KR20120066426A - Led complex heat radiating plate and led light comprising the same - Google Patents

Led complex heat radiating plate and led light comprising the same Download PDF

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Publication number
KR20120066426A
KR20120066426A KR1020100127768A KR20100127768A KR20120066426A KR 20120066426 A KR20120066426 A KR 20120066426A KR 1020100127768 A KR1020100127768 A KR 1020100127768A KR 20100127768 A KR20100127768 A KR 20100127768A KR 20120066426 A KR20120066426 A KR 20120066426A
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South Korea
Prior art keywords
led
heat dissipation
heat sink
dissipation plate
heat radiation
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KR1020100127768A
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Korean (ko)
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김영철
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소닉스자펜 주식회사
월드와이드엔지니어링 주식회사
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Priority to KR1020100127768A priority Critical patent/KR20120066426A/en
Priority to PCT/KR2011/009591 priority patent/WO2012081891A2/en
Publication of KR20120066426A publication Critical patent/KR20120066426A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F21V29/81—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires with pins or wires having different shapes, lengths or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/18—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array annular; polygonal other than square or rectangular, e.g. for spotlights or for generating an axially symmetrical light beam
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PURPOSE: An LED complex heat radiation plate and an LED lamp including the same are provided to block direct influence due to high temperature by varying length and diameter of a heat radiation plate and rapidly discharging heat created in an LED to outside. CONSTITUTION: An LED module(1) is attached to a top heat radiation plate(10). A heat radiation fin(30) is attached to the lower side of the top heat radiation plate. A bottom heat radiation plate(2) is attached to the lower side of the heat radiation fin. A carbon layer is formed on the bottom of the top heat radiation plate. The top heat radiation plate and the bottom heat radiation plate have an embossed plane. A hollow portion is formed in the inner side of the heat radiation fin and a heat radiation hole is formed at the side of the heat radiation fin.

Description

엘이디 복합방열판 및 이를 포함하는 엘이디 조명등{LED COMPLEX HEAT RADIATING PLATE AND LED LIGHT COMPRISING THE SAME} LED composite heat sink and LED lighting lamp including the same {LED COMPLEX HEAT RADIATING PLATE AND LED LIGHT COMPRISING THE SAME}

본 발명은 엘이디 방열판 및 이를 포함하는 엘이디 조명등에 관한 것으로, 보다 상세하게는 엘이디에서 발생하는 열을 급속으로 방열할 수 있으며, 필요에 따라 엘이디의 발열량에 따라 방열핀의 길이와 지름을 가변시켜 엘이디에서 발생하는 열을 급속하게 외부로 방출하여 엘이디 모듈에 고온에 의한 직접적인 영향을 주지 않고, 좁은 공간에서도 대용량의 방열면적을 제공할 수 있어 장치의 소형 경량화를 가능하게 하는 엘이디 복합방열판 및 이를 포함하는 엘이디 조명등에 관한 것이다.
The present invention relates to an LED heat sink and an LED lighting lamp including the same, and more particularly, it is possible to rapidly heat the heat generated from the LED, and if necessary, by varying the length and diameter of the heat radiation fin according to the amount of heat generated from the LED LED composite heat dissipation plate and LED including the same to enable the small size and light weight of the device by rapidly dissipating the heat generated to the outside without directly affecting the LED module due to the high temperature, even in a small space It is about a lighting.

종래에는 도 1에 도시된 바와 같은 형태의 엘이디(LED) 방열구조가 공개되어 있으며, 이러한 구조의 방열판은 엘이디로부터 발생하는 열을 급속으로 방열하는 효과가 취약하여 결국 온도상승에 따른 전원공급장치의 문제를 야기시킨다. 다른 방법으로 방열판의 외부에 발열도료를 도포하여 방열효과를 개선하고자 하였으나 이 역시 고온의 급속한 발열을 유도하는 것에는 한계를 가진다. In the related art, a heat dissipation structure of an LED (LED) as shown in FIG. 1 is disclosed, and the heat dissipation plate of such a structure has a weak effect of rapidly dissipating heat generated from the LED, resulting in a power supply device having a temperature rise. Cause problems. Another method was to improve the heat dissipation effect by applying an exothermic coating on the outside of the heat sink, but this also has a limit in inducing rapid heat generation at high temperatures.

