KR102343834B1 - LED Lighting Device With Vacuum Heat Plate - Google Patents

Abstract

The LED lighting device 100 having a vacuum heat sink of the present invention has an LED assembly 110, a heat sink 120 that surface-contacts the opposite surface to which the LED of the LED assembly is exposed, and a portion of the heat sink that surface-contacts It includes a vacuum heat sink 130 and a plurality of fastening members 140 for fixing the vacuum heat sink to the heat sink, and a portion of the heat sink in surface contact with the vacuum heat sink is formed on a line coincident with the line on which the LEDs are arranged. This invention uses a vacuum heat sink having a large-area evaporator and condensing unit in which the heat transfer medium filled in the inside can be evaporated and condensed from all sides of the inside of the plate-shaped container made of a plate in a vacuum state. By doing so, there is an advantage in that the heat dissipation efficiency of the LED can be increased while reducing the weight and volume. In addition, this invention configures the heat sink to have a heat transfer member on a line that coincides with the line on which the LED is arranged, and by configuring the upper end of the heat transfer member to be fixed in close contact with the lower surface of the vacuum heat sink, heat generated from the LED is vacuum It has the advantage of efficiently dissipating through the heat sink.

Description

LED Lighting Device With Vacuum Heat Plate

The present invention relates to an LED lighting fixture, and more particularly, to an LED lighting fixture having a vacuum heat sink.

LED (Light Emitting Diode, Light Emitting Diode) is a type of semiconductor and utilizes a phenomenon in which electric energy is converted into light energy when a voltage is applied to emit light. These LED lighting fixtures not only consume less power compared to incandescent lamps, which are currently mainly used as lighting fixtures, but also have the advantage of being able to implement light of various colors.

However, the currently used LED lighting equipment has a problem in that it does not effectively cool the heat generated by the LED during operation.

Conventionally, in order to compensate for this problem, heat generated from the LED is emitted to the outside by using a heat sink for LED lighting equipment as described in Korean Patent Registration No. 1306174. Such a heat sink consists of a plate-shaped base that receives heat in contact with the LED, and a plurality of heat dissipation fins having a large area to radiate heat conducted from the base to the outside atmosphere.

However, in the case of high-output large-capacity LED lighting used indoors and outdoors, such as factory interior lighting or street lamps, in order to secure sufficient heat dissipation capacity in response to high-output large-capacity LEDs, it is inevitable to increase the size of the heat sink. However, the enlargement of the heat sink inevitably leads to an increase in weight and volume and an increase in manufacturing cost. That is, as a support (eg, a street lamp pole) for supporting it must be rigidly configured due to an increase in weight, manufacturing cost increases, and structural design becomes difficult due to an increase in volume. As such, there is a limit to increasing the heat dissipation efficiency while reducing the weight and volume of the LED lighting fixture using the conventional heat sink.

Korean Patent Registration No. 1306174

Accordingly, the present invention has been devised to solve the problems of the prior art as described above, and the inside of the plate-shaped container made of a plate is configured in a vacuum state and the heat transfer medium filled therein is formed from all sides of the interior An object of the present invention is to provide an LED lighting device having a vacuum heat sink capable of increasing the heat dissipation efficiency of the LED while reducing weight and volume by using a vacuum heat sink having a large-area evaporator and condensing unit capable of evaporation and condensation. have.

LED lighting equipment provided with a vacuum heat sink of the present invention for achieving the above object, an LED assembly, a heat sink surface-contacting the opposite surface to which the LED of the LED assembly is exposed, and a part and surface of the heat sink A vacuum heat sink in contact, and a plurality of fastening members for fixing the vacuum heat sink to the heat sink, wherein the heat sink is in surface contact with the LED assembly to receive the heat of the LED plate-shaped base, and the LED assembly A plurality of heat dissipation fins formed on the surface of the base opposite to and for dissipating heat conducted from the base to the external atmosphere, and a line positioned between the plurality of heat dissipation fins and matching the line on which the LEDs are arranged. a plurality of heat transfer members formed on the surface of the base to be in close contact with the vacuum heat sink, wherein the plurality of heat radiation fins are formed at a height lower than the plurality of heat transfer members, and a gap between each other and a space between the top and the vacuum heat sink It is characterized in that it has a structure that emits heat to the external atmosphere through the

In addition, according to the present invention, the vacuum heat sink is sealed to form an inner space in a vacuum state, a first plate and a second plate, a mesh member disposed between the first and second plate, and in the inner space It is characterized in that it includes a heat transfer medium filled in some space.

