TWI568029B - White LED manufacturing method - Google Patents

Description

White LED manufacturing method

The invention relates to a packaging technology of a light emitting diode (LED), and mainly provides a manufacturing method of a white LED capable of effectively improving production yield

The conventional white LED packaging method is on a package body having a groove structure, and the LED die is fixed on the package body, and then the wire is connected to cover the phosphor gel to form a white LED.

Generally, the ceramic substrate or the metal bracket is combined with the plastic injection molding on the package body having the groove structure. At present, most of the technology is adopted, but there are disadvantages that the light-emitting shape has a color shift problem, and the yellow circle phenomenon is easily caused.

Furthermore, the LED die needs to transmit heat through the above package, and the high thermal resistance results in poor heat dissipation efficiency.

For example, if the LED can be directly made into white light without passing through the package structure of the groove structure, the LED chromaticity illumination will be more uniform and the heat transfer is better, so the life is longer.

At present, unpackaged white LED technology has been developed. In the conventional technology, most of the conventional flip-chip LED chips are used in the packaging process, and as shown in Fig. 1, a plurality of light-emitting diodes having a plurality of flip-chip crystal grains are arranged. The components 10 are packaged on a substrate 11 in a matrix arrangement, wherein each of the LED components 10 may include one or a plurality of LED dilithic crystal grains 12 covered by a phosphor-containing encapsulant 13 to form white light. Chip Scale Package.

After the package is completed, cutting is performed at the junction of the adjacent light-emitting diode elements 10, so that the individual light-emitting diode elements 10 are obtained. However, similar to the conventional light-emitting diode process, in the step of coating the phosphor-containing material encapsulant 13, the substrate 11 and the total number of light-emitting diodes are directly covered by the phosphor-containing material encapsulation 13 Coverage of the package.

That is, when the light-emitting diode element 10 is cut, if the cutting line L1 located at the boundary of the adjacent light-emitting diode elements 10 is slightly deflected, the two-sided light-emitting diode elements 10 may be different in size, and An asymmetric chain-like defect of the phosphor-containing encapsulating colloid of each of the light-emitting diode elements 10 causes the chromaticity of the two-sided LED component 10 to be uneven, one blue and the other yellowish As for the generation of higher non-performing rates.

In view of the above, the present invention provides a method for manufacturing a white LED which can effectively improve the production yield, and is a main object thereof.

In order to achieve the above object, the method for manufacturing a white LED of the present invention basically comprises the following steps: a. providing a rubber sheet; b. providing a positioning plate, the positioning dimension of the positioning plate is consistent with the rubber sheet, and The positioning plate is provided with a plurality of package holes arranged in a matrix; c. the cover plate is disposed on the rubber plate by the exposed shape of the rubber plate through the package hole; d. solid crystal, at least one The flip-chip of the light-emitting diode is disposed on the rubber plate through the sealing hole of the positioning plate; e. the glue is filled on the packaging hole of the positioning plate to cover the light-emitting diode a crystal-covered phosphor-containing encapsulant comprising a white light-emitting diode component formed of at least one phosphor-containing encapsulant, at least one light-emitting diode flip chip, and a rubber plate at each package hole; Glue board removal; g. cutting, after all the white light emitting diode components of the phosphor-containing material encapsulant colloid hardened and shaped, the plate surface of the positioning plate is opposite to the total adjacent white light The junction of the polar body elements is divided by two lines of white light emitting diode elements containing the fluorescent material encapsulating colloid and passing through the positioning plate, and the outermost white light emitting diode The outer surface of the body element is cut by a cutting line of the white light emitting diode element containing the fluorescent material encapsulating colloid and penetrating the positioning plate, so that the positions of all the package holes can be individually cut to form the top surface and the four sides. A white light emitting diode element containing a phosphor encapsulated colloid is extended.

By using the above technical features, the manufacturing method of the white LED of the present invention can effectively solve the problem that the size of the white light emitting diode component on both sides of the cutting line is too large or too small due to the offset of the cutting line, thereby causing a color shift problem. The invention improves the cutting accuracy of the white light emitting diode component by a relatively more positive and reliable means, and effectively improves the processing yield of the white light emitting diode component.

