TWI562671B - - Google Patents

Info

Publication number
TWI562671B
TWI562671B TW102101084A TW102101084A TWI562671B TW I562671 B TWI562671 B TW I562671B TW 102101084 A TW102101084 A TW 102101084A TW 102101084 A TW102101084 A TW 102101084A TW I562671 B TWI562671 B TW I562671B
Authority
TW
Taiwan
Application number
TW102101084A
Other versions
TW201352052A (zh
Inventor
Hideki Morimitsu
Original Assignee
Sintokogio Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sintokogio Ltd filed Critical Sintokogio Ltd
Publication of TW201352052A publication Critical patent/TW201352052A/zh
Application granted granted Critical
Publication of TWI562671B publication Critical patent/TWI562671B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
TW102101084A 2012-05-31 2013-01-11 支持構件、包含其之加熱板支持裝置及加熱裝置 TW201352052A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012123870A JP5891953B2 (ja) 2012-05-31 2012-05-31 支持部材、加熱プレート支持装置及び加熱装置

Publications (2)

Publication Number Publication Date
TW201352052A TW201352052A (zh) 2013-12-16
TWI562671B true TWI562671B (zh) 2016-12-11

Family

ID=49849589

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102101084A TW201352052A (zh) 2012-05-31 2013-01-11 支持構件、包含其之加熱板支持裝置及加熱裝置

Country Status (3)

Country Link
JP (1) JP5891953B2 (zh)
KR (1) KR101985472B1 (zh)
TW (1) TW201352052A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105304463A (zh) * 2014-07-10 2016-02-03 英属开曼群岛商精曜有限公司 垂直式平板式加热器
KR102562149B1 (ko) 2015-07-14 2023-08-01 엘지전자 주식회사 냉장고용 도어 및 냉장고
CN114774890A (zh) * 2022-04-13 2022-07-22 江苏微导纳米科技股份有限公司 薄膜沉积装置及其支撑机构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004139965A (ja) * 2002-08-20 2004-05-13 Ibiden Co Ltd 金属ヒータ
TW200913125A (en) * 2007-09-05 2009-03-16 Komico Ltd Unit for supporting a substrate and apparatus for processing a substrate having the same
JP2010040422A (ja) * 2008-08-07 2010-02-18 Ngk Insulators Ltd シャフト付きヒータ
TW201036103A (en) * 2009-03-27 2010-10-01 Sumitomo Electric Industries Wafer retainer for improving a method of connecting a high-frequency electrode, and semiconductor production device on which the wafer retainer is mounted

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1095637A (ja) 1996-09-24 1998-04-14 Noritake Co Ltd ガラス製大型基板熱処理用セッタ
JPH10302943A (ja) * 1997-04-25 1998-11-13 Noboru Naruo 均熱ヒーター装置
JP2002246286A (ja) 2001-02-15 2002-08-30 Ibiden Co Ltd セラミックヒータ
JP4311922B2 (ja) * 2002-10-03 2009-08-12 住友電気工業株式会社 セラミックス接合体、ウエハ保持体及び半導体製造装置
JP2006147416A (ja) * 2004-11-22 2006-06-08 Hitachi Chem Co Ltd 加熱板及び熱処理装置
KR20100023401A (ko) * 2008-08-22 2010-03-04 세크론 주식회사 기판 가열 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004139965A (ja) * 2002-08-20 2004-05-13 Ibiden Co Ltd 金属ヒータ
TW200913125A (en) * 2007-09-05 2009-03-16 Komico Ltd Unit for supporting a substrate and apparatus for processing a substrate having the same
JP2010040422A (ja) * 2008-08-07 2010-02-18 Ngk Insulators Ltd シャフト付きヒータ
TW201036103A (en) * 2009-03-27 2010-10-01 Sumitomo Electric Industries Wafer retainer for improving a method of connecting a high-frequency electrode, and semiconductor production device on which the wafer retainer is mounted

Also Published As

Publication number Publication date
TW201352052A (zh) 2013-12-16
KR20130135036A (ko) 2013-12-10
KR101985472B1 (ko) 2019-06-03
JP2013251086A (ja) 2013-12-12
JP5891953B2 (ja) 2016-03-23

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