TWI570394B - Testing Device with a Far-Infrared Light Source for Temperature Sensors - Google Patents

Description

Temperature sensor test device with far infrared light

The invention relates to a temperature sensor testing device, in particular to a temperature sensor testing device with far infrared light suitable for testing a temperature sensor of an ear thermometer.

In semiconductor component wafer testing, test systems often need to test product performance in a specific environment, such as high temperature and low temperature working environment, the accuracy of the test temperature provided by the test system is only about ± 1 ° C, the accuracy limited.

As far as the current market is concerned, there is no test equipment for the development of a temperature sensor for sensing the temperature of human radiation in the far-infrared 8 μm to 12 μm optical band, and if the above-mentioned general temperature accuracy is only ±1 ° C, the temperature test equipment is used. Can not be used for temperature sensors with an accuracy requirement of ±0.1 °C, and if used barely, the reliability of the tested products must not be sufficient.

Because of this, in the spirit of active invention and creation, we have considered a "temperature sensor test device with far infrared light" that can solve the above problems, and finally completed the present invention after several research experiments.

The main object of the present invention is to provide a temperature sensor test device with far infrared light, which can use a waveguide to guide a light source generated by a far infrared light source unit to directly illuminate a photosensitive area of a wafer to be tested, and utilize a floating mechanism. Keep the waveguide tightly attached to the test socket. Thereby, the far-infrared light does not escape between the waveguide and the test socket, so that the energy of the far-infrared light is concentrated on the wafer to be tested, and the accuracy of the test is increased, and the accuracy is up to ±0.1 °C.

Another object of the present invention is to provide a temperature sensor test device with far infrared light, which can use the inner layer of the test cavity to have thermal insulation material such as heat insulation cotton or bakelite, so as to achieve constant temperature in the test chamber. The effect is that a silver layer is plated on the inner layer of the heat insulating material, so that the heat energy of the inner layer is not easily lost, and the accuracy of temperature control is improved.

In order to achieve the above object, the far infrared light temperature sensor testing device of the present invention comprises: a test cavity, a test board (Load Board), a test socket (Socket), and a far infrared light source unit (Infrared Light Source), a waveguide, a floating mechanism, a heating unit, and a control unit. Wherein, the inner layer of the test cavity has a heat insulating material, the test carrier is disposed in the test cavity, the test seat is disposed on the test carrier and is located in the test cavity for placing a wafer to be tested; the far infrared light source unit is disposed at Outside the test chamber, the waveguide is disposed between the test socket and the far-infrared light source unit for guiding the light source generated by the far-infrared light source unit to directly illuminate the photosensitive region of the wafer to be tested; the floating mechanism is disposed on the waveguide and the far-infrared Between the light source units, there is an elastic member for providing a pre-force to touch the test tube to the test tube; the heating unit is for heating the test carrier, and the control unit is electrically connected to the heating unit.

The insulating material of the inner layer of the test chamber may be a material of heat insulating cotton, bakelite or other equivalent insulating material, and has extremely low thermal conductivity, and has the characteristics of heat insulation, insulation and high temperature resistance, thereby improving the test. Accuracy of temperature control inside the chamber.

The inner layer of the above-mentioned heat insulating material may be plated with a silver layer or other equivalent material, which has an extremely high reflectance, whereby the heat energy of the inner layer is not easily lost.

The invention may further comprise a filter of an optical band of 8 μm to 12 μm, the filter being disposed between the floating mechanism and the far-infrared light source unit, thereby reducing thermal interference in the non-test band.

The test chamber can have an upper cover. The far infrared light source unit is fixed on the upper cover. The upper cover can be fixed on a retractable connecting arm. The connecting arm can be extended up to a specific height and side. The function can conveniently take out the tested wafer and place the wafer to be tested, and the overall test device can be directly combined with the sorter into a test device.

The far-infrared light source unit can be coated with a heat shield or other equivalent function member, thereby reducing heat energy loss.

The waveguide can be plated with a gold layer to improve the conduction efficiency of the light source, and the inner diameter of the waveguide is the same as the sensing area of the far-infrared temperature sensor, thereby allowing the sensing area to be completely Absorbs far infrared light and increases the accuracy of the test temperature.

