TWI563585B - - Google Patents

Info

Publication number
TWI563585B
TWI563585B TW103100101A TW103100101A TWI563585B TW I563585 B TWI563585 B TW I563585B TW 103100101 A TW103100101 A TW 103100101A TW 103100101 A TW103100101 A TW 103100101A TW I563585 B TWI563585 B TW I563585B
Authority
TW
Taiwan
Application number
TW103100101A
Other languages
Chinese (zh)
Other versions
TW201528399A (zh
Inventor
An-Tian Wang
Zi-Wei Huang
Qing-Tai Huang
Jian-Hua Huang
Original Assignee
All Ring Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by All Ring Tech Co Ltd filed Critical All Ring Tech Co Ltd
Priority to TW103100101A priority Critical patent/TW201528399A/zh
Priority to CN201410304776.2A priority patent/CN104766816B/zh
Publication of TW201528399A publication Critical patent/TW201528399A/zh
Application granted granted Critical
Publication of TWI563585B publication Critical patent/TWI563585B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
TW103100101A 2014-01-02 2014-01-02 電子元件搬運方法及裝置 TW201528399A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103100101A TW201528399A (zh) 2014-01-02 2014-01-02 電子元件搬運方法及裝置
CN201410304776.2A CN104766816B (zh) 2014-01-02 2014-06-30 电子组件搬送方法及装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103100101A TW201528399A (zh) 2014-01-02 2014-01-02 電子元件搬運方法及裝置

Publications (2)

Publication Number Publication Date
TW201528399A TW201528399A (zh) 2015-07-16
TWI563585B true TWI563585B (ja) 2016-12-21

Family

ID=53648571

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103100101A TW201528399A (zh) 2014-01-02 2014-01-02 電子元件搬運方法及裝置

Country Status (2)

Country Link
CN (1) CN104766816B (ja)
TW (1) TW201528399A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615914B (zh) * 2016-01-18 2018-02-21 晶體管搬運檢測之結構
TWI640465B (zh) * 2016-02-04 2018-11-11 萬潤科技股份有限公司 Electronic component packaging carrier tape guiding method and device
TWI618666B (zh) * 2017-01-05 2018-03-21 All Ring Tech Co Ltd 載盤及使用該載盤的電子元件量測方法及裝置
CN113716278B (zh) * 2021-09-10 2023-04-25 深圳市华腾半导体设备有限公司 一种分光用高效转盘输送系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200416108A (en) * 2002-12-27 2004-09-01 Ebara Corp Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
TW200521050A (en) * 2003-12-23 2005-07-01 Tokyo Weld Co Ltd Work transferring and transporting apparatus and work transferring and transporting method
WO2013084296A1 (ja) * 2011-12-06 2013-06-13 上野精機株式会社 電子部品搬送装置
JP2013168417A (ja) * 2012-02-14 2013-08-29 Nitto Denko Corp 基板搬送方法および基板搬送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010195592A (ja) * 2010-03-18 2010-09-09 Olympus Corp 浮上ユニット及び基板検査装置
TWM445574U (zh) * 2012-08-20 2013-01-21 All Ring Tech Co Ltd 電子元件之搬運載盤構造
TWM487301U (zh) * 2014-01-02 2014-10-01 All Ring Tech Co Ltd 電子元件搬送裝置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200416108A (en) * 2002-12-27 2004-09-01 Ebara Corp Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
TW200521050A (en) * 2003-12-23 2005-07-01 Tokyo Weld Co Ltd Work transferring and transporting apparatus and work transferring and transporting method
WO2013084296A1 (ja) * 2011-12-06 2013-06-13 上野精機株式会社 電子部品搬送装置
JP2013168417A (ja) * 2012-02-14 2013-08-29 Nitto Denko Corp 基板搬送方法および基板搬送装置

Also Published As

Publication number Publication date
CN104766816A (zh) 2015-07-08
TW201528399A (zh) 2015-07-16
CN104766816B (zh) 2018-01-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees