spacer 130 do not affect the heating effect of the substrate 102, so that thermal energy can be transmitted to the substrate 102 through the spacer 130. In addition, the metal plates as the blocking members 140a and 140b can further absorb or block part of the thermal energy in the region where the temperature is too high on the heating device 100 according to requirements, that is, the embodiment uses the blocking members 140a and 140b to adjust various portions of the substrate 102. The condition is heated to achieve the purpose of uniformly heating the substrate 102. Accordingly, the heating apparatus 100 of the present embodiment is adapted to uniformly heat the substrate 102 such that the heated substrate 102 has a good overall temperature uniformity.

Figure 4 is a side elevational view of a heating apparatus in accordance with another embodiment of the present invention. Referring to FIG. 4, in the present embodiment, the main difference between the heating device 200 and the foregoing heating device 100 is that the spacer 230 used by the heating device 200 is a spacer. The material of the spacer is, for example, quartz, that is, the quartz plate is used as the spacer 230 in this embodiment, but the invention is not limited thereto. With the quartz plate as the spacer 230, most of the thermal energy provided by the lamp 120 can be transmitted to the substrate 102 through the quartz plate as the spacer 230. Furthermore, the spacer used as the spacer 230 is made of a material that allows the infrared light emitted by the lamp 120 to pass through. For example, the quartz plate can absorb infrared light having a wavelength of 0.4 μm to allow the lamp 120 to emit. Infrared light having a wavelength of 1 to 4 microns passes through. Thereby, even if a flat spacer is used as the spacer 230, thermal energy can be transmitted to the substrate 102 through the spacer, thereby heating the substrate 102, as indicated by an arrow H3 of FIG. In addition, during the process in which the heat energy provided by the lamp tube 120 is transmitted to the substrate 102 through the partition plate as the spacer 230, part of the heat energy is absorbed or blocked by the metal plates as the blocking members 140a and 140b, thereby reducing the correspondence on the substrate 102. The heat energy absorbed by the portions of the blocking members 140a and 140b is as shown by the arrow H4 of FIG.

It can be seen that the heating device 200 of the present embodiment can use the lamp 120 having the same size as the heating source, thereby simplifying the manufacturing process of the heating device 200 and reducing the manufacturing cost. Moreover, by using the quartz plate as the design of the spacer 230, the spacer 230 can be prevented from affecting the heating effect of the substrate 102 while supporting the carrier substrate 102. In other words, the material and shape of the spacer 230 do not affect the heating effect of the substrate 102, so that thermal energy can be transmitted to the substrate 102 through the spacer 230. In addition, the metal plates as the blocking members 140a and 140b can further absorb or block part of the thermal energy in the region where the temperature is too high on the heating device 200 according to requirements, that is, the present embodiment uses the blocking members 140a and 140b to adjust various portions of the substrate 102. The condition is heated to achieve the purpose of uniformly heating the substrate 102. Accordingly, the heating device 200 of the present embodiment is suitable for both The substrate 102 is heated uniformly so that the heated substrate 102 has a good overall temperature uniformity.

In summary, in the heating device of the present invention, the lamp tube is disposed in the outer casing, the support member and the spacer are disposed on the lamp tube, and the blocking member is disposed on the spacer. Thereby, the substrate can be placed on the support and heated by the thermal energy provided by the lamp, and the spacer can prevent the substrate from contacting the lamp tube, and the portion on the substrate that is easily overheated can block part of the thermal energy by the blocking member. Wherein, the shape and material of the spacer allow most of the thermal energy to be transferred to the substrate, and part of the thermal energy is absorbed by the blocking member to adjust the local heating degree of the substrate. Thereby, the heating device of the present invention is suitable for uniformly heating the substrate so that the heated substrate has a good overall temperature uniformity.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧ heating device

100a to 100c‧‧‧ heating module

110‧‧‧Shell

120‧‧‧Light tube

130‧‧‧Isolation

140a, 140b‧‧‧blocking parts

150‧‧‧Support

Claims (10)

A heating device adapted to uniformly heat a substrate, the heating device comprising: a casing; a plurality of lamps disposed in the casing and providing a thermal energy; a support member disposed on the inner side of the casing and located at the On the light tube, the substrate is adapted to be placed on the support member; a spacer is disposed on the light tubes to isolate the light tubes from the substrate, and the thermal energy passes through the light tubes The spacer is transferred to the substrate; and at least one blocking member is disposed on the spacer to block a portion of the thermal energy transfer to a portion of the substrate. The heating device of claim 1, wherein the spacer comprises a spacer through which the thermal energy is transferred to the substrate. The heating device of claim 2, wherein the material of the insulation net comprises metal. The heating device of claim 1, wherein the spacer comprises a spacer through which the thermal energy is transferred to the substrate. The heating device of claim 4, wherein the material of the separator comprises quartz. The heating device of claim 1, wherein the material of the blocking member comprises a metal. The heating device of claim 1, wherein the lamps have the same size specifications. The heating device of claim 1, wherein the heat energy provided by the lamps passes through the spacer after the amount of heat loss is smaller than the heat energy provided by the lamps passes through the blocking member. After a loss. The heating device of claim 1, wherein each of the lamps comprises an infrared light tube, wherein the lamps provide the thermal energy by emitting infrared light. The heating device of claim 1, wherein the lamps correspond to at least two heating modules, and the heating modules are adapted to be independently assembled into or detached from the housing.