TWI561579B - - Google Patents

Info

Publication number
TWI561579B
TWI561579B TW101139284A TW101139284A TWI561579B TW I561579 B TWI561579 B TW I561579B TW 101139284 A TW101139284 A TW 101139284A TW 101139284 A TW101139284 A TW 101139284A TW I561579 B TWI561579 B TW I561579B
Authority
TW
Taiwan
Application number
TW101139284A
Other languages
Chinese (zh)
Other versions
TW201326306A (en
Inventor
Takashi Kitajima
Hiroshi Yagi
Akira Takarada
Original Assignee
Otsuka Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otsuka Chemical Co Ltd filed Critical Otsuka Chemical Co Ltd
Publication of TW201326306A publication Critical patent/TW201326306A/en
Application granted granted Critical
Publication of TWI561579B publication Critical patent/TWI561579B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
TW101139284A 2011-10-26 2012-10-24 Resin composition for reflective plate and reflective plate TW201326306A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011235393A JP5979846B2 (en) 2011-10-26 2011-10-26 RESIN COMPOSITION FOR REFLECTOR AND REFLECTOR

Publications (2)

Publication Number Publication Date
TW201326306A TW201326306A (en) 2013-07-01
TWI561579B true TWI561579B (en) 2016-12-11

Family

ID=48167654

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101139284A TW201326306A (en) 2011-10-26 2012-10-24 Resin composition for reflective plate and reflective plate

Country Status (5)

Country Link
JP (1) JP5979846B2 (en)
KR (1) KR101933749B1 (en)
CN (1) CN103827209B (en)
TW (1) TW201326306A (en)
WO (1) WO2013061821A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6383604B2 (en) * 2013-08-16 2018-08-29 旭化成株式会社 Polyamide resin composition for reflector and reflector
DE102014104513A1 (en) * 2014-03-31 2015-10-01 Evonik Degussa Gmbh Polymer composition, semi-finished fiber composite and method of making the same
JP2016117864A (en) * 2014-12-24 2016-06-30 東洋インキＳｃホールディングス株式会社 Resin composition for light reflection and light reflection sheet
CN104610739B (en) * 2015-01-21 2017-09-15 金发科技股份有限公司 A kind of reflecting plate daiamid composition
WO2017100996A1 (en) 2015-12-15 2017-06-22 Materion Corporation Enhanced wavelength conversion device
JP6712930B2 (en) * 2016-07-08 2020-06-24 大塚化学株式会社 Light reflector material, light reflector manufacturing method, light reflector, and lighting fixture
CN112533993A (en) * 2018-08-03 2021-03-19 帝斯曼知识产权资产管理有限公司 Fiber-reinforced polyamide composition and molded article made therefrom

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101278416A (en) * 2005-09-30 2008-10-01 日亚化学工业株式会社 Light emitting device and backlight unit using the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05325612A (en) * 1992-05-26 1993-12-10 Dainippon Ink & Chem Inc Lamp reflector
FR2762610B1 (en) 1997-04-25 1999-07-02 Nyltech Italia POLYAMIDE COMPOSITION FOR A PROCESS FOR MANUFACTURING ARTICLES BY EXTRUSION BLOWING AND OBTAINED ARTICLES
JP3290127B2 (en) * 1998-01-27 2002-06-10 松下電工株式会社 Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition
JP2002138195A (en) * 2000-11-02 2002-05-14 Toray Ind Inc Electroconductive polyamide resin composition and molding
JP4623282B2 (en) * 2005-03-10 2011-02-02 信越化学工業株式会社 Manufacturing method of semiconductor device
JP4525917B2 (en) * 2005-03-18 2010-08-18 株式会社クラレ Polyamide resin composition for LED reflector molding and LED reflector
JP2007199672A (en) * 2005-12-27 2007-08-09 Mitsubishi Plastics Ind Ltd Aliphatic polyester resin reflection film and reflection plate equipped with the same
JPWO2007138924A1 (en) * 2006-05-26 2009-10-01 コニカミノルタオプト株式会社 Optical pickup device
CN101200588A (en) * 2006-12-15 2008-06-18 上海杰事杰新材料股份有限公司 Polyamide composition and method of making the same
JP2008233290A (en) * 2007-03-19 2008-10-02 Mitsubishi Plastics Ind Ltd Reflecting film and reflecting plate
JP5428286B2 (en) * 2008-10-21 2014-02-26 日本ゼオン株式会社 Thermally conductive filler-containing polymerizable composition, prepreg, and laminate
JP2010100682A (en) * 2008-10-21 2010-05-06 Techno Polymer Co Ltd Heat-dissipating resin composition, substrate for led mounting, and reflector
WO2011027562A1 (en) * 2009-09-07 2011-03-10 株式会社クラレ Reflector for led and light-emitting device equipped with same
JP2011128200A (en) * 2009-12-15 2011-06-30 Konica Minolta Holdings Inc Display element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101278416A (en) * 2005-09-30 2008-10-01 日亚化学工业株式会社 Light emitting device and backlight unit using the same

Also Published As

Publication number Publication date
KR20140095504A (en) 2014-08-01
KR101933749B1 (en) 2018-12-28
JP2013091737A (en) 2013-05-16
TW201326306A (en) 2013-07-01
CN103827209B (en) 2017-03-15
WO2013061821A1 (en) 2013-05-02
JP5979846B2 (en) 2016-08-31
CN103827209A (en) 2014-05-28

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