나아가 지금까지 공개된 대부분의 엘이디 방열판들은 그 사용면적의 제한으로 인해 방열판 자체에 구조적인 결함을 갖고 있어 이에 대한 개선책이 시급히 마련되어야 한다.
Furthermore, most of the LED heat sinks disclosed so far have structural defects in the heat sink itself due to the limitation of the use area, and thus an urgent solution must be prepared.

본 발명은 상기한 바와 같은 종래기술이 가지는 문제를 해결하기 위해 안출된 것으로, 그 목적은 엘이디에서 발생하는 열을 급속으로 방열할 수 있으며, 필요에 따라 엘이디의 발열량에 따라 방열핀의 길이와 지름을 가변시켜 엘이디에서 발생하는 열을 급속하게 외부로 방출하여 엘이디 모듈에 고온에 의한 직접적인 영향을 주지 않고, 좁은 공간에서도 넓은 방열면적을 제공할 수 있어 장치의 소형 경량화를 가능하게 하는 엘이디 복합방열판 및 이를 포함하는 엘이디 조명등을 제공함에 있다.
The present invention has been made to solve the problems of the prior art as described above, the object is to rapidly dissipate heat generated from the LED, and if necessary, the length and diameter of the heat radiation fin according to the amount of heat generated by the LED LED composite heat sink that enables to reduce the size and weight of the device by providing a wide heat dissipation area in a narrow space without directly affecting the LED module by high temperature by rapidly dissipating heat generated from the LED to the outside In providing an LED lamp to include.

상기한 바와 같은 본 발명의 기술적 과제는 다음과 같은 수단에 의해 달성되어진다.The technical problem of the present invention as described above is achieved by the following means.

(1) 엘이디모듈이 부착되는 상부방열판; 상면방열판의 하부에 부착되는 방열핀; 및 상기 방열핀의 하부에 부착되는 하부방열판을 포함하는 엘이디 복합방열판.
(1) an upper heat sink to which the LED module is attached; A heat dissipation fin attached to a lower portion of the upper heat dissipation plate; And a lower heat dissipation plate attached to a lower portion of the heat dissipation fins.

(2) 제 1항에 있어서,(2) The method according to claim 1,

상부방열판의 하면에 카본층이 형성된 것을 특징으로 하는 엘이디 복합방열판.
LED composite heat sink, characterized in that the carbon layer is formed on the lower surface of the top heat sink.

(3) 제 1항에 있어서,(3) The method according to claim 1,

하부방열판의 상면 또는 하면, 또는 상면 및 하면에 카본층이 형성된 것을 특징으로 하는 엘이디 복합방열판.
An LED composite heat sink, characterized in that the carbon layer is formed on the upper or lower surface, or the upper and lower surfaces of the lower heat sink.

(4) 제 1항에 있어서,(4) The method according to 1,

방열핀의 내부에 중공부가 형성되고, 측면에 방열구가 형성된 것을 특징으로 하는 엘이디 복합방열판.
An LED composite heat sink, characterized in that the hollow portion is formed inside the heat dissipation fin, the heat dissipation hole is formed on the side.

(5) 제 4항에 있어서,(5) The method according to 4,

방열핀의 표면에 카본층이 형성되고, 방열구의 중앙에 투명세라믹층이 형성된 것을 특징으로 하는 엘이디 복합방열판.
An LED composite heat sink, characterized in that the carbon layer is formed on the surface of the heat sink fin, the transparent ceramic layer is formed in the center of the heat sink.

(6) 제 1항에 있어서,(6) The method according to 1,

상부방열판 및 하부방열판은 원형의 방열판이며, 상기 방열핀은 상기 원형의 방열판 상에 동심원을 이루는 복수개의 원주상에 일정한 간격으로 상기 상부방열판과 하부방열판 사이에 부착된 것을 특징으로 하는 엘이디 복합방열판.
An upper heat dissipation plate and a lower heat dissipation plate is a circular heat dissipation plate, and the heat dissipation fin is an LED composite heat dissipation plate, characterized in that attached to the upper heat dissipation plate and the lower heat dissipation plate at regular intervals on a plurality of circumference forming a concentric circle on the circular heat dissipation plate.

