TWI562283B - Antifuse element using spacer breakdown - Google Patents
Antifuse element using spacer breakdownInfo
- Publication number
- TWI562283B TWI562283B TW104104228A TW104104228A TWI562283B TW I562283 B TWI562283 B TW I562283B TW 104104228 A TW104104228 A TW 104104228A TW 104104228 A TW104104228 A TW 104104228A TW I562283 B TWI562283 B TW I562283B
- Authority
- TW
- Taiwan
- Prior art keywords
- antifuse element
- breakdown
- spacer
- spacer breakdown
- antifuse
- Prior art date
Links
- 230000015556 catabolic process Effects 0.000 title 1
- 125000006850 spacer group Chemical group 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B20/00—Read-only memory [ROM] devices
- H10B20/20—Programmable ROM [PROM] devices comprising field-effect components
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/143—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using laser-fusible links
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
- G11C17/165—Memory cells which are electrically programmed to cause a change in resistance, e.g. to permit multiple resistance steps to be programmed rather than conduct to or from non-conduct change of fuses and antifuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/102—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
- H01L27/1021—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components including diodes only
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/005—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor comprising combined but independently operative RAM-ROM, RAM-PROM, RAM-EPROM cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2014/031592 WO2015147782A1 (en) | 2014-03-24 | 2014-03-24 | Antifuse element using spacer breakdown |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201601252A TW201601252A (zh) | 2016-01-01 |
TWI562283B true TWI562283B (en) | 2016-12-11 |
Family
ID=54196108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104104228A TWI562283B (en) | 2014-03-24 | 2015-02-09 | Antifuse element using spacer breakdown |
Country Status (6)
Country | Link |
---|---|
US (2) | US9929090B2 (zh) |
EP (1) | EP3123509B1 (zh) |
KR (1) | KR102204054B1 (zh) |
CN (2) | CN109326581B (zh) |
TW (1) | TWI562283B (zh) |
WO (1) | WO2015147782A1 (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109326581B (zh) | 2014-03-24 | 2023-01-10 | 太浩研究有限公司 | 使用间隔体击穿的反熔丝元件 |
JP6316725B2 (ja) * | 2014-10-03 | 2018-04-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9929091B2 (en) * | 2016-08-25 | 2018-03-27 | International Business Machines Corporation | Vertical fuse structures |
FR3058567B1 (fr) * | 2016-11-08 | 2019-01-25 | Stmicroelectronics (Rousset) Sas | Circuit integre comportant une structure antifusible, et procede de realisation |
US10269444B2 (en) * | 2016-12-21 | 2019-04-23 | Sandisk Technologies Llc | Memory with bit line short circuit detection and masking of groups of bad bit lines |
CN109585450B (zh) * | 2017-09-28 | 2020-11-03 | 中芯国际集成电路制造(上海)有限公司 | 存储器及其形成方法 |
US10290327B2 (en) * | 2017-10-13 | 2019-05-14 | Nantero, Inc. | Devices and methods for accessing resistive change elements in resistive change element arrays |
US20190229734A1 (en) * | 2018-01-24 | 2019-07-25 | Microsemi Soc Corp. | Vertical resistor buffered multiplexer buskeeper |
US10714180B2 (en) | 2018-02-01 | 2020-07-14 | Microsemi Soc Corp. | Hybrid configuration memory cell |
US11276697B2 (en) * | 2018-04-02 | 2022-03-15 | Intel Corporation | Floating body metal-oxide-semiconductor field-effect-transistors (MOSFET) as antifuse elements |
US11239149B2 (en) * | 2018-04-02 | 2022-02-01 | Intel Corporation | Metal interconnect fuse memory arrays |
US10910369B2 (en) * | 2019-03-12 | 2021-02-02 | International Business Machines Corporation | On-chip security circuit |
CN113496987B (zh) * | 2020-04-08 | 2024-03-29 | 长鑫存储技术有限公司 | 反熔丝器件及反熔丝单元 |
CN113496989B (zh) * | 2020-04-08 | 2024-02-09 | 长鑫存储技术有限公司 | 反熔丝单元及反熔丝阵列 |
CN116997965A (zh) | 2021-03-08 | 2023-11-03 | 微芯片技术股份有限公司 | 选择性交叉耦合反相器以及相关设备、系统和方法 |
CN115623778A (zh) * | 2021-07-14 | 2023-01-17 | 联华电子股份有限公司 | 一次性可编程存储单元及其制造方法 |
US20230064518A1 (en) * | 2021-08-30 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Novel metal fuse structure by via landing |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080211540A1 (en) * | 2007-02-28 | 2008-09-04 | Shinobu Fujita | Programmable anti-fuse based on, e.g., zncds memory devices for fpga and other applications |
US20100090213A1 (en) * | 2006-07-04 | 2010-04-15 | Samsung Electronics Co., Ltd. | One-time programmable devices including chalcogenide material and electronic systems including the same |
US20100327363A1 (en) * | 2008-05-22 | 2010-12-30 | Panasonic Corporation | Semiconductor device and method for fabricating the same |