According to the above technical feature, the phosphor-containing material encapsulant system is mixed with at least one phosphor powder.

Each of the package holes is a square through hole.

Each of the package holes is a circular through hole.

The rubber sheet may be selected from one of a single-sided tape or a heat-resistant tape.

The positioning plate may be selected from one of a copper plate, an aluminum plate, a printed circuit board, or a plastic injection molded plate.

The phosphor-containing material encapsulating system is silicone.

Specifically, the method for manufacturing a white LED according to the present invention mainly partitions the phosphor-containing material encapsulating colloid of each white light emitting diode component through a packaging hole of the positioning plate to avoid adjacent white light emitting diode components. During the hardening and cutting process, offset may occur, causing defects in uneven illumination; and, at the junction of all adjacent white light emitting diode elements, the white light emitting diode elements respectively passing through the respective sides thereof a cutting line containing a phosphor material encapsulating colloid and penetrating the positioning plate The working method effectively solves the problem that the size of the light-emitting diode elements on both sides of the cutting line is too large or too small due to the offset of the cutting line, thereby improving the cutting accuracy of the light-emitting diode element by a relatively more positive and reliable means, and effectively Improve the processing yield of the LED components.

[Prior technology]

L1‧‧‧ cutting line

10‧‧‧Lighting diode components

11‧‧‧Substrate

12‧‧‧Light-emitting diode flip chip

13‧‧‧Fluorescent encapsulant

[this invention]

L2‧‧‧ cutting line

20‧‧‧White light emitting diode components

21‧‧‧ Rubber board

22‧‧‧ Positioning board

221‧‧‧Packing holes

23‧‧‧Light-emitting diode flip chip

24‧‧‧Fluorescent encapsulant

FIG. 1 is a schematic diagram of a light-emitting diode semi-finished product that has not been cut by a conventional light-emitting diode package.

Fig. 2 is a basic flow chart showing a method of manufacturing a white LED of the present invention.

Figure 3 is a schematic view showing the arrangement of the positioning plate and the rubber plate in the present invention.

Fig. 4 is a schematic view showing the arrangement operation of the flip chip of the light-emitting diode of the present invention.

Figure 5 is a schematic view of a semi-finished product of a light-emitting diode that has been packaged and not yet cut.

Figure 6 is a schematic view showing the cutting line of the white light emitting diode element of the present invention.

Figure 7 is a schematic view of a light-emitting diode semi-finished product that has been packaged and not yet cut in another embodiment of the present invention.

Figure 8 is a cross-sectional view of a light-emitting diode semi-finished product which has been packaged and cut in another embodiment of the present invention.

The invention mainly provides a white light which can effectively improve the processing yield The manufacturing method of the LED, as shown in FIG. 1, the manufacturing method of the white LED of the present invention basically comprises the following steps:

a. Providing a rubber sheet (such as the rubber sheet 21 shown in FIG. 3); in practice, the rubber sheet 21 can be selected as one of a single-sided tape or a heat-resistant tape, and is mainly used to constitute a white light emitting light. The structural body of the polar body component (packaged product).

b. Providing a positioning plate (such as the positioning plate 22 shown in FIG. 3), the positioning plate 22 has a contour size conforming to the rubber plate 21, and the positioning plate 22 is provided with a plurality of packages arranged in a matrix. The hole 221 is mainly disposed through the sealing hole 221 of the positioning plate 22 to block the phosphor-containing material encapsulating colloid of each white light emitting diode element, thereby preventing the adjacent white light emitting diode element from causing a chain defect during the cutting process.

c. The cover plate is disposed on the rubber plate 21 in such a manner that the rubber plate 21 can be exposed through the sealing hole 221 .

d. Solid crystal, as shown in FIG. 4, at least one light-emitting diode flip chip 23 (electrode face down) is disposed on the rubber sheet 21 through the package hole 221 of the positioning plate 22.

