KR101477688B1 - Heat sink for led module - Google Patents

Abstract

The present invention relates to a heat radiation apparatus of an LED module for increasing the radiation efficiency of the LED module by manufacturing the heat radiation apparatus so that the thermal transfer rates of upper and lower parts which radiate the heat of the LED module are different from each other.

Description

Heat sink of LED module (HEAT SINK FOR LED MODULE)

The present invention relates to a heat dissipation device for an LED module, and more particularly, to a heat dissipation device for an LED module that can improve the heat radiation efficiency of an LED module by manufacturing the heat dissipation device And a heat dissipation device of the LED module.

BACKGROUND ART A heat pipe is a means for efficiently conducting heat due to a high thermal conductivity. A heat pipe is a member made of a core made of a glass fiber or a copper wire inside a pipe made of aluminum, copper, And is filled with a heating medium such as Freon, ammonia or the like or a latent heat medium, and then the air is taken out and sealed.

These heat pipes generally have a thermal conductivity of about 1,000 to 1,500 times as high as that of copper, and they are mainly used for devices for dispersing generated heat or for recovering heat that is exhausted.

Incandescent lamps are the most common light emitting means using electric energy. In the case of incandescent lamps, about 5% of the applied electric energy is converted into light energy by visible light, and the remaining 95% is converted into infrared light and heat energy Since it is general, it has a very low energy utilization efficiency, is vulnerable to vibration and shock, is relatively large in size, and has a high risk of fire due to overheated heat.

Although light emitting means such as fluorescent lamps and halogens have been developed which improve the energy utilization efficiency, about 80% to 90% of the light emitting means are diverted by heat energy, so that the energy utilization efficiency is still low and a separate driving circuit is required. Secondary environmental pollution occurs.

In a semiconductor, when a voltage higher than a certain level is applied in a forward direction of a polarity, a current flows due to the movement of electrons. When the ambient temperature is high, the movement of the electrons becomes active to increase the amount of current, The temperature becomes higher, and when the temperature rises above the rated value, the heat is remarkably heated, shortening the life span or causing a fire.

Therefore, it is necessary to maintain a constant operating temperature of the semiconductor, and in the case of a large output semiconductor, a heat sink is generally used to maintain the operating temperature.

In the heat dissipating system, there is a water-cooling system in which heat is cooled by using an air-cooled system and a forced-circulation system, which heat is cooled by the flow of air.

The LED generates light by current flow when forward voltage is applied to the junction surface of P-type and N-type semiconductors. It consumes less power, can be made very small in size, has a fast on-off control speed, And has a relatively long lifetime.

These LEDs convert about 15% of the applied electric energy into light energy by visible light and emit about 85% of the remaining light energy as heat energy. However, the energy conversion efficiency is increased by 50% to 90% It is a reality.

With the development of semiconductor device technology, it has become possible to use the light generated by LED (LED) for illumination. In particular, when a current of 1 A or more flows and power consumption is several watt (W) It became available for streetlight.

In addition, an LED that emits light of a selected color among lights of various colors by a semiconductor device and a material to be added can be manufactured.

In the case of an LED, a part of electric energy is converted into heat to generate heat, and in particular, a watt-class LED having a large power consumption has a heat dissipating device that generates a relatively large amount of heat and radiates heat generated when the device is used for a long time .

Therefore, the applicant of the present application discloses a lighting system for a heat radiating heat source, which is separated into an upper plate and a lower plate through a U-shaped heat pipe connected to the upper plate and the lower plate through Registration No. 10-1003976 (2010.12.20) We proposed the heat dissipation system of the device.

As the LED module is supported on the upper surface of the upper plate, the heat generated from the LED module 100 is transmitted to the upper plate and the lower plate to radiate heat. At this time, the conventional heat dissipating device includes a plurality of heat pipes to uniformly transfer the heat generated from the LED module to the upper plate and the lower plate.

That is, in the conventional heat dissipating device, heat dissipation devices of the LED module are required to transmit heat by providing more than several heat pipes with equal heat transfer rates between the upper plate and the lower plate, so that the manufacturing cost is increased .