In addition, according to the present invention, any one of the first and second plates further has a plurality of hemispherical-shaped beads with flat ends so that when a vacuum is applied to the inner space, they are partially overlapped with each other and supported. do it with

In addition, according to the present invention, the first and second plates are characterized in that the heat dissipation coating.

In addition, according to the present invention, the heat sink is characterized in that it further comprises a plurality of fixing bars for fixing the vacuum heat sink to the heat sink through the plurality of fastening members.

In addition, according to the present invention, the fastening member is formed in a "L" shape so that the upper end part is screwed into the fastening hole formed on the side while pressing the edge of the vacuum heat sink in the downward direction to be fixed to the fixing bar. characterized.

This invention uses a vacuum heat sink having a large-area evaporator and condensing unit in which the heat transfer medium filled in the inside can be evaporated and condensed from all sides of the inside of the plate-shaped container made of a plate in a vacuum state. By doing so, there is an advantage in that the heat dissipation efficiency of the LED can be increased while reducing the weight and volume.

In addition, this invention configures the heat sink to have a heat transfer member on a line that coincides with the line on which the LED is arranged, and by configuring the upper end of the heat transfer member to be fixed in close contact with the lower surface of the vacuum heat sink, the heat generated by the LED is vacuum It has the advantage of efficiently dissipating through the heat sink.

1 and 2 are an exploded perspective view and a combined perspective view showing the configuration relationship of an LED lighting device having a vacuum heat sink according to an embodiment of the present invention;
3 and 4 are an exploded perspective view and a combined perspective view showing the LED lighting device having a vacuum heat sink shown in FIG. 1 from another direction;
5 and 6 are cross-sectional perspective views of the LED lighting device provided with the vacuum heat sink shown in FIG. 4 taken in longitudinal and transverse directions;
7 is an exploded perspective view of the vacuum heat sink shown in FIG. 1 .

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of an LED lighting device having a vacuum heat sink according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 are an exploded perspective view and a combined perspective view showing the configuration of an LED lighting device having a vacuum heat sink according to an embodiment of the present invention, and FIGS. 3 and 4 are provided with the vacuum heat sink shown in FIG. It is an exploded perspective view and a combined perspective view showing one LED lighting device from another direction, and FIGS. 5 and 6 are cross-sectional perspective views taken in longitudinal and transverse directions of the LED lighting device having a vacuum heat sink shown in FIG. 4 , FIG. 7 is an exploded perspective view of the vacuum heat sink shown in FIG. 1 .

1 to 7, the LED lighting device 100 having a vacuum heat sink according to this embodiment is an LED assembly 110, a heat sink 120, a vacuum heat sink 130, and a pair of fastening It is configured to include a member 140 .

The LED assembly 110 includes an LED 111 , a printed circuit board (PCB) 112 , a protective cover 113 and an electric wire. The LEDs 111 of this embodiment are provided in a plurality of types to be mounted on the PCB 112 in the form of elements, not in the form of light bulbs. The PCB 112 is made of a metal having good thermal conductivity, for example, aluminum. Although not specifically illustrated, one side of the metal PCB 112 is coated with an insulating film or the like for circuit configuration, and a plurality of LEDs 111 are mounted on one side thereof. The protective cover 113 is disposed to cover one side of the PCB 112 to protect the plurality of LEDs 111 and to control the irradiation direction of light emitted from the LEDs 111 . And, the electric wire is for supplying electricity to the LED 111 and is connected to the central portion of the PCB 112 . Meanwhile, the central portion of the PCB 112 is electrically connected to the LED 111 mounted on the PCB 112 by a circuit.

One side of the heat sink 120 is in close contact with the other side of the PCB 112 and a part of the other side is in close contact with the vacuum heat sink 130 to transfer heat generated from the LED 111 to the vacuum heat sink 130. In addition, it serves to radiate the heat generated by the LED (111) itself. The heat sink 120 has a plate-shaped base 121 that is in contact with the LED 111 to receive heat, and a plurality of heat dissipation fins ( 122), a plurality of heat transfer members 123 formed on a line coincident with the line on which the LEDs 111 are arranged and closely adhered to the vacuum heat sink 130, and a pair of fastening members 140 through the vacuum heat sink 130 ) is composed of a pair of fixing bars 124 for fixing the heat sink (120).

The base 121 is formed in a standardized LED module size, and is also formed to have a fastening hole for fastening at a standardized standard position, respectively. The plurality of heat dissipation fins 122 are for discharging heat conducted from the base 121 to the external atmosphere, are formed at a height lower than the heat transfer member 123, and are formed between a gap between each other and the upper end and the vacuum heat sink 130 . heat is released to the outside atmosphere through the space of The heat transfer member 123 is in close contact with the vacuum heat sink 130 to efficiently dissipate the heat generated from the LED 111 through the vacuum heat sink 130. is formed The heat transfer member 123 of this embodiment is configured to have two LEDs 111 as they are arranged in two rows, but may be configured to have a corresponding number according to the number of LEDs 111 arranged in two rows. The pair of fixing bars 124 are for fixing the vacuum heat sink 130 to the heat sink 120 through the pair of fastening members 140 , and for this purpose, are formed to have a threaded fastening hole.

