TWI568570B - Coating detection method and device thereof - Google Patents
Coating detection method and device thereof Download PDFInfo
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Description
本發明涉及熱熔膠的塗膠技術,特別有關一種塗膠檢測方法及其裝置。 The invention relates to a glue coating technology of a hot melt adhesive, in particular to a glue coating detection method and a device thereof.
周知,太陽能面板是在兩片基板之間夾設若干個太陽能電池,並使各電池之間連接導電線路至玻璃框邊的集線器,以便傳導太陽能電池所收集並轉化而成的電能。其中,為避免液體(例如水)滲入兩片基板之間,會在兩片基板貼合前,先在兩片基板的四周框邊塗附熱熔膠,以便兩片基板貼合後能防止液體的滲入,進而提升太陽能面板的耐久使用壽命。 It is known that a solar panel is a solar cell in which a plurality of solar cells are interposed between two substrates, and a conductive line is connected between the batteries to the side of the glass frame to conduct electric energy collected and converted by the solar battery. In order to prevent liquid (such as water) from penetrating between the two substrates, the hot melt adhesive is applied to the sides of the two substrates before the two substrates are bonded, so that the liquid can be prevented after the two substrates are bonded together. Infiltration, thereby increasing the durability of the solar panel.
目前,基板上熱熔膠的塗附作業大都是採用自動塗膠機來進行,而自動塗膠機在塗附熱熔膠於基板上時,必須能有效的控制熱熔膠的塗附量,以避免發生下列兩大問題: At present, the application of hot melt adhesive on the substrate is mostly carried out by an automatic glue applicator, and the automatic applicator must be able to effectively control the amount of hot melt adhesive applied when the hot melt adhesive is applied to the substrate. To avoid the following two major problems:
1.當熱熔膠的塗附量不足時,造成兩片基板在貼合後,位於兩片基板之間的熱熔膠難以達到密封的效果,使液體很容易滲入兩片基板之間,進而減少太陽能面板的耐久使用壽命。 1. When the coating amount of the hot melt adhesive is insufficient, after the two substrates are bonded, the hot melt adhesive between the two substrates is difficult to achieve the sealing effect, so that the liquid easily penetrates between the two substrates, and further Reduce the durability of solar panels.
2.當熱熔膠的塗附量過多時,造成兩片基板在貼合的過程中,位於兩片基板之間的熱熔膠會受到擠壓而溢流至基板四周邊框的外圍,形成參差不齊的贅邊餘料,如此一來,還需要額外增加一道刮除熱熔膠之贅邊餘料的工序負擔。 2. When the amount of hot melt adhesive is too much, the hot melt adhesive between the two substrates is squeezed and overflows to the periphery of the frame around the substrate during the bonding process, forming a stagger. In this case, it is necessary to add an additional process burden to scrape off the residual material of the hot melt adhesive.
因此,有業者開發出如台灣專利M459029所揭 露一種可變換膠嘴方向的塗膠頭,是藉由呈長條孔狀出膠口的塗膠嘴將熱熔膠塗附於基板上,且該出膠口可變換方向,使得熱熔膠能以呈現扁平狀的形態被塗附且夾附於兩片基板四周框緣之間,能有效的控制熱熔膠的塗附量,提升兩片基板之間的貼合暨密合品質。 Therefore, some developers have developed such as Taiwan patent M459029 A glue-coated head which can change the direction of the nozzle is formed by applying a hot-melt adhesive to the substrate by a glue nozzle having a long hole-shaped glue outlet, and the glue outlet can change direction to make the hot melt adhesive The coating can be applied in a flat shape and sandwiched between the frame edges of the two substrates, which can effectively control the amount of hot melt adhesive applied and improve the bonding and adhesion quality between the two substrates.
然而,目前在上述的塗膠作業結束後,仍須仰賴人為目測或仰賴器械逐一區段的檢測塗附於基板上的熱熔膠,以確認是否有發生如溢料、厚度不均、寬度不足等現象,由於缺乏自動檢測的機能,乃至於影響到品管檢測的效率。 However, at the end of the above-mentioned gluing operation, it is still necessary to rely on human beings to visually or rely on the detection of the hot melt adhesive applied to the substrate one by one to confirm whether there is such a problem as overflow, uneven thickness, and insufficient width. And so on, due to the lack of automatic detection of the function, and even affect the efficiency of quality control testing.
有鑑於此,本發明之目的,旨在改善傳統檢測塗附於基板上的熱熔膠時效率不彰的問題。 In view of the above, an object of the present invention is to improve the problem of inefficiency in conventionally detecting a hot melt adhesive applied to a substrate.