Patent Registration No. 10-1003976 (December 20, 2010)

It is an object of the present invention to provide a heat dissipating device of an LED module which is manufactured to have different heat transfer rates from upper and lower sides to absorb heat from a side having a greater heat transfer rate And the heat dissipation effect of the LED module can be improved.

It is another object of the present invention to provide a heat dissipating device for an LED module capable of reducing the manufacturing cost by reducing the number of components of the heat dissipating device.

The present invention includes the following embodiments in order to achieve the above object.

A preferred embodiment of the heat dissipating device of the LED module according to the present invention is an LED module comprising a plurality of light emitting devices; An upper block for dissipating heat generated in the LED module; A transfer block fixed to a lower side of the upper block to transfer heat generated in the upper block; And a lower block having a higher heat transfer rate than the upper block and the transfer block and dissipating heat transferred from the transfer block, wherein the LED module comprises: a circuit board on which a plurality of light emitting devices are mounted; A module cover which has a lens for diffusing and transmitting light emitted from the light emitting device, a cover coupling end formed so as to be upward in both end faces, and an insertion groove upward from a lower surface of the frame; And an insertion wall protruded upward from the rim and inserted into the insertion groove to prevent moisture from penetrating between the circuit board and the module cover; A supporting bar extending from the inner surface of the rim in the lateral and longitudinal directions to support the circuit board which is in close contact with the lower surface of the module cover which is seated on the upper surface; And a waterproof panel protruding upward from both end surfaces and having a coupling protrusion inserted into the cover coupling end.

In another embodiment of the present invention, it is preferable that the lower block has a higher heat transfer coefficient than the upper block due to any one of surface roughness, thermal spray coating and anodazing technique by a short blaster .

In another embodiment of the present invention, the lower block may have a heat transfer rate higher than that of the upper block by adding a heat radiating plate made of any one selected from silver, copper, magnesium, and aluminum.

According to another embodiment of the present invention, the lower block is made of a metal material having a higher thermal conductivity than the material of the upper block.

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According to another embodiment of the present invention, the apparatus further includes a heat pipe which is inserted between the upper block and the transfer block, between the transfer block and the lower block, and transfers the upper block to the lower block.

In another embodiment of the present invention, the heat pipe is inserted between a first recessed groove, one side of which is raised from the lower surface of the upper block, and a transfer groove, which is downwardly directed from the upper surface of the transfer block, And is inserted and fixed between the transfer groove upward from the lower surface and the second concave groove downward from the upper surface of the lower block.

According to the present invention, since heat transfer rates of the upper plate and the lower plate of the heat dissipating device are made different from each other, the heat dissipating effect is improved as the heat is absorbed from the higher heat transfer side.

In addition, since the heat transfer rate of the upper plate and the lower plate is made different from that of the present invention, the heat absorption rate can be increased at the higher heat transfer rate, so that the heat pipe 500 can be reduced in number and heat dissipation can be achieved without the heat pipe 500 Accordingly, the number of component parts is reduced, thereby reducing manufacturing cost.

1 is a perspective view showing a first embodiment of a heat dissipation device of an LED module according to the present invention,
2 is an exploded perspective view of the first embodiment of the heat dissipation device of the LED module according to the present invention,
3 is a front view of the first embodiment of the heat dissipation device of the LED module according to the present invention,
4 is an exploded perspective view showing a second embodiment of the heat dissipation device of the LED module according to the present invention,
5 is a front view of a second embodiment of the heat dissipation device of the LED module according to the present invention,
6 is a cross-sectional view showing a cross section of the LED module 100 in the heat dissipation device of the LED module according to the present invention,
7 is a perspective view showing a third embodiment of the heat dissipation device of the LED module according to the present invention,
8 is a sectional view of a third embodiment of a heat dissipation device of an LED module according to the present invention,
9 and 10 are photographs for comparing heat radiation effects of the heat dissipation device of the LED module according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a heat dissipating device of an LED module according to the present invention will be described in detail with reference to the accompanying drawings.

2 is an exploded perspective view of a first embodiment of a heat dissipation device of an LED module according to the present invention. Fig. 3 is a perspective view of an LED module according to the present invention. 1 is a front view of a first embodiment in a heat dissipation device of a module.