The elastic member refers to a spring or other equivalent function member, thereby providing a pre-force to make the waveguide touch the test seat, so that the light of the far-infrared light is not easily dispersed, and the accuracy of the test temperature is increased.

Adjacent to the test carrier and a thermistor for measuring the temperature, if the thermistor is disposed outside the test cavity, the measured temperature can be converted into a test cavity via an experimental comparison. The internal temperature.

The waveguide can be designed as a single sleeve or a double sleeve. When the waveguide is a single sleeve, there is only one perforation therein, that is, the size of the perforation is fixed; When it is a double sleeve, it has a perforation and an inner shaft. By quickly changing the inner shaft of different perforations, if you need to test different types of temperature sensors, you only need to use a temperature sensor. The sensing area and the inner shaft have the same size of the perforation, and the components of the temperature sensor testing device need not be replaced.

The floating mechanism may further include a limiting plate, a groove and a sealing ring, wherein the limiting plate ring is disposed at one end of the waveguide, the elastic member is disposed on the limiting plate, and the sealing ring is disposed in the concave groove.

1A and 1B, respectively, FIG. 1 is a temperature sensor testing device and an enlarged view of a floating mechanism according to a first preferred embodiment of the present invention. The testing device 10 of the far infrared light temperature sensor of the present embodiment includes a test chamber 15, a test carrier 20, a test socket 25, a far infrared light source unit 30, a waveguide 35, a floating mechanism 38, a filter 36, a heating unit (not shown), and A control unit (not shown).

As shown in FIG. 1A, the test chamber 15 is a closed space, and is surrounded by an upper cover 16, a test carrier 20, a plug 17, a heat insulating cotton 18, and the like to form a square sealed space. In addition, in the present embodiment, the inner surface of the square sealed space formed by the upper cover 16, the test carrier 20, the plug 17, the heat insulating cotton 18, and the like is plated with a silver layer, which has a very high reflectivity. Thereby, the thermal energy of the inner layer of the test cavity 15 can be easily lost. In addition, in the embodiment, the upper cover 16 is a bakelite, which has extremely low thermal conductivity and has the characteristics of heat insulation, insulation and high temperature resistance, thereby improving the accuracy of temperature control inside the test cavity 15.

The test board 20 is disposed under the test cavity 15; the test socket 25 is disposed on the test carrier 20 and located in the test cavity 15, and the test socket 25 can be placed on the test socket 25 The far-infrared light source unit 30 is disposed outside the test cavity 15. The waveguide 35 is disposed between the test stand 25 and the far-infrared light source unit 30. The waveguide 35 can guide the light source generated by the far-infrared light source unit 30 directly. Irradiation of the photosensitive region of the wafer to be tested.

In addition, as shown in FIG. 1B, the floating mechanism 38 is disposed between the waveguide 35 and the far-infrared light source unit 30. The floating mechanism 38 includes a limiting plate 381, an elastic member 382, and a sealing ring (O-ring). 383 and a recess 384, wherein the limiting plate 381 of the floating mechanism 38 is disposed at one end of the waveguide 35, the elastic member 382 is disposed on the limiting plate 381, and the groove 384 of the floating mechanism 38 is disposed on the guiding wave One side of the tube 35, the sealing ring 383 (O-ring) ring is disposed in the groove 384, so that when the temperature sensor testing device is assembled, the elastic member 382 can provide a pre-force to make the waveguide 35 touch the test seat. 25, and the sealing ring 383 not only makes the light of the far-infrared light difficult to disperse, but also increases the accuracy of the test temperature, and also provides a damping force for the waveguide 35, preventing the waveguide 35 from moving up and down quickly, and eliminating the pressure of the waveguide 35 Injury to the test wafer. Further, the filter 36 is disposed between the floating mechanism 38 and the far-infrared light source unit 30.