因此,本發明之一具體實施例,在於提供一種塗膠檢測方法,其技術手段包括:提供一具雙軸向移動能力的塗膠頭,依循一基板上的一塗膠路徑進行塗膠,並透過跟隨該塗膠頭移動的電荷耦合元件,對該塗膠路徑取像,其中所述電荷耦合元件係跟隨塗膠頭之雙軸向中的至少一軸向移動。 Therefore, an embodiment of the present invention provides a method for detecting a glue coating, the technical means comprising: providing a rubber head with biaxial moving capability, applying a glue path according to a substrate, and The glue path is imaged by a charge coupled element that follows the movement of the glue head, wherein the charge coupled element follows at least one of the biaxial movements of the glue head.
更具體的說,上述技術特徵還可進一步實施成:所述電荷耦合元件取像時還包含透過至少一發光元件提供光源。 More specifically, the above technical features may be further implemented such that the charge-coupled component further comprises providing a light source through the at least one light-emitting component.
該塗膠路徑係由四邊形的軌跡圍繞形成,該四邊形軌跡依塗膠先後順序包含一第一塗膠路徑、一第二塗膠路徑、一第三塗膠路徑及一第四塗膠路徑。 The glue path is formed by a quadrilateral trajectory comprising a first glue path, a second glue path, a third glue path and a fourth glue path in the order of glue application.
所述電荷耦合元件係於塗膠頭對第四塗膠路徑塗膠過程中進行取像。 The charge-coupled component is imaged by the glue applicator during the fourth glue path.
該第三塗膠路徑與第四塗膠路徑之間還包含一斜線塗膠路徑。 The diagonal line is also included between the third glue path and the fourth glue path.
上述方法可以透過一種裝置技術而獲得實現,為 此,本發明之一具體實施例在於提供一種塗膠檢測裝置,包括:一基板;一滑台,提供一Y向滑道,該滑台並滑設於一組相互平行的X向滑軌上;一塗膠頭,滑組於該滑台的Y向滑道上,該塗膠頭經由滑台而沿X軸向及Y軸向移動,對該基板上一塗膠路徑進行塗膠;其中,該滑台上固置有多個電荷耦合元件,所述電荷耦合元件跟隨滑台沿X軸向移動而對塗膠路徑取像。 The above method can be realized by a device technology, Therefore, an embodiment of the present invention provides a glue application detecting device, comprising: a substrate; a sliding table, providing a Y-direction slideway, and the sliding table is slidably disposed on a pair of X-direction slide rails parallel to each other. a rubber-coated head is slidably disposed on the Y-direction slide of the slide table, and the glue-coated head is moved along the X-axis and the Y-axis via the slide table to apply a glue path on the substrate; wherein A plurality of charge coupled elements are fixed on the slide table, and the charge coupled elements follow the slide table in the X-axis direction to take an image of the glue path.
更具體的說,上述技術特徵還可進一步實施成:所述多個電荷耦合元件係沿Y軸向排列。 More specifically, the above technical features may be further implemented such that the plurality of charge coupled elements are arranged along the Y axis.
還包含至少一發光元件,固置於所述電荷耦合元件的旁側,對所述電荷耦合元件取像時提供光源。 A light-emitting element is further included, disposed on a side of the charge-coupled element, and providing a light source when the charge-coupled element is imaged.
該塗膠路徑包含一第一塗膠路徑、一第二塗膠路徑、一第三塗膠路徑及一第四塗膠路徑,該第一塗膠路徑與第三塗膠路徑平行於Y軸向,該第二塗膠路徑與第四塗膠路徑係平行於X軸向。 The glue application path includes a first glue application path, a second glue application path, a third glue application path and a fourth glue application path, the first glue application path and the third glue application path being parallel to the Y-axis direction The second glue path and the fourth glue path are parallel to the X axis.
該第三塗膠路徑與第四塗膠路徑之間還包含一斜線塗膠路徑。 The diagonal line is also included between the third glue path and the fourth glue path.
根據上述技術手段,本發明的優點在於:藉由呈線性排列的多個電荷耦合元件,能跟隨塗膠頭在塗膠過程中,沿X軸向移動來對塗膠路徑中的熱熔膠進行視覺檢測,進而減少人為目測或器械逐一檢測所需耗損的時間,達到塗膠完成即檢測完成的效果,以提升自動檢測的效率。 According to the above technical means, the invention has the advantages that: by means of a plurality of charge-coupled elements arranged in a linear manner, the hot-melt adhesive in the glue-coated path can be followed by following the movement of the glue-coated head in the X-axis direction during the coating process. Visual inspection, thereby reducing the time required for human visual inspection or instrument detection one by one, to achieve the effect of completion of the glue application, to improve the efficiency of automatic detection.