The heat dissipation device of the LED module according to the present invention includes an LED module 100 having a plurality of light emitting devices 132 and an upper block 130 for dissipating heat generated from the LED module 100 A transfer block 300 for supporting the upper plate and a lower block 400 fixed at the lower side of the transfer block 300 to dissipate heat.

The LED module 100 includes a circuit board 130 including a plurality of light emitting devices 132 mounted on a substrate 131 and fixing holes 133 formed through the light emitting devices 132, And a waterproof panel 120 which is fixed between the module cover 110 and the circuit board 130 and prevents the inflow of moisture from the outside, . Here, the module cover 110 and the circuit board 130 are fastened to the LED module 100 with the waterproof panel 120 interposed therebetween. The coupling structure of the LED module 100 is shown in FIG.

The module cover 110 includes a plurality of lenses 111 fixed to project upward from an upper portion of the flat plate, a fixing hole 112 into which fixing means (not shown) is inserted, A cover attachment end 113 to which the panel 120 is fastened, and an insertion groove 114 (see FIG. 6) that is upward from the bottom edge.

The lens 111 is located in a room directly above the light emitting device 132 and outputs light emitted from the lower side to the outside. The lens 111 is formed of an aspherical surface or a spherical surface to transmit light emitted from the light emitting device 132 to be diffused.

A plurality of fixing holes 120 are formed on the upper surface of the module cover 110 and are formed to correspond to the fixing holes 133 formed in the waterproof panel 120 and the circuit board 130 The fixing means (not shown) is communicatively inserted.

The cover coupling end 113 is formed as a groove cut upward in both end faces so as to engage the waterproof panel 120 and the module cover 110 by inserting the coupling protrusion 123 of the waterproof panel 120 to be described later.

The insertion groove 114 is inserted into the insertion wall 124 protruding upward along the rim of the waterproof panel 120 as an upward groove along the rim of the lower surface of the module cover 110.

The waterproof panel 120 includes a support bar 121 extending horizontally and vertically from the inside and a fixing hole formed between the support bar 121 and the fixing hole 120 of the module cover 110, And an insertion wall 124 projecting upwardly from the rim to be inserted into the insertion groove 114. The insertion protrusion 123 is inserted into the insertion hole 114 of the module cover 110, ).

The support bar 121 extends in the lateral and longitudinal directions at the central portion of the wall surface forming the rim, so that the end of the circuit board 130 is brought into close contact with the inner surface of the support bar 121, So that the cross section can be brought in close contact with the inner surface. That is, the waterproof panel 120 can seal the waterproof panel 120 so that moisture from the outside can be prevented from penetrating through the circuit board 130 and the module cover 110 with the support bar 121 interposed therebetween.

The fixed end 122 extends horizontally from the support bars 121 or from the wall surface forming the rim of the waterproof panel 120 and has a center portion coinciding with the fixing hole 410 of the module cover 110 The fixing hole 410 is formed through the through hole.

The coupling protrusions 123 protrude upward from both end faces of the waterproof panel 120 and are inserted into the cover coupling ends 113 of the module cover 110. [ The cover coupling end 113 is formed so as to be upward from the lower side and the coupling protrusion 123 is protruded upward and inserted into the cover coupling end 113 to be fixed with screws ) Or interference fit or interlocking with each other and may be fastened in a locking manner.

The coupling structure of the coupling protrusion 123 and the cover coupling end 113 as described above can be implemented by the above description only if it is an employee engaged in the industry, so that the drawings and detailed description are omitted.

The insertion wall 124 is inserted into the insertion groove 114 of the module cover 110 as a wall surface protruding from a central portion of an upper surface rim of the waterproof panel 120. The insertion wall 124 protrudes from the rim of the waterproof panel 120 and protrudes from the rim of the module cover 110 so as to engage the end surface between the insertion grooves 114 with an end 124a.

The circuit board 130 is inserted into and installed in the waterproof panel 120 so that the light emitting device 132 is positioned directly below the lens 111 through the empty space between the support bars 121. In addition, the circuit board is formed with fixing holes that correspond to the fixing holes 410 of the module cover 110 and the waterproof panel 120.

The LED module 100 is fixed to the upper block 200 by fixing means (not shown) for connecting the fixing holes 120 and 133 to the upper surface of the upper block 200, do.