(7) 제 1항에 있어서,(7) The method according to 1,

상부방열판 및 하부방열판은 요철면을 갖는 방열판인 것을 특징으로 하는 엘이디 복합방열판.
The upper heat sink and the lower heat sink is an LED composite heat sink, characterized in that the heat sink having an uneven surface.

(8) 제 1항 내지 제 7항 중 선택된 어느 한 항에 의한 엘이디 복합방열판을 포함하는 엘이디 조명등.(8) An LED lighting lamp comprising the LED composite heat sink according to any one of paragraphs 1 to 7.

상기 본 발명에 의하면, 엘이디에서 발생하는 열을 급속으로 방열할 수 있으며, 필요에 따라 엘이디의 발열량에 따라 방열핀의 길이와 지름을 가변시켜 엘이디에서 발생하는 열을 급속하게 외부로 방출하여 엘이디 모듈에 고온에 의한 직접적인 영향을 주지 않고, 좁은 공간에서도 넓은 방열면적을 제공할 수 있어 장치의 소형 경량화를 가능하게 하는 효과를 제공한다.
According to the present invention, the heat generated from the LED can be rapidly radiated, and if necessary, by varying the length and diameter of the heat radiation fins according to the amount of heat generated by the LED to quickly discharge the heat generated from the LED to the outside to the LED module It is possible to provide a large heat dissipation area even in a narrow space without directly affecting the high temperature, thereby providing the effect of enabling a compact and lightweight device.

도 1은 종래기술에 따른 엘이디 방열판의 구성도.
도 2는 본 발명에 따른 엘이디 복합방열판을 구성하는 상부방열판(좌측)과 하부방열판(우측)의 구성도.
도 3은 본 발명에 따른 엘이디 복합방열판을 구성하는 방열핀의 구성도.
도 4는 본 발명에 따른 엘이디 복합방열판의 단면구성도.
도 5는 본 발명에 따른 엘이디 복합방열판의 방열이동통로를 나타내는 설명도.
도 6a는 본 발명에 따른 엘이디 복합방열판이 내부에 부착된 엘이디전구의 제1 실시예.
도 6b는 본 발명에 따른 엘이디 복합방열판이 내부에 부착된 엘이디전구의 제2 실시예.
도 6c는 본 발명에 따른 엘이디 복합방열판이 내부에 부착된 엘이디전구의 제3 실시예.1 is a block diagram of an LED heat sink according to the prior art.
Figure 2 is a block diagram of the upper heat sink (left) and the lower heat sink (right) constituting the LED composite heat sink according to the present invention.
Figure 3 is a block diagram of a heat radiation fin constituting the LED composite heat sink according to the invention.
Figure 4 is a cross-sectional view of the LED composite heat sink according to the invention.
5 is an explanatory view showing a heat dissipation movement path of the LED composite heat dissipation plate according to the present invention.
Figure 6a is a first embodiment of the LED bulb attached to the LED composite heat sink according to the present invention.
Figure 6b is a second embodiment of the LED bulb is attached to the LED composite heat sink according to the present invention.
Figure 6c is a third embodiment of the LED bulb attached to the LED composite heat sink according to the present invention.

본 발명은 엘이디모듈이 부착되는 상부방열판; 상면방열판의 하부에 부착되는 방열핀; 및 상기 방열핀의 하부에 부착되는 하부방열판을 포함하는 엘이디 복합방열판을 제공한다.
The present invention is a heat dissipation plate is attached to the LED module; A heat dissipation fin attached to a lower portion of the upper heat dissipation plate; And a lower heat dissipation plate attached to a lower portion of the heat dissipation fins.

이하 본 발명의 내용을 실시예를 도시한 도면을 참조하여 보다 상세하게 설명하기로 한다.Hereinafter, the content of the present invention will be described in more detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 엘이디 복합방열판을 구성하는 상부방열판(좌측)과 하부방열판(우측)의 구조를 나타낸다. Figure 2 shows the structure of the upper heat sink (left) and the lower heat sink (right) constituting the LED composite heat sink according to the present invention.