以上所述之方法與裝置之技術手段及其產生效能的具體實施細節,請參照下列實施例及圖式加以說明。 The specific implementation details of the above-mentioned methods and devices and the specific implementation details thereof will be described with reference to the following embodiments and drawings.
10‧‧‧基板 10‧‧‧Substrate
11‧‧‧塗膠路徑 11‧‧‧Glue path
111‧‧‧第一塗膠路徑 111‧‧‧First glue path
112‧‧‧第二塗膠路徑 112‧‧‧Second glue path
113‧‧‧第三塗膠路徑 113‧‧‧ Third glue path
114‧‧‧第四塗膠路徑 114‧‧‧The fourth glue path
115‧‧‧斜線塗膠路徑 115‧‧‧Slanted glue path
121、122、123、124、125‧‧‧定位點 121, 122, 123, 124, 125‧‧‧ anchor points
20‧‧‧塗膠頭 20‧‧‧Glue head
30‧‧‧滑台 30‧‧‧ slide table
31‧‧‧Y向滑道 31‧‧‧Y-direction slide
32‧‧‧驅動器 32‧‧‧ drive
40‧‧‧X向滑軌 40‧‧‧X-direction slide
50‧‧‧電荷耦合元件 50‧‧‧Charge-coupled components
60‧‧‧發光元件 60‧‧‧Lighting elements
61‧‧‧主發光元件 61‧‧‧Main light-emitting elements
62‧‧‧副發光元件 62‧‧‧Sub-lighting elements
70‧‧‧熱熔膠 70‧‧‧Hot melt adhesive
80‧‧‧載具 80‧‧‧ Vehicles
X、Y‧‧‧軸向 X, Y‧‧‧ axial
圖1是本發明塗膠檢測方法的程序方塊圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing the procedure of a glue coating detecting method of the present invention.
圖2是本發明塗膠檢測裝置的構造示意圖。 Fig. 2 is a schematic view showing the configuration of a glue detecting device of the present invention.
圖3是圖2的A-A剖示圖。 Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2;
圖4至圖8分別是本發明塗膠檢測裝置的動作示意。 4 to 8 are schematic views of the operation of the glue application detecting device of the present invention, respectively.
請參閱圖1,說明本發明所提供之塗膠檢測方法,包括實施下列步驟S1至步驟S3: Please refer to FIG. 1 , which illustrates a method for detecting a glue applied by the present invention, including performing the following steps S1 to S3:
步驟S1:提供塗膠頭。 Step S1: providing a rubberized head.
實施上,如圖2所示,說明本發明是提供一具有雙軸向移動能力的塗膠頭20,上述的雙軸向在實施上是指X軸向及Y軸向,也就是說,該塗膠頭20能沿X軸向及Y軸向移動,藉此將該塗膠頭20內載的熱熔膠塗附於物件(例如基板)上。 In an implementation, as shown in FIG. 2, the present invention is to provide a rubberized head 20 having a biaxial movement capability. The above biaxial directions are referred to as an X axis and a Y axis, that is, the The glue head 20 is movable in the X-axis and the Y-axis, whereby the hot-melt adhesive carried in the applicator head 20 is applied to an article (for example, a substrate).
步驟S2:沿塗膠路徑塗膠。 Step S2: Apply glue along the glue application path.