The upper block 200 is formed on the upper surface of the transfer block 300 so as to have a flat plane so that the LED module 100 can be fastened on the upper surface thereof. In addition, the upper block 200 is manufactured as a material having a lower heat transfer coefficient than the lower block 400. A detailed description will be given later with a description of the lower block 400.

The transfer block 300 is positioned between the upper block 200 and the lower block 400 and transfers the heat transferred from the upper block 200 to the lower block 400. To this end, the transfer block 300 is formed in a box-like structure having front and rear openings, an upper surface, a lower surface, and both side surfaces.

The lower block 400 has a higher heat transfer rate than the upper block 200 and absorbs the heat of the upper block 200 through the transfer block 300 to dissipate heat. For this, the lower block 400 is fixed to the lower surface of the transfer block 300 by fixing means (not numbered) inserted through the fixing hole 410. The lower block 400 is manufactured to have a higher heat transfer rate than the upper block 200 and absorbs heat generated in the upper block 200 through the transfer block 300 to dissipate heat to the outside.

For this purpose, the lower block 400 is subjected to surface treatment by anodizing so as to have a higher heat transfer coefficient than the upper block 200. When the upper block 200 and the lower block 400 are made of the same metal material (for example, aluminum), the anodizing technique causes an electrochemical reaction on the surface of the lower block 400, It is a coating technique. Such anodizing surface treatment techniques can generally increase the abrasion resistance, corrosion resistance and hardness to increase the radiant heat effect. Since the anodizing technique is a generally known surface finishing technique, a detailed description thereof will be omitted.

Also, the lower block 400 may be manufactured to have a higher heat transfer coefficient than the upper block 200 by being thermally coated on the surface. That is, the lower block 400 is heat radiating coated as a Graphene radiation coating or a CNT (Carbon Nano tube) radiation coating method, so that the heat transfer rate is increased as compared with the raw material. Therefore, even though the lower block 400 is made of the same material as the upper block 200, the lower block 400 has a higher heat transfer coefficient due to the heat radiation coating.

The lower block 400 is made of a material having a higher heat transfer coefficient than the upper block 200 and is manufactured to absorb heat and dissipate heat due to a difference in heat transfer rate between the upper blocks 200. For example, if the upper block 200 is a general steel material, the lower block 400 may be made of silver, magnesium, copper, or aluminum with a higher thermal conductivity than the upper block 200 .

When the upper block 200 is made of the same material as the upper block 200, a heat sink made of a material having a high thermal conductivity (for example, copper, silver, magnesium or aluminum) And is further attached to the upper surface of the lower block which is in close contact with the lower surface of the transfer block 300. Here, the heat dissipation plate (not shown) can increase the heat transfer rate of the lower block 400 according to the metal plate having a higher heat transfer coefficient than the upper block 200.

Alternatively, when the lower block 400 is made of the same material as the upper block 200, surface roughness may be formed on the surface in an irregular concavo-convex shape having a small amplitude by a short blast technique. This is to improve the emissivity of heat by the roughness of the concavo-convex shape on the surface of the lower block 400 (for example, the upper surface in close contact with the transfer block 300). Since the short blast is a generally known technique, a detailed description thereof will be omitted.

The lower block 400 may be formed of one or more selected from a material having a high thermal conductivity, a heat radiation coating, a surface roughness by shot blast, and an additional heat sink (not shown) High heat transfer rate. Accordingly, since the lower block 400 has a higher heat transfer rate than the upper block 200, the absorption rate of heat from the transfer block 300 is higher. Therefore, the heat is effectively absorbed by the upper block 200 as the heat is absorbed from the lower block 400 within a short period of time.

Therefore, the heat dissipation effect of the LED module 100 can be improved even if the heat transfer structure between the upper block 200 and the lower block 400 does not include the heat pipe 500 as compared with the conventional heat dissipating device, The heat pipe 500 can be omitted and the number of components can be reduced.

Further, according to the present invention, if the heat pipe 500 is further constructed in the lower block 400 as described above, a higher heat radiation effect can be obtained. This will be described with reference to Figs. 4 and 5 as a second embodiment of the present invention.