The vacuum heat sink 130 has a plate-shaped container having an inner space. Here, the vacuum heat sink 130 may also be referred to as a vapor chamber. On the other hand, the plate-shaped container is formed by overlapping two thin first and second plates 131 and 132 having a large area and welding the outer edges to form a single plate-shaped structure. Here, as the welding method, argon welding, laser welding, or plasma welding may be used. On the other hand, the mesh member 133 is inserted into the inner space of the plate-shaped container, and a small amount of heat transfer medium is inserted into the inner space layer in a vacuum state.

The first and second plates 131 and 132 come in contact with the heat sink 120 and the outside air, respectively, and spread the heat condensed on the heat sink 120 to discharge to the outside air, and are made of a plate-shaped stainless material. . As the first and second plates 131 and 132 are configured in a plate shape, more efficient heat dissipation is possible because the contact area with the heat sink 120 is wide and the contact area with the outside air is also wide. On the other hand, the first and second plates 131 and 132 are preferably made of STS 304 material having a thickness of 0.3 mm or less, which is excellent in high strength, corrosion resistance and heat dissipation performance. In this way, by using a stainless material as a material of the first and second plates 131 and 132, the rigidity can be improved. Meanwhile, the first and second plates 131 and 132 are preferably coated with a heat dissipation coating for more efficient heat dissipation.

As described above, in the plate-shaped container, an inner space is formed by the first and second plates 131 and 132, and this inner space is formed by stepping the edges of the first and second plates 131 and 132 in a stepped shape. formed by composing That is, the first and second plates 131 and 132 are formed to be in surface contact with each other by forming the edge portions to be stepped upward or downward, and are edge-welded to each other at the ends of the portions.

On the other hand, the inner space formed by the first and second plates 131 and 132 is compressed with each other when a vacuum is applied to the inner space, and disappears or is deformed. Therefore, one of the first and second plates 131 and 132 of this embodiment is configured to have beads of a certain shape that overlap and support each other when a vacuum is applied to the inner space. In this embodiment, the first plate 131 is configured to have a hemispherical bead 134 with a flat top. That is, in manufacturing the first plate 131, a plate made of stainless steel is press-molded so that the upper end has a flat hemispherical bead 134.

The mesh member 133 is disposed between the first and second plates 131 and 132 and serves to provide a passage through which the heat transfer medium can smoothly move. That is, the mesh member 133 enables vapor diffusion and condensing recovery of the heat transfer medium in the entire area of the inner space together with the beads 134 of the first plate 131 . Accordingly, the mesh member 133 is preferably made of a STS 304 material having a mesh structure and excellent high strength and corrosion resistance.

The heat transfer medium is inserted into a partial space layer of the inner space of the plate-shaped container, absorbs the heat generated in the evaporator, evaporates, exchanges heat with the entire area (condensation part) in contact with the outside air to release heat, and returns to liquid in the vapor state. It is condensed into a state and moves to the evaporation part. Therefore, it is preferable to use water that satisfies the above conditions as the heat transfer medium.

Meanwhile, in inserting the heat transfer medium into the spatial layer of the inner space, a hole is drilled on one side of the second plate 132 , and the heat transfer medium may be injected through the hole. And, when the heat transfer medium is injected in this way, after cooling the heat transfer medium, vacuum is applied through the hole, the hole is sealed and air cooled at room temperature, so that the inside has a certain degree of vacuum.

In the vacuum heat sink 130 of this embodiment configured as described above, a portion in contact with the heat sink 120 becomes an evaporation portion and the remaining portion becomes a condensing portion. That is, when heat is introduced from the evaporator, the inside is in a vacuum state, so that the heat transfer medium evaporates at 40° C. or less and changes to a vapor state, moves along the flow passage formed by the beads 134 and the mesh member 133, Heat is released by exchanging heat with the entire area (condensation part) in contact with it, and it is condensed from vapor to liquid again. The condensed heat transfer medium moves along the bead 134 and the mesh member 133 to the side where the evaporator is located, and then discharges heat to the outside by repeating the same process described above.