상기 실시예에 따른 상부방열판(10)은 원형의 판으로 이루어지고, 복수개의 방열핀을 부착하기 위한 결합공(11)이 형성되어 있다. 바람직하게는 상기 결합공(11)은 상기 원형의 상부방열판(10) 상에 동심원을 이루는 복수개의 원주상에 일정한 간격으로 형성되어진다. 상기 상부방열판(10)의 하면에는 엘이디에서 발생한 고온의 열을 급속하게 수직으로 방출할 수 있도록 카본층(10a)이 증착되어지는 것이 바람직하다.The upper heat dissipation plate 10 according to the embodiment is made of a circular plate, a coupling hole 11 for attaching a plurality of heat dissipation fins is formed. Preferably, the coupling holes 11 are formed at regular intervals on a plurality of circumferences forming concentric circles on the circular upper heat dissipation plate 10. It is preferable that the carbon layer 10a is deposited on the lower surface of the upper heat dissipation plate 10 so as to rapidly vertically discharge the high temperature heat generated from the LEDs.

상기 실시예에 따른 하부방열판(20)은 상부방열판(10)과 마찬가지로 원형의 판으로 이루어지고, 복수개의 방열핀을 부착하기 위한 결합공(21)이 형성되어 있다. 바람직하게는 상기 결합공(21)은 상기 원형의 하부방열판(20) 상에 동심원을 이루는 복수개의 원주상에 일정한 간격으로 형성되어진다. 상기 하부방열판(20)의 상면 또는 하면, 바람직하게는 상면 및 하면에는 엘이디에서 발생한 고온의 열을 급속하게 외부로 방출할 수 있도록 카본층(20a)이 증착되어진다.
The lower heat dissipation plate 20 according to the embodiment is made of a circular plate similar to the upper heat dissipation plate 10, and a coupling hole 21 for attaching a plurality of heat dissipation fins is formed. Preferably, the coupling hole 21 is formed on a plurality of circumferences forming a concentric circle on the circular lower heat dissipation plate 20 at regular intervals. A carbon layer 20a is deposited on the upper or lower surface of the lower heat dissipation plate 20, preferably on the upper and lower surfaces so as to rapidly dissipate high temperature heat generated from the LED to the outside.

도 3은 본 발명에 따른 엘이디 복합방열판을 구성하는 방열핀(30)의 구조를 나타낸다. 3 shows the structure of the heat dissipation fin 30 constituting the LED composite heat dissipation plate according to the present invention.

상기 방열핀(30)은 상부에 상부방열판(10)에 형성된 결합공(11)과 결합하는 결합돌기(33)와, 하단에 하부방열판(20)에 형성된 결합공(21)을 통해 삽입되어지는 고정부재(미도시)와 결합하는 결합홈(34)이 형성되어 있다. 상부방열판(10)의 결합공(11)은 너트구조로 하고, 이와 결합하는 방열핀(30)의 결합돌기(33)는 볼트로 형성하여 상부방열판(10)과 방열핀(30)의 상단을 결합할 수 있으며, 상기 고정부재는 볼트로 하고 이와 결합하는 하부방열판(20)의 결합홈(34)은 너트구조를 형성하여 방열핀(30)의 하단과 하부방열판(20)을 결합시킬 수 있다.The heat dissipation fins 30 are fixed to be inserted through the coupling protrusions 33 formed on the upper heat dissipation plate 10 and the coupling protrusions 33 formed on the upper heat dissipation plate 10 and the lower heat dissipation plate 20 at the bottom thereof. Coupling groove 34 is formed to engage the member (not shown). The coupling hole 11 of the upper heat dissipation plate 10 has a nut structure, and the coupling protrusion 33 of the heat dissipation fin 30 coupled thereto is formed of a bolt to couple the upper ends of the upper heat dissipation plate 10 and the heat dissipation fin 30. The fixing member may be a bolt and the coupling groove 34 of the lower heat dissipation plate 20 coupled thereto may form a nut structure to couple the lower end of the heat dissipation fin 30 to the lower heat dissipation plate 20.

상기 방열핀(30)의 내부는 중공부(31)를 가지며, 상기 중공부와 연통하여 외부로 열을 방출시킬 수 있는 방열구(32)가 측면에 소정 개소 형성되어 있다. 또한, 바람직하게는 상기 방열핀(30)의 표면은 카본층(30a)이 형성되고 방열구의 중앙은 투명세라믹으로 이루어진 코팅층을 형성하는 것이 좋다. 이러한 구성에 의하면 엘이디에서 발생한 고온의 열을 보다 급속하게 외부로 방출할 수 있도록 함에 효과적이다.
The inside of the heat dissipation fin 30 has a hollow portion 31, and the heat dissipation opening 32 that can discharge heat to the outside in communication with the hollow portion is formed in a predetermined position on the side. In addition, the surface of the heat radiation fin 30 is preferably formed with a carbon layer 30a and the center of the heat dissipation port to form a coating layer made of transparent ceramic. According to such a configuration, it is effective to allow the high temperature heat generated from the LED to be released more rapidly to the outside.