FIG. 4 is an exploded perspective view showing a second embodiment of the heat dissipation device of the LED module according to the present invention, and FIG. 5 is a front view of the second embodiment of the heat dissipation device of the LED module according to the present invention.

Referring to FIGS. 4 and 5, the second embodiment of the present invention includes an LED module 100 including a circuit board, a waterproof panel 120 and a module cover 110, A transfer block 300 for transferring heat generated in the upper block 200, a heat pipe 500 for transferring heat generated in the upper block 200, And a lower block 400 for dissipating heat transferred through the block 300 and the heat pipe 500.

Since the LED module 100 is the same as that of the first embodiment, detailed description thereof will be omitted.

The upper block 200 further includes a first concave groove 220 protruding downward from a lower surface thereof to conform to the shape of the heat pipe 500. The first concave groove 220 is formed in the lower surface of the upper block 200 to form a space through which the heat pipe 500 can be inserted and contacted.

The transfer block 300 further includes transfer grooves 310 which are vertically elongated in the upper and lower surfaces to which the heat pipe 500 is bonded. The transfer groove 310 is formed at a depth where a diameter corresponding to a half of the entire diameter of the heat pipe 500 can be seated.

The lower block 400 further includes a second concave groove 420 which protrudes upward from the upper surface and conforms to the external shape of the heat pipe 500.

The heat pipe 500 is filled with a liquid heat transfer medium or latent heat medium (for example, water, freon or ammonia) from the inside, and one side of the heat pipe 500 is connected to the transfer groove 310 on the upper side of the transfer block 300. And the second transfer groove 310 of the transfer block 300 and the second concave groove 420 of the lower block 400 are mounted on the other side of the first block 200 and the first concave groove 220 of the upper block 200, Respectively.

The structure of the second embodiment adds the heat pipe 500 to the lower block 400 of the first embodiment. Accordingly, since the heat transfer rate difference between the lower block 400 and the upper block 200 and the contact area between the upper block 200 and the lower block 400 by the heat pipe 500 are improved, The heat dissipation is possible in a shorter time.

In addition, the present invention may further include a third embodiment, which can replace the heat dissipation effect of the heat pipe 500 through the transfer block 300 instead of the heat pipe 500 described above. The third embodiment will be described with reference to Figs. 6 and 7. Fig.

FIG. 7 is a perspective view showing a third embodiment of the heat dissipation device of the LED module according to the present invention, and FIG. 8 is a sectional view of the third embodiment of the heat dissipation device of the LED module according to the present invention.

Referring to FIGS. 7 and 8, the third embodiment of the present invention includes at least one stationary heat pipe 320 which is vertically fixed inside the transfer block 300. The fixed heat dissipating tube 320 is installed to extend vertically from the upper surface of the transfer block 300 and includes a body 322 in which a liquid heat transfer medium or a latent heat medium is charged, And has a stopper 321 for sealing.

The main body 322 may be integrally formed with the transfer block 300 or may be configured separately. A through hole into which the main body 322 can be inserted is formed on the upper surface of the transfer block 300 and a concave groove is formed on the lower surface of the transfer block 300 so that the lower end of the main body 322 can be fixed .

The body 322 shown in FIG. 8 is configured integrally with the transfer block 300, and the entrance of the body 322 is exposed on the upper surface of the transfer block 300.

The cap 321 is fastened to the inlet of the main body 322 to prevent filling and leakage of the liquid heat transfer medium or latent heat medium to the inside of the main body 322. Here, the stopper 321 and the main body 322 may be fastened in a screwed or fastened manner.

The heat transfer rate between the upper block 200 and the lower block 400 forming the heat dissipating device of the LED module is different and the heat pipe 500 and the fixed heat dissipating pipe 320 are additionally provided The heat radiation effect can be improved.

This was confirmed according to the results of the experiments of FIGS. 9 and 10.

FIGS. 9 and 10 show the temperature of the heat dissipating device according to the first embodiment and the conventional heat dissipating device. 9 (a) is a thermal image obtained by photographing the temperature of the heat dissipating device according to the first embodiment of the present invention in which the material of the lower block 400 is graphen heat-coated, and FIG. 9 (b) Is a thermal image obtained by photographing the temperature of the heat dissipating device having the same heat transfer rate between the heat exchanger (200) and the lower block (400). Here, the thermal image is captured in white as the temperature is higher.