實施上,如圖2所示,說明將基板10透過載具(例如鏈條、皮帶或滾輪等)移動至塗膠頭20的下方,該基板10在實施上是呈四邊形的板體,該塗膠頭20是沿一塗膠路徑11塗附熱熔膠於基板10上,該塗膠路徑11在實施上是由四邊形的軌跡圍繞形成,且該四邊形軌跡是位於基板10的四周框邊,該四邊形軌跡依塗膠先後順序包含一第一塗膠路徑111、一第二塗膠路徑112、一第三塗膠路徑113及一第四塗膠路徑114,且該第三塗膠路徑113與第四塗膠路徑114之間還包含一斜線塗膠路徑115,該塗膠頭20是依序通過第一塗膠路徑111、第二塗膠路徑112、第三塗膠路徑113、斜線塗膠路徑115及第四塗膠路徑114所圍繞形成的塗膠路徑11而塗附熱熔膠於基板10上。 In practice, as shown in FIG. 2, the substrate 10 is moved through a carrier (such as a chain, a belt, a roller, etc.) to the underside of the rubberized head 20. The substrate 10 is implemented as a quadrangular plate. The head 20 is coated with a hot melt adhesive on the substrate 10 along a glue application path 11. The glue path 11 is formed by a quadrilateral trajectory, and the quadrilateral trajectory is located at the periphery of the substrate 10, the quadrilateral The track-adhesive sequence includes a first glue application path 111, a second glue application path 112, a third glue application path 113, and a fourth glue application path 114, and the third glue path 113 and the fourth glue path The glue application path 114 further includes a diagonal glue application path 115, which sequentially passes through the first glue application path 111, the second glue application path 112, the third glue application path 113, and the oblique line glue path 115. And the fourth glue application path 114 is coated with the hot melt adhesive on the substrate 10 around the formed glue path 11 .
步驟S3:電荷耦合元件取像。 Step S3: The charge coupled device takes an image.
實施上,如圖2所示,說明本發明還包含有能跟隨該塗膠頭20移動的電荷耦合元件50,更具體的說,所述電荷耦合元件50能跟隨塗膠頭20之雙軸向中的至少一軸向移動,該軸向在此是指上述的X軸向。並且,所述電荷耦合元件50於取像時還透過至少一發光元件60提供光源。在實施 上,所述電荷耦合元件50能沿X軸向移動,用以對該塗膠路徑11進行取像。更具體的說,當塗膠頭20沿塗膠路徑11依序通過第一塗膠路徑111、第二塗膠路徑112及第三塗膠路徑113後,要對斜線塗膠路徑115及第四塗膠路徑114塗膠的過程中,所述電荷耦合元件50開始對已塗附有熱熔膠的塗膠路徑11進行取像,如上述的第一塗膠路徑111、第二塗膠路徑112及第三塗膠路徑113,並當塗膠頭20塗附熱熔膠70於斜線塗膠路徑115及第四塗膠路徑114後,所述電荷耦合元件50接續對斜線塗膠路徑115及第四塗膠路徑114進行取像,使塗膠頭20在對塗膠路徑11塗膠完成後,所述電荷耦合元件50也完成對塗膠路徑11的取像作業。 In practice, as shown in FIG. 2, the present invention further includes a charge coupled device 50 that can follow the movement of the rubberized head 20. More specifically, the charge coupled device 50 can follow the biaxial direction of the rubberized head 20. At least one of the axial movements, the axial direction herein refers to the X-axis direction described above. Moreover, the charge coupled device 50 further provides a light source through the at least one light emitting element 60 when taking an image. In implementation The charge coupling element 50 is movable in the X-axis for taking the glue path 11 to be imaged. More specifically, after the rubberizing head 20 sequentially passes through the first coating path 111, the second coating path 112, and the third coating path 113 along the coating path 11, the diagonally coated path 115 and the fourth are applied. During the application of the glue path 114, the charge coupling element 50 begins to image the glue path 11 to which the hot melt adhesive has been applied, such as the first glue path 111 and the second glue path 112 described above. And the third glue application path 113, and after the glue head 20 applies the hot melt adhesive 70 to the diagonal glue application path 115 and the fourth glue application path 114, the charge coupling element 50 continues to diagonally apply the glue path 115 and The four-coating path 114 performs image capturing, and after the glue-coated head 20 finishes coating the glue-coated path 11, the charge-coupled element 50 also completes the image-taking operation of the glue-coated path 11.
另一方面,請合併參閱圖2及圖3,說明本發明還提供一種塗膠檢測裝置,使上述塗膠檢測方法可以容易地被實施。該塗膠檢測裝置包括上述的基板10、塗膠頭20及電荷耦合元件50。其中:該塗膠頭20是滑組一滑台30上,更具體的說,該塗膠頭20是滑設於該滑台30的一Y向滑道31上,該Y向滑道31連接有一驅動器32,該塗膠頭20能經由驅動器32的驅動而沿Y軸向移動。在實施上,該滑台30是滑設於一組相互平行的X向滑軌40上,該滑台30能經由X向滑軌40的驅動而沿X軸向移動,藉此使該塗膠頭20具有沿X軸向及Y軸向移動的雙軸向移動能力。 On the other hand, referring to FIG. 2 and FIG. 3 together, the present invention also provides a glue application detecting apparatus which can be easily implemented. The glue detecting device includes the substrate 10, the glue head 20, and the charge coupling element 50 described above. Wherein: the rubberizing head 20 is a sliding group and a sliding table 30. More specifically, the rubberizing head 20 is slidably disposed on a Y-direction slide 31 of the sliding table 30, and the Y-direction slide 31 is connected. There is a driver 32 which is movable in the Y-axis direction by driving of the driver 32. In practice, the slide table 30 is slidably disposed on a pair of mutually parallel X-direction slide rails 40, and the slide table 30 can be moved in the X-axis direction by driving the X-direction slide rails 40, thereby applying the glue. The head 20 has a biaxial movement capability that moves in the X and Y directions.