US20130059238A1 (en) * | 2004-05-06 | 2013-03-07 | Sidense Corporation | Reverse optical proximity correction method |
Family Cites Families (22)
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US4442507A (en) * | 1981-02-23 | 1984-04-10 | Burroughs Corporation | Electrically programmable read-only memory stacked above a semiconductor substrate |
US4881114A (en) * | 1986-05-16 | 1989-11-14 | Actel Corporation | Selectively formable vertical diode circuit element |
US5298784A (en) * | 1992-03-27 | 1994-03-29 | International Business Machines Corporation | Electrically programmable antifuse using metal penetration of a junction |
JPH07321287A (ja) * | 1994-05-20 | 1995-12-08 | Texas Instr Inc <Ti> | ユーザプログラマブル集積電子回路内に使用されるアンチヒューズ及びその製造方法 |
KR100937647B1 (ko) | 2002-12-30 | 2010-01-19 | 동부일렉트로닉스 주식회사 | 프로그램이 가능한 커패시터 및 이의 제조 방법 |
US7511352B2 (en) * | 2003-05-19 | 2009-03-31 | Sandisk 3D Llc | Rail Schottky device and method of making |
US7755162B2 (en) * | 2004-05-06 | 2010-07-13 | Sidense Corp. | Anti-fuse memory cell |
CA2520140C (en) * | 2004-05-06 | 2007-05-15 | Sidense Corp. | Split-channel antifuse array architecture |
US7795094B2 (en) * | 2004-09-02 | 2010-09-14 | Micron Technology, Inc. | Recessed gate dielectric antifuse |
KR20080012989A (ko) | 2005-05-24 | 2008-02-12 | 엔엑스피 비 브이 | 비휘발성 메모리셀과 그의 제조방법, 메모리 소자 및 장치 |
TW200910470A (en) * | 2007-05-03 | 2009-03-01 | Dsm Solutions Inc | Enhanced hole mobility p-type JFET and fabrication method therefor |
US8035139B2 (en) * | 2007-09-02 | 2011-10-11 | Suvolta, Inc. | Dynamic random access memory having junction field effect transistor cell access device |
US8120072B2 (en) | 2008-07-24 | 2012-02-21 | Micron Technology, Inc. | JFET devices with increased barrier height and methods of making same |
US8067815B2 (en) * | 2008-12-11 | 2011-11-29 | Macronix International Co., Lt.d. | Aluminum copper oxide based memory devices and methods for manufacture |
US8278691B2 (en) * | 2008-12-11 | 2012-10-02 | Micron Technology, Inc. | Low power memory device with JFET device structures |
US8395923B2 (en) * | 2008-12-30 | 2013-03-12 | Intel Corporation | Antifuse programmable memory array |
US9431127B2 (en) * | 2010-08-20 | 2016-08-30 | Shine C. Chung | Circuit and system of using junction diode as program selector for metal fuses for one-time programmable devices |
US8854859B2 (en) | 2010-08-20 | 2014-10-07 | Shine C. Chung | Programmably reversible resistive device cells using CMOS logic processes |
US8830720B2 (en) * | 2010-08-20 | 2014-09-09 | Shine C. Chung | Circuit and system of using junction diode as program selector and MOS as read selector for one-time programmable devices |
KR101088954B1 (ko) * | 2011-08-26 | 2011-12-01 | 권의필 | 프로그램이 가능한 비휘발성 메모리 |
US9502424B2 (en) * | 2012-06-29 | 2016-11-22 | Qualcomm Incorporated | Integrated circuit device featuring an antifuse and method of making same |
CN109326581B (zh) | 2014-03-24 | 2023-01-10 | 太浩研究有限公司 | 使用间隔体击穿的反熔丝元件 |
-
2014
- 2014-03-24 CN CN201811093402.5A patent/CN109326581B/zh active Active
- 2014-03-24 WO PCT/US2014/031592 patent/WO2015147782A1/en active Application Filing
- 2014-03-24 CN CN201480076293.XA patent/CN106030793B/zh active Active
- 2014-03-24 US US15/117,621 patent/US9929090B2/en active Active
- 2014-03-24 EP EP14887643.6A patent/EP3123509B1/en active Active
- 2014-03-24 KR KR1020167020039A patent/KR102204054B1/ko active IP Right Grant
-
2015
- 2015-02-09 TW TW104104228A patent/TWI562283B/zh active
-
2018
- 2018-03-26 US US15/935,838 patent/US10847456B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130059238A1 (en) * | 2004-05-06 | 2013-03-07 | Sidense Corporation | Reverse optical proximity correction method |
US20100090213A1 (en) * | 2006-07-04 | 2010-04-15 | Samsung Electronics Co., Ltd. | One-time programmable devices including chalcogenide material and electronic systems including the same |
US20080211540A1 (en) * | 2007-02-28 | 2008-09-04 | Shinobu Fujita | Programmable anti-fuse based on, e.g., zncds memory devices for fpga and other applications |
US20100327363A1 (en) * | 2008-05-22 | 2010-12-30 | Panasonic Corporation | Semiconductor device and method for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
CN109326581A (zh) | 2019-02-12 |
US20180218977A1 (en) | 2018-08-02 |
US20160351498A1 (en) | 2016-12-01 |
KR102204054B1 (ko) | 2021-01-18 |
CN106030793B (zh) | 2018-10-26 |
US10847456B2 (en) | 2020-11-24 |
WO2015147782A1 (en) | 2015-10-01 |
TW201601252A (zh) | 2016-01-01 |
EP3123509A4 (en) | 2017-11-22 |
EP3123509A1 (en) | 2017-02-01 |
EP3123509B1 (en) | 2021-06-23 |
KR20160136275A (ko) | 2016-11-29 |
CN106030793A (zh) | 2016-10-12 |
CN109326581B (zh) | 2023-01-10 |
US9929090B2 (en) | 2018-03-27 |
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