The conventional heat dissipating device according to the first embodiment of the present invention is a conventional heat dissipating device in which the entirety of the heat dissipating device of the present invention is photographed in red in the image of a) and the conventional upper block 200 and the lower block 400 are made of the same material, ), The center portion is photographed in white. That is, since the heat dissipating device of the present invention having a difference in heat transfer rate between the upper block 200 and the lower block 400 is superior, a lower temperature is measured as compared with the conventional heat dissipating device.

10 is a thermal image obtained by photographing the temperatures of four samples in total, wherein the first image on the left is a thermal image of the conventional heat sink, the second image on the left is an anodizing device, and the third image on the left is heat sink Device, and the fourth image on the left is a thermal image of a heat dissipating device to which a shot blast and an anodizing technique are simultaneously applied.

10, the top block 200 of the leftmost conventional heat sink is the deepest red, and the remaining three images to which the present invention is applied are the top block 200 is pink .

Here, the temperature of the thermal image is displayed from pink to red and from red to white as the temperature is higher.

Accordingly, in the second to fourth images on the left side to which the present invention is applied, the upper block 200 is displayed in pink and the lower block 400 is displayed in red. This is because the temperature of the upper block 200 is further reduced as the heat of the upper block 200 is absorbed by the lower block 400.

Consequently, according to the present invention, since the heat dissipating device is manufactured such that the heat transfer rate is different between the upper and lower portions by applying any one of the anodizing technique, the heat radiating coating, the surface roughness, the additional heat sink, It has an excellent heat radiation effect.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the following claims And changes may be made without departing from the spirit and scope of the invention.

100: LED module 110: module cover
111: Lens 112: Fixed ball
113: cover coupling end 114: insertion groove
120: Waterproof panel 121: Support bar
122: fixed end 123: engaging projection
124: insertion wall 130, 131: circuit board
132: light emitting element 133: fixed hole
200: upper block 210:
220: first concave groove 300: transfer block
310: transfer groove 320: fixed heat dissipating tube
321: plug 322:
400: lower block 410: stationary ball
420: second concave groove 500: heat pipe

Claims (6)

An LED module having a plurality of light emitting devices;
An upper block for dissipating heat generated in the LED module;
A transfer block fixed to a lower side of the upper block to transfer heat generated in the upper block; And
And a lower block having a higher heat transfer rate than the upper block and the transfer block and dissipating heat transferred from the transfer block,
The LED module
A circuit board on which a plurality of light emitting devices are mounted;
A module cover which has a lens for diffusing and transmitting light emitted from the light emitting device, a cover coupling end formed so as to be upward in both end faces, and an insertion groove upward from a lower surface of the frame; And
An insertion wall protruded upward from the rim and inserted into the insertion groove to prevent moisture from penetrating between the circuit board and the module cover; A supporting bar extending from the inner surface of the rim in the lateral and longitudinal directions to support the circuit board which is in close contact with the lower surface of the module cover which is seated on the upper surface; And a waterproof panel protruding upward from both end surfaces and having an engagement protrusion inserted into the cover engagement end.
2. The apparatus of claim 1, wherein the lower block
Wherein the heat radiating plate has a higher thermal conductivity than the upper block by any one of surface roughness, thermal spray coating, and anodazing technique by a short blast.
2. The apparatus of claim 1, wherein the lower block
Wherein a heat radiating plate made of one selected from the group consisting of copper, magnesium, and aluminum is added to have a higher thermal conductivity than the upper block.
2. The apparatus of claim 1, wherein the lower block
Wherein the heat sink is made of a metal material having a higher thermal conductivity than the material of the upper block.
delete The apparatus of claim 1, further comprising a heat pipe that is inserted between the upper block and the transfer block, between the transfer block and the lower block, and transfers the row of the upper block to the lower block,
The heat pipe
A first concave groove formed on a bottom surface of the upper block and a transfer groove being downwardly formed on an upper surface of the transfer block,
And the other side is inserted and fixed between a transfer groove formed on a lower surface of the transfer block and a second recessed groove formed on an upper surface of the lower block.

Images