上述的基板10能透過載具80的載運而移動至塗膠頭20的下方,該基板20上已預先規劃有塗膠路徑11,由上述可知,該塗膠路徑11是由第一塗膠路徑111、第二塗膠路徑112、第三塗膠路徑113、斜線塗膠路徑115及第四塗膠路徑114依序圈繞構成,該塗膠頭20能經由滑台30及X向滑軌40的驅動而通過上述塗膠路徑11,進而塗附熱熔膠於基板10上,在實施上,該第一塗膠路徑111與第三塗膠路徑113 是平行於Y軸向,該第二塗膠路徑112與第四塗膠路徑114是平行於X軸向。 The substrate 10 can be moved to the underside of the glue head 20 by the carrier 80. The glue path 11 is pre-planned on the substrate 20. As can be seen from the above, the glue path 11 is the first glue path. 111, the second glue application path 112, the third glue application path 113, the oblique line glue path 115 and the fourth glue application path 114 are sequentially wound, and the glue head 20 can pass through the slide table 30 and the X-direction slide rail 40. After the driving, the hot glue is applied to the substrate 10 through the above-mentioned glue path 11 , and in practice, the first glue path 111 and the third glue path 113 are driven. It is parallel to the Y-axis, and the second glue path 112 and the fourth glue path 114 are parallel to the X-axis.
所述電荷耦合元件50是固置於該滑台30上,所述電荷耦合元件50能跟隨滑台30沿X軸向移動而對塗膠路徑11取像。進一步的說,所述電荷耦合元件50的數量在實施上為多個,在本實施例中為4個,所述電荷耦合元件50是沿Y軸向呈一直線排列的間隔固置於該滑台30上,其中位於該直線雙端的電荷耦合元件50之間的間距與該第二塗膠路徑112及第四塗膠路徑113之間的間距相等,且上述電荷耦合元件50是位於該第二塗膠路徑112及第四塗膠路徑113的正上方,使所述電荷耦合元件50沿X軸向移動時,除能對第一塗膠路徑111及第三塗膠路徑113進行取像外,並能對該第二塗膠路徑112及第四塗膠路徑114進行取像。 The charge coupled device 50 is fixed to the slide table 30, and the charge coupled device 50 can follow the slide table 30 to move in the X-axis direction to take an image of the glue path 11. Further, the number of the charge-coupled elements 50 is plural in implementation, and in the present embodiment, four, the charge-coupled elements 50 are fixed to the slide table at intervals spaced in a line along the Y-axis. 30, wherein the spacing between the charge coupling elements 50 at the double ends of the straight line is equal to the spacing between the second glue path 112 and the fourth glue path 113, and the charge coupling element 50 is located at the second coating Directly above the glue path 112 and the fourth glue path 113, when the charge coupling element 50 is moved in the X-axis direction, the first glue path 111 and the third glue path 113 can be imaged, and The second glue path 112 and the fourth glue path 114 can be imaged.
上述中的發光元件60在實施上可以是指發光二極體(LED),所述發光元件60是固置於所述電荷耦合元件50的旁側,對所述電荷耦合元件50提供取像時所需的光源。進一步的說,所述發光元件60包含一主發光元件61及一副發光元件62,該主發光元件61是沿Y軸向固置於所述電荷耦合元件50的雙側,該副發光元件62是固置於電荷耦合元件50的旁側並朝X軸向延伸,該主發光元件61能提供所述電荷耦合元件50對第一塗膠路徑111、第三塗膠路徑113及斜線塗膠路徑115取像時所需的光源,反之,該副發光元件62能提供所述電荷耦合元件50對第二塗膠路徑112及第四塗膠路徑114取像時所需的光源。 The light-emitting element 60 in the above may be referred to as a light-emitting diode (LED), and the light-emitting element 60 is disposed on the side of the charge-coupled element 50 to provide image pickup of the charge-coupled element 50. The required light source. Further, the light-emitting element 60 includes a main light-emitting element 61 and a pair of light-emitting elements 62, which are fixed on both sides of the charge-coupled element 50 along the Y-axis, and the sub-light-emitting element 62 Is disposed on the side of the charge coupled device 50 and extends in the X-axis direction, and the main light-emitting element 61 can provide the first adhesive path 111, the third glue path 113, and the oblique glue path. 115, the light source required for the image is taken. Conversely, the sub-light-emitting element 62 can provide the light source required for the charge-coupled element 50 to take the second glue path 112 and the fourth glue path 114.