In the present embodiment, the filter 36 refers to the filter 36 of the optical band of 8 μm to 12 μm, whereby the thermal interference in the non-test band can be reduced. In addition, the far-infrared light source unit 30 is covered with a heat insulating plate 31, and the heat energy loss of the far-infrared light source unit 30 can be reduced by the heat insulating plate 31. Moreover, in the embodiment, the waveguide 35 is plated with a gold layer to improve the conduction efficiency of the light source, and the inner diameter of the waveguide 35 is the same as the sensing area of the far infrared light temperature sensor. This allows the sensing area to completely absorb far-infrared light and increase the accuracy of the test temperature. Further, in the present embodiment, the elastic member 382 of the floating mechanism 38 refers to a spring. And the waveguide 35 of the area A has a through hole 351 which is the same size as the sensing area of the temperature sensor.

Further, as shown in FIG. 1A, the heating unit can heat the test carrier 20, and the control unit is electrically connected to the heating unit to control the heating temperature of the heating unit. In addition, adjacent to the test carrier 20 and a thermistor 21, the temperature can be measured by the thermistor 21, and the measured temperature can be converted into the internal temperature of the test cavity 15 through experimental comparison. The heating temperature of the heating unit is controlled by the control unit to precisely control the internal temperature of the test chamber 15.

Therefore, the light source generated by the far-infrared light source unit 30 is directly irradiated to the photosensitive region of the wafer to be tested by the waveguide 35, and the waveguide 35 is closely attached to the test seat 25 by using the floating mechanism 38, far infrared. The light does not escape between the waveguide 35 and the test stand 25, so that the energy of the far-infrared light is concentrated on the wafer to be tested, and the accuracy of the test is increased, and the accuracy is up to ±0.1 °C. In addition, in this embodiment, the inner layer of the test cavity 15 can be made of insulating material such as heat insulating cotton or bakelite, so that the test chamber 15 can achieve a constant temperature effect, and the inner layer of the heat insulating material is plated with a layer. The silver layer makes the heat energy of the inner layer difficult to dissipate, which can improve the accuracy of temperature control.

2 is a temperature sensor testing device according to a second preferred embodiment of the present invention, and please refer to FIG. 1 together. This embodiment is substantially the same as the structure of the first embodiment except that the waveguide 46 of the region A of the present embodiment has a through hole 461 and an inner axis 462, and the waveguide 35 of the first embodiment is only The waveguide 446 of the embodiment has a double sleeve design, and the inner shaft 462 of different sizes of the through holes 461 can be quickly replaced. If different types of temperature sensors need to be tested, only The sensing area of the temperature sensor needs to be the same size as the hole 461 of the inner shaft 462, and the components of the temperature sensor testing device need not be replaced.

Please refer to FIG. 3 which is a temperature sensor testing device according to a first preferred embodiment of the present invention, and please refer to FIG. 1 together. The test chamber 10 of the temperature sensor with far infrared light has an upper cover 16 on the test chamber 15 , and the far infrared light source unit 30 is covered with a heat insulation plate 31 , and the plurality of locks 45 are fixed by the heat insulation plate 31 . The upper cover 16 is fixed on a retractable connecting arm 50 by a plurality of locking members 55, and can be easily taken out by the connecting arm 50 extending up to a certain height and side sill function. The completed wafer and the wafer to be tested are tested, and the overall testing device 10 can be directly combined with the sorting machine into a test device 1 having a far infrared light temperature sensor.