e. laminating, as shown in FIG. 5, filling the sealing material hole 221 of the positioning plate 22 with the fluorescent material-containing encapsulant 24 covering the flip-chip crystal grains 23, so as to be disposed at each of the package holes 221 Forming a white light emitting diode element 20 composed of at least a phosphor-containing material encapsulating body 24, at least one light-emitting diode flip chip 23 and a rubber sheet 21; in practice, the phosphor-containing material encapsulating body 24 is It may be a silicone; and the phosphor-containing encapsulant system may be further mixed with at least one phosphor.

f. The rubber sheet is removed. As shown in Fig. 6, after the phosphor-containing material encapsulant 24 of the full white light-emitting diode element 20 is hardened and shaped, the rubber sheet is removed.

g. Cutting, as shown in Fig. 6, the interface of the positioning plate 22 with respect to all of the adjacent white light emitting diode elements 20 is passed through the white light emitting diode elements 20 of the respective sides thereof. The fluorescent material encapsulating colloid 24 is divided by the cutting line L2 penetrating the positioning plate 22, and is further disposed on the outer side of the outermost white light emitting diode element 20 to pass the white light emitting diode element 20 containing the fluorescent material. The package body 24 is cut through the cutting line L2 of the positioning plate 22, and the positions of all the package holes 221 are respectively cut to form a top surface and the four sides are extended with a white light emitting diode containing a fluorescent material encapsulant. The body member 20 is disposed in the package hole 221 of the positioning plate 22.

Further, the distance between the white light emitting diode element 20 and the cutting line L2 The distance is 0.23 mm ± 0.05 mm; the distance between the cutting line L2 and the edge of the package hole 221 is 0.10 mm ± 0.05 mm; the distance between the package holes 221 is 1.2 mm ± 0.05 mm.

According to the method for manufacturing a white LED of the present invention, an effective solution can be obtained. Because of the offset of the cutting line, the size of the white light emitting diode component on both sides of the cutting line is too large or too small, and the cutting accuracy of the white light emitting diode component is improved by a relatively more positive and reliable means, thereby effectively improving the white light. Processing yield of the LED component.

It is worth mentioning that the implementation shown in Figures 3 to 6 is disclosed. In the example, each of the package holes 221 is a square through hole; of course, each of the package holes 221 may also be a circular through hole as shown in FIG. 7 , and the functions thereof mainly include the white light emitting diode elements. 20 contains a fluorescent material encapsulating colloid 24 to prevent the adjacent white light emitting diode element 20 from causing a chain defect during the cutting process, and can also effectively control the filling range of the fluorescent material encapsulating colloid 24 to reach The purpose of saving the amount of the encapsulant 24 containing the fluorescent material is saved.

The white LED of the present invention is compared with the conventional technology. The manufacturing method mainly separates the phosphor-containing material encapsulating colloid of each white light emitting diode component through the packaging hole of the positioning plate, thereby avoiding the offset which may occur in the hardening and cutting process of the adjacent white light emitting diode component, resulting in a defect of uneven illumination; and, through the intersection of all adjacent white light-emitting diode elements, respectively, through two white light-emitting diode elements of the associated side, containing a fluorescent material encapsulant and penetrating the positioning The cutting line method of the board effectively solves the cutting caused by the cutting line offset The lack of size or too small size of the white light-emitting diode elements on both sides of the line improves the cutting accuracy of the white light-emitting diode element by a relatively more positive and reliable means, and effectively improves the processing yield of the white light-emitting diode element.

In summary, the present invention provides a preferred method for manufacturing a white LED, and an application for an invention patent is provided according to the law; the technical content and technical features of the present invention have been disclosed above, but those skilled in the art may still be based on The invention is not to be construed as being limited or modified by the spirit of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims

L2‧‧‧ cutting line

20‧‧‧White light emitting diode components

21‧‧‧ Rubber board

22‧‧‧ Positioning board

221‧‧‧Packing holes

23‧‧‧Light-emitting diode flip chip

24‧‧‧Fluorescent encapsulant

Claims (12)