根據上述配置,請接續參閱圖4至圖8,依序揭示本發明的動作解說圖,說明當塗膠頭20經由滑台30及X向滑軌40的驅動而移動至定位點121時(如圖4所示),該塗膠頭20能沿第一塗膠路徑11而塗附熱熔膠70於基板10上,接著當塗膠頭20依序通過定位點122、123、124時(如圖5 所示),該塗膠頭20沿第二塗膠路徑112、第三塗膠路徑113及斜線塗膠路徑115而塗附熱熔膠於基板10上,當電荷耦合元件50經由滑台30的帶動而移動到第三塗膠路徑113上方時(如圖6所示),所述電荷耦合元件50開始對第三塗膠路徑113進行取像(如圖7所示),隨著塗膠頭20依序通過定位點124、125而沿斜線塗膠路徑115及第四塗膠路徑114的進行塗膠時,所述電荷耦合元件50跟在塗膠頭20的後方同步進行取像,當塗膠頭20沿第四塗膠路徑114回到定位點121而完成塗膠過程並遠離基板10後(如圖8所示),所述電荷耦合元件50也同步完成對塗膠路徑11的動態取像。 According to the above configuration, please refer to FIG. 4 to FIG. 8 to sequentially disclose the operation diagram of the present invention, and explain that when the rubber head 20 is moved to the positioning point 121 via the sliding table 30 and the X-direction sliding rail 40 (eg, As shown in FIG. 4, the glue head 20 can apply the hot melt adhesive 70 to the substrate 10 along the first glue path 11, and then when the glue head 20 sequentially passes through the positioning points 122, 123, 124 (eg Figure 5 The glue head 20 is coated with a hot melt adhesive on the substrate 10 along the second glue path 112, the third glue path 113, and the diagonal glue path 115, when the charge coupled device 50 passes through the slide table 30. When the light is moved to the third glue path 113 (as shown in FIG. 6), the charge coupling element 50 starts to image the third glue path 113 (as shown in FIG. 7), along with the glue head. When the glue is applied along the oblique line coating path 115 and the fourth glue path 114 through the positioning points 124 and 125, the charge coupling element 50 is synchronously imaged behind the glue head 20 to be painted. After the rubber head 20 returns to the positioning point 121 along the fourth glue application path 114 to complete the coating process and away from the substrate 10 (as shown in FIG. 8 ), the charge coupling element 50 also synchronously completes the dynamic extraction of the glue application path 11 . image.
以上實施例僅為表達了本發明的較佳實施方式,但並不能因此而理解為對本發明專利範圍的限制。因此,本發明應以申請專利範圍中限定的請求項內容為準。 The above embodiments are merely illustrative of preferred embodiments of the invention, but are not to be construed as limiting the scope of the invention. Therefore, the present invention should be based on the content of the claims defined in the scope of the patent application.
S1至S3‧‧‧實施例之步驟說明 Description of the steps of the S1 to S3‧‧‧ examples
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TWI356173B (en) * | 2006-11-09 | 2012-01-11 | Nihon Micronics Kk | Probe positioning method, movable probe unit mecha |
TWM452450U (en) * | 2013-01-14 | 2013-05-01 | Wei Kuang Automation Co Ltd | Glue head heat preservation device of automatic gluing machine |
TW201411117A (en) * | 2012-09-07 | 2014-03-16 | Mas Automation Corp | Inspection device |
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CN202815380U (en) * | 2012-09-29 | 2013-03-20 | 北京京东方光电科技有限公司 | Gluing device |
CN203972241U (en) * | 2014-07-15 | 2014-12-03 | 苏州市星光精密机械有限公司 | PUR glue dispensing valve |
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TWI356173B (en) * | 2006-11-09 | 2012-01-11 | Nihon Micronics Kk | Probe positioning method, movable probe unit mecha |
TW201411117A (en) * | 2012-09-07 | 2014-03-16 | Mas Automation Corp | Inspection device |
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