도 4는 본 발명에 따른 엘이디 복합방열판의 단면구성도이다.Figure 4 is a cross-sectional view of the LED composite heat sink according to the present invention.

엘이디 복합방열판은 엘이디모듈(1)이 상면에 부착된 상부방열판(10), 상기 상부방열판(10)에 형성된 결합공(11)과 나사결합하는 결합돌기(33)가 형성된 방열핀(30), 상기 방열핀(30)의 하단에 형성된 결합홈(34)과 결합하는 볼트(22)가 삽입되는 결합공(21)이 형성되어 이들의 결합을 통해 방열핀(30)을 지지하는 하단방열판(20)으로 이루어진다.The LED composite heat dissipation plate is a heat dissipation fin 30 having an LED module 1 having an upper heat dissipation plate 10 attached to an upper surface, a coupling protrusion 33 screwed with a coupling hole 11 formed in the upper heat dissipation plate 10, and the A coupling hole 21 into which the bolt 22 coupled to the coupling groove 34 formed at the bottom of the heat dissipation fin 30 is inserted is formed, and the lower heat dissipation plate 20 supporting the heat dissipation fin 30 is formed through the coupling thereof. .

전술한 바와 같이 상단방열판(10)의 하면과, 방열핀(30)의 표면 및 하부방열판(20)의 상면 또는 하면, 혹은 상면 및 하면에 카본층(10a, 20a, 30a)이 각각 형성되어 있다. As described above, the carbon layers 10a, 20a, and 30a are formed on the lower surface of the upper heat sink 10, the surface of the heat dissipation fin 30 and the upper or lower surface of the lower heat sink 20, or the upper and lower surfaces.

상기와 같은 구성에 의해 도 5에 도시된 바와 같이 엘이디에서 발생한 열은 상부방열판(10)을 통해 방열핀(30)으로 수직으로 급속하게 열이 전달되고, 이 열은 다시 방열핀(30)의 중공부(31) 및 이와 연통된 방열구(32)를 통해 외부로 열을 급속하게 방열할 수 있도록 하며, 나머지 열은 다시 하부방열판(20)을 통해 외부로 급속하게 방열될 수 있는 구조를 제공한다.
As shown in FIG. 5, heat generated from the LEDs is rapidly transferred vertically to the heat dissipation fins 30 through the upper heat dissipation plate 10, and the heat is again in the hollow portion of the heat dissipation fins 30. (31) and the heat dissipation hole 32 in communication with it to allow heat to rapidly radiate to the outside, the remaining heat again provides a structure that can be rapidly radiated to the outside through the lower heat sink (20).

도 6a은 본 발명에 따른 엘이디 복합방열판이 내부에 장착된 엘이디전구의 예로 주로 소용량의 엘이디전구로서 적합한 실시예가 도시되어 있다. 6A illustrates an example of an LED bulb in which an LED composite heat sink according to the present invention is mounted therein, and is mainly suitable as a LED bulb having a small capacity.

상기 엘이디전구는 통상적으로 소켓에 삽입되어지는 꼭지쇠(50)가 상단에 부착되고, 그 하부에 전원공급장치가 부착되며, 상기 전원공급장치와 결합하는 방열판의 구성이 엘이디모듈이 부착된 상부방열판(10)과 전원공급장치(미도시)와 부착된 하부방열판(20) 사이에 방열핀(30)이 결합된 엘이디 복합방열판으로 이루어진 예이다. 미설명 부호 60은 유리구이다.The LED bulb is usually attached to the upper end of the clasp 50 is inserted into the socket, the power supply is attached to the lower portion, the top of the heat sink is attached to the LED module is configured of a heat sink An example of an LED composite heat dissipation plate having a heat dissipation fin 30 coupled between the power supply device 10 and the lower heat dissipation plate 20 attached thereto is provided. Reference numeral 60 is a glass sphere.