The method for manufacturing a white LED includes the following steps: a. providing a rubber sheet; b. providing a positioning plate having a contour size conforming to the rubber sheet, and having a plurality of matrix arrays on the positioning plate a sealing hole; c. a covering plate, wherein the positioning plate is disposed on the rubber plate through the exposed shape of the rubber plate; d. solid crystal, at least one light-emitting diode flip chip is passed through the The sealing hole of the positioning plate is disposed on the rubber plate; e. laminating, filling the sealing material of the positioning plate with the fluorescent material encapsulating colloid covering the LED chip, so as to be in each package hole Forming at least a white light emitting diode component composed of a phosphor-containing material encapsulating colloid, at least one light emitting diode flip chip and a rubber plate; f. rubber plate removal; g. cutting, waiting for all white light emitting diodes After the phosphor-containing material encapsulant of the component is hardened and shaped, the white light emitting diode component of the positioning plate is adjacent to all the adjacent white light emitting diode components, and the white light emitting diode component of the component is respectively included The fluorescent material encapsulates the colloid and penetrates the cutting line of the positioning plate Cutting, and the outer side of the outermost white light emitting diode element is cut by a cutting line of the white light emitting diode element containing the fluorescent material encapsulating colloid and penetrating the positioning plate, so that all the holes can be packaged The positions are individually cut to form a top surface and the four sides are each extended with a white light emitting diode element containing a fluorescent material encapsulant. The method of manufacturing a white LED according to claim 1, wherein the phosphor-containing material encapsulant system is mixed with at least one phosphor powder. The method of manufacturing a white LED according to claim 1, wherein the cutting line is disposed in a packaging hole of the positioning plate. The method of manufacturing a white LED according to claim 1, wherein the distance between the light emitting diode and the cutting line is 0.23 mm ± 0.05 mm. The method of manufacturing a white LED according to claim 1, wherein the distance between the cutting line and the edge of the package hole is 0.10 mm ± 0.05 mm. The method of manufacturing a white LED according to claim 1, wherein the distance between the package holes is 1.2 mm ± 0.05 mm. The method of manufacturing a white LED according to claim 1 or 2, wherein each of the package holes is a square through hole. The method of manufacturing a white LED according to claim 1 or 2, wherein each of the package holes is a circular through hole. The method of manufacturing a white LED according to claim 1 or 2, wherein the rubber sheet is selected from one of a single-sided tape or a heat-resistant tape. The method of manufacturing a white LED according to claim 1 or 2, wherein the positioning plate is selected from one of a copper plate, an aluminum plate, a printed circuit board, or a plastic injection molded plate. The method for manufacturing a white LED according to claim 1 or 2, wherein the phosphor-containing material encapsulating system is silicone. The method for manufacturing a white LED includes the following steps: a. providing a rubber sheet; b. providing a positioning plate having a contour size conforming to the rubber sheet, and having a plurality of matrix arrays on the positioning plate a package hole, each package hole is a square through hole; c. a cover plate, wherein the glue plate can pass through the exposed shape of the package hole, the positioning plate is disposed on the rubber plate; d. solid crystal, at least one light is emitted The diode flip-chip is disposed on the rubber plate through the sealing hole of the positioning plate; e. the rubber is filled in the packaging hole of the positioning plate to cover the covered crystal grain of the light emitting diode a phosphor material encapsulating colloid, wherein the phosphor-containing encapsulant system is mixed with at least one phosphor powder to form at least a phosphor-containing encapsulant colloid, at least one light-emitting diode flip chip and glue at each package hole a white light emitting diode component composed of a plate; f. a rubber plate is removed; g. cutting, after the phosphorescent material encapsulating colloid of all the white light emitting diode components is hardened and shaped, the plate surface of the positioning plate is opposite to the whole phase The junction of the adjacent white light-emitting diode elements is divided by two lines of white light-emitting diode elements containing the fluorescent material encapsulating colloid and passing through the positioning plate, and the outermost side The outer side of the white light emitting diode element is cut by a cutting line of the white light emitting diode element containing the fluorescent material encapsulating colloid and penetrating the positioning plate, so that the positions of all the package holes can be individually cut to form a top surface. White light emitting diode elements with a phosphor encapsulated colloid are extended on all four sides.