TWI563519B - - Google Patents

Info

Publication number
TWI563519B
TWI563519B TW101124426A TW101124426A TWI563519B TW I563519 B TWI563519 B TW I563519B TW 101124426 A TW101124426 A TW 101124426A TW 101124426 A TW101124426 A TW 101124426A TW I563519 B TWI563519 B TW I563519B
Authority
TW
Taiwan
Application number
TW101124426A
Other versions
TW201308354A (zh
Inventor
Yuuko Nagahara
Kenji Takai
Takayuki Ichimura
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201308354A publication Critical patent/TW201308354A/zh
Application granted granted Critical
Publication of TWI563519B publication Critical patent/TWI563519B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW101124426A 2011-07-07 2012-07-06 電路連接材料及電路基板的連接構造體 TW201308354A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011150991 2011-07-07

Publications (2)

Publication Number Publication Date
TW201308354A TW201308354A (zh) 2013-02-16
TWI563519B true TWI563519B (zh) 2016-12-21

Family

ID=47437174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101124426A TW201308354A (zh) 2011-07-07 2012-07-06 電路連接材料及電路基板的連接構造體

Country Status (5)

Country Link
JP (2) JP6208011B2 (zh)
KR (1) KR101920952B1 (zh)
CN (1) CN103636068B (zh)
TW (1) TW201308354A (zh)
WO (1) WO2013005831A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10010437B2 (en) 2011-10-17 2018-07-03 W. L. Gore & Associates, Inc. Endoluminal device retrieval devices and related systems and methods
TW202219987A (zh) 2014-11-17 2022-05-16 日商迪睿合股份有限公司 異向性導電膜及連接構造體
JP6889020B2 (ja) 2016-05-02 2021-06-18 デクセリアルズ株式会社 異方性導電フィルムの製造方法、及び異方性導電フィルム
KR102445646B1 (ko) * 2016-05-02 2022-09-21 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
JP7011141B2 (ja) * 2016-06-24 2022-02-10 天馬微電子有限公司 触覚提示用パネル、触覚提示装置および電子機器
CN110461984A (zh) * 2017-03-29 2019-11-15 日立化成株式会社 粘接剂组合物及结构体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101911214A (zh) * 2008-02-05 2010-12-08 日立化成工业株式会社 导电粒子及导电粒子的制造方法
JP2011080033A (ja) * 2009-05-29 2011-04-21 Hitachi Chem Co Ltd 接着剤組成物、接着剤シート及び半導体装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法
JP3561748B2 (ja) * 1994-10-14 2004-09-02 綜研化学株式会社 異方導電性接着剤
JP2001164232A (ja) * 1999-12-09 2001-06-19 Sony Chem Corp 熱硬化性接着材料
JP4178774B2 (ja) * 2001-08-28 2008-11-12 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
JP5030196B2 (ja) * 2004-12-16 2012-09-19 住友電気工業株式会社 回路接続用接着剤
JP4839622B2 (ja) 2005-01-31 2011-12-21 日立化成工業株式会社 接着フィルム及びこれを備える積層体
JP2007056209A (ja) * 2005-08-26 2007-03-08 Sumitomo Electric Ind Ltd 回路接続用接着剤
JP2007110062A (ja) * 2005-09-15 2007-04-26 Hitachi Chem Co Ltd ダイボンディング用樹脂ペースト並びに、それを用いた半導体装置の製造方法及び半導体装置
JP5130682B2 (ja) * 2006-02-14 2013-01-30 日立化成工業株式会社 ダイボンディング用樹脂ペースト、該樹脂ペーストを用いた半導体装置の製造方法、および該製造方法により得られる半導体装置
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP5304019B2 (ja) * 2008-05-14 2013-10-02 日立化成株式会社 回路接続材料
JP2010006912A (ja) * 2008-06-25 2010-01-14 Shin-Etsu Chemical Co Ltd 接着剤組成物、接着フィルム及びダイシング・ダイアタッチフィルム
JP2011233633A (ja) * 2010-04-26 2011-11-17 Hitachi Chem Co Ltd 回路接続材料及び回路部材の接続体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101911214A (zh) * 2008-02-05 2010-12-08 日立化成工业株式会社 导电粒子及导电粒子的制造方法
JP2011080033A (ja) * 2009-05-29 2011-04-21 Hitachi Chem Co Ltd 接着剤組成物、接着剤シート及び半導体装置の製造方法

Also Published As

Publication number Publication date
KR20140035993A (ko) 2014-03-24
KR101920952B1 (ko) 2018-11-21
JPWO2013005831A1 (ja) 2015-02-23
JP6183499B2 (ja) 2017-08-23
CN103636068A (zh) 2014-03-12
WO2013005831A1 (ja) 2013-01-10
JP6208011B2 (ja) 2017-10-04
CN103636068B (zh) 2017-09-08
TW201308354A (zh) 2013-02-16
JP2016196646A (ja) 2016-11-24

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