상기 구성에 의한 엘이디 전구는 엘이디에서 발생한 열을 외부로 효과적으로 급속하게 방열할 수 있어 엘이디모듈 및 전원공급장치 등에 고온에 의한 직접적인 영향을 주지 않는 효과를 제공한다.
The LED bulb according to the above configuration can effectively dissipate heat generated from the LED rapidly to the outside effectively, thereby providing an effect of not directly affecting the LED module and the power supply by high temperature.

도 6b는 본 발명에 따른 다른 실시태양으로서의 엘이디전구를 나타내고 있으며 이러한 구조는 주로 대용량 엘이디 전구에 적합하다.Fig. 6B shows an LED bulb as another embodiment according to the present invention, and this structure is mainly suitable for large capacity LED bulbs.

이러한 엘이디전구는 도 6a에서의 엘이디전구와 유사한 구조를 나타내며, 다만 전원공급장치(40)에 부착되는 엘이디 복합방열판의 구성에 있어서, 상부방열판(10) 및 하부방열판(20)이 요철면을 갖는 방열판인 점에서 차이가 있다. 이러한 구성에 의한 엘이디전구는 엘이디에서 발생한 열을 외부로 효과적으로 급속하게 방열할 수 있어 엘이디모듈 및 전원공급장치 등에 고온에 의한 직접적인 영향을 주지 않는 효과를 제공한다. 나아가 좁은 공간에서도 대용량의 방열면적을 제공할 수 있어 장치의 소형 경량화를 가능하게 하는 효과를 제공한다. 미설명부호 70은 엘이디 반사경을 나타낸다.
The LED bulb has a structure similar to that of the LED bulb in FIG. 6A, but in the configuration of the LED composite heat sink attached to the power supply device 40, the upper heat sink 10 and the lower heat sink 20 have uneven surfaces. There is a difference in that it is a heat sink. The LED bulb according to this configuration can effectively dissipate heat generated from the LED rapidly to the outside effectively, thereby providing an effect of not directly affecting the LED module and the power supply by high temperature. Furthermore, it can provide a large heat dissipation area even in a narrow space, thereby providing the effect of enabling compact and lightweight device. Reference numeral 70 denotes an LED reflector.

도 6c는 본 발명의 또 다른 형태의 엘이디전구로서 복합방열판의 형상을 사각형상으로 구성한 실시예를 나타내고 있다. 이러한 구조 역시 대용량의 엘이디전구로서 적합하며, 엘이디에서 발생한 열을 외부로 효과적으로 급속하게 방열할 수 있어 엘이디모듈 및 전원공급장치 등에 고온에 의한 직접적인 영향을 주지 않고, 나아가 좁은 공간에서도 대용량의 방열면적을 제공할 수 있어 장치의 소형 경량화를 가능하게 하는 효과를 제공한다.
FIG. 6C shows an embodiment in which the shape of the composite heat dissipation plate is formed in a quadrangular shape as an LED bulb of another embodiment of the present invention. Such a structure is also suitable as a large-capacity LED bulb, and can effectively dissipate heat generated from the LED rapidly to the outside effectively, without directly affecting the LED module and the power supply by high temperature, and even in a small space, It can provide the effect that enables the compact and light weight of the device.

또한 이들 각 실시예에 따른 본 발명의 엘이디 복합방열판은 장착되는 엘이디의 발열량에 따라 방열핀의 길이와 지름을 가변시킴으로써 엘이디에서 발생하는 열을 급속하게 외부로 방출할 수 있도록 할 수 있다. In addition, the LED composite heat dissipation plate of the present invention according to each of these embodiments can be rapidly released to the outside heat generated from the LED by varying the length and diameter of the heat radiation fins according to the amount of heat generated by the LED mounted.