Referring to FIG. 4 and FIG. 5, respectively, the temperature sensor testing device for the state in which the connecting arm is in the extended state and the side of the connecting arm is in the first preferred embodiment of the present invention. As shown in FIG. 4, when the test finished wafer is to be taken out, the connecting arm 50 can be extended to a specific height, and as shown in FIG. 5, the connecting arm 50 is squatted, and the tested wafer can be taken out, and then the wafer is removed. The wafer to be tested is placed on the test stand 25, and the connecting arm 50 is returned to the erect state and lowered in height to continue operation. Therefore, the test device 10 with the far-infrared light temperature sensor of the embodiment can be combined with the sorting machine to form a temperature sensor with far infrared light by the telescopic and laterally connectable arm 50. Test equipment 1.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1‧‧‧Test equipment
10‧‧‧Testing device
15‧‧‧Test cavity
16‧‧‧Upper cover
17‧‧‧ Conce
18‧‧‧Insulation cotton
20‧‧‧Test carrier
21‧‧‧Thermistor
25‧‧‧ test seat
30‧‧‧ far infrared light source unit
31‧‧‧ Thermal insulation board
35‧‧‧guide tube
351‧‧‧Perforation
36‧‧‧Filter
38‧‧‧Floating agencies
381‧‧‧Limited board
382‧‧‧Flexible parts
383‧‧‧Seal ring
384‧‧‧ Groove
45‧‧‧Locker
46‧‧‧guide tube
461‧‧‧Perforation
462‧‧‧ inner shaft
50‧‧‧Connecting arm
55‧‧‧Locker
A‧‧‧ area

1A is a temperature sensor testing device according to a first preferred embodiment of the present invention. Figure 1B is an enlarged view of the floating mechanism of the first preferred embodiment of the present invention. 2 is a temperature sensor test apparatus according to a second preferred embodiment of the present invention. 3 is a temperature sensor test apparatus according to a first preferred embodiment of the present invention. 4 is a temperature sensor test apparatus for the state in which the connecting arm is extended in the first preferred embodiment of the present invention. Fig. 5 is a temperature sensor test apparatus for the side of the arm of the first preferred embodiment of the present invention.

10‧‧‧Testing device

15‧‧‧Test cavity

16‧‧‧Upper cover

17‧‧‧ Conce

18‧‧‧Insulation cotton

20‧‧‧Test carrier

21‧‧‧Thermistor

25‧‧‧ test seat

30‧‧‧ far infrared light source unit

31‧‧‧ Thermal insulation board

35‧‧‧guide tube

351‧‧‧Perforation

36‧‧‧Filter

38‧‧‧Floating agencies

381‧‧‧Limited board

382‧‧‧Flexible parts

383‧‧‧Seal ring

384‧‧‧ Groove

45‧‧‧Locker

A‧‧‧ area

Claims (10)

A temperature sensor testing device with far infrared light, comprising: a test cavity, the inner layer has an insulating material; a test carrier is disposed in the test cavity; a test seat is disposed on the test load The board is located in the test chamber for placing a wafer to be tested; a far infrared light source unit is disposed outside the test chamber; and a waveguide is disposed between the test socket and the far infrared light source unit. The light source for guiding the light source generated by the far-infrared light source unit is directly irradiated to the photosensitive region of the wafer to be tested; a floating mechanism is disposed between the waveguide and the far-infrared light source unit, and has an elastic member for providing a pre-force causes the waveguide to contact the test socket; a heating unit for heating the test carrier; and a control unit electrically connected to the heating unit. The temperature sensor testing device with far infrared light according to claim 1, wherein the heat insulating material refers to heat insulating cotton or bakelite. The temperature sensor testing device with far infrared light according to claim 2, wherein the inner layer of the heat insulating material is plated with a silver layer. The far-infrared light temperature sensor test device according to claim 1, further comprising a filter of an optical band of 8 μm to 12 μm disposed between the floating mechanism and the far-infrared light source unit. The far-infrared light temperature sensor test device of claim 1, wherein the test cavity has an upper cover, and the far-infrared light source unit is fixed on the upper cover. The temperature sensor testing device with far infrared light according to claim 5, wherein the upper cover is fixed on a telescopic connecting arm. The far-infrared light temperature sensor testing device according to claim 1, wherein the far-infrared light source unit is covered with a heat insulating plate. The temperature sensor test device with far infrared light according to claim 1, wherein the waveguide is plated with a gold layer to improve the conduction efficiency of the light source. The temperature sensor testing device with far infrared light according to claim 1, wherein the waveguide has a perforation and an inner axis. The temperature sensor test apparatus of claim 1 , wherein the floating mechanism further comprises a limiting plate, a groove and a sealing ring, wherein the limiting plate ring is disposed on the One end of the waveguide, the elastic member is disposed on the limiting plate, and the sealing ring is disposed in the groove.