The pair of fastening members 140 are for fixing the vacuum heat sink 130 to the heat sink 120 , and have fastening holes at positions corresponding to the fastening holes of the fixing bar 124 of the heat sink 120 , respectively. . This fastening member 140 is formed in a "L" shape, and the upper part is screwed into the fastening hole formed on the side while pressing the edge of the vacuum heat sink 130 in the lower direction, so that the fixing bar of the heat sink 120 is fixed. configured to be secured to 124 .

Hereinafter, a heat dissipation process in the LED lighting fixture having the vacuum heat sink of this embodiment configured as described above will be described.

First, power is supplied to the LED assembly 110 through a wire. Then, the LEDs 111 emit light, thereby generating heat. The heat generated in this way is transferred to the base 121 of the heat sink 120 in surface contact with the PCB 112 made of metal, a part is emitted to the outside by the heat radiation fin 122 of the heat sink 120, and the remaining heat is After being condensed on the heat transfer member 123 of the heat sink 120 , it is transferred to the vacuum heat sink 130 in surface contact with the heat transfer member 123 . Then, in the vacuum heat sink 130 , the portion in contact with the heat transfer member 123 of the heat sink 120 becomes an evaporation portion and the remaining portion becomes a condensing portion, thereby discharging heat to the outside through a heat exchange process.

The LED lighting device 100 having a vacuum heat sink of this embodiment configures the inside of the plate-shaped container made of the plate in a vacuum state, and the heat transfer medium filled therein can evaporate and condense on all sides of the inside. By using the vacuum heat sink 130 having an evaporating part and a condensing part of the area, efficient LED heat dissipation is possible without forming the heat sink 120 large. That is, since it is not necessary to form the large heat sink 120 , the weight and volume due to the heat sink 120 can be reduced. Therefore, the LED lighting device 100 having a vacuum heat sink of this embodiment is applicable to various fields such as a street light, a floodlight, a security light, a factory, a tunnel, an airport, a golf course, and the like.

In addition, the LED lighting device 100 having a vacuum heat sink of this embodiment configures the heat sink 120 to have a heat transfer member 123 on a line coincident with the line on which the LED 111 is arranged, respectively, and this heat transfer member By configuring the upper end of 123 to be fixed in close contact with the lower surface of the vacuum heat sink 130 , heat generated from the LED 111 can be efficiently discharged through the vacuum heat sink 130 .

In the above, the technical details of the LED lighting device having a vacuum heat sink of the present invention have been described along with the accompanying drawings, but this is an exemplary description of the best embodiment of the present invention. Accordingly, the present invention is not limited to the above-described embodiments, and it is apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention, such modifications Examples or modifications will also fall within the scope of the claims of this invention.

100: LED lighting equipment 110: LED combination
120: heat sink 130: vacuum heat sink
140: fastening member

Claims (6)

LED assembly and
And a heat sink surface-contacting the opposite surface to which the LED of the LED assembly is exposed;
a vacuum heat sink in surface contact with a portion of the heat sink; and
A plurality of fastening members for fixing the vacuum heat sink to the heat sink,
The heat sink is formed on a plate-shaped base to receive heat from the LED in surface contact with the LED assembly, and is formed on the surface of the base opposite to the LED assembly to radiate heat conducted from the base to the outside atmosphere. A plurality of heat dissipation fins, and a plurality of heat transfer members positioned between the plurality of heat dissipation fins and formed on the surface of the base in a line coincident with the line on which the LEDs are arranged and are in close contact with the vacuum heat sink,
The plurality of heat dissipation fins are formed to have a lower height than the plurality of heat transfer members, and have a structure for discharging heat to the outside atmosphere through a gap between each other and a space between the upper end and the vacuum heat sink. One LED light fixture. The method according to claim 1,
The vacuum heat sink includes a first plate and a second plate that are sealed to form an inner space in a vacuum state, a mesh member disposed between the first and second plates, and a heat transfer medium filled in a partial space in the inner space LED lighting equipment having a vacuum heat sink comprising a. 3. The method according to claim 2,
One of the first and second plates has a vacuum heat sink, characterized in that it further has a plurality of hemispherical beads with flat ends so that when a vacuum is applied to the inner space, they are partially overlapped with each other and supported. LED lighting fixtures. 3. The method according to claim 2,
The first and second plates are LED lighting equipment having a vacuum heat sink, characterized in that the heat radiation coating. The method according to claim 1,
The heat sink is an LED lighting device having a vacuum heat sink, characterized in that it further comprises a plurality of fixing bars for fixing the vacuum heat sink to the heat sink through the plurality of fastening members. 6. The method of claim 5,
The fastening member is formed in a “L” shape, and the upper part is screwed into the fastening hole formed on the side while pressing the edge of the vacuum heat sink in the lower direction to be fixed to the fixing bar. One LED light fixture.

Images