상기와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It can be understood that

1: 엘이디모듈
10: 상부방열판
10a,20a,30a: 카본층
11: 결합공
20: 하부방열판
21: 결합공
22: 고정부재
30: 방열핀
31: 중공부
32: 방열구
33: 결합돌기
34: 결합홈
40: 전원공급장치
50: 꼭지쇠
60: 유리구1: LED module
10: upper heat sink
10a, 20a, 30a: carbon layer
11: joiner
20: lower heat sink
21: joiner
22: fixing member
30: heat sink fin
31: hollow part
32: heatsink
33: engaging protrusion
34: coupling groove
40: power supply
50: clasp
60: glass sphere

Claims (8)

엘이디모듈이 부착되는 상부방열판; 상면방열판의 하부에 부착되는 방열핀; 및 상기 방열핀의 하부에 부착되는 하부방열판을 포함하는 엘이디 복합방열판.An upper heat sink to which an LED module is attached; A heat dissipation fin attached to a lower portion of the upper heat dissipation plate; And a lower heat dissipation plate attached to a lower portion of the heat dissipation fins. 제 1항에 있어서,
상부방열판의 하면에 카본층이 형성된 것을 특징으로 하는 엘이디 복합방열판.The method of claim 1,
LED composite heat sink, characterized in that the carbon layer is formed on the lower surface of the top heat sink. 제 1항에 있어서,
하부방열판의 상면 또는 하면, 또는 상면 및 하면에 카본층이 형성된 것을 특징으로 하는 엘이디 복합방열판.The method of claim 1,
An LED composite heat sink, characterized in that the carbon layer is formed on the upper or lower surface, or the upper and lower surfaces of the lower heat sink. 제 1항에 있어서,
방열핀의 내부에 중공부가 형성되고, 측면에 방열구가 형성된 것을 특징으로 하는 엘이디 복합방열판.The method of claim 1,
An LED composite heat sink, characterized in that the hollow portion is formed inside the heat dissipation fin, the heat dissipation hole is formed on the side. 제 4항에 있어서,
방열핀의 표면에 카본층이 형성되고, 방열구의 중앙에 투명세라믹층이 형성된 것을 특징으로 하는 엘이디 복합방열판.The method of claim 4, wherein
An LED composite heat sink, characterized in that the carbon layer is formed on the surface of the heat sink fin, the transparent ceramic layer is formed in the center of the heat sink. 제 1항에 있어서,
상부방열판 및 하부방열판은 원형의 방열판이며, 상기 방열핀은 상기 원형의 방열판 상에 동심원을 이루는 복수개의 원주상에 일정한 간격으로 상기 상부방열판과 하부방열판 사이에 부착된 것을 특징으로 하는 엘이디 복합방열판.The method of claim 1,
An upper heat dissipation plate and a lower heat dissipation plate is a circular heat dissipation plate, and the heat dissipation fin is an LED composite heat dissipation plate, characterized in that attached to the upper heat dissipation plate and the lower heat dissipation plate at regular intervals on a plurality of circumference forming a concentric circle on the circular heat dissipation plate. 제 1항에 있어서,
상부방열판 및 하부방열판은 요철면을 갖는 방열판인 것을 특징으로 하는 엘이디 복합방열판.The method of claim 1,
The upper heat sink and the lower heat sink is an LED composite heat sink, characterized in that the heat sink having an uneven surface. 제 1항 내지 제 7항 중 선택된 어느 한 항에 의한 엘이디 복합방열판을 포함하는 엘이디 조명등.An LED lighting lamp comprising the LED composite heat sink according to any one of claims 1 to 7.
KR1020100127768A 2010-12-14 2010-12-14 Led complex heat radiating plate and led light comprising the same KR20120066426A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101477688B1 (en) * 2014-09-16 2014-12-31 (주) 파루 Heat sink for led module
KR102040415B1 (en) * 2018-10-31 2019-11-04 (주)성진하이텍 High heat dissipation structure of led module and led lighting apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103196064B (en) * 2013-04-22 2016-02-17 贵州光浦森光电有限公司 A kind of LED bulb light machine module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5124347B2 (en) * 2008-05-29 2013-01-23 アピックヤマダ株式会社 Semiconductor mounting substrate and manufacturing method thereof
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KR101012308B1 (en) * 2008-10-01 2011-02-08 주식회사 아모럭스 Radiator and Bulb Type LED Lighting Apparatus Using the Same
KR20100009686U (en) * 2009-03-24 2010-10-04 강민영 Heat sink for led lamp

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KR101477688B1 (en) * 2014-09-16 2014-12-31 (주) 파루 Heat sink for led module
KR102040415B1 (en) * 2018-10-31 2019-11-04 (주)성진하이텍 High heat dissipation structure of led module and led lighting apparatus

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